CN113056099B

CN113056099B - LED printed board structure and manufacturing method thereof

Info

Publication number: CN113056099B
Application number: CN202110237839.7A
Authority: CN
Inventors: 罗勋; 黄大志; 党光跃
Original assignee: EVOC Intelligent Technology Co Ltd
Current assignee: EVOC Intelligent Technology Co Ltd
Priority date: 2021-03-03
Filing date: 2021-03-03
Publication date: 2022-08-16
Anticipated expiration: 2041-03-03
Also published as: CN113056099A

Abstract

The invention provides an LED printed board structure and a manufacturing method thereof, wherein the LED printed board structure comprises a printed board and a panel made of opaque materials; the first surface of the printed board is provided with a plurality of surface mounted LEDs; a plurality of openings are formed in the panel; and the panel is buckled on the first surface of the printed board, and each patch LED is embedded into the corresponding opening. Still including pasting and establishing the pad pasting that deviates from the printing board one side on the panel, have a plurality of impenetrable printing opacity regions on this pad pasting, every printing opacity region is relative with the paster LED position that corresponds. The problem that the production process flow is more complicated caused by the plug-in LED is avoided; the adjacent surface mounted LEDs are separated through the longitudinal section of the panel, and light rays emitted by each surface mounted LED are only transmitted to the outside through the light transmission area on the film, so that the problem of crosstalk interference between the adjacent surface mounted LEDs is solved; the surface mounted LED is prevented from directly contacting with the outside air, and dust prevention and electrical insulation are realized; the production process and flow are simplified, and the production efficiency is improved; the material cost of production is reduced.

Description

LED printed board structure and manufacturing method thereof

Technical Field

The invention relates to the technical field of electronic equipment, in particular to an LED printed board structure and a manufacturing method thereof.

Background

In the application process of electronic equipment, a Light Emitting Diode (LED) printed board structure is used in many places, and a plurality of LEDs on the LED printed board structure are used as indicator lights to indicate the state of the electronic equipment. In the prior art, as shown in fig. 1, a plug-in LED is adopted, after an SMT (surface mount technology) process is performed in production, a wave soldering process is required, and before the plug-in LED is inserted into a hole of a printed board, the plug-in LED needs to be assembled with a lamp sleeve in advance to prevent the plug-in LED from being damaged due to high temperature in the wave soldering process. In the manufacturing process of the LED printed board structure, an SMT process and a wave soldering process are required, and the production process flow is as follows: solder paste printing → paster → reflow soldering → AOI optical inspection → maintenance → inserter → pre-coating flux → preheating → wave soldering → cooling → pin shear → inspection → maintenance → plate split → assembling machine. The LED printed board structure not only needs to additionally increase the lamp sleeve, so that the material cost is high; and the process flow is complex, which is not beneficial to automatic production and has low production efficiency.

Another LED printed board structure in the prior art is shown in fig. 2, and a form of mounting a patch LED + a light guide column and a panel in a combined manner is adopted to realize an indicator light effect, specifically, a space is provided between the panel and the printed board to avoid a solder joint electrically connected with the outside on the printed board; the light guide column is adopted to guide light emitted by the patch LED on the printed board to the opening of the panel and the light-transmitting hole of the adhesive film, so that the exterior can see whether the patch LED is lightened. Although the LED printed board structure solves the problem that the production process flow caused by the plug-in LED is complex, the positioning and mounting process of a plurality of light guide columns is also complex. In addition, in order to solve crosstalk interference between adjacent patch LEDs, the non-light-conducting surfaces of the guide rail columns need to be blackened, which results in a complex processing process and high cost.

Disclosure of Invention

The invention provides an LED printed board structure and a manufacturing method thereof, which aim to avoid the problem of complicated production process flow caused by a plug-in LED; the problem of crosstalk interference between adjacent surface mounted LEDs is solved; the mounting structure and the assembly mode are simplified, so that the production process and the flow are simplified, full-automatic production is convenient to realize, and the production efficiency is improved; effectively reducing the cost of production materials.

In a first aspect, the present invention provides an LED printed board structure, which includes a printed board, and a panel made of an opaque material; the printed board is provided with a first surface and a second surface which are opposite, and the first surface of the printed board is provided with a plurality of patch LEDs; the panel is provided with a plurality of openings, the openings correspond to the patch LEDs one by one, and the size of each opening is not smaller than the cross section size of the corresponding patch LED; and the panel is buckled on the first surface of the printed board, and each patch LED is embedded into the corresponding opening. This LED printed structure still establishes the pad pasting that deviates from printing board one side on the panel including pasting, has a plurality of impermeable light transmission areas on this pad pasting, a plurality of light transmission areas and a plurality of paster LED one-to-one, and every light transmission area is relative with the paster LED position that corresponds.

In the scheme, the mode of arranging the patch LED on the printed board is adopted, so that the problem of complicated production process flow caused by the plug-in LED is avoided; through with the first face of opaque panel lock at the printing board, make during every paster LED imbeds corresponding trompil, later paste on the panel and establish the pad pasting, make adjacent paster LED separate through the longitudinal section of panel, the light that every paster LED sent only conducts the outside through the printing opacity region on the pad pasting to there is the problem of crosstalk interference between the adjacent paster LED to have been solved. And the sticking film stuck on the panel seals the open hole on the panel, so that the hole wall of the open hole, the sticking films which are opposite up and down and the printed board enclose each surface mounted LED into an impermeable space, the surface mounted LED is prevented from directly contacting with the outside air, and dustproof electrical insulation is realized. By adopting the scheme of the application, the generation process flow is as follows: solder paste printing → pasting → reflow soldering → AOI optical inspection → maintenance → board separation → assembly machine. Because a plurality of light guide columns are not needed, a wave-soldering process is not needed, the surface plate with the opening and the film with the light transmission area can be used for packaging the surface-mounted LED, more than half of process flows are reduced, manual plug-in and pin cutting processes are avoided, the mounting structure and the assembly mode are simplified, the production process and the flow are simplified, full-automatic production is convenient to achieve, and the production efficiency is improved. Because the price of the patch LED is far lower than that of the plug-in LED, the material production cost can be effectively reduced.

In a specific embodiment, a plurality of first pad areas are arranged on the first surface of the printed board, the plurality of first pad areas correspond to the plurality of patch LEDs one by one, and each patch LED is welded on the corresponding first pad area; and the cross-sectional dimension of each first pad region is not greater than the dimension of the corresponding opening, so that each first pad region is positioned in the corresponding opening. The second surface of the printed board is provided with a second pad area which is used for being electrically connected with the outside, and the second pad area is electrically connected with each first pad area through wiring and via holes in the inside of the printed board and on the second surface. The second pad area electrically connected with the outside is arranged on the second surface of the printed board, so that the whole first surface of the printed board is free of pads electrically connected with the outside, and the condition that a panel is buckled on the first surface of the printed board to avoid welding spots electrically connected with the outside is not needed to be considered. And the first pad area electrically connected with each patch LED is electrically connected to the second pad area through the wiring inside the printed board and on the second surface, so that the wiring is not required to be arranged on the first surface of the printed board, and the wiring on the first surface of the printed board is prevented from being scratched when the panel is buckled on the first surface of the printed board, thereby avoiding the defects of electric leakage and the like.

In a specific embodiment, the panel is a metal panel, and the advantage of good rigidity of a metal material is utilized to improve the protection effect on the printed board. The size of the cross section of each first pad area is smaller than that of the corresponding opening, so that the hole wall of each opening is spaced from the first pad area corresponding to the opening, the first pad area is prevented from being electrically connected with the opening of the metal panel, the electrical insulation between the first pad area and the metal panel is realized, and the problem of insulation short circuit caused by too short distance between the surface mounted LED, the printed board and the metal panel is solved; and no additional structural material is needed to be added, and the structure is simplified.

In a specific embodiment, the material of the adhesive film is a light-transmitting material, so that the whole adhesive film can transmit light, a plurality of scattered light-transmitting areas do not need to be additionally arranged, and the structure and the production process are simplified. The adhesive film can be a transparent PC film (Polycarbonate film for short), so that the light transmittance of the light-transmitting area is good, the electric insulation and dust prevention are realized, and the overall appearance effect is improved.

In a specific implementation mode, each light-transmitting area is provided with an impermeable light-transmitting hole towards one side of the panel, and each light-transmitting hole is opposite to the corresponding patch LED, so that light emitted by the patch LEDs has a larger divergence area through the light-transmitting holes, and a user can conveniently observe whether the patch LEDs are lightened.

In a specific embodiment, the size of each light-transmitting hole is larger than the size of the corresponding first pad area and smaller than the size of the corresponding opening, so that a good visual effect is obtained.

In a specific embodiment, at least two positioning holes are arranged on the printed board, and at least two positioning pins are arranged on one side of the panel, which faces the printed board. At least two positioning pins correspond to the at least two positioning holes one by one, and each positioning pin penetrates through the corresponding positioning hole to position the relative position between the printed board and the panel. Accurate positioning is realized, and the surface scratch of the printed board caused by the friction between the printed board and the panel in the installation process is prevented.

In a specific embodiment, a plurality of mounting holes are formed in the printed board, and a plurality of press riveting bolts are arranged on one side, facing the printed board, of the panel; wherein, the height of a plurality of pressure riveting bolts all is less than the height of every locating pin in at least two locating pins. The press riveting bolts are in one-to-one correspondence with the mounting holes, and each press riveting bolt penetrates through the corresponding mounting hole and then is in threaded connection with the nut, so that the printed board is fixed on the panel. The height of the positioning pin is larger than that of the rivet pressing screw, so that the positioning and mounting are guaranteed in the mounting process.

In a second aspect, the present invention further provides a method for manufacturing an LED printed board structure, the method including: providing a printed board, wherein the printed board is provided with a first surface and a second surface which are opposite; arranging a plurality of patch LEDs on a first surface of a printed board; a plurality of openings are formed in a panel made of opaque materials, the plurality of openings correspond to the plurality of patch LEDs one by one, and the size of each opening is not smaller than the size of the cross section of the corresponding patch LED; buckling a panel on the first surface of the printed board, and embedding each patch LED into the corresponding opening; one side of deviating from the printing board on the panel pastes and establishes the pad pasting, wherein, has a plurality of impenetrable printing opacity regions on the pad pasting, a plurality of printing opacity regions and a plurality of paster LED one-to-one, and every printing opacity region is relative with the paster LED position that corresponds.

In the scheme, the mode of arranging the patch LED on the printed board is adopted, so that the problem of complicated production process flow caused by the plug-in LED is avoided; through the first face with the opaque panel lock of printing board, make every paster LED imbed in the trompil that corresponds, later paste on the panel and establish the pad pasting, make adjacent paster LED separate through the longitudinal section of panel, the light that every paster LED sent only conducts the outside through the printing opacity region on the pad pasting to there is the problem of crosstalk interference between the adjacent paster LED to solved. And the sticking film stuck on the panel seals the open hole on the panel, so that the hole wall of the open hole, the sticking films which are opposite up and down and the printed board enclose each patch LED into an impermeable space, the patch LEDs are prevented from directly contacting with the outside air, and dust prevention and electrical insulation are realized. By adopting the scheme of the application, the generation process flow is as follows: solder paste printing → pasting → reflow soldering → AOI optical inspection → maintenance → board separation → assembly machine. Because a plurality of light guide columns are not needed, a wave-soldering process is not needed, the surface plate with the opening and the film with the light transmission area can be used for packaging the surface-mounted LED, more than half of process flows are reduced, manual plug-in and pin cutting processes are avoided, the mounting structure and the assembly mode are simplified, the production process and the flow are simplified, full-automatic production is convenient to achieve, and the production efficiency is improved. Because the price of the patch LED is far lower than that of the plug-in LED, the material production cost can be effectively reduced.

In one specific embodiment, a printed board is provided, the printed board having a first side and a second side opposite to each other, and the printed board comprises: providing a printed board body, wherein the printed board body is provided with a first surface and a second surface which are opposite; arranging a plurality of first pad areas on the first surface of the printed board body, wherein the plurality of first pad areas correspond to the plurality of surface mounted LEDs one by one, and the cross section size of each first pad area is not larger than the size of the corresponding opening; arranging a second pad area for being electrically connected with the outside on the second surface of the printed board; and electrically connecting the second pad area with each first pad area through the wiring and the via hole in the printed board body and on the second surface. Set up a plurality of paster LEDs at the first face of printing board and include: each of the plurality of patch LEDs is soldered on a corresponding first pad area. With the panel lock on the first face of printing board, and include in the trompil that every paster LED embedding corresponds: the panel is buckled on the first surface of the printed board, each patch LED is embedded into the corresponding opening, and each first pad area is located in the corresponding opening. The second pad area electrically connected with the outside is arranged on the second surface of the printed board, so that the whole first surface of the printed board is free of pads electrically connected with the outside, and the condition that a panel is buckled on the first surface of the printed board to avoid welding spots electrically connected with the outside is not needed to be considered. And the first pad area electrically connected with each patch LED is electrically connected to the second pad area through the wiring inside the printed board and on the second surface, so that the wiring is not required to be arranged on the first surface of the printed board, and the wiring on the first surface of the printed board is prevented from being scratched when the panel is buckled on the first surface of the printed board, thereby avoiding the defects of electric leakage and the like.

Drawings

FIG. 1 is a schematic diagram of an LED printed board structure in the prior art;

fig. 2 is a schematic view of another LED printed board structure in the prior art;

fig. 3 is an exploded view of an LED printed board structure according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a printed board according to an embodiment of the present invention;

FIG. 5 is a comparison graph of the size of the opening, the first pad area, and the light hole on the film according to the embodiment of the present invention;

FIG. 6 is an enlarged view, partially in section, of an LED printed board structure provided in accordance with an embodiment of the present invention when assembled together;

fig. 7 is a flowchart of a method for manufacturing an LED printed board structure according to an embodiment of the present invention;

fig. 8 is a flowchart of one step in a method for manufacturing an LED printed board structure according to an embodiment of the present invention.

Reference numerals:

10-printed board 11-first pad area 12-second pad area 121-socket

13-positioning hole 14-mounting hole 20-patch LED 30-panel

31-opening 32-positioning pin 33-rivet-pressing bolt 34-nut

35-side plate 40-film 41-light transmission area 42-light transmission hole

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to facilitate understanding of the LED printed board structure provided in the embodiment of the present invention, an application scenario of the LED printed board structure provided in the embodiment of the present invention is first described below, where the LED printed board structure is applied to an electronic device that needs an LED indicator, so as to represent different states of the electronic device by turning on or off the LED indicator. The LED board structure will be described in detail with reference to the accompanying drawings.

Referring to fig. 3, 4, 5 and 6, an LED printed board 10 structure provided by an embodiment of the present invention includes a printed board 10, and a panel 30 made of an opaque material; the printed board 10 has a first surface and a second surface opposite to each other, and the first surface of the printed board 10 is provided with a plurality of patch LEDs 20; a plurality of openings 31 are formed in the panel 30, the plurality of openings 31 correspond to the plurality of patch LEDs 20 one by one, and the size of each opening 31 is not smaller than the cross-sectional size of the corresponding patch LED 20; and the panel 30 is snapped onto the first side of the printed board 10 with each of the patch LEDs 20 inserted into a corresponding opening 31. The LED printing structure further includes a film 40 attached to a surface of the panel 30 facing away from the printed board 10, the film 40 has a plurality of opaque transparent regions 41, the transparent regions 41 correspond to the patch LEDs 20 one-to-one, and each transparent region 41 is opposite to the corresponding patch LED 20.

In the scheme, the patch LED20 is arranged on the printed board 10, so that the problem of complicated production process flow caused by the insertion of the LED is avoided; each patch LED20 is embedded into the corresponding opening 31 by fastening the opaque panel 30 to the first surface of the printed board 10, and then the adhesive film 40 is attached to the panel 30, so that the adjacent patch LEDs 20 are separated by the longitudinal section of the panel 30, and the light emitted by each patch LED20 is transmitted to the outside only through the light-transmitting area 41 on the adhesive film 40, thereby solving the problem of crosstalk interference between the adjacent patch LEDs 20. The adhesive film 40 attached to the panel 30 seals the opening 31 of the panel 30, so that the hole wall of the opening 31, the adhesive films 40 facing up and down, and the printed board 10 enclose each of the chip LEDs 20 into an impermeable space, thereby preventing the chip LED20 from directly contacting with the outside air, and achieving dust prevention and electrical insulation. By adopting the scheme of the application, the generation process flow is as follows: solder paste printing → pasting → reflow soldering → AOI optical inspection → maintenance → board separation → assembly machine. Because a plurality of light guide columns are not needed, a wave-soldering process is not needed, the surface plate 30 with the opening 31 and the adhesive film 40 with the light transmission area 41 can be used for packaging the patch LED20, the process flow is reduced by more than half, manual plug-in and pin cutting processes are avoided, the installation structure and the assembly mode are simplified, the production process and the flow are simplified, full-automatic production is convenient to realize, and the production efficiency is improved. Because the price of the patch LED20 is far lower than that of the plug-in LED, the production material cost can be effectively reduced. The above-described respective structures will be described in detail with reference to the accompanying drawings.

When printed board 10 is provided, printed board 10 has first and second surfaces opposite to each other, as shown in fig. 3 and 4. A plurality of patch LEDs 20 are arranged on printed board 10, and each patch LED20 can be specifically attached to printed board 10 by using an SMT process, thereby avoiding the problem of complicated production process flow caused by inserting LEDs. Referring to fig. 5 and 6, a plurality of first pad regions 11 may be disposed on the first surface of the printed board 10, the plurality of first pad regions 11 correspond to the plurality of chip LEDs 20 one-to-one, and each chip LED20 is soldered on the corresponding first pad region 11, so as to electrically connect each chip LED20 to the printed board 10. In determining the number of the printed patch LEDs 20, the number of the patch LEDs 20 may be any of 2, 3, 5, 10, 20, 30, 50, etc. not less than 2. Referring to fig. 3 and 4, a plurality of patch LEDs 20 may be arranged on printed board 10 in an array manner.

When the panel 30 is disposed, the material of the panel 30 is opaque material, and may specifically be opaque plastic, metal material, etc., in this case, the panel 30 is a plastic panel 30, a metal panel 30, etc. When the material of the panel 30 is a metal material, the advantage of good rigidity of the metal material can be utilized to improve the protection effect on the printed board 10. As shown in fig. 3, 5 and 6, a plurality of openings 31 are formed in the panel 30, and each opening 31 penetrates through two opposite surfaces of the panel 30. The plurality of openings 31 correspond one-to-one to the plurality of patch LEDs 20, and each patch LED20 is fitted into the corresponding opening 31 when the panel 30 is fastened to the first surface of the printed board 10. That is, the number of the openings 31 on the panel 30 is equal to the number of the chip LEDs 20, the distribution mode of the plurality of openings 31 is the same as the distribution mode of the plurality of chip LEDs 20, and the size of each opening 31 is not smaller than the cross-sectional size of the corresponding chip LED20, so that when the panel 30 is fastened on the first surface of the printed board 10, each chip LED20 is embedded in the corresponding opening 31. The panel 30 is fastened on the first surface of the printed board 10, that is, the surface of the panel 30 is in close contact with the first surface of the printed board 10, and other structures and intentionally arranged space are not arranged between the panel 30 and the first surface, so that the adjacent patch LEDs 20 are separated by the longitudinal section of the panel 30, and light emitted by each patch LED20 is only transmitted to the outside through the light-transmitting area 41 on the adhesive film 40, thereby solving the problem of crosstalk interference between the adjacent patch LEDs 20.

In specifically sizing each aperture 31 with the cross-sectional dimension of the corresponding patch LED20, the size of each aperture 31 may be made equal to the cross-sectional dimension of the corresponding patch LED 20. Of course, referring to fig. 5 and 6, it is also possible to make the size of each aperture 31 larger than the cross-sectional size of the corresponding patch LED 20. As shown in fig. 5 and 6, the size of each first pad region 11 may be larger than the size of the corresponding patch LED20, so that each patch LED20 can be well electrically connected to the pads of the first pad region 11.

Each first land area 11 may have a cross-sectional dimension not greater than a dimension of the corresponding opening 31, and each first land area 11 may be located in the corresponding opening 31 when the panel 30 is snapped on the first surface of the printed board 10. Specifically, the cross-sectional dimension of each first pad region 11 may be made equal to the dimension of the corresponding opening 31. Of course, referring to fig. 5 and 6, the size of each opening 31 may also be larger than the size of the corresponding first pad region 11, that is, the cross-sectional size of each first pad region 11 is smaller than the size of the corresponding opening 31, so that when the panel 30 is fastened to the first surface of the printed board 10, the hole wall of each opening 31 is spaced from the first pad region 11 corresponding to the opening 31, thereby preventing the first pad region 11 and the opening 31 of the metal panel 30 from being electrically connected, realizing electrical insulation between the first pad region 11 and the metal panel 30, and solving the problem of insulation short circuit caused by too close distance between the patch LED20 and the printed board 10 and the metal panel 30; and no additional structural material is needed to be added, and the structure is simplified. Specifically, the size of the opening 31 on the panel 30 may be larger than the size of the first pad area 11 by more than 1mm, and the distance between the hole wall of the opening 31 on the panel 30 and the extension of the first pad area 11 is larger than 1mm, so as to ensure the electrical insulation and isolation between the opening 31 of the metal panel 30 and the first pad area 11, and solve the problem of insulation short circuit caused by too close distance between the patch LED20, the printed board 10 and the metal panel 30.

When the patch LED20 on the printed board 10 is electrically connected to the outside, referring to fig. 3 and 6, a second pad region 12 for electrically connecting to the outside may be provided on the second surface of the printed board 10, and specifically, the second pad region 12 may be electrically connected to an external power supply and may also be electrically connected to an external control circuit. Referring to fig. 3, a patch socket 121 may be electrically connected to the second pad area 12 for plug connection with an external power source or control circuit, etc., so as to facilitate electrical connection between the LED board structure and the outside. In implementing the electrical connection of the second pad region 12 to each of the chip LEDs 20, the second pad region 12 is electrically connected to each of the first pad regions 11 to implement the electrical connection of the second pad region 12 to each of the chip LEDs 20. The second pad area 12 and each first pad area 11 may be electrically connected through the routing and via holes inside the printed board 10 and on the second side, that is, only the first pad area 11 is located on the first side of the printed board 10, and the pad on the first pad area 11 is electrically connected to the second pad area 12 on the second side of the printed board 10 through the routing and via holes inside the printed board 10 and on the second side of the printed board 10. By arranging the second pad region 12 electrically connected with the outside on the second surface of the printed board 10, the entire first surface of the printed board 10 is free from pads electrically connected with the outside, and therefore, when the panel 30 is fastened to the first surface of the printed board 10, the situation of avoiding the solder points electrically connected with the outside is not considered. And the first pad area 11 electrically connected with each patch LED20 is electrically connected to the second pad area 12 through the wiring inside the printed board 10 and on the second side, and there is no need to set a wiring on the first side of the printed board 10, which prevents the wiring on the first side of the printed board 10 from being scratched when the panel 30 is fastened to the first side of the printed board 10, thereby causing defects such as electric leakage.

It should be understood that the second pad region 12 is not limited to be disposed on the second surface of the printed board 10, and the second pad region 12 may also be disposed on the first surface of the printed board 10, in this case, an avoiding groove for avoiding the second pad region 12 needs to be additionally formed on the panel 30 to avoid a solder point electrically connected to the outside; it is also necessary to increase the thickness of the panel 30 so that the external wires are electrically connected to the pads of the second pad area 12 by passing through the avoiding grooves on the second pad area 12. Similarly, the first pad area 11 and the second pad area 12 may be electrically connected through the routing and via holes inside the printed board 10 and on the second side, and the routing may not be provided on the first side of the printed board 10, so as to prevent the panel 30 from scratching the routing on the first side of the printed board 10 when being fastened to the first side of the printed board 10, thereby causing defects such as electric leakage.

Referring to fig. 3, at least two positioning holes 13 may be provided on printed board 10, and at least two positioning pins 32 may be provided on panel 30 toward printed board 10 side. At least two positioning pins 32 correspond to at least two positioning holes 13 one to one, and each positioning pin 32 passes through a corresponding positioning hole 13 to position the relative position between printed board 10 and panel 30. Accurate positioning is realized, and surface scratch of the printed board 10 caused by friction between the printed board 10 and the panel 30 in the installation process is prevented. Specifically, when the number of the positioning holes 13 and the positioning pins 32 is determined, the number of the positioning holes 13 and the positioning pins 32 may be any value not less than 2, such as 2, 3, 4, or the like.

Referring to fig. 3 and 4, a plurality of mounting holes 14 may be formed in printed board 10, a plurality of press-riveting bolts 33 may be formed on panel 30 toward printed board 10, a plurality of press-riveting bolts 33 may be in one-to-one correspondence with the plurality of mounting holes 14, and each press-riveting bolt 33 may be screwed with a nut 34 after passing through the corresponding mounting hole 14 to fix printed board 10 to panel 30. That is, printed board 10 is fixed to panel 30 by caulking bolt 33 and nut 34. Of course, printed board 10 may be fixed to panel 30 by means such as snap fit, adhesive, or the like. In addition, the heights of the plurality of press-riveting bolts 33 can be lower than the height of each positioning pin 32 in the at least two positioning pins 32, that is, the height of each positioning pin 32 is higher than the height of any press-riveting bolt 33, so that the press-riveting bolts 33 are ensured to be positioned and then installed in the installation process, and the first surface of the printed board 10 is prevented from being scratched by the press-riveting bolts 33 in the positioning process.

In addition, referring to fig. 3, a side plate 35 extending in a direction toward printed board 10 may be connected at an edge of panel 30, and side plate 35 surrounds printed board 10 to protect printed board 10.

When the adhesive film 40 is provided, referring to fig. 3, 5 and 6, the adhesive film 40 is attached to a surface of the panel 30 away from the printed board 10, that is, the printed board 10, the panel 30 and the adhesive film 40 are sequentially stacked up and down, and the panel 30 is located between the printed board 10 and the adhesive film 40. The adhesive film 40 has a plurality of opaque light-transmitting regions 41, the plurality of light-transmitting regions 41 correspond to the plurality of patch LEDs 20 one by one, and each light-transmitting region 41 is opposite to the corresponding patch LED 20. It should be noted that the opaque light-transmitting region 41 is not air-permeable but can transmit light. The number of the light-transmitting regions 41 is equal to that of the patch LEDs 20, and the light-transmitting regions 41 are distributed in the same manner as that of the patch LEDs 20, so that when the adhesive film 40 is attached to the panel 30, each light-transmitting region 41 is opposite to the corresponding patch LED20, and light emitted from each patch LED20 is transmitted to the outside through the corresponding light-transmitting region 41. The adhesive film 40 attached to the panel 30 can seal the opening 31 of the panel 30, so that the hole wall of the opening 31, the adhesive film 40 facing up and down, and the printed board 10 enclose each of the chip LEDs 20 into an impermeable space, thereby preventing the chip LED20 from directly contacting with the outside air, and achieving dust prevention and electrical insulation. In addition, the generation process flow of the scheme of the application is as follows: solder paste printing → pasting → reflow soldering → AOI optical inspection → maintenance → board separation → assembly machine. Because a plurality of light guide columns are not needed, a wave-soldering process is not needed, the surface plate 30 with the opening 31 and the film 40 with the light transmission area 41 can be used for packaging the patch LED20, more than half of process flow is reduced, manual plug-in and pin shearing processes are avoided, the installation structure and the assembly mode are simplified, the production process and flow are simplified, full-automatic production is convenient to achieve, and the production efficiency is improved. Because the price of the patch LED20 is far lower than that of the plug-in LED, the production material cost can be effectively reduced.

In addition, a light-transmitting material can be used as a raw material of the adhesive film 40, so that the whole adhesive film 40 can transmit light, and the plurality of light-transmitting areas 41 are different areas on the adhesive film 40, so that a plurality of scattered light-transmitting areas 41 do not need to be additionally arranged, and the structure and the production process are simplified. The film 40 may be a transparent PC film, so that the light-transmitting region 41 has good light transmittance, is electrically insulated and dustproof, and improves the overall appearance. Of course, the adhesive film 40 may be formed of a plurality of transparent regions 41 and opaque regions 41 filled between the transparent regions 41.

Referring to fig. 6, an opaque light hole 42 is formed in each light-transmitting region 41 on a side facing the panel 30, and each light hole 42 is opposite to the corresponding patch LED20, that is, by forming an opaque blind hole as the light hole 42 in each light-transmitting region 41 on a side facing the panel 30, light emitted from the patch LED20 has a larger divergence region through the light hole 42, which is convenient for a user to observe whether the patch LED20 is lit. Referring to fig. 5, the size of each light-transmitting hole 42 may be made larger than the size of the corresponding first pad region 11 and smaller than the size of the corresponding opening 31 to obtain a good visual effect. Of course, the adhesive film 40 may be formed in a film structure having a uniform thickness, and the light-transmitting hole 42 may not be formed therein, but the light may be transmitted to the outside through the light-transmitting region 41 having a uniform thickness opposite to the position of the opening 31 of the panel 30.

By adopting the mode of arranging the patch LED20 on the printed board 10, the problem of complicated production process flow caused by the plug-in LED is avoided; each patch LED20 is embedded into the corresponding opening 31 by fastening the opaque panel 30 to the first surface of the printed board 10, and then the adhesive film 40 is attached to the panel 30, so that the adjacent patch LEDs 20 are separated by the longitudinal section of the panel 30, and the light emitted by each patch LED20 is transmitted to the outside only through the light-transmitting area 41 on the adhesive film 40, thereby solving the problem of crosstalk interference between the adjacent patch LEDs 20. The adhesive film 40 attached to the panel 30 seals the opening 31 of the panel 30, so that the hole wall of the opening 31, the adhesive film 40 and the printed board 10 which are opposite to each other vertically enclose each of the chip LEDs 20 into an impermeable space, thereby preventing the chip LEDs 20 from directly contacting with the outside air, and achieving dust prevention and electrical insulation. By adopting the scheme of the application, the generation process flow is as follows: solder paste printing → pasting → reflow soldering → AOI optical inspection → maintenance → board separation → assembly machine. Because a plurality of light guide columns are not needed, a wave-soldering process is not needed, the surface plate 30 with the opening 31 and the adhesive film 40 with the light transmission area 41 can be used for packaging the patch LED20, the process flow is reduced by more than half, manual plug-in and pin cutting processes are avoided, the installation structure and the assembly mode are simplified, the production process and the flow are simplified, full-automatic production is convenient to realize, and the production efficiency is improved. Because the price of the patch LED20 is far lower than that of the plug-in LED, the production material cost can be effectively reduced.

In addition, an embodiment of the present invention further provides a manufacturing method of a structure of an LED printed board 10, and with reference to fig. 3 to 7, the manufacturing method includes:

step 1: providing a printed board 10, wherein the printed board 10 is provided with a first surface and a second surface which are opposite;

step 2: arranging a plurality of patch LEDs 20 on a first side of printed board 10;

step 3: a plurality of openings 31 are formed in a panel 30 made of an opaque material, the plurality of openings 31 correspond to the plurality of patch LEDs 20 one by one, and the size of each opening 31 is not smaller than the cross-sectional size of the corresponding patch LED 20;

step 4: the panel 30 is buckled on the first surface of the printed board 10, and each patch LED20 is embedded in the corresponding opening 31;

step 5: an adhesive film 40 is attached to a surface of the panel 30 facing away from the printed board 10, wherein the adhesive film 40 has a plurality of opaque light-transmitting regions 41, the plurality of light-transmitting regions 41 correspond to the plurality of patch LEDs 20 one-to-one, and each light-transmitting region 41 is opposite to a corresponding patch LED 20.

In the scheme, the patch LED20 is arranged on the printed board 10, so that the problem of complicated production process flow caused by the insertion of the LED is avoided; each patch LED20 is embedded into the corresponding opening 31 by buckling the lightproof panel 30 on the first surface of the printed board 10, then the adhesive film 40 is adhered on the panel 30, the adjacent patch LEDs 20 are separated by the longitudinal section of the panel 30, and the light emitted by each patch LED20 is only transmitted to the outside through the light-transmitting area 41 on the adhesive film 40, so that the problem of crosstalk interference between the adjacent patch LEDs 20 is solved. The adhesive film 40 attached to the panel 30 seals the opening 31 of the panel 30, so that the hole wall of the opening 31, the adhesive films 40 facing up and down, and the printed board 10 enclose each of the chip LEDs 20 into an impermeable space, thereby preventing the chip LED20 from directly contacting with the outside air, and achieving dust prevention and electrical insulation. By adopting the scheme of the application, the generation process flow is as follows: solder paste printing → pasting → reflow soldering → AOI optical inspection → maintenance → board separation → assembly machine. Because a plurality of light guide columns are not needed, a wave-soldering process is not needed, the surface plate 30 with the opening 31 and the adhesive film 40 with the light transmission area 41 can be used for packaging the patch LED20, the process flow is reduced by more than half, manual plug-in and pin cutting processes are avoided, the installation structure and the assembly mode are simplified, the production process and the flow are simplified, full-automatic production is convenient to realize, and the production efficiency is improved. Because the price of the patch LED20 is far lower than that of the plug-in LED, the production material cost can be effectively reduced.

When a printed board 10 is provided, and the printed board 10 has a first surface and a second surface opposite to each other, referring to fig. 8, a printed board 10 body may be provided, and the printed board 10 body has a first surface and a second surface opposite to each other. Next, a plurality of first pad regions 11 are provided on the first surface of the printed board 10 body, the plurality of first pad regions 11 correspond to the plurality of patch LEDs 20 one to one, and the cross-sectional size of each first pad region 11 is not larger than the size of the corresponding opening 31. Next, a second pad region 12 for electrical connection with the outside is provided on the second side of the printed board 10. Next, the second pad region 12 and each of the first pad regions 11 are electrically connected through traces and vias inside the body of the printed board 10 and on the second side. Next, providing a plurality of patch LEDs 20 on the first side of the printed board 10 includes: each of the plurality of patch LEDs 20 is soldered 20 on the corresponding first pad area 11. At this time, when the panel 30 is fastened to the first surface of the printed board 10 and each of the patch LEDs 20 is inserted into the corresponding opening 31, specifically, when the panel 30 is fastened to the first surface of the printed board 10, each of the patch LEDs 20 is inserted into the corresponding opening 31 and each of the first pad regions 11 is located in the corresponding opening 31. By arranging the second pad region 12 electrically connected with the outside on the second surface of the printed board 10, the entire first surface of the printed board 10 is free from pads electrically connected with the outside, and therefore, when the panel 30 is fastened to the first surface of the printed board 10, the situation of avoiding the solder points electrically connected with the outside is not considered. And the first pad area 11 electrically connected with each patch LED20 is electrically connected to the second pad area 12 through the wiring inside the printed board 10 and on the second side, and there is no need to set a wiring on the first side of the printed board 10, which prevents the wiring on the first side of the printed board 10 from being scratched when the panel 30 is fastened to the first side of the printed board 10, thereby causing defects such as electric leakage.

The specific manufacturing method refers to the foregoing description of the structural part of the LED printed board 10, and is not described herein again.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An LED printed board structure, comprising:

the LED packaging structure comprises a printed board with a first surface and a second surface which are opposite, wherein the first surface of the printed board is provided with a plurality of patch LEDs;

the panel is made of light-tight materials, and a plurality of openings are formed in the panel; the openings correspond to the patch LEDs one by one, and the size of each opening is not smaller than the cross section size of the corresponding patch LED; the panel is buckled on the first surface of the printed board, and each patch LED is embedded into the corresponding opening;

the sticking film is stuck on one surface, which is far away from the printed board, of the panel, and a plurality of impermeable light-transmitting areas are arranged on the sticking film; the plurality of light-transmitting areas correspond to the plurality of patch LEDs one by one, and each light-transmitting area is opposite to the corresponding patch LED;

the first surface of the printed board is provided with a plurality of first pad areas, the plurality of first pad areas correspond to the plurality of patch LEDs one by one, and each patch LED is welded on the corresponding first pad area; the cross section size of each first bonding pad area is not larger than that of the corresponding opening, so that each first bonding pad area is positioned in the corresponding opening;

the second surface of the printed board is provided with a second pad area used for being electrically connected with the outside, and the second pad area is electrically connected with each first pad area through wiring and via holes in the inside of the printed board and on the second surface;

the panel is a metal panel; the cross-sectional dimension of each first pad region is less than the dimension of the corresponding opening, such that the hole wall of each opening is spaced from the first pad region corresponding to the opening.

2. The LED board structure of claim 1, wherein the material of the film is a light-transmissive material.

3. The LED board structure of claim 2, wherein each light-transmitting area is provided with an opaque light-transmitting hole on a side facing the panel, and each light-transmitting hole is located opposite to a corresponding patch LED.

4. The LED board structure of claim 3, wherein each light-transmitting hole has a size larger than a size of the corresponding first pad area and smaller than a size of the corresponding opening.

5. The LED printed board structure of claim 1, wherein said printed board has at least two positioning holes, and said panel has at least two positioning pins on a side thereof facing said printed board;

the at least two positioning pins correspond to the at least two positioning holes one to one; each positioning pin passes through the corresponding positioning hole so as to position the relative position between the printed board and the panel.

6. The LED printed board structure of claim 5, wherein the printed board has a plurality of mounting holes, and the panel has a plurality of press-fit bolts on a side thereof facing the printed board; wherein the heights of the plurality of pressure riveting bolts are all lower than the height of each positioning pin in the at least two positioning pins;

the plurality of press riveting bolts correspond to the plurality of mounting holes one to one; and each pressure riveting bolt penetrates through the corresponding mounting hole and then is in threaded connection with a nut so as to fix the printed board on the panel.

7. A manufacturing method of an LED printed board structure is characterized by comprising the following steps:

providing a printed board, wherein the printed board is provided with a first surface and a second surface which are opposite;

arranging a plurality of patch LEDs on the first surface of the printed board;

a plurality of openings are formed in a panel made of light-tight materials, the openings correspond to the patch LEDs one by one, and the size of each opening is not smaller than the size of the cross section of the corresponding patch LED;

buckling the panel on the first surface of the printed board, and embedding each patch LED into the corresponding opening;

a pasting film is pasted on one surface, which is far away from the printed board, of the panel, wherein the pasting film is provided with a plurality of impermeable light-transmitting areas; the plurality of light-transmitting areas correspond to the plurality of patch LEDs one by one, and each light-transmitting area is opposite to the corresponding patch LED;

wherein, providing a printed board, the printed board has relative first face and second face and includes:

providing a printed board body, wherein the printed board body is provided with a first surface and a second surface which are opposite;

arranging a plurality of first pad areas on the first surface of the printed board body, wherein the plurality of first pad areas correspond to the plurality of patch LEDs one by one, and the cross section size of each first pad area is not larger than that of a corresponding opening;

arranging a second pad area for being electrically connected with the outside on the second surface of the printed board;

electrically connecting the second pad area with each first pad area through wiring and via holes in the printed board body and on the second surface;

set up a plurality of paster LEDs at the first face of printing board include: soldering each of the plurality of patch LEDs to a corresponding first pad area;

the will the panel lock is in on the first face of printing board, and include in the trompil that every paster LED embedding corresponds: the panel is buckled on the first surface of the printed board, each patch LED is embedded into the corresponding opening, and each first pad area is located in the corresponding opening;

and the panel is a metal panel; the cross-sectional dimension of each first pad region is less than the dimension of the corresponding opening, such that the hole wall of each opening is spaced from the first pad region corresponding to the opening.