CN204460011U - A kind of vapour automobile-used LED Rear Fog Lamp - Google Patents
A kind of vapour automobile-used LED Rear Fog Lamp Download PDFInfo
- Publication number
- CN204460011U CN204460011U CN201520145541.3U CN201520145541U CN204460011U CN 204460011 U CN204460011 U CN 204460011U CN 201520145541 U CN201520145541 U CN 201520145541U CN 204460011 U CN204460011 U CN 204460011U
- Authority
- CN
- China
- Prior art keywords
- led
- heat dissipation
- chip
- fog lamp
- constant current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Led Device Packages (AREA)
Abstract
本实用新型提供一种汽车用LED后雾灯,包括配光镜、灯壳、反光碗、基板、线路板、至少一个LED芯片、恒流电源芯片和散热部件;恒流电源芯片与LED芯片安装在线路板上,且所述恒流电源芯片通过线路板为所述LED芯片提供电源;散热部件包括散热底板和多个固定在所述散热底板的下表面上的散热体,相邻的所述散热体之间设置有间隔;所述基板与所述线路板、所述散热底板密封连接,且散热体按照阵列式排布固定在所述散热底板的下表面。此外,基板由多个彼此相隔的子基板构成,每一个子基板与LED芯片或恒流电源芯片相对应。本实用新型结构简单,体积小,散热效果好,实现了热电分离,减小了电子元器件之间的互相影响,并且生产成本低廉。
The utility model provides an LED rear fog lamp for automobiles, which includes a light distribution mirror, a lamp housing, a reflective bowl, a substrate, a circuit board, at least one LED chip, a constant current power chip and a heat dissipation component; the constant current power chip and the LED chip are installed on the circuit board, and the constant current power supply chip provides power for the LED chip through the circuit board; the heat dissipation component includes a heat dissipation bottom plate and a plurality of heat dissipation bodies fixed on the lower surface of the heat dissipation bottom plate, and the adjacent Spaces are provided between the heat sinks; the substrate is sealed and connected to the circuit board and the heat dissipation bottom plate, and the heat sinks are arranged in an array and fixed on the lower surface of the heat dissipation bottom plate. In addition, the substrate is composed of a plurality of sub-substrates spaced apart from each other, and each sub-substrate corresponds to an LED chip or a constant current power supply chip. The utility model has the advantages of simple structure, small volume, good heat dissipation effect, realizes separation of thermoelectricity, reduces mutual influence between electronic components, and has low production cost.
Description
技术领域technical field
本实用新型涉及一种后雾灯,特别是涉及一种汽车用LED后雾灯。The utility model relates to a rear fog lamp, in particular to an LED rear fog lamp for automobiles.
背景技术Background technique
后雾灯是在大雾情况下,从车辆后方观察车辆,使得车辆更为易见的灯具。根据《GB4785-1007汽车及挂车外部照明和光信号装置的安装规定》规定,后雾灯为车辆必需配备的灯具。目前市场上的后雾灯车灯光源主要为灯泡与LED。但是由于灯泡光源的设计受空间、造型和寿命等原因的限制;以及世界各地都在提倡绿色环保,所以LED依据其具有色温调节范围大、便于使用、工作电压低、功耗小和体积小的特性,逐渐替代灯泡光源作为绿色光源将被广泛使用到汽车灯具的使用中。并且,对于灯室空间比较紧张的车用灯具而言,按照传统的方法在布置LED时,考虑到LED后雾灯具产生的热量高以及散热方案欠缺等问题,一般只布置十几颗的小功率LED。并且,多个LED主要通过并联和串联相结合的方式实现电路。通过改变电阻的值来控制电流,保证光效。通过在灯壳(即底座)上增加透气孔来实现灯具的散热,其散热效果往往不佳,常常出现LED的光衰严重、亮度不足和寿命降低等问题,导致顾客抱怨增多、索赔增加。The rear fog lamp is a lamp that observes the vehicle from the rear of the vehicle under heavy fog conditions, making the vehicle more visible. According to the provisions of "GB4785-1007 Installation Regulations for Exterior Lighting and Light Signal Devices of Automobiles and Trailers", rear fog lamps are required for vehicles. At present, the light sources of rear fog lights on the market are mainly bulbs and LEDs. However, because the design of the light bulb light source is limited by space, shape and life; characteristics, gradually replacing bulb light sources as green light sources will be widely used in the use of automotive lamps. Moreover, for vehicle lamps with relatively tight lamp room space, when arranging LEDs according to the traditional method, considering the high heat generated by LED rear fog lamps and the lack of heat dissipation solutions, generally only a dozen of low-power LEDs are arranged. LED. Moreover, a plurality of LEDs are mainly connected in parallel and in series to realize a circuit. The current is controlled by changing the value of the resistor to ensure the light effect. The heat dissipation of the lamp is achieved by adding air holes on the lamp housing (ie the base), but the heat dissipation effect is often not good, and problems such as serious light decay, insufficient brightness, and reduced life of the LED often occur, resulting in more complaints and claims from customers.
LED后雾灯,其在工作时会产生大量的热。当多个LED密集排布时,热量的聚集将会更为严重。若不尽快将此热量散出,随之而来的热效应将会非常明显,这将会引起芯片内部热量聚集,导致光效下降以及使用寿命缩短等一系列问题。所以,在LED后雾灯具中,外部散热器的结构设计非常关键,其直接影响到整个系统的散热能力。LED后雾灯一般采用1W的大功率LED。LED是具有二极管特性的发光管,它只能单方向通电,其亮度输出与通过LED电流成正比,但大功率LED在大电流下会出现饱和现象,发光效率会大幅度下降,甚至失效。LED rear fog lights generate a lot of heat when they work. When multiple LEDs are densely arranged, the accumulation of heat will be more serious. If the heat is not dissipated as soon as possible, the ensuing thermal effect will be very obvious, which will cause heat accumulation inside the chip, resulting in a series of problems such as decreased light efficiency and shortened service life. Therefore, in LED rear fog lamps, the structural design of the external radiator is very critical, which directly affects the heat dissipation capacity of the entire system. LED rear fog lights generally use 1W high-power LEDs. LED is a light-emitting tube with diode characteristics. It can only be energized in one direction, and its luminance output is proportional to the current passing through the LED. However, high-power LEDs will appear saturated under high current, and the luminous efficiency will be greatly reduced, or even fail.
不难看出,由于LED芯片本身受热量的影响较大,所以在汽车用LED后雾灯的设计中,对于LED后雾灯的散热结构的要求就比较高。现有的汽车用LED后雾灯中,为了要满足LED的散热要求,散热结构的体积一般都比较大。It is not difficult to see that since the LED chip itself is greatly affected by heat, in the design of automotive LED rear fog lamps, the requirements for the heat dissipation structure of LED rear fog lamps are relatively high. In the existing LED rear fog lamps for automobiles, in order to meet the heat dissipation requirements of LEDs, the volume of the heat dissipation structure is generally relatively large.
此外,汽车用LED后雾灯中的LED芯片的驱动电源现在比较广泛使用的是DCDC(DirectCurrent Direct Current)结构,其是LED芯片的直流电源。但是,DCDC这种结构,本身也比较复杂,对应的体积比较大。大体积的车载LED后雾灯势必给汽车的设计带来了一定的不便;并且,也造成了整个汽车用LED后雾灯的成本相应增加。In addition, the driving power supply of LED chips in LED rear fog lamps for automobiles is now widely used in DCDC (Direct Current Direct Current) structure, which is the DC power supply of LED chips. However, the structure of DCDC itself is relatively complicated, and the corresponding volume is relatively large. The large-volume automotive LED rear fog lights will inevitably bring some inconvenience to the design of the car; moreover, it will also cause a corresponding increase in the cost of the entire car LED rear fog lights.
实用新型内容Utility model content
鉴于以上所述现有技术的缺点,本实用新型的目的在于提供一种汽车用LED后雾灯,用于解决现有技术中汽车用LED后雾灯体积大、散热效果不好,严重影响LED芯片寿命的问题。In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an LED rear fog lamp for automobiles, which is used to solve the problem that the LED rear fog lamps for automobiles in the prior art have large volume and poor heat dissipation effect, which seriously affects the LED rear fog lamp. The problem of chip life.
为实现上述目的及其他相关目的,本实用新型提供一种汽车用LED后雾灯,包括配光镜、灯壳//反光碗、基板、线路板、至少一个LED芯片、恒流电源芯片和散热部件;其中,所述恒流电源芯片与所述LED芯片安装在所述线路板上,且所述恒流电源芯片通过所述线路板为所述LED芯片提供电源;所述散热部件包括散热底板和多个固定在所述散热底板的下表面上的散热体,并且,相邻的所述散热体之间设置有间隔;所述基板与所述线路板、所述散热底板密封连接。In order to achieve the above purpose and other related purposes, the utility model provides an LED rear fog lamp for automobiles, including a light distribution mirror, a lamp housing//reflective bowl, a substrate, a circuit board, at least one LED chip, a constant current power supply chip and a heat sink component; wherein, the constant current power supply chip and the LED chip are installed on the circuit board, and the constant current power supply chip provides power for the LED chip through the circuit board; the heat dissipation component includes a heat dissipation bottom plate and a plurality of heat dissipation bodies fixed on the lower surface of the heat dissipation bottom plate, and intervals are provided between adjacent heat dissipation bodies; the substrate is sealed and connected with the circuit board and the heat dissipation bottom plate.
可选地,所述散热部件是铝制散热部件;所述基板是铝基板。Optionally, the heat dissipation component is an aluminum heat dissipation component; the substrate is an aluminum substrate.
可选地,多个所述散热体是按照阵列式排布固定在所述散热底板的下表面上。Optionally, a plurality of heat sinks are arranged in an array and fixed on the lower surface of the heat dissipation bottom plate.
可选地,所述散热体的形状为圆柱体或长方体。Optionally, the shape of the radiator is a cylinder or a cuboid.
可选地,所述恒流电源芯片和所述LED芯片的管脚固定安装在所述线路板上;所述恒流电源芯片和所述LED芯片的芯片体与所述基板相接。Optionally, pins of the constant current power supply chip and the LED chip are fixedly installed on the circuit board; the chip bodies of the constant current power supply chip and the LED chip are in contact with the substrate.
可选地,所述基板与所述线路板、所述散热底板通过胶水或密封圈密封连接。Optionally, the substrate is sealed and connected to the circuit board and the heat dissipation bottom plate through glue or a sealing ring.
可选地,所述基板包括多个子基板,相邻的子基板之间设置有间隔。Optionally, the substrate includes a plurality of sub-substrates, and spaces are provided between adjacent sub-substrates.
可选地,所述子基板的数量由所述LED芯片和所述恒流电源芯片的数量决定,且所述子基板的排布位置是与所述恒流电源芯片和每一个所述LED芯片相对应的。Optionally, the number of the sub-substrates is determined by the number of the LED chips and the constant-current power supply chips, and the arrangement position of the sub-substrates is the same as that of the constant-current power supply chips and each of the LED chips. Corresponding.
可选地,所述汽车用LED后雾灯包括2个LED芯片。Optionally, the LED rear fog lamp for automobiles includes 2 LED chips.
可选地,所述汽车用LED后雾灯还包括多个二极管,所述二极管连接在所述LED芯片和所述恒流电源之间,且所述二极管的数量与所述LED芯片的数量相关。Optionally, the LED rear fog lamp for automobiles further includes a plurality of diodes, the diodes are connected between the LED chips and the constant current power supply, and the number of the diodes is related to the number of the LED chips .
如上所述,本实用新型的汽车用LED后雾灯,采用恒流电源芯片为LED芯片提供恒流电源,并将散部件进行了一些修改;并且,本实用新型的基板采用分体式结构,使得本实用新型的汽车用LED后雾灯结构更加简单,体积小,散热效果好,实现了热电分离,减小了电子元器件之间的互相影响,有效防止了由于后雾灯过热而引起的LED芯片发光强度低、光衰严重以及电子元器件受损等问题,并且,本实用新型还大大降低了生产成本。As mentioned above, the LED rear fog lamp for automobiles of the present utility model adopts a constant current power supply chip to provide constant current power supply for the LED chip, and some modifications are made to the loose parts; moreover, the substrate of the present utility model adopts a split structure, so that The LED rear fog lamp for automobiles of the utility model has a simpler structure, small volume, good heat dissipation effect, realizes thermoelectric separation, reduces the mutual influence between electronic components, and effectively prevents LED damage caused by overheating of the rear fog lamp. The problems of low luminous intensity of the chip, serious light decay, damage to electronic components and the like, and the utility model also greatly reduces the production cost.
附图说明Description of drawings
图1显示为本实用新型实施例1公开的一种汽车用LED后雾灯的结构示意图。Fig. 1 shows a schematic structural diagram of an LED rear fog lamp for automobiles disclosed in Embodiment 1 of the present utility model.
图2显示为本实用新型实施例1公开的一种汽车用LED后雾灯的散热部件俯视图。Fig. 2 is a top view of a heat dissipation component of an LED rear fog lamp for automobiles disclosed in Embodiment 1 of the present utility model.
图3显示为本实用新型实施例2公开的一种汽车用LED后雾灯的结构示意图。Fig. 3 is a schematic structural diagram of an LED rear fog lamp for automobiles disclosed in Embodiment 2 of the present invention.
图4显示为本实用新型实施例2公开的一种汽车用LED后雾灯去掉散热部件后的结构示意图。Fig. 4 is a schematic structural diagram of an LED rear fog lamp for automobiles disclosed in Embodiment 2 of the present invention after removing the cooling parts.
图5显示为本实用新型实施例2公开的一种汽车用LED后雾灯的基板的结构示意图。FIG. 5 is a schematic structural diagram of a substrate of an LED rear fog lamp for automobiles disclosed in Embodiment 2 of the present invention.
元件标号说明Component designation description
100 汽车用LED后雾灯100 LED rear fog lights for cars
110 基板110 Substrate
111 第一基板111 The first substrate
112 第二基板112 second substrate
113 第三基板113 third substrate
120 线路板120 circuit board
130 LED芯片130 LED chips
131 第一LED芯片131 The first LED chip
132 第二LED芯片132 second LED chip
140 恒流电源芯片140 constant current power chip
150 散热部件150 cooling parts
151 散热底板151 heat sink
152 散热体152 radiator
160 二极管160 diodes
具体实施方式Detailed ways
以下由特定的具体实施例说明本实用新型的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本实用新型的其他优点及功效。The implementation of the present utility model is illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification.
须知,本说明书所附图式所绘示的结构、比例、大小等,均仅用以配合说明书所揭示的内容,以供熟悉此技术的人士了解与阅读,并非用以限定本实用新型可实施的限定条件,故不具技术上的实质意义,任何结构的修饰、比例关系的改变或大小的调整,在不影响本实用新型所能产生的功效及所能达成的目的下,均应仍落在本实用新型所揭示的技术内容得能涵盖的范围内。同时,本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语,亦仅为便于叙述的明了,而非用以限定本实用新型可实施的范围,其相对关系的改变或调整,在无实质变更技术内容下,当亦视为本实用新型可实施的范畴。It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the utility model Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of The technical content disclosed by the utility model must be within the scope covered. At the same time, terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit this specification. The practicable range of the utility model, and the change or adjustment of its relative relationship, without any substantial change in the technical content, shall also be regarded as the practicable scope of the utility model.
实施例1Example 1
本实施例公开了一种汽车用LED后雾灯100,如图1所示,包括配光镜、灯壳、反光碗、基板110、线路板120、LED芯片130、恒流电源芯片140和散热部件150。This embodiment discloses a kind of LED rear fog lamp 100 for automobile, as shown in Fig. Part 150.
LED芯片130和恒流电源芯片140都是芯片,包括管脚和芯片体,管脚用于与外界电路相连,芯片体则是包含了集成电路的硅片。在本实施例中,LED芯片130和恒流电源芯片140的管脚固定安装在线路板120上的。基板110与线路板120和散热部件150通过胶水或密封圈密封连接。在本实施例中,基板110和散热部件150为了散热效果和成本的考量,都采用铝材质。基板110、线路板120和散热部件150放置在灯壳的相应位置,然后和反光碗固定形成灯壳组件,最后再与配光镜焊接在一起组成整个汽车用LED后雾灯100。Both the LED chip 130 and the constant current power supply chip 140 are chips, including pins and a chip body. The pins are used to connect with external circuits, and the chip body is a silicon chip containing an integrated circuit. In this embodiment, the pins of the LED chip 130 and the constant current power supply chip 140 are fixedly installed on the circuit board 120 . The substrate 110 is sealed and connected to the circuit board 120 and the heat dissipation component 150 through glue or a sealing ring. In this embodiment, both the substrate 110 and the heat dissipation component 150 are made of aluminum for heat dissipation effect and cost consideration. The base plate 110, the circuit board 120 and the heat dissipation part 150 are placed in the corresponding positions of the lamp housing, and then fixed with the reflector bowl to form a lamp housing assembly, and finally welded together with the light distribution mirror to form the entire LED rear fog lamp 100 for automobiles.
在本实施例中,出于对后雾灯的体积和成本的考量,将现有的为LED芯片130提供电源的DCDC结构改为恒流电源芯片140。恒流电源芯片140相较于DCDC结构,其稳定性更加好:输出的电流更加稳定,不受负载和外界环境(温度)的影响;体积更加小;成本也更加低廉。In this embodiment, due to the consideration of the size and cost of the rear fog lamp, the existing DCDC structure that provides power for the LED chip 130 is changed to a constant current power chip 140 . Compared with the DCDC structure, the constant current power supply chip 140 has better stability: the output current is more stable, not affected by the load and the external environment (temperature); the volume is smaller; the cost is also lower.
在本实施例中,如图2所示,散热部件150包括散热底板151和多个散热体152。散热底板151的上表面与基板110密封连接。多个散热体152固定在散热底板151的下表面,并且,多个散热体152是按照阵列式排布在散热底板151的下表面。在按照阵列式排布的相邻的散热体152之间具有一定的间隔。通过在相邻的散热体152之间设置一定的间隔,加快了空气流通,变向地也更利于整个后雾灯100的散热。此外,散热体152的形状包括但不限于圆柱体和长方体。在本实施例中,散热体152采用的是空气流通效果较好的圆柱体的形状。In this embodiment, as shown in FIG. 2 , the heat dissipation component 150 includes a heat dissipation bottom plate 151 and a plurality of heat dissipation bodies 152 . The upper surface of the heat dissipation bottom plate 151 is in sealing connection with the substrate 110 . A plurality of radiators 152 are fixed on the lower surface of the heat dissipation bottom plate 151 , and the plurality of radiators 152 are arranged in an array on the lower surface of the heat dissipation bottom plate 151 . There is a certain interval between adjacent radiators 152 arranged in an array. By setting a certain distance between adjacent radiators 152 , the air circulation is accelerated, and the direction of change is also more conducive to the heat dissipation of the entire rear fog lamp 100 . In addition, the shape of the radiator 152 includes but not limited to a cylinder and a cuboid. In this embodiment, the radiator 152 is in the shape of a cylinder with better air circulation.
进一步地,本实施例中LED芯片130和恒流电源芯片140的管脚都是固定安装在线路板120上的,并且,LED芯片130和恒流电源芯片140的芯片体也是与线路板相接触的。Further, in this embodiment, the pins of the LED chip 130 and the constant current power supply chip 140 are all fixedly installed on the circuit board 120, and the chip bodies of the LED chip 130 and the constant current power supply chip 140 are also in contact with the circuit board of.
在汽车用LED后雾灯100工作时,LED芯片130和恒流电源芯片140的发出的热量通过铝制基板110和铝制的散热部件150进行充分的散热,从而进一步的保证LED芯片的寿命和发光强度。When the automotive LED rear fog lamp 100 is working, the heat emitted by the LED chip 130 and the constant current power supply chip 140 is fully dissipated through the aluminum substrate 110 and the aluminum heat dissipation part 150, thereby further ensuring the life of the LED chip and light intensity.
实施例2Example 2
本实施例公开了一种汽车用LED后雾灯100,如图3和图4所示,包括配光镜、灯壳、反光碗、基板110、线路板120、第一LED芯片131、第二LED芯片132、恒流电源芯片140、散热部件150和两个二极管160。This embodiment discloses an LED rear fog lamp 100 for automobiles, as shown in Fig. 3 and Fig. LED chip 132 , constant current power supply chip 140 , heat dissipation component 150 and two diodes 160 .
其中,第一LED芯片131、第二LED芯片132、恒流电源芯片140和二极管160的管脚都是固定安装在线路板120上的。基板110与线路板120和散热部件150密封连接。在本实施例中,基板110和散热部件150为了散热效果和成本的考量,都采用铝材质。基板110、线路板120和散热部件150放置在灯壳的相应位置,然后和反光碗固定形成灯壳组件,最后再与配光镜焊接在一起组成整个汽车用LED后雾灯100。Wherein, pins of the first LED chip 131 , the second LED chip 132 , the constant current power supply chip 140 and the diode 160 are all fixedly mounted on the circuit board 120 . The substrate 110 is sealed and connected with the circuit board 120 and the heat dissipation component 150 . In this embodiment, both the substrate 110 and the heat dissipation component 150 are made of aluminum for heat dissipation effect and cost consideration. The base plate 110, the circuit board 120 and the heat dissipation part 150 are placed in the corresponding positions of the lamp housing, and then fixed with the reflector bowl to form a lamp housing assembly, and finally welded together with the light distribution mirror to form the entire LED rear fog lamp 100 for automobiles.
在本实施例中,恒流电源芯片140同时为第一LED芯片131、第二LED芯片132提供电源的DCDC结构改为恒流电源芯片140。In this embodiment, the DCDC structure in which the constant current power supply chip 140 simultaneously provides power to the first LED chip 131 and the second LED chip 132 is changed to the constant current power supply chip 140 .
并且,与实施例1相同,散热部件150也如图2所示,包括散热底板151和多个散热体152。在此不再赘述。Furthermore, as in the first embodiment, the heat dissipation component 150 also includes a heat dissipation bottom plate 151 and a plurality of heat dissipation bodies 152 as shown in FIG. 2 . I won't repeat them here.
进一步地,本实施例中第一LED芯片131、第二LED芯片132、恒流电源芯片140和二极管160的管脚与实施例1相同,都是固定安装在线路板120上的。但是,第一LED芯片131、第二LED芯片132和恒流电源芯片140的芯片体与实施例1不同,其是直接与基板110相接触的。由于基板110采用的是铝制材质,并且与散热部件150紧密连接,所以,第一LED芯片131、第二LED芯片132和恒流电源芯片140的芯片体与基板110直接相连,更加有利于芯片的散热。Further, the pins of the first LED chip 131 , the second LED chip 132 , the constant current power supply chip 140 and the diode 160 in this embodiment are the same as those in Embodiment 1, and they are all fixedly installed on the circuit board 120 . However, the chip bodies of the first LED chip 131 , the second LED chip 132 and the constant current power supply chip 140 are different from those in Embodiment 1, and they are in direct contact with the substrate 110 . Since the substrate 110 is made of aluminum and is closely connected with the heat dissipation component 150, the chip body of the first LED chip 131, the second LED chip 132 and the constant current power supply chip 140 are directly connected with the substrate 110, which is more conducive to chip cooling. heat dissipation.
并且,为了进一步地保证第一LED芯片131、第二LED芯片132恒流电源芯片140的散热,并避免芯片彼此之间的发热散热不同所造成的影响,将基板110分为多个单独的子基板。子基板位于线路板120和散热底板151之间,其数量和排布位置都由LED芯片和恒流电源芯片决定,并且,相邻的子基板之间设置有间隔。Moreover, in order to further ensure the heat dissipation of the first LED chip 131 and the second LED chip 132, the constant current power supply chip 140, and avoid the influence caused by the difference in heat dissipation between the chips, the substrate 110 is divided into a plurality of separate sub-units. substrate. The sub-substrates are located between the circuit board 120 and the heat dissipation bottom plate 151, the number and arrangement of which are determined by the LED chips and the constant current power supply chips, and there are spaces between adjacent sub-substrates.
在本实施例中,如图4和图5所示,由于后雾灯100包括第一LED芯片131、第二LED芯片132和一个恒流电源芯片140,所以对应地,基板110包括:第一子基板111、第二子基板112和第三子基板113。第一子基板111的位置与第一LED芯片131相对应;第二子基板112的位置与恒流电源芯片140对应;第三子基板113的位置与第二LED芯片132对应。并且,第一子基板111与第二子基板112之间具有间隔,第二子基板112和第三子基板113之间具有一定的间隔。通过将基板110进行分体式处理,充分达到了热电分离的效果。在恒流电源芯片140为第一LED芯片131和第二LED芯片132提供恒流电源的同时,这种分体式的基板110使得恒流电源芯片140产生的热量和散发出的热量、第一LED芯片131产生的热量和散发出的热量、以及第二LED芯片132产生的热量和散发出的热量互不影响,进一步的保证LED芯片的寿命和发光强度。In this embodiment, as shown in FIG. 4 and FIG. 5 , since the rear fog lamp 100 includes a first LED chip 131 , a second LED chip 132 and a constant current power supply chip 140 , correspondingly, the substrate 110 includes: a first The sub-substrate 111 , the second sub-substrate 112 and the third sub-substrate 113 . The position of the first sub-substrate 111 corresponds to the first LED chip 131 ; the position of the second sub-substrate 112 corresponds to the constant current power chip 140 ; the position of the third sub-substrate 113 corresponds to the second LED chip 132 . Moreover, there is a space between the first sub-substrate 111 and the second sub-substrate 112 , and there is a certain distance between the second sub-substrate 112 and the third sub-substrate 113 . By performing separate processing on the substrate 110 , the effect of thermoelectric separation is fully achieved. While the constant current power supply chip 140 provides constant current power for the first LED chip 131 and the second LED chip 132, this split substrate 110 makes the heat generated and emitted by the constant current power supply chip 140, the first LED The heat generated and emitted by the chip 131, and the heat generated and emitted by the second LED chip 132 do not affect each other, further ensuring the lifespan and luminous intensity of the LED chip.
由于本实施例中,LED芯片是两个,对应地,二极管160也是两个,其中一个连接在第一LED芯片131和恒流电源芯片140之间,另一个连接在第二LED芯片132和恒流电源芯片140之间,用于对第一LED芯片131和第二LED芯片132进行防反保护。Since there are two LED chips in this embodiment, correspondingly, there are also two diodes 160, one of which is connected between the first LED chip 131 and the constant current power supply chip 140, and the other is connected between the second LED chip 132 and the constant current power supply chip 140. Between the flow power chip 140, it is used to protect the first LED chip 131 and the second LED chip 132 against reverse.
此外,为了突出本实用新型的创新部分,本实施例中并没有将与解决本实用新型所提出的技术问题关系不太密切的单元引入,但这并不表明本实施例中不存在其它的单元。In addition, in order to highlight the innovative part of the utility model, this embodiment does not introduce units that are not closely related to solving the technical problems proposed by the utility model, but this does not mean that there are no other units in this embodiment .
需要说明的是,本实用新型的实施例中所提供的图示仅以示意方式说明本实用新型的基本构想,遂图式中仅显示与本实用新型中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制,其实际实施时各组件的型态、数量及比例可为一种随意的改变,且其组件布局型态也可能更为复杂。It should be noted that the illustrations provided in the embodiments of the present utility model are only schematically illustrating the basic idea of the present utility model, and only the components related to the present utility model are shown in the drawings rather than according to the actual implementation. The number, shape and size of components are drawn, and the type, quantity and ratio of each component can be changed at will during actual implementation, and the component layout type may also be more complicated.
综上所述,本实用新型的汽车用LED后雾灯,采用恒流电源芯片为LED芯片提供恒流电源,并将散部件进行了一些修改;并且,本实用新型的基板采用分体式结构,使得本实用新型的汽车用LED后雾灯结构更加简单,体积小,散热效果好,实现了热电分离,减小了电子元器件之间的互相影响,有效防止了由于后雾灯过热而引起的LED芯片发光强度低、光衰严重以及电子元器件受损等问题,并且,本实用新型还大大降低了生产成本。所以,本实用新型有效克服了现有技术中的种种缺点而具高度产业利用价值。In summary, the LED rear fog lamp for automobiles of the present utility model adopts a constant current power supply chip to provide constant current power supply for the LED chip, and some modifications are made to the loose parts; moreover, the substrate of the present utility model adopts a split structure, The structure of the LED rear fog lamp for automobiles of the utility model is simpler, the volume is small, and the heat dissipation effect is good, the thermoelectric separation is realized, the mutual influence between electronic components is reduced, and the overheating of the rear fog lamp is effectively prevented. The LED chip has problems such as low luminous intensity, serious light decay, and damage to electronic components, and the utility model also greatly reduces production costs. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has high industrial application value.
上述实施例仅例示性说明本实用新型的原理及其功效,而非用于限制本实用新型。任何熟悉此技术的人士皆可在不违背本实用新型的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本实用新型所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本实用新型的权利要求所涵盖。The above-mentioned embodiments only illustrate the principles and effects of the present utility model, but are not intended to limit the present utility model. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the utility model should still be covered by the claims of the utility model.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520145541.3U CN204460011U (en) | 2015-03-13 | 2015-03-13 | A kind of vapour automobile-used LED Rear Fog Lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520145541.3U CN204460011U (en) | 2015-03-13 | 2015-03-13 | A kind of vapour automobile-used LED Rear Fog Lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204460011U true CN204460011U (en) | 2015-07-08 |
Family
ID=53666891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520145541.3U Expired - Lifetime CN204460011U (en) | 2015-03-13 | 2015-03-13 | A kind of vapour automobile-used LED Rear Fog Lamp |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204460011U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104748035A (en) * | 2015-03-13 | 2015-07-01 | 上海信耀电子有限公司 | Automobile LED rear fog lamp |
CN105977366A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | Heat-dissipation type LED packaging structure and method |
CN106195860A (en) * | 2016-08-29 | 2016-12-07 | 福建鸿博光电科技有限公司 | The light modulating device of a kind of LED car lamp and LED car lamp |
-
2015
- 2015-03-13 CN CN201520145541.3U patent/CN204460011U/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104748035A (en) * | 2015-03-13 | 2015-07-01 | 上海信耀电子有限公司 | Automobile LED rear fog lamp |
CN105977366A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | Heat-dissipation type LED packaging structure and method |
CN106195860A (en) * | 2016-08-29 | 2016-12-07 | 福建鸿博光电科技有限公司 | The light modulating device of a kind of LED car lamp and LED car lamp |
CN106195860B (en) * | 2016-08-29 | 2019-02-05 | 福建鸿博光电科技有限公司 | A kind of dimming device and LED car lamp of LED car lamp |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101900271A (en) | Light-emitting diode lamps with better heat dissipation effect | |
CN204460011U (en) | A kind of vapour automobile-used LED Rear Fog Lamp | |
CN102128381B (en) | High-lighting-effect LED bulb | |
JP3215782U (en) | LED lights for vehicles | |
CN103807719A (en) | Liquid-cooled LED headlamp for means of transportation | |
CN101788112A (en) | Three-dimensional heat dissipation high-power LED illumination device | |
CN104748035A (en) | Automobile LED rear fog lamp | |
CN102829451A (en) | Light-emitting diode (LED) light source fixing device | |
CN1978979B (en) | structure of lighting module | |
CN202229043U (en) | LED car lamp | |
CN205299323U (en) | H4LED car headlight | |
CN201724015U (en) | Solid lighting LED light source module convenient in maintenance | |
CN202955660U (en) | Fixed device of light-emitting diode (LED) light source | |
CN204187523U (en) | LED special high-efficiency heat-dissipation light-reflecting lampshade structure | |
CN203162616U (en) | Light source plate of light emitting diode | |
CN105423217A (en) | H4 LED automobile headlamp | |
CN108302344A (en) | Light emitting diode bulb and car light module | |
CN202501348U (en) | Light-emitting diode (LED) ceiling lamp | |
JP3157521U (en) | LED lighting device for spotlight | |
CN201992446U (en) | High-efficiency LED bulbs | |
CN203927502U (en) | Lighting device | |
CN202091855U (en) | LED light device | |
CN203384821U (en) | High-power all-directional lensed LED reversing lamp | |
CN202229013U (en) | Led street lamp | |
CN208652452U (en) | A kind of automobile lamp LED heat dissipation structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20150708 |
|
CX01 | Expiry of patent term |