CN203134866U - Optical component - Google Patents
Optical component Download PDFInfo
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- CN203134866U CN203134866U CN2013201492589U CN201320149258U CN203134866U CN 203134866 U CN203134866 U CN 203134866U CN 2013201492589 U CN2013201492589 U CN 2013201492589U CN 201320149258 U CN201320149258 U CN 201320149258U CN 203134866 U CN203134866 U CN 203134866U
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- heat
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- circuit board
- optical assembly
- chip
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Abstract
An optical component comprises a circuit board, a chip and a lens, wherein the chip is sealed on the circuit board by using the lens, the circuit board comprises a metal layer, an insulating layer and an aluminum layer, the aluminum layer, the insulating layer and the metal layer are sequentially superposed layer by layer, one side of the aluminum layer of the circuit board is subjected to roughing treatment, a heat conductive layer is coated on the roughened surface of the circuit board, a heat dissipation layer is coated on the surface of the heat conductive layer, and the circuit board is provided with heat conductive through holes. The optical component adopting the structure has the advantages of good heat dissipation performance, simple structure, easy manufacturing, and excellent practical value.
Description
[technical field]
The utility model relates to the LED lighting field, particularly a kind of heat radiation optical assembly.
[background technology]
LED (Light Emittting Diode) is as light source of new generation, and little based on its volume, it is low to consume energy, the brightness height, and advantages such as environmental protection, the LED lamp is widely used.The LED lamp produces a large amount of heats in the course of the work, yet under hot environment, the working life of LED lamp shortens greatly, has data to show that the working temperature of optical assembly generally is lower than 50 ℃, and when its working temperature reached 55 ℃, the life-span of optical assembly reduced by half.So the LED lamp all will carry out heat dissipation design usually.
Most existing LED lamp comprises optical assembly and radiator, optical assembly produces heat in working order down, heat dispels the heat by the radiator with metal fins or heat conductive silica gel, optical assembly is directly passed to metal fins or heat conductive silica gel with heat energy, but in this kind radiating mode, heat freely transmits, non-directional, heat radiation is slow, and radiating effect is poor, does not reach the radiating effect of expection in practice.
[utility model content]
Non-directional for overcoming present optical assembly heat radiation, the slow defective of dispelling the heat, the present invention proposes a kind of specific heat dissipation direction that has, the optical assembly of rapid heat dissipation.
A kind of optical assembly, this optical assembly comprises the circuit board of side process alligatoring one by one, a chip and lens, and lens are sealed in chip on the circuit board, this circuit board has a heat-conducting layer through the surface-coated of alligatoring, and this circuit board is provided with the heat conduction through hole that runs through circuit board.
Preferably, this heat-conducting layer lower surface is coated with a heat dissipating layer.
Preferably, the heat conduction through hole is corresponding with the position of chip placement.
Preferably, this circuit board comprises a metal level, an insulating barrier and an aluminum base layer, and this aluminum base layer, insulating barrier and metal level are layering successively.
Preferably, in the heat conduction through hole of this circuit board heat conducting element is installed.
Preferably, this heat conducting element one end contacts with chip, and the other end contacts with heat-conducting layer.
Preferably, the metal level of this circuit board comprises heat sink and electrode pads, and this metal level heat sink is provided with flat tin layer.
Preferably, chip is placed on the flat tin layer.
Preferably, this circuit board is provided with glue filling opening and steam vent.
The utility model also provides a kind of optical assembly, this optical assembly comprises a circuit board, one chip and lens, lens are sealed in chip on the circuit board, circuit board comprises a metal level, one insulating barrier and an aluminum base layer, this aluminum base layer, insulating barrier and metal level be time stack layer by layer successively, and aluminum base layer one side of this circuit board has been carried out roughening treatment, surface-coated in this circuit board process alligatoring has a heat-conducting layer, the heat-conducting layer surface-coated has a heat dissipating layer, and circuit board is provided with the heat conduction through hole, in the heat conduction through hole heat conducting element is installed, the metal level of circuit board comprises heat sink and electrode pads, and this metal level heat sink is provided with flat tin layer.
Compared with prior art, the utility model optical assembly has carried out roughening treatment in its circuit board one side, is coated with a heat-conducting layer at its roughened layer, is coated with a heat dissipating layer at heat-conducting layer.Circuit board through roughening treatment has adhesive force preferably, and coating is attached on the circuit board easily.The heat-conducting layer that is coated on the roughened layer is a kind of coating with superior absorption effect, the heat that this coating can fast Absorption passes over from chip, the heat dissipating layer that is coated on the heat-conducting layer is a kind of coating with good radiating effect, and the heat that this coating can pass over heat-conducting layer fast distributes.The heat that the optical assembly chip produces passes to heat dissipating layer through circuit board and heat-conducting layer, and heat dissipating layer distributes heat.Circuit board is provided with the heat conduction through hole, in the heat conduction through hole heat conducting element is installed, and has accelerated the speed of heat from the chip to the heat-conducting layer.Therefore, the heat radiation of this optical assembly has directivity, and radiating rate is fast, the heat that the optical assembly chip produces can be distributed fast, and the working temperature of avoiding optical assembly is too high and influence the optical assembly life-span.In addition, the metal level of circuit board directly forms heat sink and electrode pads by technologies such as corrosion, has simplified manufacture craft.
[description of drawings]
Fig. 1 is the structural representation of the utility model first embodiment optical assembly.
Fig. 2 is the structural representation of the utility model second embodiment optical assembly.
[embodiment]
In order to make the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with accompanying drawing and embodiment, the present invention are further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
See also Fig. 1, first embodiment of the utility model LED lamp 10.Optical assembly 10 comprises a circuit board 101, one chips 102 and lens 103, and lens 103 are sealed in chip 102 on the circuit board 101, and lens 103 prevent from optical assembly 10 chance water or make moist causing chip 102 oxidations when playing the luminous intensity distribution effect.Scribble a phosphor powder layer 1021 on the chip 102, phosphor powder layer 1021 can produce the light of different colours under the exciting of different light.
Circuit board 101 comprises a metal level 104, one insulating barriers 105 and an aluminum base layer 106, this aluminum base layer 106, and insulating barrier 105 and metal level 104 are layering successively.Metal level 104 materials are preferably copper, and the material of aluminum base layer 106 is preferably aluminium.Circuit board 101 further comprises some heat conduction through hole 107, one glue filling openings 108 and a steam vent 109, this heat conduction through hole 107, and glue filling opening 108 and steam vent 109 run through the aluminum base layer 106 of circuit board 101, insulating barrier 105 and metal level 104.Part heat conduction through hole 107 is positioned under the position that chip 102 places, heat conduction through hole 107 is the heat dissipation channel of chip 102 work calorieses, in the heat conduction through hole 107 heat conducting element is installed, heat conducting element is heat conduction rivet 1071 among this embodiment, the transmission of heat conduction rivet 1071 accelerated heat in heat conduction through hole 107.Glue filling opening 108 is the injecting glue entrance, and glue injects from glue filling opening 108 and forms lens 103, and in the injecting glue process, air is discharged by steam vent 109 in the lens 103.
Circuit board 101 covers copper layer 104 formation heat sink 1041 and electrode pads 1043 by chemical etching technology at it.Heat sink 1041 be used for to transmit the heat that optical assembly 10 produces when luminous.The electrode of chip 102 and electrode pads 1043 welding.Heat sink 1041 surfaces are coated with a flat tin layer 1042, and chip 102 is installed on the flat tin layer 1042.The thermal conductivity of metallic tin is very good, so flat tin layer 1042 can be effectively the work calories of chip 102 is passed to heat sink 1041.In addition, because there is the manufactured head of heat conduction rivet 1071 on heat sink 1041 surfaces, so there is a projection (not label) in heat sink 1041 surfaces, another of the flat tin layer 1042 of this heat conduction act as and keeps the smooth of heat sink 1041 surfaces, heat conduction rivet 1,071 one ends contact with chip 102, and the other end contacts with heat-conducting layer 1063.
The aluminum base layer 106 of circuit board 101 is cellular roughening treatment layer 1061 through forming a surface after the roughening treatment.Use the coating with superior absorption effect to apply a heat-conducting layer 1063 on the roughening treatment layer 1061, this coating preferable methyl is deceived/nano material.Use the coating with good radiating effect to apply a heat dissipating layer 1065 on the heat-conducting layer 1063, this coating is preferably nano-far-infrared coating.Roughening treatment layer 1061 act as the adhesive force that strengthens between aluminum base layer 106 and the heat-conducting layer 1063.The heat that chip 102 produces passes to heat-conducting layer 1063 by heat conduction rivet 1071 because heat-conducting layer 1063 has good endothermic effect, heat-conducting layer 1063 can be fast with heat absorption and pass to heat dissipating layer 1065.Heat dissipating layer 1065 has good radiating effect, the heat that heat-conducting layer 1063 absorbs can be distributed rapidly.
As mentioned above, during optical assembly 10 work, the heat that chip 102 produces is through flat tin layer 1042, and is heat sink 1041, insulating barrier 106, pass to aluminum base layer 106, because heat-conducting layer 1063 has good endothermic effect, heat-conducting layer 1063 comes to pass to heat dissipating layer 1065 with the heat absorption of aluminum base layer 106 at once, at the same time, because heat dissipating layer 1065 has good radiating effect, heat dissipating layer 1065 sheds heat to guarantee that optical assembly 10 stablizes suitable working temperature rapidly.
See also Fig. 2, second embodiment of the utility model optical assembly 20.Optical assembly 20 comprises a circuit board 201, one chips 202 and lens 203, and lens 203 are sealed in chip 202 on the circuit board 201, prevents from optical assembly 20 chance water or make moist causing chip 202 oxidations.Scribble a phosphor powder layer 2021 on the chip 202, phosphor powder layer 2021 can produce the light of different colours under the exciting of different light.
The heat transfer layer 206 of circuit board 201 is cellular roughened layer 2061 through forming a surface after the roughening treatment.Use the coating with superior absorption effect to apply a heat-conducting layer 2063 on the roughened layer 2061, this coating is preferably methyl and deceives/nano material.Use good radiating effect coating to apply a heat dissipating layer 2065 on the heat-conducting layer 2063, this coating is preferably nano-far-infrared coating.Roughening treatment layer 2061 act as the adhesive force that strengthens between aluminum base layer 206 and the heat-conducting layer 2063.The heat that chip 202 produces passes to heat-conducting layer 2063 by circuit board 201 because heat-conducting layer 2063 has good endothermic effect, heat-conducting layer 2063 can be fast with heat absorption and pass to heat dissipating layer 2065.Heat dissipating layer 2065 has good radiating effect, the heat that heat-conducting layer 2063 absorbs can be distributed rapidly.
As mentioned above, during optical assembly 20 work, the heat that chip 202 produces is through flat tin layer 2042, metal level 204 heat sink 2041, insulating barrier 205, pass to heat transfer layer 206, because the heat-conducting effect of heat transfer layer 206 is very good, so, compare with embodiment one, need not to install heat conduction rivet 1071 in the present embodiment heat conduction through hole 207, the manufacture craft of this execution mode is simpler.Because heat-conducting layer 2063 has good endothermic effect, heat-conducting layer 2063 comes to pass to heat dissipating layer 2065 with the heat absorption of heat transfer layer 2061 at once, at the same time, because heat dissipating layer 2065 has good radiating effect, heat dissipating layer 2065 sheds heat to guarantee that optical assembly 20 stablizes suitable working temperature rapidly.
Compared with prior art, LED lamp 10,20 of the present invention has carried out roughening treatment in its circuit board one side, is coated with a heat-conducting layer 1063,2063 on its roughened layer 1061,2061, is coated with a heat dissipating layer 1065,2065 on heat-conducting layer 1063,2063.Have adhesive force preferably through the circuit board 101,201 of roughening treatment, coating is attached on the circuit board 101,201 easily.Be coated in roughened layer 1061, heat-conducting layer 1063 on 2061, the 2063rd, a kind of coating with superior absorption effect, this coating can fast Absorption from the heat that chip 102,202 passes over, be coated in heat-conducting layer 1063, heat dissipating layer 1065 on 2063, the 2065th, a kind of coating with good radiating effect, the heat that this coating can pass over heat-conducting layer 1063,2063 fast distributes.Circuit board 101 is provided with heat conduction through hole 107, in heat conduction through hole 107 heat conducting element is installed, accelerated heat from chip 102 to heat-conducting layer 1063 speed.Therefore, the heat that optical assembly 10,20 chips 102,202 produce passes to heat dissipating layer 1065,2065 through circuit board 101,201 and heat-conducting layer 1063,2063, and heat dissipating layer 1065,2065 distributes heat.10,20 heat radiations of this optical assembly have directivity, and radiating rate is fast, and the heat that optical assembly 10,20 chips 102,202 can be produced distributes fast, and the working temperature of avoiding optical assembly 10,20 is too high and influence 10,20 life-spans of optical assembly.In addition, the metal level of circuit board 101,202 104,204 directly forms heat sink 1041,2041 and electrode pads 1043,2043 by technologies such as corrosion, has simplified manufacture craft.
The above only is preferred embodiment of the present utility model, and in order to limit the utility model, all any modifications of doing within principle of the present utility model are not equal to replacement and improvement etc. and all should be included within the protection range of the present utility model.
Claims (10)
1. optical assembly, this optical assembly comprises the circuit board of side process alligatoring one by one, a chip and lens, and lens are sealed in chip on the circuit board, it is characterized in that: this circuit board has a heat-conducting layer through the surface-coated of alligatoring, and this circuit board is provided with the heat conduction through hole that runs through circuit board.
2. a kind of optical assembly as claimed in claim 1, it is characterized in that: this heat-conducting layer lower surface is coated with a heat dissipating layer.
3. a kind of optical assembly as claimed in claim 1 is characterized in that: the heat conduction through hole is corresponding with the position that chip is placed.
4. a kind of optical assembly as claimed in claim 2, it is characterized in that: this circuit board comprises a metal level, an insulating barrier and an aluminum base layer, this aluminum base layer, insulating barrier and metal level are layering successively.
5. a kind of optical assembly as claimed in claim 2 is characterized in that: in the heat conduction through hole of this circuit board heat conducting element is installed.
6. a kind of optical assembly as claimed in claim 5, it is characterized in that: this heat conducting element one end contacts with chip, and the other end contacts with heat-conducting layer.
7. a kind of optical assembly as claimed in claim 4, it is characterized in that: the metal level of this circuit board comprises heat sink and electrode pads, this metal level heat sink is provided with flat tin layer.
8. a kind of optical assembly as claimed in claim 7, it is characterized in that: chip is placed on the flat tin layer.
9. a kind of optical assembly as claimed in claim 1, it is characterized in that: this circuit board is provided with glue filling opening and steam vent.
10. optical assembly, this optical assembly comprises a circuit board, one chip and lens, lens are sealed in chip on the circuit board, circuit board comprises a metal level, one insulating barrier and an aluminum base layer, this aluminum base layer, insulating barrier and metal level be time stack layer by layer successively, and it is characterized in that: aluminum base layer one side of this circuit board has been carried out roughening treatment, surface-coated in this circuit board process alligatoring has a heat-conducting layer, the heat-conducting layer surface-coated has a heat dissipating layer, and circuit board is provided with the heat conduction through hole, in the heat conduction through hole heat conducting element is installed, the metal level of circuit board comprises heat sink and electrode pads, and this metal level heat sink is provided with flat tin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201492589U CN203134866U (en) | 2013-03-16 | 2013-03-16 | Optical component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201492589U CN203134866U (en) | 2013-03-16 | 2013-03-16 | Optical component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203134866U true CN203134866U (en) | 2013-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013201492589U Expired - Fee Related CN203134866U (en) | 2013-03-16 | 2013-03-16 | Optical component |
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| Country | Link |
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| CN (1) | CN203134866U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883814A (en) * | 2015-05-28 | 2015-09-02 | 乐健科技（珠海）有限公司 | Graphite substrate and manufacture method thereof, LED module and manufacture method thereof |
| CN106098901A (en) * | 2016-08-02 | 2016-11-09 | 王川 | A kind of high-heat-dispersion LED substrate, LED encapsulation and LED |
| CN108511577A (en) * | 2017-02-24 | 2018-09-07 | 联京光电股份有限公司 | Light emitting element and method for manufacturing the same |
| CN108922952A (en) * | 2018-05-29 | 2018-11-30 | 北京敬科技有限公司 | A kind of board structure and its production technology of semiconductor diode chip |
| CN108963048A (en) * | 2018-05-29 | 2018-12-07 | 北京敬科技有限公司 | A kind of semiconductor diode chip structure and its lamp luminescence component |
| CN113066776A (en) * | 2020-01-02 | 2021-07-02 | 财团法人工业技术研究院 | power module |
-
2013
- 2013-03-16 CN CN2013201492589U patent/CN203134866U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883814A (en) * | 2015-05-28 | 2015-09-02 | 乐健科技（珠海）有限公司 | Graphite substrate and manufacture method thereof, LED module and manufacture method thereof |
| CN106098901A (en) * | 2016-08-02 | 2016-11-09 | 王川 | A kind of high-heat-dispersion LED substrate, LED encapsulation and LED |
| CN106098901B (en) * | 2016-08-02 | 2018-06-22 | 王一川 | A kind of high-heat-dispersion LED substrate, LED encapsulation and LED light |
| CN108511577A (en) * | 2017-02-24 | 2018-09-07 | 联京光电股份有限公司 | Light emitting element and method for manufacturing the same |
| CN108511577B (en) * | 2017-02-24 | 2019-06-28 | 联京光电股份有限公司 | Light emitting element and method for manufacturing the same |
| CN108922952A (en) * | 2018-05-29 | 2018-11-30 | 北京敬科技有限公司 | A kind of board structure and its production technology of semiconductor diode chip |
| CN108963048A (en) * | 2018-05-29 | 2018-12-07 | 北京敬科技有限公司 | A kind of semiconductor diode chip structure and its lamp luminescence component |
| CN113066776A (en) * | 2020-01-02 | 2021-07-02 | 财团法人工业技术研究院 | power module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 |