CN203481357U - Filter harmonic oscillator, filter, and electromagnetic equipment - Google Patents
Filter harmonic oscillator, filter, and electromagnetic equipment Download PDFInfo
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- CN203481357U CN203481357U CN201320369011.8U CN201320369011U CN203481357U CN 203481357 U CN203481357 U CN 203481357U CN 201320369011 U CN201320369011 U CN 201320369011U CN 203481357 U CN203481357 U CN 203481357U
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- 238000001914 filtration Methods 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 10
- 239000010949 copper Substances 0.000 abstract description 10
- 238000009713 electroplating Methods 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000000741 silica gel Substances 0.000 description 13
- 229910002027 silica gel Inorganic materials 0.000 description 13
- 239000003292 glue Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 8
- -1 polytetrafluoroethylene Polymers 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000010923 batch production Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000008034 disappearance Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of filters, and discloses a filter harmonic oscillator, a filter, and electromagnetic equipment. The filter harmonic oscillator comprises a dielectric slice, and a film layer which is pasted on the surface of the dielectric slice. A conductive geometric structure is formed on the surface of the film layer. The film layer and the dielectric slice are arranged in a laminating manner. According to the utility model, the conductive geometric structure is formed on the surface of the film layer of the filter harmonic oscillator, thereby avoiding the electroplating and etching of the dielectric slice. Moreover, the application equipment is reduced, the manufacturing is easy, the filter harmonic oscillator is suitable for mass production, the efficiency of production is high, and the cost is low. Because the conductive geometric structure is directly formed on the surface of the film layer, thereby avoiding the phenomenon of the copper plating of two surfaces of the dielectric slice, and avoiding the phenomena of unclean etching of the conductive geometric structure or the loss of the conductive geometric structure. In addition, the film layer is connected with the dielectric slice through pasting, so there is no need to directly print block adhesive on the dielectric slice, thereby preventing the dielectric slice from being crushed.
Description
Technical field
The utility model relates to the technical field of filter, relates in particular to filter resonance, comprises the filtering device of filter resonance and the electromagnetic equipment that comprises this filtering device.
Background technology
Harmonic oscillator is the important component part in filter, and in prior art, the manufacture method of the harmonic oscillator of filter is as follows:
1), on dieelctric sheet copper electroplating layer, then by PCB production line, etching conduction geometry on the copper layer of dieelctric sheet;
2) mode of, printing by steel mesh on the dieelctric sheet in step 1), black glue is printed on dieelctric sheet, again a plurality of above-mentioned etchings there is is the dieelctric sheet that conducts electricity geometry and be printed with black glue sequentially stacking layer by layer, and put into insulating box and carry out high-temperature baking, thus shaping filter harmonic oscillator.
Filter resonance that above-mentioned manufacture method forms, it comprises sequentially stacked dieelctric sheet of multilayer, the conduction geometry forming with the etching of copper layer on dieelctric sheet, between adjacent dieelctric sheet by black glue bond.
The manufacture method of prior art filter resonance, it has following defect:
1), on dieelctric sheet, pass through copper electroplating layer, etching forms conduction geometry again, due in manufacture process, whole dieelctric sheet need to be dropped in electroplate liquid, like this, for single dieelctric sheet, on it, easily form electrodeposited coating, but for batch production, need to adopt the collaborative dieelctric sheet of tool to electroplate; Dieelctric sheet is fixed on tool, so that dieelctric sheet can bear at heavy copper or electroplate the concuss of cylinder the inside, prevents that dieelctric sheet from falling in plating cylinder, cannot give for change, like this, make the copper facing processing of dieelctric sheet comparatively bother, increase equipment, reduces production efficiency, and it increases production cost;
2), dieelctric sheet in the process of electroplating, its two-sided easily plated with copper all, but only need to form conduction geometry in its one side on dieelctric sheet, like this, can the process of etching conduction geometry in, be prone to the sordid problem of etching;
3), on dieelctric sheet etching conduction geometry, because the live width spacing of conduction geometry is less, therefore in etched process, be prone to the phenomenon of the conduction geometry disappearance on dieelctric sheet;
4), directly printing forms black glue on dieelctric sheet, because dieelctric sheet mostly is ceramic material, makes, and like this, in operating process, is prone to the crushed problem of dieelctric sheet.
Utility model content
The purpose of this utility model is to provide filter resonance son, be intended to solve filter resonance of the prior art exist be difficult to batch production, cost is high, efficiency is low, etching is clean, conduction geometry disappearance and the easy crushed problem of dieelctric sheet.
The utility model is achieved in that a kind of filter resonance, comprises dieelctric sheet and the lip-deep rete that sticks to described dieelctric sheet, is formed with conduction geometry on the surface of described rete, and described rete and described dieelctric sheet are layered laminate and arrange.
Further, in the both side surface of described dieelctric sheet, be stained with respectively described rete.
Further, described dieelctric sheet has two or more, at least wherein described in adjacent two, between dieelctric sheet, accompanies described rete, and two surfaces of described rete adhere to respectively on the surface of connected described adjacent two dieelctric sheets.
Further, between described rete and the surface of described dieelctric sheet, have glue-line, described glue-line adheres to described rete on the surface of described dieelctric sheet.
Further, the surface of described rete is provided with the conductive layer that is used to form described conduction geometry.
The utility model also provides a kind of filtering device, the harmonic oscillator that it comprises resonant cavity and is positioned at described resonant cavity, and described harmonic oscillator is above-mentioned filter resonance.
The utility model also provides a kind of electromagnetic equipment, and it comprises signal emission module, signal receiving module and above-mentioned filtering device, and the input of described filtering device is connected with described signal emission module, and output is connected with signal receiving module.
Particularly, described electromagnetic equipment is communication system, navigation system, navigation system, tracing system or measuring system.
Particularly, described electromagnetic equipment is base station, aircraft, ship, car, radar or satellite.
Compared with prior art, filter resonance that the utility model provides, it can directly form conduction geometry on rete, thereby avoid dieelctric sheet to electroplate and the operation such as etching, reduce use equipment, make this harmonic oscillator easily manufactured, be applicable to batch production, production efficiency is high and cost is low; Owing to directly forming conduction geometry on rete, avoid in the two-sided copper-plated phenomenon of dieelctric sheet, thereby avoid conducting electricity the phenomenon that geometry etching is clean or conduction geometry lacks; In addition, between rete and dieelctric sheet, by adhesion, be connected, thereby do not need directly on dieelctric sheet, to print black glue, avoid occurring the crushed phenomenon of dieelctric sheet.
Accompanying drawing explanation
Fig. 1 is the blast schematic perspective view of filter resonance that provides of the utility model embodiment;
Fig. 2 is the assembling schematic perspective view of filter resonance that provides of the utility model embodiment;
Fig. 3 is the longitudinally cutting schematic diagram of filter resonance that provides of the utility model embodiment;
Fig. 4 is the A place enlarged diagram in figure.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Below in conjunction with specific embodiment, realization of the present utility model is described in detail.
As shown in Fig. 1～4, the preferred embodiment providing for the utility model.
In above-mentioned filter resonance 1, on its rete 15, directly can form conduction geometry 13, therefore do not need directly in the enterprising electroplating operation of dieelctric sheet 11, do not need to utilize the equipment such as electroplating cylinder and fixed jig that adopts, manufacture process is simple, be applicable to batch production, and greatly improve its production efficiency, further reduce production costs; Can avoid the phenomenon that etching is clean and conduction geometry 13 lacks; Between rete 15 and dieelctric sheet 11, adopt to adhere to be connected, need on dieelctric sheet 11, not print glue-line, avoid dieelctric sheet 11 in printing process, occur crushed phenomenon.
Certainly, in the structure of above-mentioned filter resonance 1, different according to mutual alignment between the quantity of the quantity of rete 15, dieelctric sheet 11 and rete 15 and dieelctric sheet 11, can a variety of concrete structures of refinement, specific as follows:
The first structure:
In the both side surface of dieelctric sheet 11, being stained with respectively rete 15, like this, can be a dieelctric sheet 11, and the both side surface of dieelctric sheet 11 is all stained with rete 15, can be also a plurality of dieelctric sheets 11, and the both side surface of each dieelctric sheet 11 is all stained with respectively rete 15.
The second structure:
Above two kinds of structures are concrete two kinds, certainly, can also be other various structures forms, as long as rete 15 sticks on dieelctric sheet 11, and between rete 15 and dieelctric sheet 11, form layered laminate and can.
The filter resonance son 1 that the present embodiment provides is cylindrical shape, wherein be provided with the through hole 14 of up/down perforation, thereby be convenient to tuning plug, insert in this through hole 14, the resonance frequency of harmonic oscillator 1 is finely tuned, accordingly, dieelctric sheet 11, rete 15 and glue-line 12 form respectively annular.
Certainly, the profile of harmonic oscillator 1 is not limited to above-mentioned cylindrical shape, it can also be the various shapes such as square tube and different in nature tubular, as long as be wherein formed with plug 14 of the through holes of tuning plug can, now, also various correspondingly-shaped such as the side of being annular of the respective shapes of dieelctric sheet 11, rete 15 and glue-line 12.Glue-line herein can be the glue-line that solid-state glue cuts into, the glue-line that also liquid glue is solidified into after applying.
In the present embodiment, dieelctric sheet 11 can adopt any dielectric constant to be greater than the material that air (dielectric constant of air is 1 substantially), loss tangent are less than 0.1.Because dielectric constant is higher, the resonant cavity that harmonic oscillator 1 is used is when realizing identical resonance frequency, and volume can be less, and loss tangent is less, the Q value of harmonic oscillator 1 can be higher, therefore, preferably dielectric constant is relatively higher, and loss tangent is lower, for example, dielectric constant is greater than 10, loss tangent is less than 0.01, and more preferably, dielectric constant is greater than 30, loss tangent is less than 0.001.Therefore, dieelctric sheet 11 can be made by preferably ceramic material, and its thickness range is between 0.5mm～40mm.Certainly, also can select metal material to make.
In the present embodiment, the thickness range of glue-line 12 is between 5 μ m～40 μ m.
In the present embodiment, above-mentioned rete 15 is low-loss soft base plate, and the material such as it can preferably polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyamide, epoxy resin is made.Conduction geometry 13 on rete 15, for conductive layer forms, by conductive layer is carried out to etching, thereby makes the lip-deep conductive layer of staying rete 15 form conduction geometry 13.
The present embodiment also provides the manufacture method of harmonic oscillator 1, as follows:
Adopt above-mentioned manufacture method to manufacture harmonic oscillator 1, it has the following advantages:
1), in the process of its manufacture, do not need directly in the enterprising electroplating operation of dieelctric sheet 11, it directly forms conduction geometry 13 on rete 15, thereby do not need to utilize the equipment such as electroplating cylinder and fixed jig that adopts, manufacture process is simple, be applicable to batch production, and greatly improve its production efficiency, further reduce production costs;
2), due on the surface at rete 15, directly can be processed to form conduction geometry 13, avoid in prior art the two-sided plated with copper of dieelctric sheet 11 of existence, so that etching is clean and the phenomenon of conduction geometry 13 disappearances;
3), by adhesion mode, be connected between dieelctric sheet 11 and rete 15, thereby need on dieelctric sheet 11, not print glue-line, avoid dieelctric sheet 11 in printing process, occur crushed phenomenon.
In above-mentioned manufacture method, according to the variation of relation between rete 15 and dieelctric sheet 11, the difference such as quantitative relation and position relationship etc., can refinement go out multiple different manufacture, and form multiple different structure, specific as follows:
The first situation:
Two above-mentioned retes 15 are provided, and on the surface of two retes 15, are formed with respectively conduction geometry 13;
An above-mentioned dieelctric sheet 11 is provided, and two above-mentioned retes 15 are sticked to respectively in the both side surface of this dieelctric sheet 11, thereby formed three filter resonance 1 of stack structure layer by layer.
The second situation:
The above-mentioned rete of a slice 15 is provided, on the surface of this rete 15, is formed with above-mentioned conduction geometry 13;
Two above-mentioned dieelctric sheets 11 are provided, and rete 15 is placed in the middle of two dieelctric sheets 11, and its two surface sticks to respectively on the surface of connected two dieelctric sheets 11, thereby obtains three filter resonance 1 of stack structure layer by layer.
The third situation:
At least two above-mentioned retes 15 are provided, and namely two or two above retes 15, be formed with conduction geometry 13 on the surface of each rete 15;
At least three above-mentioned dieelctric sheets 11 are provided, above dieelctric sheets 11 of three or three namely, and, between two adjacent dieelctric sheets 11, at least place above-mentioned rete 15, two surfaces of rete 15 stick to respectively on the surface of connected two adjacent dieelctric sheets 11, thereby obtain at least five folded filter resonance 1 layer by layer.
In the present embodiment, between rete 15 and dieelctric sheet 11, by glue-line 12, adhere to and be connected, like this, in the process connecting, directly glue-line 12 is coated on the surface that needs to connect at dieelctric sheet 11 or rete 15, and then directly rete 15 is connected passablely with dieelctric sheet 11, it is easy and simple to handle.Certainly, can be also that other multiple glue-line connects, be not limited to the glue-line 12 in the present embodiment.
In above-mentioned manufacture process, the concrete operation step that forms conduction geometry 13 on the surface of rete 15 is as follows:
1), on the surface of rete 15, form conductive layer, conductive layer can select the materials such as copper, silver, gold, palladium to make;
2), the lip-deep conductive layer of rete 15 is carried out to etching operation, make the lip-deep conductive layer of staying rete 15 form above-mentioned conduction geometry 13.
Above-mentioned middle etching operation can adopt various processing equipment to obtain, and generally, adopts PCB apparatus for production line to carry out etching to the conductive layer on rete 15 more.
In the present embodiment, above-mentioned rete 15 is low-loss soft base plate, and the material such as it can preferably polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyamide, epoxy resin is made.
After rete 15 and dieelctric sheet 11 adhere to operation, shaping filter harmonic oscillator 1, need to be cured processing to this filter resonance 1, and its step is as follows:
1), filter resonance 1 is placed in fixture;
2), utilize two cushions that fixture has to be pressed on respectively on the both sides of filter resonance 1, certainly, this cushion can be made for multiple material, comparatively commonly, can adopt silica gel to make;
3), the nut of recycling on fixture tighten, and two cushions are further reduced the distance respectively, is pressed on the both sides of filter resonance 1.
In above-mentioned fixture, between nut and cushion, can also be provided with plain cushion, to accelerate solidifying of stacked structure, and prevent that filter resonance 1 is out of shape in solidifying processing procedure.
In above-mentioned curing processing procedure, in the environment of fixture in certain curing temperature, in the present embodiment, the curing processing of filter resonance 1 is in the temperature range of 70 ℃～300 ℃.
Below enumerate the manufacture process of four kinds of different harmonic oscillators 1, the structure of harmonic oscillator 1 described and performance test explanation:
The first harmonic oscillator 1:
Select the rete 15 that 12 μ m are thick, it is toroidal, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out to circular glue-line 12, and its thickness is 50 μ m;
Select three's potsherd as dieelctric sheet 11, its thickness is respectively 2mm, 1mm and tri-kinds of specifications of 4mm;
On the fixture in design, thick potsherd+glue-line the 12+ of rete 15+ glue-line 12+1mm that presses potsherd+glue-line 12+ band conduction geometry 13 that silica gel cushion+2mm is thick is from top to bottom with the thick potsherd+glue-line 12+ of rete 15+ glue-line 12+4mm of conduction geometry 13 to be with the thick thick thick potsherd+silica gel cushion+plain cushion+nut heap poststack of potsherd+glue-line 12+1mm of potsherd+glue-line 12+1mm of rete 15+ glue-line 12+1mm of conduction geometry 13, utilize nut that stacked structure is tightened, and be cured in the curing temperature of 170 ° of C;
After above-mentioned stacked structure is cooling, remove silica gel cushion, plain cushion, nut, the harmonic oscillator of stacked structure 1 is put into standard resonator build-in test Q value, test result is: Q value: 5132, centre frequency: 2.115GHz, bandwidth: 412KHz.
The second harmonic oscillator 1:
The rete 15 of selecting 25 μ m, it is circular, and in the inside of annulus, logical region is " ten " word shape, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out to circular glue-line 12, and its thickness is 25 μ m;
Select three's potsherd as dieelctric sheet 11, its thickness is respectively 2mm, 1mm and tri-kinds of specifications of 4mm;
On the fixture in design, thick potsherd+glue-line the 12+ of rete 15+ glue-line 12+1mm that presses potsherd+glue-line 12+ band conduction geometry 13 that silica gel cushion+2mm is thick is from top to bottom with the thick potsherd+glue-line 12+ of rete 15+ glue-line 12+4mm of conduction geometry 13 to be with the thick thick thick potsherd+silica gel cushion+plain cushion+nut heap poststack of potsherd+glue-line 12+1mm of potsherd+glue-line 12+1mm of rete 15+ glue-line 12+1mm of conduction geometry 13, utilize nut that stacked structure is tightened, and be cured in the curing temperature of 170 ° of C;
After above-mentioned stacked structure is cooling, remove silica gel cushion, plain cushion, nut, the harmonic oscillator of stacked structure 1 is put into standard resonator build-in test Q value, test result is: Q value: 4036, centre frequency: 2.06GHz, bandwidth: 510KHz.
The third harmonic oscillator 1:
The rete 15 of selecting 25 μ m, it is circular, and in the inside of annulus, logical region is " one " word shape, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out to circular glue-line 12, and its thickness is 25 μ m;
Select three's potsherd as dieelctric sheet 11, its thickness is respectively 2mm, 1mm and tri-kinds of specifications of 4mm;
On the fixture in design, thick potsherd+glue-line the 12+ of rete 15+ glue-line 12+1mm that presses potsherd+glue-line 12+ band conduction geometry 13 that silica gel cushion+2mm is thick is from top to bottom with the thick potsherd+glue-line 12+ of rete 15+ glue-line 12+4mm of conduction geometry 13 to be with the thick thick thick potsherd+silica gel cushion+plain cushion+nut heap poststack of potsherd+glue-line 12+1mm of potsherd+glue-line 12+1mm of rete 15+ glue-line 12+1mm of conduction geometry 13, utilize nut that stacked structure is tightened, and be cured in the curing temperature of 170 ° of C;
After above-mentioned stacked structure is cooling, remove silica gel cushion, plain cushion, nut, the harmonic oscillator of stacked structure 1 is put into standard resonator build-in test Q value, test result is: Q value: 4025, centre frequency: 2.059GHz, bandwidth: 511KHz.
The 4th kind of harmonic oscillator 1:
The rete 15 of selecting 25 μ m, it is circular, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out to circular glue-line 12, and its thickness is 50 μ m;
Select three's potsherd as dieelctric sheet 11, its thickness is respectively 2mm, 1mm and tri-kinds of specifications of 4mm;
On the fixture in design, thick potsherd+glue-line the 12+ of rete 15+ glue-line 12+1mm that presses potsherd+glue-line 12+ band conduction geometry 13 that silica gel cushion+2mm is thick is from top to bottom with the thick potsherd+glue-line 12+ of rete 15+ glue-line 12+4mm of conduction geometry 13 to be with the thick thick thick potsherd+silica gel cushion+plain cushion+nut heap poststack of potsherd+glue-line 12+1mm of potsherd+glue-line 12+1mm of rete 15+ glue-line 12+1mm of conduction geometry 13, utilize nut that stacked structure is tightened, and be cured in the curing temperature of 170 ° of C;
After above-mentioned stacked structure is cooling, remove silica gel cushion, plain cushion, nut, the harmonic oscillator of stacked structure 1 is put into standard resonator build-in test Q value, test result is: Q value: 4028, centre frequency: 2.107GHz, bandwidth: 414.8KHz.
The present embodiment also provides filtering device, and it comprises resonant cavity and above-mentioned filter resonance 1.This filtering device can be cavity body filter, can be also duplexer.
The present embodiment also provides electromagnetic equipment, it comprises signal emission module, signal receiving module and above-mentioned filtering device, the input of described filtering device is connected with described signal emission module, and output is connected with signal receiving module, thereby realizes filter function.Particularly, this electromagnetic equipment can be communication system, navigation system, navigation system, tracing system or measuring system, for example base station, aircraft, ship, car, radar or satellite.Certainly, can also be other the multiple equipment that need to use filtering device.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. filter resonance, is characterized in that, comprises dieelctric sheet and the lip-deep rete that sticks to described dieelctric sheet, is formed with conduction geometry on the surface of described rete, and described rete and described dieelctric sheet are layered laminate and arrange.
2. filter resonance according to claim 1, is characterized in that, is stained with respectively described rete in the both side surface of described dieelctric sheet.
3. filter resonance according to claim 1 is sub, it is characterized in that, described dieelctric sheet has two or more, at least wherein described in adjacent two, between dieelctric sheet, accompanies described rete, and two surfaces of described rete adhere to respectively on the surface of connected described adjacent two dieelctric sheets.
4. according to filter resonance described in claims 1 to 3 any one, it is characterized in that having glue-line between described rete and the surface of described dieelctric sheet, described glue-line adheres to described rete on the surface of described dieelctric sheet.
5. according to filter resonance described in claims 1 to 3 any one, it is characterized in that, the surface of described rete is provided with the conductive layer that is used to form described conduction geometry.
6. a filtering device, is characterized in that, comprises resonant cavity and the harmonic oscillator that is positioned at described resonant cavity, and described harmonic oscillator is filter resonance described in claim 1 to 5 any one.
7. filtering device according to claim 6, is characterized in that, described filtering device is cavity body filter or duplexer.
8. an electromagnetic equipment, it is characterized in that, comprise signal emission module, signal receiving module and filtering device, the input of described filtering device is connected with described signal emission module, output is connected with signal receiving module, and described filtering device is the filtering device as described in claim 1 to 7 any one.
9. electromagnetic equipment according to claim 8, is characterized in that, described electromagnetic equipment is communication system, navigation system, navigation system, tracing system or measuring system.
10. electromagnetic equipment according to claim 8, is characterized in that, described electromagnetic equipment is base station, aircraft, ship, car, radar or satellite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320369011.8U CN203481357U (en) | 2013-06-25 | 2013-06-25 | Filter harmonic oscillator, filter, and electromagnetic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320369011.8U CN203481357U (en) | 2013-06-25 | 2013-06-25 | Filter harmonic oscillator, filter, and electromagnetic equipment |
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| Publication Number | Publication Date |
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| CN203481357U true CN203481357U (en) | 2014-03-12 |
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| CN201320369011.8U Expired - Fee Related CN203481357U (en) | 2013-06-25 | 2013-06-25 | Filter harmonic oscillator, filter, and electromagnetic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253296A (en) * | 2013-06-25 | 2014-12-31 | 深圳光启创新技术有限公司 | Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253296A (en) * | 2013-06-25 | 2014-12-31 | 深圳光启创新技术有限公司 | Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment |
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