[go: up one dir, main page]

CN203218261U - 具高散热特性的全角度发光组件 - Google Patents

具高散热特性的全角度发光组件 Download PDF

Info

Publication number
CN203218261U
CN203218261U CN201320127619XU CN201320127619U CN203218261U CN 203218261 U CN203218261 U CN 203218261U CN 201320127619X U CN201320127619X U CN 201320127619XU CN 201320127619 U CN201320127619 U CN 201320127619U CN 203218261 U CN203218261 U CN 203218261U
Authority
CN
China
Prior art keywords
heat dissipation
heat
light
high heat
dissipation characteristics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320127619XU
Other languages
English (en)
Inventor
吴庆辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unity Opto Technology Co Ltd
Original Assignee
Unity Opto Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unity Opto Technology Co Ltd filed Critical Unity Opto Technology Co Ltd
Application granted granted Critical
Publication of CN203218261U publication Critical patent/CN203218261U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

本实用新型揭露一种具高散热特性的全角度发光组件，其包含一透明基板、至少一发光芯片、至少一散热支架以及一导热胶。透明基板具有一固晶区域，且固晶区域面积为A。发光芯片设于固晶区域上。散热支架贴抵设于透明基板上，散热支架为片状体结构并具有一散热区段与一热源接触区段，散热支架的热源接触区段靠抵固晶区域邻接设置，其中热源接触区段的面积为B，且3%≦B/A≦26%。导热胶覆盖固晶区域与散热支架而使的封合。因此，由散热支架的散热区段与热源接触区段可有效地传导发光芯片所产生的热，并且取得360度全角度光源。

Description

具高散热特性的全角度发光组件
技术领域
本实用新型为一种发光组件，特别是指一种可有效地发散发光芯片所产生的热，且可取得360度全角度光源的具高散热特性的全角度发光组件。 
背景技术
随着发光二极管(Light-Emitting Diode，LED)的蓬勃发展，LED俨然成为现代照明领域最热门的发光组件，然而LED在发光过程中会产生大量的热，若没有适当地散热，温度升高时不仅会造成亮度下降，若超过摄氏100度时则会造成LED本体及封装材料的劣化，导致发光芯片毁损以及LED寿命降低。 
众所皆知，热的传导可分为热传导、热对流及热辐射三种方式，固态介质适用于热传导，一般而言金属及陶瓷材料具有较佳的导热能力，若物体的传导接触面积较大的话也有助于热传导的效果，热对流是用于液体介质及气体介质中，可由高温处传递至低温处的现象，热辐射则通过电磁波形式传递热。因此，于LED照明领域中，增加散热面积、使用较佳热传导的材料、加设散热块及搭配风扇，都是目前解决LED散热问题常用的方法。然而，上述方式仍有其亟待加以改良之处，若以额外加装散热块的方式，因加装散热块和增设风扇会提高成本的支出，而散热块更需通过加工处理，才可将散热块与LED发光装置相互设置成一体，将增加制程所需耗费的时间；再者，增加散热面积对于整体尺寸设计上有较多限制，且材料的选择上因应成本考虑较为不易。 
另外，传统式LED芯片以蓝宝石基板(sapphire)作为基板，其热传导系数仅约为20W/mK，不易将磊晶层所产生的热快速排出至外部，而传统LED封装所使用的为打线方式，但相对于金属基板，蓝宝石基板传导热的速度相当慢，所以热源会从金属线传导，但散热效果仍不佳。 
因此，以需求来说，设计一个可将透明基板上的LED芯片所产生的热有效地排出，且不遮蔽LED芯片所发出的光线，而取得360度全角度光源的具高散热特性的全角度发光组件，已成市场应用上的一个刻不容缓的议题。 
发明内容
有鉴于上述现有技艺的问题，本实用新型的目的就是在提供一种具有散热区段与热源接触区段的散热支架且可有效地传导发光芯片所产生的热，并且不阻挡住发光芯片所发出的光线，而取得360度全角度光源的具高散热特性的全角度发光组件，以解决现有技术的问题。 
根据本实用新型的目的，提出一种具高散热特性的全角度发光组件，其包含一透明基板、至少一发光芯片、至少一散热支架及一导热胶。其中，该透明基板具有一固晶区域，且该固晶区域面积为A；该发光芯片设于该固晶区域上；该散热支架贴抵设于该透明基板上，该散热支架为片状体结构并具有一散热区段与一热源接触区段，该散热支架的该热源接触区段靠抵该固晶区域邻接设置，其中该热源接触区段的面积为B，且3%≦B/A≦26%；及该导热胶覆盖该固晶区域与该散热支架而使之封合。 
另一实施例中，本实用新型的具高散热特性的全角度发光组件，更包含：一第一荧光粉层及一第二荧光粉层，其中该第一荧光粉层设于该透明基板下方，该第二荧光粉层设于该导热胶、该发光芯片与该散热支架上方，进而使该透明基板、该导热胶、该发光芯片与该散热支架夹合于该第一荧光粉层及该第二荧光粉层之间。 
其中，该发光芯片为单晶双光源芯片，而该散热支架的材质为金属。 
而在上述的具高散热特性的全角度发光组件中，该导热胶为锡膏材质。 
本实用新型达到的有益技术效果在于，可有效地发散发光芯片所产生的热，且可取得360度全角度光源。 
为让本实用新型的上述和其它目的、特征和优点能更明显易懂，下文特举较佳实施例，并配合所附图式，作详细说明如下。 
附图说明
图1为本实用新型的具高散热特性的全角度发光组件的第一实施例的第一示意图。 
图2为本实用新型的具高散热特性的全角度发光组件的第一实施例的第二示意图。 
图3为本实用新型的具高散热特性的全角度发光组件的第一实施例的立体图。 
图4为本实用新型的具高散热特性的全角度发光组件的第二实施例的剖面图。 
图5为本实用新型的具高散热特性的全角度发光组件的第三实施例的立体图
附图标记说明 
1、2-具高散热特性的全角度发光组件；11-透明基板；110-固晶区域；12-发光芯片；13-散热支架；131-热源接触区段；132-散热区段；14-导热胶；15-第一荧光粉层；16-第二荧光粉层；17-第三荧光粉层。 
具体实施方式
以下将参照相关图式，以说明本实用新型的具高散热特性的全角度发光组件的实施例，为使便于理解，下述实施例中的相同组件以相同的符号标示来说明。 
请参阅图1、图2及图3，其为本实用新型的具高散热特性的全角度发光组件的第一实施例的第一示意图、第二示意图及立体图。其中，图1为本实用新型的具高散热特性的全角度发光组件1的正面，而图2为本实用新型的具高散热特性的全角度发光组件1的背面，而本实用新型的具高散热特性的全角度发光组件1包含一透明基板11、至少一发光芯片12、至少一散热支架13以及一导热胶14。其中，该透明基板11具有一固晶区域110，且该固晶区域110面积为A，并于该固晶区域110上设置该发光芯片12，而该发光芯片12可为单晶结构，并由一侧或两侧发出单色光源。换句话说，由本实用新型的具高散热特性的全角度发光组件1的该透明基板11结合可发出双光源的发光芯片12及该散热支架13，则形成可发出全角度光源的具高散热特性的全角度发光组件1。 
而该散热支架13呈片状体结构并贴抵于该透明基板11上，其具有一散热区域132与一热源接触区段131，该热源接触区段131靠抵该固晶区域110邻接设置，且该热源接触区段131的面积为B。并且，该固晶区域110的面积与该热源接触区段131的面积符合3%≦B/A≦26%的关系式，而该散热支架13的材质较佳可为金属或金属合金。附带一提的是，本实用新型的具高散热特性的全角度发光组件1的该散热区域132的长度或面积可依需求而有所调整，在此并不局限。 
因此，如图所示，由该散热支架13直接贴设该透明基板11上，使该发光芯片12设置于该透明基板11的该固晶区域110上所产生的高温将会直接导引至该散热支架13的该热源接触区段131再传至该散热区段132进行散热。又，该散热支架13的该热源接触区段131具有如梳体的多个突出部，所述突出部贴设于所述芯片12周缘，并且该发光芯片12至散热区段132的间隔距离非常短，因此，其散热路径为最短、最直接的路径，以使得本实用新型的具高散热特性的全角度发光组件1具有最佳散热效果的功效。 
同时，为加强本实用新型的具高散热特性的全角度发光组件1的导热效果，本实用新型的具高散热特性的全角度发光组件1更可于该固晶区域110与该散热支架13上覆盖该导热胶14而使的封合。并且，由于该导热胶14为透明状，故将不会影响该发光芯片12所发出的光线，使本实用新型的具高散热特性的全角度发光组件1具有较佳地发光效果。 
另外，本实用新型的具高散热特性的全角度发光组件1的该散热支架13的材质可为金属材质，而使本实用新型的该散热支架13具有较佳的热传导效果。 
请参阅图4，其为本实用新型的具高散热特性的全角度发光组件的第二实施例的剖面图，如图所示，与第一实施例不同之处在于本实用新型的具高散热特性的全角度发光组件2更包含一第一荧光粉层15及一第二荧光粉层16，以供发光。所述发光芯片12可由此混光以激发出不同波长的色光。 
其中，该第一荧光粉层15设于该透明基板11的一侧，该第二荧光粉层16设于该导热胶14、该发光芯片12与该散热支架13的另一侧，进而使该透明基板11、该导热胶14、该发光芯片12与该散热支架13夹合于该第一荧光粉层15及该第二荧光粉层16之间。并且，该发光芯片12为单晶结构，且可为单晶双光源芯片，使其可由上下两侧分别发射出不同波长的光源至该第一荧光粉层15及该第二荧光粉层16，以激发出混光光源。其中，该导热胶可为锡膏材质，以促使本实用新型的具高散热特性的全角度发光组件2的散热效能提高。 
其中，该透明基板11由二氧化硅SiO2、磷化镓GaP、碳化硅SiC、砷化铝镓AlGaAs或蓝宝石(Sapphire)的其中的一种材料所制成。 
请参阅图5，其为本实用新型的具高散热特性的全角度发光组件的第三实施例的立体图，如图所示，与第二实施例不同之处在于本实用新型的具高散热特性的全角度发光组件3更包含一第三荧光粉层17，设置于该透明基板11、该导热胶14、该发光芯片12与该散热支架13的左右两侧，使些微光源由左右两侧射出时，经该第三荧光粉层17得以激发出混光光源。 
以上对本实用新型的描述是说明性的，而非限制性的，本专业技术人员理解，在权利要求限定的精神与范围内可对其进行许多修改、变化或等效，但是它们都将落入本实用新型的保护范围内。 

Claims (5)

1.一种具高散热特性的全角度发光组件，其特征在于，包含：
一透明基板，具有一固晶区域，且该固晶区域面积为A；
至少一发光芯片，设于该固晶区域上；
至少一散热支架，贴抵设于该透明基板上，该散热支架为片状体结构并具有一散热区段与一热源接触区段，该散热支架的该热源接触区段靠抵该固晶区域邻接设置，其中该热源接触区段的面积为B，且3%≦B/A≦26%；及
一导热胶，覆盖该固晶区域与该散热支架而使之封合。
2.如权利要求1所述的具高散热特性的全角度发光组件，其特征在于，更包含：
一第一荧光粉层及一第二荧光粉层，其中该第一荧光粉层设于该透明基板下方，该第二荧光粉层设于该导热胶、该发光芯片与该散热支架上方，进而使该透明基板、该导热胶、该发光芯片与该散热支架夹合于该第一荧光粉层及该第二荧光粉层之间。
3.如权利要求1所述的具高散热特性的全角度发光组件，其特征在于，该发光芯片为单晶双光源芯片。
4.如权利要求1所述的具高散热特性的全角度发光组件，其特征在于，该散热支架的材质为金属。
5.如权利要求1至4其中任一项所述的具高散热特性的全角度发光组件，其特征在于，该导热胶为锡膏材质。
CN201320127619XU 2013-03-15 2013-03-20 具高散热特性的全角度发光组件 Expired - Fee Related CN203218261U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102204747 2013-03-15
TW102204747U TWM457299U (zh) 2013-03-15 2013-03-15 具高散熱特性之全角度發光元件

Publications (1)

Publication Number Publication Date
CN203218261U true CN203218261U (zh) 2013-09-25

Family

ID=48915717

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320127619XU Expired - Fee Related CN203218261U (zh) 2013-03-15 2013-03-20 具高散热特性的全角度发光组件

Country Status (6)

Country Link
US (1) US8710723B1 (zh)
JP (1) JP3185958U (zh)
KR (1) KR200476144Y1 (zh)
CN (1) CN203218261U (zh)
DE (1) DE202013102680U1 (zh)
TW (1) TWM457299U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895788A (zh) * 2014-05-08 2016-08-24 罗冠杰 片式白光发光二极管、制备片式白光发光二极管的方法及封装胶材
WO2017121154A1 (zh) * 2016-01-11 2017-07-20 漳洲立达信光电子科技有限公司 Led灯丝封装结构
CN108321278A (zh) * 2018-01-23 2018-07-24 深圳市璨阳光电有限公司 一种led封装器件

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2942825B1 (en) * 2014-05-08 2020-04-15 Guan-Jie Luo White light emitting diode, manufacturing method
CN106653990A (zh) * 2015-11-04 2017-05-10 涂波 Led封装的新导热方法
KR102737501B1 (ko) 2017-01-31 2024-12-04 삼성전자주식회사 Led장치 및 이를 이용한 led램프
CN112066273A (zh) * 2019-06-10 2020-12-11 宁波天炬光电科技有限公司 Led光源模组及照明装置
US20230106003A1 (en) * 2020-08-21 2023-04-06 Yin-Hu Ko Led light source device and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165811A (ja) * 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
TWI391609B (zh) * 2009-09-28 2013-04-01 Yu Nung Shen Light emitting diode lighting device
KR101101241B1 (ko) 2010-07-13 2012-01-04 김점도 Ｌｅｄ조명용 ｐｃｂ기판의 방열 구조
US8587185B2 (en) * 2010-12-08 2013-11-19 Cree, Inc. Linear LED lamp
EP2492978B1 (en) * 2010-12-28 2015-07-01 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device, light-emitting module, and lamp
KR20120112936A (ko) * 2011-04-04 2012-10-12 주식회사 허니리츠 양면 발광 엘이디 모듈을 갖는 램프 패키지
JP2012253073A (ja) 2011-05-31 2012-12-20 Olympus Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895788A (zh) * 2014-05-08 2016-08-24 罗冠杰 片式白光发光二极管、制备片式白光发光二极管的方法及封装胶材
WO2017121154A1 (zh) * 2016-01-11 2017-07-20 漳洲立达信光电子科技有限公司 Led灯丝封装结构
CN108321278A (zh) * 2018-01-23 2018-07-24 深圳市璨阳光电有限公司 一种led封装器件

Also Published As

Publication number Publication date
JP3185958U (ja) 2013-09-12
US8710723B1 (en) 2014-04-29
KR200476144Y1 (ko) 2015-02-02
TWM457299U (zh) 2013-07-11
DE202013102680U1 (de) 2013-07-01
KR20140005079U (ko) 2014-09-24

Similar Documents

Publication Publication Date Title
CN203218261U (zh) 具高散热特性的全角度发光组件
CN107464803B (zh) 一种基于芯片级封装的可自调色温的led灯丝制备方法
CN108198933B (zh) 一种led芯片、制备方法及led晶片
CN104566292B (zh) 一种led全方位出光的高光效高导热散热结构
CN104078548A (zh) 一种全角度发光led白光光源及其制造方法
CN105449079A (zh) 一种可调色温白光led照明光源
WO2016029808A1 (zh) 一种led光源发光散热结构及其发光散热方法
TWI696302B (zh) 具有高導熱效果的發光二極體陣列封裝結構
CN103050607B (zh) Led散热基板
CN102903838A (zh) 带散热结构的封装led光源及其制备方法
CN103247742B (zh) 一种led散热基板及其制造方法
TW200845415A (en) Light source module with high heat dissipation capability
CN104167409A (zh) 一种光棒及使用其的光源
CN207602568U (zh) 可挠曲高亮度发光二极管
CN202662668U (zh) 用于led封装的铝基板
JP2012119544A (ja) Ｌｅｄ発光体
CN202948968U (zh) 一种白光led器件
CN204118066U (zh) 基于透明基板的半导体发光器件封装结构
CN202065726U (zh) 一种带有散热器的led照明结构
CN202660334U (zh) 高散热效率led光源
CN203521476U (zh) 一种具有高导热性能的led封装结构
CN209309701U (zh) 一种激光照明器件
CN103644549A (zh) 一种led散热结构
Zhang et al. Research progress on packaging thermal management techniques of high power led
WO2016077992A1 (zh) Led模组

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130925

Termination date: 20210320