CN105466263B - Temperature equalizing plate structure - Google Patents

Abstract

A temperature equalizing plate structure comprises: a main body having a chamber, the chamber having a first side, a second side and a connector, the axial ends of the connector are respectively connected to the first and second sides, a first capillary structure layer is provided on the radial outer periphery of the connector, and working liquid is contained in the chamber. The connector of the present invention can prevent the main body from being deformed by heat and achieve the effect of increasing the heat conduction efficiency.

Description

Vapor chamber structure

【Technical field】

A temperature-spreading plate structure, especially a temperature-spreading plate structure that can improve the support degree and heat conduction efficiency of the temperature-spreading plate.

【Background technique】

The current mobile devices, personal computers, servers, and communication cases are all due to the improvement of computing performance, and the heat generated by the internal computing unit is also increased, so relatively more heat dissipation units are needed to assist their heat dissipation. Most manufacturers choose radiators, Heat-dissipating elements such as heat pipes and vapor chambers are used with fans for auxiliary heat dissipation, and when large areas are required for heat dissipation, the vapor chamber is used to absorb heat and is matched with radiators and cooling fans for forced heat dissipation. In order to prevent the occurrence of thermal resistance, the vapor chamber is a flat plate body, and a chamber for vapor-liquid circulation is provided inside for heat conduction. In order to prevent the flat vapor chamber from expanding after being pressurized or heated Or deformed, a plurality of support cylinders are arranged in the chamber to serve as the chamber for supporting the temperature equalizing plate.

The vapor chamber is a surface-to-surface heat transfer, and in the above description, in order to prevent the vapor chamber from being thermally expanded or compressed and deformed by external forces, a plurality of support cylinders are provided, but additional manufacturing time and manufacturing costs are required in the manufacturing process. (support column), and if a plurality of copper columns are used to combine sintering rings, the copper columns are used as support, and the sintering ring is only used as a reflow cycle, and its bottom flatness is not easy to control, or if a multi-groove copper column is used, the The copper column also acts as a support and a reflow cycle, and the flatness of the bottom is also difficult to control.

Although the original technology solves problems such as deformation, it increases the manufacturing man-hours and costs, and it is difficult to control the flatness of the bottom. Therefore, it is still necessary to conduct in-depth discussions on how to reduce the manufacturing cost.

[Content of the invention]

In order to effectively solve the above problems, the main purpose of the present invention is to provide a vapor chamber structure, comprising: a body having a chamber, the chamber having a first side and a second side and a plate-shaped connecting body The axial ends of the plate-shaped connecting body are respectively connected to the first side and the second side, a first capillary structure layer is provided on the radially outer peripheral edge of the plate-shaped connecting body, and the chamber has a working liquid.

The main body further has a first plate body and a second plate body, and the first and second plate bodies correspond to cover and jointly define the cavity.

The plate-shaped connecting body is a metal plate body.

The plate-shaped connecting body is any one of a copper material, an aluminum material or a good thermal conductor.

The first capillary structure layer is either a sintered powder body or a groove.

The connecting body is in any of geometric shapes such as square, rectangle, trapezoid or circle.

Furthermore, a heat receiving area is recessed on either of the first and second sides, the plate-shaped connecting body is disposed in the heat receiving area, a second capillary structure layer is further provided on the first and second sides, and the heat receiving area is further provided with a second capillary structure layer. The thickness of the second capillary structure layer is thicker than that of other non-heated regions.

The outer edge of the plate-shaped connecting body further has a plurality of grooves.

The first capillary structure layer is in any of geometric shapes such as square, rectangle, trapezoid or circle.

The first capillary structure layer has an inclination angle.

The vapor chamber structure of the present invention can not only solve the problems of thermal expansion deformation or pressure compression deformation of the conventional vapor chamber, and the difficulty in controlling the flatness of the bottom of the support body, but also has the advantages of saving manufacturing time and improving heat transfer efficiency. .

[Simple description of the diagram]

FIG. 1 is an exploded perspective view of the first embodiment of the vapor chamber structure of the present invention;

2 is a cross-sectional view of a composite view of the first embodiment of the vapor chamber structure of the present invention;

3 is a cross-sectional view of a composite view of a second embodiment of the vapor chamber structure of the present invention;

4 is a cross-sectional view of a combination view of a third embodiment of the vapor chamber structure of the present invention;

5 is a cross-sectional view of a composite view of a fourth embodiment of the vapor chamber structure of the present invention;

FIG. 6 is a schematic diagram of the structure of the vapor chamber of the present invention.

The names of the components corresponding to the reference numerals in the figure are:

Body 1

The first plate body 1a

The second plate body 1b

chamber 11

first side 111

second side 112

Plate connector 12

Groove 121

The first capillary structure layer 13

Inclination 131

Heated area 14

The second capillary structure layer 15

working fluid 2

Vaporous working fluid 21

Liquid working fluid 22

Heat source 3

【Detailed ways】

The above-mentioned objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

As shown in Figures 1 and 2, it is a three-dimensional exploded and combined cross-sectional view of the first embodiment of the vapor chamber structure of the present invention. As shown in the figures, the vapor chamber structure has a main body 1;

The body 1 has a cavity 11, the cavity 11 has a first side 111 and a second side 112 and a plate-shaped connecting body 12, and the two axial ends of the plate-shaped connecting body 12 are respectively connected to the first and second sides. On the two sides 111 and 112 , a first capillary structure layer 13 is provided on the radially outer peripheral edge of the plate-shaped connecting body 12 , the chamber 11 contains the working liquid 2 , and the first capillary structure layer 13 is a sintered powder body .

The main body 1 further has a first plate body 1a and a second plate body 1b, and the first and second plate bodies 1a and 1b correspond to each other to define the cavity 11 .

The plate-shaped connecting body 12 is a metal plate body, and the plate-shaped connecting body 12 is any one of a copper material, an aluminum material or a good thermal conductor. be limited.

The plate-shaped connecting body 12 has any geometric shape such as a square, a rectangle, a trapezoid or a circle. In this embodiment, a square is used as an illustrative embodiment, but it is not limited thereto.

As shown in FIG. 3 , it is a cross-sectional view of a combined view of the second embodiment of the vapor chamber structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned first embodiment is that the body 1 further has a heat-receiving area 14 recessed on either of the aforementioned first and second sides 111 and 112 , and the heat-receiving area 14 of this embodiment is recessed on the first and second sides 111 and 112 . On the first side 111 , the plate-shaped connecting body 12 is disposed in the heated area 14 , the first and second sides 111 , 112 are further provided with a second capillary structure layer 15 , and the second capillary structure layer in the heated area 14 15 is thicker than other non-heated areas 14 in thickness.

As shown in FIG. 4 , it is an exploded perspective view of the third embodiment of the vapor chamber structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned second embodiment is that the outer edge of the plate-shaped connecting body 12 further has a plurality of grooves 121 .

As shown in FIG. 5 , it is a cross-sectional view of a composite view of the fourth embodiment of the vapor chamber structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the first capillary structure layer 13 has an inclination angle 131 , which is helpful for the dispersion of the working fluid in the vapor state.

As shown in FIG. 6 , which is a schematic diagram of the structure of the vapor chamber of the present invention, the main body 1 is in contact with at least one heat source 3 , and the part where the main body 1 is provided with the plate-shaped connecting body 12 is selected as the main contact part with the heat source 3 , the main body 1 is provided with a plate-shaped connecting body 12, the plate-shaped connecting body 12 is used as a support, which can mainly avoid the deformation of the main body 1 when the two are closely attached.

Furthermore, when the main body 1 and the heat source 3 conduct heat conduction, the first plate body 1a directly transfers the heat to the plate-shaped connecting body 12 and the working fluid 2 in the auxiliary chamber 11 to generate a vapor-liquid circulation, mainly The heat is transmitted by the plate-shaped connecting body 12 , and the vaporized working fluid 21 and the liquid working fluid 22 can be evaporated and returned by the first capillary structure layer 13 , so as to achieve excellent heat dissipation effect.

Claims (10)

1. A temperature equalizing plate structure, comprising: a body with a chamber, the chamber has a first side and a second side and a plate-shaped connecting body, the two axial ends of the plate-shaped connecting body are connected respectively On the first and second sides, a first capillary structure layer is provided on the radial outer peripheral edge of the plate-shaped connecting body, and the chamber has working liquid. The plate-shaped connecting body is a plate body located in the middle of the chamber and is selected to be The main body is provided with a plate-shaped connecting body as the part that is mainly in contact with the heat source. It is characterized in that there is a heat-receiving area recessed on either of the first and second sides, and the plate-shaped connecting body is disposed in the heat-receiving area. , the first and second sides are further provided with a second capillary structure layer, and the thickness of the second capillary structure layer of the heated area is thicker than that of other non-heated areas. 2 . The vapor chamber structure according to claim 1 , wherein the main body further has a first plate body and a second plate body, and the first and second plate bodies correspondingly cover and jointly define the cavity. 3 . room. 3 . The vapor chamber structure according to claim 1 , wherein the plate-shaped connecting body is a metal plate body. 4 . 4 . The vapor chamber structure according to claim 3 , wherein the plate-shaped connecting body is any conductor with good thermal conductivity. 5 . 5 . The vapor chamber structure according to claim 4 , wherein the plate-shaped connecting body is made of a copper material or an aluminum material. 6 . 6 . The vapor chamber structure of claim 1 , wherein the first capillary structure layer is either a sintered powder body or a groove. 7 . 7 . The vapor chamber structure according to claim 1 , wherein the connecting body is in any one of square, rectangular, trapezoidal or circular geometric shapes. 8 . 8. The vapor chamber structure according to claim 1, wherein the outer edge of the plate-shaped connecting body further has a plurality of grooves. 9 . The vapor chamber structure according to claim 1 , wherein the first capillary structure layer is in any one of square, rectangular, trapezoidal or circular geometric shapes. 10 . 10 . The vapor chamber structure according to claim 1 , wherein the first capillary structure layer has an inclination angle. 11 .