CN204085274U - Vapor structure - Google Patents
Vapor structure Download PDFInfo
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- CN204085274U CN204085274U CN201420504337.1U CN201420504337U CN204085274U CN 204085274 U CN204085274 U CN 204085274U CN 201420504337 U CN201420504337 U CN 201420504337U CN 204085274 U CN204085274 U CN 204085274U
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- equalizing plate
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- 239000012530 fluid Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000002470 thermal conductor Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【技术领域】 【Technical field】
一种均温板结构,尤指一种可提升均温板支撑度及热传导效率的均温板结构。 A vapor chamber structure, especially a vapor chamber structure that can improve the support and heat transfer efficiency of the vapor chamber.
【背景技术】 【Background technique】
现行行动装置、个人电脑、伺服器、通信机箱皆因运算效能提升而内部计算单元所产生之热量亦随着提升,则相对的更加需要散热单元来辅助其散热,绝大多数业者选用散热器、热管、均温板等散热元件搭配风扇进行辅助散热,并当遇到需大面积进行散热时则选用均温板吸热并搭配散热器及散热风扇进行强制散热,由于各散热元件间需紧密贴合防止热阻现象之发生,而均温板为一扁平状板体,并内部设置一提供汽液循环的腔室进行热传导,并因为了防止扁平状之均温板受压力或受热后产生膨胀或变形,则腔室内设置有复数根支撑柱体做为支撑均温板之腔室使用。 The current mobile devices, personal computers, servers, and communication chassis are all due to the improvement of computing performance, and the heat generated by the internal computing unit is also increasing. Relatively, a cooling unit is needed to assist in cooling. Most companies use radiators, Cooling elements such as heat pipes and vapor chambers are used together with fans for auxiliary heat dissipation, and when a large area is required for heat dissipation, the vapor chamber is used to absorb heat and cooperate with radiators and cooling fans for forced heat dissipation. To prevent the occurrence of thermal resistance, the vapor chamber is a flat plate with a chamber for vapor-liquid circulation inside to conduct heat conduction, and to prevent the flat vapor chamber from expanding when it is under pressure or heated Or deformed, a plurality of supporting columns are set in the chamber as a chamber for supporting the chamber.
均温板为一种面与面之热量传递,并且前述说明中为了防止均温板受热膨胀或受外力压扁变形设置有复数支撑柱体,但于制程上则需额外增加制造工时及制造成本(支撑柱体),且若选用复数铜柱外部组合烧结环,铜柱作为支撑作用,烧结环仅作为回流循环,其底部平面度控制不易,或使用多沟槽铜柱,该多沟槽之铜柱同作为支撑与回流循环作用,其底部平面度亦相同控制不易。 The vapor chamber is a surface-to-surface heat transfer, and in the above description, multiple support columns are provided to prevent the vapor chamber from being heated and expanded or crushed and deformed by external forces, but additional manufacturing hours and manufacturing costs are required in the manufacturing process (Support cylinder), and if a plurality of copper pillars are used to combine sintered rings, the copper pillars are used as supports, and the sintered ring is only used as a reflow cycle. It is difficult to control the flatness of the bottom, or use multi-groove copper pillars. The copper pillars also serve as supports and recirculation functions, and the flatness of the bottom is also difficult to control. the
原先技术虽解决变形等问题但却增加了制造工时及成本以及底部平面度控制不易等问题,故仍须针对如何降低制造成本此项问题进行深讨。 Although the original technology solves the problems such as deformation, it increases the man-hours and costs of manufacturing, and it is difficult to control the flatness of the bottom. Therefore, it is still necessary to conduct in-depth discussions on how to reduce the manufacturing cost. the
【实用新型内容】 【Content of utility model】
为有效解决上述之问题,本实用新型之主要目的,提供一种均温板结构,包含:一本体,具有一腔室,该腔室具有一第一侧及一第二侧及一板状连接体,该板状连接体轴向两端分别连接该第一、二侧,所述板状连接体径向外侧周缘设有一第一毛细结构层,所述腔室内具有工作液体。 In order to effectively solve the above problems, the main purpose of this utility model is to provide a vapor chamber structure, including: a body with a chamber, the chamber has a first side and a second side and a plate-shaped connection body, the axial ends of the plate-shaped connecting body are respectively connected to the first and second sides, a first capillary structure layer is provided on the radially outer periphery of the plate-shaped connecting body, and a working liquid is contained in the chamber.
所述本体更具有一第一板体及一第二板体,所述第一、二板体对应盖合共同界定前述腔室。 The body further has a first board and a second board, and the first and second boards are correspondingly covered and jointly define the aforementioned cavity. the
所述板状连接体为一金属板体。 The plate connector is a metal plate. the
所述板状连接体为一铜材质或一铝材质或导热良导体其中任一。 The plate connector is any one of copper material, aluminum material or good thermal conductor. the
所述第一毛细结构层为一烧结粉末体或沟槽其中任一。 The first capillary structure layer is any one of a sintered powder body or grooves. the
所述连接体呈正方形或矩形或梯形或圆形等几何形状其中任一。 The connecting body is in any geometric shape such as square, rectangle, trapezoid, or circle. the
更具有一受热区凹设于前述第一、二侧其中任一,所述板状连接体设置于该受热区,所述第一、二侧更设有一第二毛细结构层,并该受热区之第二毛细结构层较其他非受热区之区域厚度厚。 There is also a heat receiving area recessed on any one of the first and second sides, the plate-shaped connector is arranged on the heat receiving area, and a second capillary structure layer is further provided on the first and second sides, and the heat receiving area The thickness of the second capillary structure layer is thicker than that of other non-heated regions. the
所述板状连接体外缘更具有复数凹槽。 The edge of the plate-shaped connecting body further has a plurality of grooves. the
所述第一毛细结构层呈正方形或矩形或梯形或圆形等几何形状其中任一。 The first capillary structure layer is in any geometric shape such as square, rectangle, trapezoid, or circle. the
所述第一毛细结构层更具有一倾角。 The first capillary structure layer further has an inclination angle. the
透过本实用新型均温板结构除可解决习知均温板受热膨胀变形或受压力压缩变形以及支撑体底部平面度不易控制等问题外,亦具有达到节省制造工时及提升热传效率等优点者。 Through the structure of the vapor chamber of the utility model, in addition to solving the problems of thermal expansion deformation or pressure compression deformation of the conventional temperature chamber, and difficulty in controlling the flatness of the bottom of the support body, it also has the advantages of saving manufacturing man-hours and improving heat transfer efficiency. By. the
【附图说明】 【Description of drawings】
图1为本实用新型均温板结构之第一实施例之立体分解图; Fig. 1 is the three-dimensional exploded view of the first embodiment of the structure of the uniform temperature plate of the present invention;
图2为本实用新型均温板结构之第一实施例之组合图剖视图; Fig. 2 is a cross-sectional view of the combined view of the first embodiment of the structure of the uniform temperature plate of the present invention;
图3为本实用新型均温板结构之第二实施例之组合图剖视图; Fig. 3 is a cross-sectional view of the combination diagram of the second embodiment of the structure of the uniform temperature plate of the present invention;
图4为本实用新型均温板结构之第三实施例之组合图剖视图; Fig. 4 is the sectional view of the assembly diagram of the third embodiment of the structure of the uniform temperature plate of the present invention;
图5为本实用新型均温板结构之第四实施例之组合图剖视图; Fig. 5 is a cross-sectional view of the combination diagram of the fourth embodiment of the structure of the uniform temperature plate of the present invention;
图6为本实用新型均温板结构示意图。 Fig. 6 is a schematic diagram of the structure of the uniform temperature plate of the present invention.
图中各附图标记对应的构件名称为: The component names corresponding to the reference signs in the figure are:
本体1 Ontology 1
第一板体1a The first board 1a
第二板体1b Second board body 1b
腔室11 Chamber 11
第一侧111 first side 111
第二侧112 second side 112
板状连接体12 plate connector 12
凹槽121 Groove 121
第一毛细结构层13 First capillary layer 13
倾角131 Dip 131
受热区14 Heating zone 14
第二毛细结构层15 Second capillary layer 15
工作液体2 working fluid 2
汽态之工作流体21 Vapor working fluid 21
液态之工作流体22 Liquid Working Fluid 22
热源3。 heat source 3.
【具体实施方式】 【Detailed ways】
本实用新型之上述目的及其结构与功能上的特性,将依据所附图式之较佳实施例予以说明。 The above-mentioned purpose of the utility model and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.
如图1、2所示,为本实用新型之均温板结构之第一实施例之立体分解及组合图剖视图,如图所示,所述均温板结构,具有一本体1; As shown in Figures 1 and 2, it is a three-dimensional decomposition and a cross-sectional view of the first embodiment of the chamber structure of the present invention. As shown in the figure, the chamber structure has a body 1;
所述本体1具有一腔室11,该腔室11具有一第一侧111及一第二侧112及一板状连接体12,该板状连接体12轴向两端分别连接该第一、二侧111、112,所述板状连接体12径向外侧周缘设有一第一毛细结构层13,所述腔室11内具有工作液体2,所述第一毛细结构层13为一烧结粉末体。 The body 1 has a chamber 11, the chamber 11 has a first side 111, a second side 112 and a plate-shaped connecting body 12, the two axial ends of the plate-shaped connecting body 12 are respectively connected to the first, Two sides 111, 112, a first capillary structure layer 13 is provided on the radially outer periphery of the plate-shaped connecting body 12, the working liquid 2 is inside the chamber 11, and the first capillary structure layer 13 is a sintered powder body .
所述本体1更具有一第一板体1a及一第二板体1b,所述第一、二板体1a、1b对应盖合共同界定前述腔室11。 The main body 1 further has a first plate body 1a and a second plate body 1b, and the first and second plate bodies 1a and 1b are correspondingly covered and jointly define the aforementioned cavity 11 . the
所述板状连接体12为一金属板体,并所述板状连接体12为一铜材质或一铝材质或导热良导体其中任一,本实施例以铜材质作为说明实施例,但不引以为限。 The plate-shaped connector 12 is a metal plate, and the plate-shaped connector 12 is made of a copper material or an aluminum material or any one of a good thermal conductor. As far as possible. the
所述板状连接体12呈正方形或矩形或梯形或圆形等几何形状其中任一,本实施例以正方形作为说明实施例,但并不引以为限。 The plate-shaped connecting body 12 is in any geometric shape such as square, rectangle, trapezoid, or circle. In this embodiment, a square is used as an illustrative example, but it is not limited thereto. the
如图3所示,为本实用新型之均温板结构之第二实施例之组合图剖视图,如图所示,本实施例部分结构与前述第一实施例相同,故在此将不再赘述,惟本实施例与前述第一实施例之不同处为该本体1更具有一受热区14凹设于前述第一、二侧111、112其中任一,本实施例之受热区14凹设于该第一侧111,所述板状连接体12设置于该受热区14,所述第一、二侧111、112更设有一第二毛细结构层15,并该受热区14之第二毛细结构层15较其他非受热区14之区域厚度厚。 As shown in Figure 3, it is a cross-sectional view of the combined view of the second embodiment of the uniform temperature plate structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that the body 1 further has a heat receiving area 14 recessed on any of the aforementioned first and second sides 111, 112, and the heat receiving area 14 of this embodiment is recessed on the The first side 111, the plate-like connector 12 is arranged in the heat receiving area 14, the first and second sides 111, 112 are further provided with a second capillary structure layer 15, and the second capillary structure of the heat receiving area 14 The layer 15 is thicker than other areas of the non-heated area 14 . the
如图4所示,为本实用新型之均温板结构之第三实施例之立体分解图,如图所示,本实施例部分结构与前述第一实施例相同,故在此将不再赘述,本实施例与前述第二实施例之不同处为所述板状连接体12外缘更具有复数凹槽121。 As shown in Figure 4, it is a three-dimensional exploded view of the third embodiment of the uniform temperature plate structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned second embodiment is that the outer edge of the plate-shaped connecting body 12 has a plurality of grooves 121 . the
如图5所示,为本实用新型之均温板结构之第四实施例之组合图剖视图,如图所示,本实施例部分结构与前述第一实施例相同,故在此将不再赘述,惟本实施例与前述第一实施例之不同处为所述第一毛细结构层13更具有一倾角131,有助于汽态之工作流体进行发散。 As shown in Figure 5, it is a sectional view of the combined view of the fourth embodiment of the uniform temperature plate structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that the first capillary structure layer 13 further has an inclination angle 131, which is helpful for the vapor working fluid to disperse. the
如图6所示,为本实用新型之均温板结构示意图,所述本体1与至少一热源3接触,并选择将本体1设置有板状连接体12之处作为与该热源3主要接触之部位,如第6图所示,该本体1设置有板状连接体12之处,该板状连接体12作为支撑使用,主要可避免两者紧密贴合时本体1产生变形。 As shown in Figure 6, it is a schematic diagram of the structure of the uniform temperature plate of the present invention. The body 1 is in contact with at least one heat source 3, and the place where the body 1 is provided with a plate-shaped connector 12 is selected as the main contact point with the heat source 3. As shown in Figure 6, the main body 1 is provided with a plate-like connecting body 12. The plate-like connecting body 12 is used as a support, mainly to avoid deformation of the main body 1 when the two are closely attached. the
当该本体1与热源3进行热传导时,该第一板体1a将热量直接传递给该板状连接体12及在辅以腔室11内之工作流体2搭配产生汽液循环,主要热量由该板状连接体12作为传递,而受蒸发后之汽态之工作流体21及该液态之工作流体22可由该第一毛细结构层13蒸发发散以及回流,藉以达到极佳的散热效果。 When the body 1 conducts heat conduction with the heat source 3, the first plate body 1a directly transfers heat to the plate-shaped connecting body 12 and cooperates with the working fluid 2 in the auxiliary chamber 11 to generate a vapor-liquid cycle, and the main heat comes from the The plate-shaped connecting body 12 serves as a transmission, and the evaporated working fluid 21 in vapor state and the working fluid in liquid state 22 can evaporate, diverge and flow back from the first capillary structure layer 13, so as to achieve an excellent heat dissipation effect. the
Claims (10)
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CN201420504337.1U CN204085274U (en) | 2014-09-03 | 2014-09-03 | Vapor structure |
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CN201420504337.1U CN204085274U (en) | 2014-09-03 | 2014-09-03 | Vapor structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105466263A (en) * | 2014-09-03 | 2016-04-06 | 奇鋐科技股份有限公司 | Temperature equalizing plate structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105466263A (en) * | 2014-09-03 | 2016-04-06 | 奇鋐科技股份有限公司 | Temperature equalizing plate structure |
CN105466263B (en) * | 2014-09-03 | 2019-08-02 | 奇鋐科技股份有限公司 | Temperature equalizing plate structure |
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Granted publication date: 20150107 Termination date: 20200903 |