CN203375950U - A vertical wafer shape measuring apparatus - Google Patents
A vertical wafer shape measuring apparatus Download PDFInfo
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- CN203375950U CN203375950U CN201320485948.1U CN201320485948U CN203375950U CN 203375950 U CN203375950 U CN 203375950U CN 201320485948 U CN201320485948 U CN 201320485948U CN 203375950 U CN203375950 U CN 203375950U
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- 238000000034 method Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 abstract 4
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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Abstract
The utility model provides a vertical wafer shape measuring apparatus comprising adjusting pad feet, a pedestal disposed on the adjusting pad feet, a platform disposed on the pedestal, a support base disposed on the platform, a cross beam disposed on the support base, a shaft system comprising an X shaft, a Y shaft, a Z shaft and a rotation shaft, a wafer bearing stand fixed on the rotation shaft, and a contact-type measuring head fixed on a Z shaft movable plate. The X shaft is disposed on the cross beam; the Y shaft is disposed on the platform and is perpendicular to the X shaft; the Z shaft is fixed on an X shaft movable plate and is perpendicular to the movement direction of the X shaft, the movement direction of the Z shaft being perpendicular to the measuring platform; and the rotation shaft is fixed on a Y shaft movable plate. With the special contact-type measuring head and the fixed cross beam layout method and with the linear shafts and the rotation shaft which are controlled by a precision servo, the vertical wafer shape measuring apparatus can be used for automatic measurement of shape parameters such as flatness and thickness of wafers.
Description
Technical field
The utility model relates to a kind of measurement mechanism, relates in particular to a kind of vertical wafer shape measuring instrument.
Background technology
The demand progressively enlarged for meeting global energy, sun power extensively is used as green energy resource, and wafer is as the key element of sun power circuit plate, demand and quality are all improving constantly, generally by multiple layers of different materials, (ground floor is polysilicon to wafer, the second layer is bonding agent, the 3rd layer is glass, the 4th layer is adhesive tape) adopt process for pressing to make, generally from successively pressing of ground floor to the four, after each lamination closes back plane degree and pressing, thickness needs monitor closely, after 4 layers of whole pressing, flatness and the thickness of product wafer also need to be detected, the product that only meets wafer pressing quality requirements could enter next process as qualified base material and be processed, and finally guarantee that the wafer finished product meets the requirements of the customers.
The measuring equipment of tradition wafer, be divided into contact and contactless two kinds from metering system: traditional contact type measurement equipment, single for the wafer measurement function, can not be in the measurement of same the enterprising parallel planes degree of equipment and thickness, in addition, ergometry is difficult to accurate control, cause the each point measuring accuracy to be affected, even inhomogeneous because of ergometry and the uncontrollable wafer that causes in measuring process is cracked, and contactless wafer measuring instrument, owing to adopting laser irradiation mode, measured, can be difficult to unification because the reflective effect difference of different measuring material causes each layer of measurement data, especially for the high brightness top layer after glassy layer and finished product, measure, can be because material is transparent or the highlight surface degree affects measuring accuracy, cause the measurement data distortion, be difficult to accurately judge the authenticity of measurement data.
The utility model content
The utility model aim to provide a kind of simple in structure, integrated level is high, complete function, vertical wafer shape measuring instrument that measuring accuracy is high.
For achieving the above object, the utility model adopts following technical scheme, and a kind of vertical wafer shape measuring instrument, comprise the adjustment feet; Base, described base is located to be adjusted on feet; Platform, described platform is located on base; Supporting seat, described supporting seat is located on platform; Crossbeam, described crossbeam is located on supporting seat; Axle system, described axle is to comprise X-axis, Y-axis, Z axis and turning axle; Described X-axis is located on crossbeam; Described Y-axis is located on platform, mutually vertical with X-axis; Described Z axis is fixed on the moving plate of X-axis, mutually vertical with X-axis direction of motion, and its direction of motion is perpendicular to measuring table; Described turning axle is fixed on the moving plate of Y-axis; The wafer carrying platform, described wafer carrying platform is fixed on turning axle; Contact measuring head, described contact measuring head is fixed on the moving plate of Z axis.
As preferably, described contact measuring head comprises probe, elastic device, square air guide rail, the air guide rail air inlet seat, laser displacement sensor, top board, grating scale, air guide rail is led the core air connector, the gauge head mount pad, gauge head mounting base and base plate, described square air guide rail is arranged on the gauge head mounting base, probe connects the lower end that square air guide rail is led core, run through base plate, lead between core lower end and base plate and be provided with elastic device, the air guide rail air inlet seat is located at the top of square air guide rail, laser displacement sensor is located at the top of air guide rail air inlet seat, the data line be connected with sensor runs through top board, grating scale is arranged on the left side of laser displacement sensor, air guide rail is led the left side that the core air connector is located at the air guide rail air inlet seat, connect air inlet seat, the gauge head mount pad is located at the left side of gauge head mounting base.
As preferably, the parallel laser displacement sensor that is installed on of described grating scale.
As preferably, described elastic device is precision spring.
As preferably, the core inner of leading of described square air guide rail is hollow core structures, and top connects the square rail air inlet seat.
As preferably, described square rail air inlet seat side connects square air guide rail air connector.
As preferably, described wafer carrying platform comprises the plummer mount pad, card extender, set screw, precision spring, the suction hole gas-tpe fitting, the right angle locating piece, absorption orifice plate and absorption frid, described card extender is located at the upper surface of plummer mount pad, the absorption frid is located at the top of card extender, absorption frid and card extender link together by set screw, be provided with precision spring between absorption frid and card extender, described absorption orifice plate is located at the upper surface of absorption frid, the right angle locating piece is fixed on two right-angle sides of absorption orifice plate by tommy, several circular holes are arranged on described card extender, on the corresponding card extender of absorption frid, the position of circular hole is provided with the suction hole gas-tpe fitting.
As preferably, described platform has roller.
The utility model provides a kind of vertical wafer shape measuring instrument, adopt unique contact measuring head and fixed cross beam formula layout type, by the wafer carrying platform of taking vacuum adsorption principle, wafer is adsorbed fixing, and the verticality that can regulate wafer adsorption face and measuring probe, the linear axis and the turning axle that adopt elaborate servo to control, realize that the form parameters such as wafer plane degree and thickness measure automatically, only need artificial loading, blanking, measuring process need not manual intervention, guarantee to measure high measuring accuracy, the relative non-contact measurement instrument of the utility model does not exist transparent material and high-brightness surface to affect the problem of measuring accuracy, in addition, relatively traditional contact type measurement instrument, the utility model has flatness and thickness measure dual-use function concurrently, the utility model is simple in structure, integrated level is high, complete function, for the form parameter measurements such as wafer plane degree, thickness provide the more surveying instrument of science.
The accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
The structural representation that Fig. 2 is contact measuring head;
The structural representation that Fig. 3 is contact measuring head;
The structural representation that Fig. 4 is contact measuring head;
The structural representation that Fig. 5 is the wafer carrying platform;
Fig. 6 is the structural representation of the brilliant plummer of circle.
In figure: 1. adjust feet; 2. base; 3. grouan platform; 4. keyboard bracket; 5. display bracket; 6. display; 7. mouse; 8. keyboard; 9. turning axle; 10. wafer; 11. gauge head; 12. gauge head mount pad; 13.Z axle; 14. grouan crossbeam; 15.X axle; 16. wafer carrying platform; 17.Y axle moves plate; 18.Y axle; 19. grouan supporting seat; 20. roller; 21. probe; 22. precision spring; 23. square air guide rail; 24. air guide rail air inlet seat; 25. laser displacement sensor; 26. top board; 27. grating scale; 28. air guide rail is led the core air connector; 29. gauge head mount pad; 30. gauge head mounting base; 31. base plate; 32. air guide rail air connector; 33. lead core; 34, data line; 35. plummer mount pad; 36. card extender; 37. set screw; 38. precision spring; 39. pore gas-tpe fitting; 40. lock-screw; 41. set nut; 42. tommy; 43. right angle locating piece; 44. absorption orifice plate; 45. absorption frid.
Embodiment
Below describe embodiment of the present utility model in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label means same or similar element or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, only for explaining the utility model, and can not be interpreted as restriction of the present utility model.
Referring to shown in Fig. 1 to Fig. 6, a kind of vertical wafer shape measuring instrument, comprise and adjust feet 1; Base 2, described base 2 is located to be adjusted on feet 1; Grouan platform 3, described platform 3 is located on base 2; Roller 20, described roller 20 is located at platform 3 times, during normal the use, measuring instrument must be put steadily, now by adjusting, adjusts feet 1 and can make roller 20 liftoff, and can regulate the levelness of platform 3, and need to move the measuring instrument putting position time, only need to regulate and adjust feet 1, allow roller 20 contact with ground, and after platform 3 is effectively supported, the hand propelled measuring instrument, roller 20 can drive measuring instrument like a cork to formulating putting position; Grouan supporting seat 19, described supporting seat 19 is located on platform 3; Grouan crossbeam 14, described crossbeam 14 is located on supporting seat 19; Axle system, described axle is to comprise X-axis 15, Y-axis 18, Z axis 13 and turning axle 9; Described X-axis 15 is located on crossbeam 14; Described Y-axis 18 is located on platform 3, mutually vertical with X-axis 15; Described Z axis 13 is fixed on the moving plate of X-axis, mutually vertical with X-axis 15 direction of motion, and its direction of motion is perpendicular to measuring table 3; Described turning axle 9 is fixed on the moving plate 17 of Y-axis; Wafer carrying platform 16, described wafer carrying platform 16 is fixed on turning axle 9; Contact measuring head 11, described contact measuring head 11 is fixed on the moving plate of Z axis by gauge head mount pad 12.
Described contact measuring head 11 comprises probe 21, precision spring 22, square air guide rail 23, air guide rail air inlet seat 24, laser displacement sensor 25, top board 26, grating scale 27, air guide rail is led core air connector 28, gauge head mount pad 29, gauge head mounting base 30 and base plate 31, described square air guide rail 23 is arranged on gauge head mounting base 30, described square air guide rail 23 to lead core 33 inner be hollow core structures, top connects square rail air inlet seat 24, square rail air inlet seat 24 sides connect square air guide rail air connector 32, probe 21 connects the lower end that square air guide rail is led core 33, run through base plate 31, lead between core 33 lower ends and base plate 31 and be provided with precision spring 22, air guide rail air inlet seat 24 is located at the top of square air guide rail 23, laser displacement sensor 25 is located at the top of air guide rail air inlet seat 24, the data line 34 be connected with sensor 25 runs through top board, the parallel left side that is installed on laser displacement sensor 25 of grating scale 27, air guide rail is led the left side that core air connector 28 is located at air guide rail air inlet seat 24, connect air inlet seat 24, gauge head mount pad 29 is located at the left side of gauge head mounting base 30.
When to square air guide rail 23 air feed, pressurized air can be delivered to by airflow hole each interior spigot surface of square rail 23 " mouth " font, be distributed with air slot on these spigot surfaces, the pressurized air that will have certain air pressure by air slot is fed between each interior spigot surface of leading core 33 and square rail 23 " mouth " font, formation has the air film layer of certain pressure, thereby formation air guide rail, lead core 33 only can accurately move up and down in square rail 23, leading core 33 inner is hollow core structures, top is connecting square rail air inlet seat 24, these air inlet seat 24 sides are equipped with air connector 32, top is equipped with grating scale 27, measure probe 21 by the laser displacement sensor 25 with grating scale 27 parallel installations and change the displacement that causes core vertical movement Shang Xia 33 with workpiece surface appearance, the displacement value of reading from laser displacement sensor 25 is real-time transmitted to measuring system by data line 34, and display measurement result in Survey Software in time.
Described wafer carrying platform 16 comprises plummer mount pad 35, card extender 36, set screw 37, precision spring 38, suction hole gas-tpe fitting 39, right angle locating piece 40, absorption orifice plate 44 and absorption frid 45, described card extender 36 is located at the upper surface of plummer mount pad 35, absorption frid 45 is located at the top of card extender 36, absorption frid 45 links together by set screw 37 with card extender 36, be provided with precision spring 38 between absorption frid 45 and card extender 36, described absorption orifice plate 44 is located at the upper surface of absorption frid 45, right angle locating piece 43 is fixed on two right-angle sides of absorption orifice plate 44 by tommy 42, on described card extender 36, several circular holes are arranged, on the corresponding card extender 36 of absorption frid 45, the position of circular hole is provided with suction hole gas-tpe fitting 39.
During measurement, Z axis 13 drive gauge heads 11 move downward until probe 21 and wafer 10 Surface Contacts, again by X-axis 15 and Y-axis 18 side-to-side movement respectively, seesaw, the scan-type flatness is carried out in wafer 10 surfaces and measured, this metering system can carry out the flatness scanning survey to whole wafer 10 surfaces fast.And if only need preliminary judgement, can allow X-axis 15 drive wafer 10 makes it under gauge head 11, X-axis 15 is motionless again, Z axis 13 drives gauge head 11 and makes its probe 21 and wafer 10 Surface Contacts, Y-axis 18 drives wafer 10 again and moves forward and backward, can carry out the measurement of single pass formula along the Y direction of wafer 10, after completing, recycling turning axle 9 drives wafer 10 and rotates 90 degree, repeat measurement action just now, finally can complete wafer 10X direction of principal axis and Y direction are respectively measured to straight line, but go out the flatness of wafer by the Survey Software abbreviated analysis.
The utility model provides a kind of vertical wafer shape measuring instrument, adopt unique contact measuring head and fixed cross beam formula layout type, by the wafer carrying platform of taking vacuum adsorption principle, wafer is adsorbed fixing, and the verticality that can regulate wafer adsorption face and measuring probe, the linear axis and the turning axle that adopt elaborate servo to control, realize that the form parameters such as wafer plane degree and thickness measure automatically, only need artificial loading, blanking, measuring process need not manual intervention, guarantee to measure high measuring accuracy, the relative non-contact measurement instrument of the utility model does not exist transparent material and high-brightness surface to affect the problem of measuring accuracy, in addition, relatively traditional contact type measurement instrument, the utility model has flatness and thickness measure dual-use function concurrently, the utility model is simple in structure, integrated level is high, complete function, for the form parameter measurements such as wafer plane degree, thickness provide the more surveying instrument of science.
In the description of this instructions, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the characteristics of this embodiment or example description.In this manual, the schematic statement of above-mentioned term not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or characteristics can be with suitable mode combinations in any one or more embodiment or example.
Although illustrated and described embodiment of the present utility model, those having ordinary skill in the art will appreciate that: in the situation that do not break away from principle of the present utility model and aim can be carried out multiple variation, modification, replacement and modification to these embodiment, scope of the present utility model is limited by claim and equivalent thereof.
Claims (8)
1. a vertical wafer shape measuring instrument, is characterized in that, comprising:
Adjust feet;
Base, described base is located to be adjusted on feet;
Platform, described platform is located on base;
Supporting seat, described supporting seat is located on platform;
Crossbeam, described crossbeam is located on supporting seat;
Axle system, described axle is to comprise X-axis, Y-axis, Z axis and turning axle;
Described X-axis is located on crossbeam;
Described Y-axis is located on platform, mutually vertical with X-axis;
Described Z axis is fixed on the moving plate of X-axis, mutually vertical with X-axis direction of motion, and its direction of motion is perpendicular to measuring table;
Described turning axle is fixed on the moving plate of Y-axis;
The wafer carrying platform, described wafer carrying platform is fixed on turning axle;
Contact measuring head, described contact measuring head is fixed on the moving plate of Z axis.
2. measuring instrument according to claim 1, it is characterized in that, described contact measuring head comprises probe, elastic device, square air guide rail, the air guide rail air inlet seat, laser displacement sensor, top board, grating scale, air guide rail is led the core air connector, the gauge head mount pad, gauge head mounting base and base plate, described square air guide rail is arranged on the gauge head mounting base, probe connects the lower end that square air guide rail is led core, run through base plate, lead between core lower end and base plate and be provided with elastic device, the air guide rail air inlet seat is located at the top of square air guide rail, laser displacement sensor is located at the top of air guide rail air inlet seat, the data line be connected with sensor runs through top board, grating scale is arranged on the left side of laser displacement sensor, air guide rail is led the left side that the core air connector is located at the air guide rail air inlet seat, connect air inlet seat, the gauge head mount pad is located at the left side of gauge head mounting base.
3. measuring instrument according to claim 2, is characterized in that, the parallel laser displacement sensor that is installed on of described grating scale.
4. measuring instrument according to claim 2, is characterized in that, described elastic device is precision spring.
5. measuring instrument according to claim 2, is characterized in that, the core inner of leading of described square air guide rail is hollow core structures, and top connects the square rail air inlet seat.
6. measuring instrument according to claim 2, is characterized in that, described square rail air inlet seat side connects square air guide rail air connector.
7. measuring instrument according to claim 1, it is characterized in that, described wafer carrying platform comprises the plummer mount pad, card extender, set screw, precision spring, the suction hole gas-tpe fitting, the right angle locating piece, absorption orifice plate and absorption frid, described card extender is located at the upper surface of plummer mount pad, the absorption frid is located at the top of card extender, absorption frid and card extender link together by set screw, be provided with precision spring between absorption frid and card extender, described absorption orifice plate is located at the upper surface of absorption frid, the right angle locating piece is fixed on two right-angle sides of absorption orifice plate by tommy, several circular holes are arranged on described card extender, on the corresponding card extender of absorption frid, the position of circular hole is provided with the suction hole gas-tpe fitting.
8. measuring instrument according to claim 1, is characterized in that, described platform has roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320485948.1U CN203375950U (en) | 2013-08-09 | 2013-08-09 | A vertical wafer shape measuring apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320485948.1U CN203375950U (en) | 2013-08-09 | 2013-08-09 | A vertical wafer shape measuring apparatus |
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| Publication Number | Publication Date |
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| CN203375950U true CN203375950U (en) | 2014-01-01 |
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| CN201320485948.1U Expired - Fee Related CN203375950U (en) | 2013-08-09 | 2013-08-09 | A vertical wafer shape measuring apparatus |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103389051A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Vertical-type wafer shape measuring instrument |
| CN104215188A (en) * | 2014-09-23 | 2014-12-17 | 江苏农林职业技术学院 | Wafer thickness measuring device applied to sapphire thinning device |
| CN108296794A (en) * | 2018-03-31 | 2018-07-20 | 温州职业技术学院 | Processing and online detection process of medical parts |
| CN108861532A (en) * | 2018-03-31 | 2018-11-23 | 温州职业技术学院 | Medicine bottle and its production process method |
| CN110596435A (en) * | 2015-12-28 | 2019-12-20 | 塞莱敦系统股份有限公司 | Modular rail system, mechanism and apparatus for a device under test |
-
2013
- 2013-08-09 CN CN201320485948.1U patent/CN203375950U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103389051A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Vertical-type wafer shape measuring instrument |
| CN104215188A (en) * | 2014-09-23 | 2014-12-17 | 江苏农林职业技术学院 | Wafer thickness measuring device applied to sapphire thinning device |
| CN104215188B (en) * | 2014-09-23 | 2017-06-16 | 江苏农林职业技术学院 | A kind of wafer measuring thickness device for being applied to sapphire stripping apparatus |
| CN110596435A (en) * | 2015-12-28 | 2019-12-20 | 塞莱敦系统股份有限公司 | Modular rail system, mechanism and apparatus for a device under test |
| US11313902B2 (en) | 2015-12-28 | 2022-04-26 | Celadon Systems, Inc. | Modular rail systems, rail systems, mechanisms, and equipment for devices under test |
| CN110596435B (en) * | 2015-12-28 | 2022-07-05 | 塞莱敦系统股份有限公司 | Modular rail system, mechanism and apparatus for a device under test |
| CN108296794A (en) * | 2018-03-31 | 2018-07-20 | 温州职业技术学院 | Processing and online detection process of medical parts |
| CN108861532A (en) * | 2018-03-31 | 2018-11-23 | 温州职业技术学院 | Medicine bottle and its production process method |
| CN108861532B (en) * | 2018-03-31 | 2020-07-31 | 温州职业技术学院 | Medicine bottle and production process method thereof |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140101 Termination date: 20140809 |
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| EXPY | Termination of patent right or utility model |