CN204189823U - LED surface-mount digital tube - Google Patents
LED surface-mount digital tube Download PDFInfo
- Publication number
- CN204189823U CN204189823U CN201420566172.0U CN201420566172U CN204189823U CN 204189823 U CN204189823 U CN 204189823U CN 201420566172 U CN201420566172 U CN 201420566172U CN 204189823 U CN204189823 U CN 204189823U
- Authority
- CN
- China
- Prior art keywords
- housing
- pcb
- circuit board
- printed circuit
- digital tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 23
- 238000010276 construction Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 9
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 230000004308 accommodation Effects 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED surface-mount digital tube, comprise printed circuit board (PCB), LED chip and shell; LED chip is welded on described printed circuit board (PCB) admittedly; Shell and printed circuit board (PCB) fluid-tight engagement; Shell comprises the first housing and the second housing; Be connected with described printed circuit board (PCB) after described second housing and described first housing are fixedly connected with; Described first housing comprises the first support and light-emitting zone; Described light-emitting zone is positioned at the top of described LED chip; Described second housing offers hollow out window; Described hollow out window is corresponding with described light-emitting zone.Above-mentioned LED surface-mount digital tube forms the spatial accommodation to LED chip and bonding wire by the hollow out window area of the second housing, therefore, it is possible to ensure that the light-emitting zone on the first housing can not touch bonding wire in encapsulation process, therefore can not cause bonding wire come off or collapse line problem occur, effectively can ensure product quality and the yields of LED surface-mount digital tube.
Description
Technical field
The utility model relates to surface-mount digital tube technical field, particularly relates to a kind of LED surface-mount digital tube.
Background technology
Traditional LED surface-mount digital tube needs to be encapsulated by modes such as a glue, encapsulating and mold pressings in encapsulation process, the more difficult strict control realizing glue amount in encapsulation process.Therefore when glue amount is too much, easily occur colloid touch bonding wire cause bonding wire to come off or the line that collapses situation occur, thus LED surface-mount digital tube cannot normally be worked, cause the product quality of LED surface-mount digital tube to be protected, the yields of product is lower.
Utility model content
Based on this, be necessary for the problems referred to above, provide a kind of product quality high and the LED surface-mount digital tube that yields is high.
A kind of LED surface-mount digital tube, comprises printed circuit board (PCB), LED chip and shell; Described LED chip is welded on described printed circuit board (PCB) admittedly; Described shell and described printed circuit board (PCB) fluid-tight engagement; Described shell comprises the first housing and the second housing; Be connected with described printed circuit board (PCB) after described second housing and described first housing are fixedly connected with; Described first housing comprises the first support and light-emitting zone; Described light-emitting zone is positioned at the top of described LED chip; Described second housing offers hollow out window; Described hollow out window is corresponding with described light-emitting zone.
Wherein in an embodiment, the electrode of described LED chip is connected on described printed circuit board (PCB) by bonding wire, and the thickness of described second housing is greater than the maximum height of described pitch of weld from described printed circuit board (PCB).
Wherein in an embodiment, the connected mode between described first housing and described second housing is that buckle connects.
Wherein in an embodiment, the material of described first support and described second housing is alternatively non-transparent plastic material, and the material of described light-emitting zone is light transmissive material.
Wherein in an embodiment, described first stent surface coated has layer of ink.
Wherein in an embodiment, also comprise the diaphragm being arranged at described first surface of shell, described diaphragm comprises transmission region and alternatively non-transparent region; Described transmission region is corresponding with the light-emitting zone on described first housing.
Wherein in an embodiment, the one side that the transmission region of described diaphragm is connected with described light-emitting zone is provided with fluorescent material.
Wherein in an embodiment, described shell also comprises reference column; Described printed circuit board (PCB) is provided with location hole with described reference column corresponding position, and described shell is connected with described printed circuit board (PCB) pressing by described reference column.
Wherein in an embodiment, described reference column piles or asymmetricly distributes on the housing.
Wherein in an embodiment, described shell also comprises ruggedized construction, and described ruggedized construction is positioned on described first housing or described second housing; Described ruggedized construction and described first housing or described second housing one-body molded.
The shell of above-mentioned LED surface-mount digital tube comprises the first housing and the second housing, the spatial accommodation to LED chip and bonding wire is formed by the hollow out window area of the second housing, therefore, it is possible to ensure that the light-emitting zone on the first housing can not touch bonding wire in encapsulation process, therefore can not cause bonding wire come off or collapse line problem occur, effectively can ensure product quality and the yields of LED surface-mount digital tube.
Accompanying drawing explanation
Fig. 1 is the vertical view of the LED surface-mount digital tube in an embodiment;
Fig. 2 be embodiment illustrated in fig. 1 in the front view of LED surface-mount digital tube;
Fig. 3 be embodiment illustrated in fig. 1 in the end view of LED surface-mount digital tube;
Fig. 4 be embodiment illustrated in fig. 1 in LED surface-mount digital tube along the cutaway view of A-A ＇;
Fig. 5 be embodiment illustrated in fig. 2 in LED surface-mount digital tube along the cutaway view of B-B ＇.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.First-selected embodiment of the present utility model is given in accompanying drawing.But the utility model can realize in many different forms, is not limited to embodiment described herein.On the contrary, the object of these embodiments is provided to be make to disclosure of the present utility model more thoroughly comprehensively.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in specification of the present utility model herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
A kind of LED surface-mount digital tube, comprises printed circuit board (PCB), LED chip and shell.LED chip is welded on described printed circuit board (PCB) admittedly.Shell and printed circuit board (PCB) fluid-tight engagement.Shell comprises the first housing and the second housing.Second housing is connected with the first housing and printed circuit board (PCB) respectively.First housing comprises the first support and light-emitting zone.Wherein, light-emitting zone is positioned at the top of LED chip.Second housing offers hollow out window, hollow out window is corresponding with light-emitting zone.
The shell of above-mentioned LED surface-mount digital tube comprises the first housing and the second housing, the spatial accommodation to LED chip and bonding wire is formed by the hollow out window area of the second housing, therefore, it is possible to ensure that the light-emitting zone on the first housing can not touch bonding wire in encapsulation process, therefore can not cause bonding wire come off or collapse line problem occur, effectively can ensure product quality and the yields of LED surface-mount digital tube.
Figure 1 shows that the vertical view of the LED surface-mount digital tube in an embodiment; Fig. 2 be embodiment illustrated in fig. 1 in the front view of LED surface-mount digital tube; Fig. 3 be embodiment illustrated in fig. 1 in the end view (left view) of LED surface-mount digital tube, Fig. 4 be embodiment illustrated in fig. 1 in LED surface-mount digital tube along the cutaway view of A-A ＇; Fig. 5 be then embodiment illustrated in fig. 2 in LED surface-mount digital tube along the cutaway view of B-B ＇.Below in conjunction with Fig. 1 ~ Fig. 5, the LED surface-mount digital tube in the present embodiment is elaborated.
In the present embodiment, LED surface-mount digital tube comprises printed circuit board (PCB) 100, LED chip 200 and shell 300.Printed circuit board (PCB) 100 is provided with golden finger 110, for being connected with external circuit.The electrode of LED chip 200 is connected on printed circuit board (PCB) 100 by bonding wire 210.In the present embodiment, the electrode of LED chip 200 is connected on printed circuit board (PCB) 100 by aluminium wire weldering pressure.In other examples, the electrode of LED chip 200 also can adopt gold ball bonding to be connected on printed circuit board (PCB) 100.Shell 300 is connected with printed circuit board (PCB) 100 fluid-tight engagement.
Shell 300 comprises the first housing 310 and the second housing 320.In the present embodiment, connected by mechanical snap mode between the first housing 310 and the second housing 320, be convenient to the carrying out producing and encapsulate.In other examples, the first housing 310 and the second housing 320 also can adopt other connected modes such as gummed to be fixed connection.First housing 310 comprises the first support 312 and light-emitting zone 314.Light-emitting zone 314 is arranged at the top of LED chip 200.In the present embodiment, light-emitting zone 314 can be formed by traditional process for filling colloid into.Light-emitting zone 314 is diffused or focus type lens arrangement, and the light uniform emission that LED chip 200 can be sent is gone out, and effectively ensures luminous intensity and the consistency thereof of LED surface-mount digital tube.First support 312 surface-coated has layer of ink.Ink film thickness can control below 1 millimeter.In other examples, the surface of the first housing 310 is provided with diaphragm and substitutes layer of ink.Diaphragm comprises transmission region and alternatively non-transparent region.Transmission region is corresponding with the light-emitting zone 314 on the first housing 310.Diaphragm is diffusion barrier or light-transmissive film, and is heatproof diaphragm.The one side that transmission region is connected with the light-emitting zone 314 on the first housing 310 can also arrange the luminescent materials such as fluorescent material as required.
Second housing 320 is connected with the first housing 310 and printed circuit board (PCB) 100 respectively.Second housing 320 arranges hollow out window 322.Hollow out window 322 is corresponding with the light-emitting zone 314 on the first housing 310, and what jointly form LED chip 200 goes out optical channel.In the present embodiment, the thickness b of the second housing 320 is greater than the maximum height H of bonding wire 210 apart from printed circuit board (PCB) 100.Therefore, after the first housing 310 and the second housing 320 buckle are connected to form shell 300, hollow out window 322 forms the spatial accommodation holding LED chip 200 and bonding wire 210.In the present embodiment, be fixedly connected to form shell 300 with the second housing 320 after the first housing 310 is formed, shell 300 is fixedly connected with printed circuit board (PCB) 100 again.Therefore, can ensure that in shell 300, hollow out window 322 is enough to hold LED chip 200 and bonding wire 210.Therefore the light-emitting zone 314 on the first housing 310 can not touch bonding wire 210 in encapsulation process, can not cause bonding wire come off or collapse line problem occur, effectively can ensure product quality and the yields of LED surface-mount digital tube.
First support 312 and the second housing 320 are formed by alternatively non-transparent plastic material, and light-emitting zone 314 is formed by transparent material.Particularly, the first support 312 and the second housing 320 all adopt the alternatively non-transparent plastic material of environmental-protecting material, and light-emitting zone 314 then adopts transparent or translucent environmental-protecting material.In the present embodiment, the material of the first support 312 and the second housing 320 can be the polyphthalamide (Polyphthalamide, PPA) of shades of colour, and the material of light-emitting zone 314 is transparent resin material.In other examples, the first support 312 in first housing 310 and light-emitting zone 314 can adopt same light transmissive material to form, only need carry out isolating at the contact-making surface of the first support 312 and light-emitting zone 314, the generation of altering optical phenomenon can be prevented like this.First support 312 also can adopt different materials to make from the second housing 320.The thickness of the first housing 310 is less than the thickness of the second housing 320, therefore, effectively can either ensure that encapsulation process can not cause bonding wire come off or the collapse problem of line to occur, also be conducive to reducing the thickness of shell 300, be convenient to fast packing and reduce defective products produce.First housing 310 and the second housing 320 are temperature-resistant material.In the present embodiment, the first housing 310 and the second housing 320 adopt heatproof indeformable material more than 180 DEG C.
Shell 300 also comprises reference column 330.Reference column 330 is arranged at and can be arranged on the first housing 310, also can be arranged on the second housing 320, and with the first housing 310 or the second housing 320 one-body molded.Printed circuit board (PCB) 100 is provided with reference column 330 opposite position place the location hole 120 matched with reference column 330.Shell 300 is connected with printed circuit board (PCB) 100 pressing through location hole 120 by reference column 330.In the present embodiment, reference column 330 comprises multiple, and on asymmetric distribution and shell 300.Location hole 120 is trapezoidal location hole.The accurate location fit of shell 300 and printed circuit board (PCB) 100 can be realized by the reference column 330 and location hole 120 arranging asymmetric distribution.In other enforcement, reference column 330 also can be symmetrical with on printed circuit board (PCB) 100.Shell 300 and printed circuit board (PCB) 100 also can adopt and be connected as gummed waits other to be fixedly connected with mode.
Above-mentioned LED chip, the higher and finished product quality of its process efficiency can be protected, and yields is high.
In another embodiment, shell also comprises ruggedized construction.Ruggedized construction is arranged on the first housing or the second housing, and with the first housing or the second housing one-body molded.Ruggedized construction effectively can improve the withstand voltage holding capacity of LED surface-mount digital tube.In the present embodiment, ruggedized construction is rinforcement bar, and its size can decide according to the actual size of LED surface-mount digital tube and pressurized situation.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a LED surface-mount digital tube, comprises printed circuit board (PCB), LED chip and shell; Described LED chip is welded on described printed circuit board (PCB) admittedly; Described shell and described printed circuit board (PCB) fluid-tight engagement; It is characterized in that, described shell comprises the first housing and the second housing; Be connected with described printed circuit board (PCB) after described second housing and described first housing are fixedly connected with; Described first housing comprises the first support and light-emitting zone; Described light-emitting zone is positioned at the top of described LED chip; Described second housing offers hollow out window; Described hollow out window is corresponding with described light-emitting zone.
2. LED surface-mount digital tube according to claim 1, is characterized in that, the electrode of described LED chip is connected on described printed circuit board (PCB) by bonding wire, and the thickness of described second housing is greater than the maximum height of described pitch of weld from described printed circuit board (PCB).
3. LED surface-mount digital tube according to claim 1, is characterized in that, the connected mode between described first housing and described second housing is that buckle connects.
4. LED surface-mount digital tube according to claim 1, is characterized in that, the material of described first support and described second housing is alternatively non-transparent plastic material, and the material of described light-emitting zone is light transmissive material.
5. LED surface-mount digital tube according to claim 1, is characterized in that, described first stent surface coated has layer of ink.
6. LED surface-mount digital tube according to claim 1, is characterized in that, also comprises the diaphragm being arranged at described first surface of shell, and described diaphragm comprises transmission region and alternatively non-transparent region; Described transmission region is corresponding with the light-emitting zone on described first housing.
7. LED surface-mount digital tube according to claim 6, is characterized in that, the one side that the transmission region of described diaphragm is connected with described light-emitting zone is provided with fluorescent material.
8. LED surface-mount digital tube according to claim 1, is characterized in that, described shell also comprises reference column; Described printed circuit board (PCB) is provided with location hole with described reference column corresponding position, and described shell is connected with described printed circuit board (PCB) pressing by described reference column.
9. LED surface-mount digital tube according to claim 8, is characterized in that, described reference column piles or asymmetricly distributes on the housing.
10. LED surface-mount digital tube according to claim 1, is characterized in that, described shell also comprises ruggedized construction, and described ruggedized construction is positioned on described first housing or described second housing; Described ruggedized construction and described first housing or described second housing one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420566172.0U CN204189823U (en) | 2014-09-28 | 2014-09-28 | LED surface-mount digital tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420566172.0U CN204189823U (en) | 2014-09-28 | 2014-09-28 | LED surface-mount digital tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204189823U true CN204189823U (en) | 2015-03-04 |
Family
ID=52621798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420566172.0U Expired - Lifetime CN204189823U (en) | 2014-09-28 | 2014-09-28 | LED surface-mount digital tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204189823U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN107516474A (en) * | 2017-08-15 | 2017-12-26 | 江苏稳润光电科技有限公司 | A kind of intelligent LED charactron and preparation method |
| CN107705712A (en) * | 2017-09-19 | 2018-02-16 | 蓝国贤 | A kind of LED surface-mount digital tubes and its manufacture craft |
| WO2019195899A1 (en) * | 2018-04-10 | 2019-10-17 | Graph On Ltd | Heating device for lead-acid batteries operating under low temperatures and a battery with this device |
| CN112581879A (en) * | 2020-12-22 | 2021-03-30 | 无锡雄达电子科技有限公司 | LED (light emitting diode) patch nixie tube and manufacturing process thereof |
| CN113056099A (en) * | 2021-03-03 | 2021-06-29 | 研祥智能科技股份有限公司 | LED printed board structure and manufacturing method thereof |
-
2014
- 2014-09-28 CN CN201420566172.0U patent/CN204189823U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN105810115B (en) * | 2016-05-30 | 2019-08-20 | 深圳市奥蕾达科技有限公司 | Full-color LED light-emitting panel |
| CN107516474A (en) * | 2017-08-15 | 2017-12-26 | 江苏稳润光电科技有限公司 | A kind of intelligent LED charactron and preparation method |
| CN107705712A (en) * | 2017-09-19 | 2018-02-16 | 蓝国贤 | A kind of LED surface-mount digital tubes and its manufacture craft |
| WO2019195899A1 (en) * | 2018-04-10 | 2019-10-17 | Graph On Ltd | Heating device for lead-acid batteries operating under low temperatures and a battery with this device |
| CN112581879A (en) * | 2020-12-22 | 2021-03-30 | 无锡雄达电子科技有限公司 | LED (light emitting diode) patch nixie tube and manufacturing process thereof |
| CN113056099A (en) * | 2021-03-03 | 2021-06-29 | 研祥智能科技股份有限公司 | LED printed board structure and manufacturing method thereof |
| CN113056099B (en) * | 2021-03-03 | 2022-08-16 | 研祥智能科技股份有限公司 | LED printed board structure and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204189823U (en) | LED surface-mount digital tube | |
| CN204189391U (en) | LED surface-mount digital tube | |
| CN101440941A (en) | Multiple-in-one LED display screen module surface paste and display screen module | |
| CN103840071A (en) | LED lamp bar manufacturing method and LED lamp bar | |
| CN201044149Y (en) | LED color display unit | |
| CN101599521A (en) | A kind of encapsulating structure of great power LED | |
| CN104391347A (en) | Quantum dot prism film | |
| CN203659854U (en) | Spiral LED packaging lamp filament | |
| CN104407404A (en) | Quantum dot diffusion membrane | |
| CN210136873U (en) | LED packaging structure and LED packaging frame | |
| CN204439860U (en) | A kind of quantum dot diffusion barrier | |
| CN204189393U (en) | LED surface-mount digital tube | |
| CN216488127U (en) | Lamp bead packaging device of multi-group RGB LED chip and built-in IC | |
| CN201853438U (en) | Laminated LED (light-emitting diode) display device | |
| CN201117657Y (en) | Light emitting diode packaging structure | |
| CN203746898U (en) | LED packaging body and illumination equipment | |
| KR20140121507A (en) | LED module for flash and method for fabricating the sme | |
| CN204332956U (en) | A kind of dual-colored LED lamp pearl and the light bar based on this lamp pearl | |
| CN201226357Y (en) | Light emitting diode chip packaging structure for backlight module | |
| CN207896088U (en) | The lamp bead of IC built in a kind of more cup type holders | |
| CN201226215Y (en) | High-density pixel whole color display unit and display screen | |
| CN111710667B (en) | A backlight LED module and packaging method thereof | |
| CN209896095U (en) | LED support and LED luminescent device | |
| CN203746899U (en) | LED packaging structure and illumination equipment | |
| CN201060870Y (en) | Side light-emitting diode device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, Guangdong, Shenzhen, Baoan District Fuyong Street West Ring Road, Chongqing Road south of the Han Dynasty laser Fuyong Industrial Park, building six, four floor, five floor Patentee after: GYX OPTOELECTRONICS CO.,LTD. Address before: 518000, Guangdong, Shenzhen, Baoan District Fuyong Street West Ring Road, Chongqing Road south of the Han Dynasty laser Fuyong Industrial Park, building six, four floor, five floor Patentee before: Shenzhen Guoyexing Optoelectronics Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150304 |