CN203466210U - Chip on board - Google Patents

Abstract

The utility model provides a chip on board, which comprises an aluminum substrate and a chip, wherein the chip is arranged on the surface of the aluminum substrate through a sapphire substrate. According to the chip on board provided by the utility model, the chip is directly arranged on the aluminum substrate through the sapphire substrate with an insulating property, and an insulating layer is removed, thereby avoiding influences imposed on the overall heat dissipation performance of the chip on board by the insulating layer with low heat conductivity, enabling the heat dissipation performance of the chip on board to be further improved, and prolonging the operating life of the chip on board.

Description

A kind of chip on board

Technical field

The utility model relates to semiconductor lamp technical field, more particularly, relates to a kind of chip on board.

Background technology

Along with the development of semiconductor lighting technology, the abbreviation of the English Light-Emitting Diode of LED(, light-emitting diode) lamp more and more enters into various lighting fields.

The main luminous component of LED lamp is the chip on board that is provided with LED, and wherein, the substrate 01 of chip on board is aluminium base, on it, be bonded with a layer insulating 02, on insulating barrier 02, circuit is set, and deposits by the sapphire of insulation the chip 04 that the end 03 is connected with insulating barrier, as shown in Figure 1.Selecting aluminium as base material, is because aluminium has good thermal diffusivity, and the dissipation of heat that can timely circuit, chip 04 and LED be produced falls.But in the prior art, insulating barrier 02 is due to self material, its conductive coefficient is lower, thereby has affected the integral heat sink effect of chip on board.

Therefore, how further improving the heat dispersion of chip on board, is current those skilled in the art's problem demanding prompt solution.

Utility model content

In view of this, the utility model provides a kind of chip on board, and it can further improve self-radiating.

In order to achieve the above object, the utility model provides following technical scheme:

A chip on board, comprises aluminium base and chip, and wherein, described chip is arranged on the surface of described aluminium base by Sapphire Substrate.

Preferably, in above-mentioned chip on board, also comprise and be arranged on described aluminium base surface, and the zinc layer between described aluminium base and described chip.

Preferably, in above-mentioned chip on board, also comprise and be arranged on described zinc layer surface, and the nickel dam between described zinc layer and described chip.

Preferably, in above-mentioned chip on board, also comprise and be arranged on described nickel dam surface, and the silver layer between described nickel dam and described chip, described chip is arranged on described silver layer surface by described Sapphire Substrate.

In the chip on board that the utility model provides, chip is deposited the end by the sapphire of insulating property (properties) and is set directly on aluminium base, rejected insulating barrier, avoided the impact on chip on board integral heat sink performance of insulating barrier that conductive coefficient is lower, the heat dispersion of chip on board is further improved, extended the working life of chip on board.

Accompanying drawing explanation

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

The structural representation of the chip on board that Fig. 1 provides for prior art;

The structural representation of the chip on board that Fig. 2 provides for the utility model embodiment.

In above Fig. 1-Fig. 2:

Substrate 01, insulating barrier 02, Sapphire Substrate 03, chip 04;

Aluminium base 1, chip 2, Sapphire Substrate 3, zinc layer 4, nickel dam 5, silver layer 6.

Embodiment

The utility model provides a kind of chip on board, and it can further improve self-radiating.

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.

As shown in Figure 2, the chip on board that the utility model embodiment provides, comprises aluminium base 1 and chip 2, and wherein, chip 2 is set directly at the surface of aluminium base 1 by Sapphire Substrate 3.

In the chip on board that the present embodiment provides, chip 2 is set directly on aluminium base 1 by the Sapphire Substrate 3 of insulating property (properties), rejected insulating barrier, avoided the impact on chip on board 2 integral heat sink performances of insulating barrier that conductive coefficient is lower, the heat dispersion of chip on board is further improved, extended the working life of chip on board.

In order further to optimize technique scheme, in the chip on board that the present embodiment provides, also comprise and be arranged on aluminium base 1 surface and the zinc layer 4 between aluminium base 1 and chip 2; Be arranged on zinc layer 4 surface, and the nickel dam 5 between zinc layer 4 and chip 2; Nickel dam 5 surfaces are set, and the silver layer 6 between nickel dam 5 and chip 2, chip 2 is arranged on silver layer 6 surfaces by Sapphire Substrate 3, as shown in Figure 2.

The setting of above-mentioned metal coating can improve light emission rate and the reliability of LED.

The chip on board that the present embodiment provides, make full use of the heat-sinking capability of aluminium, avoid insulating barrier heat conduction not enough, adopt Novel aluminum base plate heat radiation technique, the heat that the PN junction of chip 2 produces is directly transmitted to above silver layer 6 by chip 2 Sapphire Substrate 3, strengthen radiating effect, PN junction heat-chip 2 substrates-silver coating 6-nickel dam 5-zinc layer 4-aluminium base, this kind of radiator structure can make heat directly be dispersed in the middle of air, avoid the very little insulating barrier of coefficient of heat transfer, the raising of highly significant the integral heat sink effect of chip on board.

In this specification, each embodiment adopts the mode of going forward one by one to describe, and each embodiment stresses is the difference with other embodiment, between each embodiment identical similar part mutually referring to.

Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the utility model.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims (4)

1. a chip on board, comprises aluminium base (1) and chip (2), it is characterized in that, described chip (2) is arranged on the surface of described aluminium base (1) by Sapphire Substrate (3).

2. chip on board according to claim 1, is characterized in that, also comprises and is arranged on described aluminium base (1) surface, and be positioned at the zinc layer (4) between described aluminium base (1) and described chip (2).

3. chip on board according to claim 2, is characterized in that, also comprises and is arranged on described zinc layer (4) surface, and be positioned at the nickel dam (5) between described zinc layer (4) and described chip (2).

4. chip on board according to claim 3, it is characterized in that, also comprise and be arranged on described nickel dam (5) surface, and be positioned at the silver layer (6) between described nickel dam (5) and described chip (2), described chip (2) is arranged on described silver layer (6) surface by described Sapphire Substrate (3).

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