CN203131524U - Bendable light-emitting diode (LED) light source module - Google Patents
Bendable light-emitting diode (LED) light source module Download PDFInfo
- Publication number
- CN203131524U CN203131524U CN2013201015819U CN201320101581U CN203131524U CN 203131524 U CN203131524 U CN 203131524U CN 2013201015819 U CN2013201015819 U CN 2013201015819U CN 201320101581 U CN201320101581 U CN 201320101581U CN 203131524 U CN203131524 U CN 203131524U
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- Prior art keywords
- light source
- source module
- groove
- led light
- led
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 65
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 230000004888 barrier function Effects 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 28
- 239000004642 Polyimide Substances 0.000 abstract description 8
- 229920001721 polyimide Polymers 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 4
- 239000011324 bead Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a bendable LED light source module. The bendable LED light source module comprises a metal substrate, a polyimide (PI) insulating layer, a copper-layer circuit, a solder mask and an LED lamp bead, wherein one surface of the PI insulating layer adheres to the metal substrate, the copper-layer circuit and the solder mask are formed on the other surface of the PI insulating layer, a window is arranged on the solder mask, the copper-layer circuit which is located at the position of the window is exposed to form an electric connection area, the electric connection area comprises an LED pad which is used for assembling the LED lamp bead, the LED lamp bead is fixed on the LED pad and electrically connected with the LED pad, at least one groove is arranged on the surface of one side of the metal substrate, which does not adhere to the PI insulating layer, and the depth of the at least one groove is smaller than the thickness of the metal substrate. Only at least one groove is required to be cut at the bottom of the metal substrate, and the insulating layer made of a PI material is used, so that the bendable LED light source module can be manufactured; and the bendable LED light source module is simple in structure and low in manufacturing cost.
Description
Technical field
The utility model relates to the LED technical field, is specifically related to a kind of bent led light source module.
Background technology
In recent years, led light source is because the remarkable advantage that its life-span is long, light efficiency is high, radiation is low and low in energy consumption has obtained extensive use in various fields.
LED also produces a large amount of heats when high brightness output is provided, therefore, under high-temperature work environment, problems such as colour cast, brightness reduction, shortening in service life can take place LED, even fault immediately can occur.For avoiding occurring the problems referred to above, require the substrate of carrying LED can derive the heat that produces when LED works in time, fully, be extensive use of the Metal Substrate pcb board at present and carried LED to satisfy the requirement to the substrate heat conductivility.
Existing Metal Substrate pcb board comprises metal-based layer, high heat conductive insulating dielectric layer and copper layer line layer.The insulating medium layer effect of edge effect and bonded metal basic unit, copper layer line layer of drawing last breath that electrifies, the inorganic filler powder of the high heat conduction of general employing and epoxy resin are mixed with and form, can not carry out bending process, and metal-based layer is dull and stereotyped sheet material, cause above-mentioned Metal Substrate pcb board can't satisfy the LED lighting device to the diversified demand of led light source module shape for the preparation of the led light source module of flat shape.
The utility model content
In view of this, being necessary the problem mentioned at background technology provides a kind of bent led light source module, and it is bent to be various 3D shapes, satisfies the LED lighting device to the diversified demand of led light source module shape.
The purpose of this utility model is achieved through the following technical solutions:
A kind of bent led light source module, it comprises:
Metal-based layer;
PI insulating barrier, surface thereof adhere to described metal-based layer;
Copper layer line road, it is formed at another surface of described PI insulating barrier;
Solder mask, another surface that it also is formed at the PI insulating barrier offers window on this solder mask, and exposed formation the in copper layer line road that is positioned at the window place is electrically connected the zone, and described electrical connection zone comprises the LED pad for assembled LED lamp pearl;
LED lamp pearl, it is fixed on the described LED pad and with described LED pad and is electrically connected;
Wherein, offer at least one groove on the side surface that does not adhere to described PI insulating barrier of described metal-based layer, the degree of depth of described groove is less than the thickness of described metal-based layer.
Described metal-based layer is the thin plate with toughness that is prepared from by aluminium, copper or stainless steel, and its thickness is between 0.5-2.0mm.
Described groove is V-type groove, U-shaped groove, deep-slotted chip breaker or dovetail groove.
The degree of depth of described V-type groove is the 1/3-2/3 of the thickness of described metal-based layer.
The drift angle of described V-type groove 5 is greater than 30 °.
The degree of depth of described U-shaped groove is 1/4 to 3/4 of described metal-based layer thickness, and its width is 1.0-5.0mm.
Compared with prior art, the utility model possesses following advantage:
The utility model only needs at least one groove of metal-based layer bottom cutting at the Metal Substrate pcb board of described led light source module, and the insulating barrier of employing PI material, can prepare bent led light source module, simple in structure, preparation cost is low, and helps to alleviate the weight of led light source module.
Description of drawings
Fig. 1 is the not bending state cross-sectional view of the utility model embodiment one;
Fig. 2 is the bending state cross-sectional view of the utility model embodiment one;
Fig. 3 is the not bending state cross-sectional view of the utility model embodiment two;
Fig. 4 is the not bending state cross-sectional view of the utility model embodiment three;
Fig. 5 is the bending state cross-sectional view of the utility model embodiment three.
The specific embodiment
Embodiment one:
As shown in Figure 1, the described Metal Substrate pcb board for structure led light source module of present embodiment comprises: metal-based layer 1; The PI(polyimides) insulating barrier 2, and surface thereof adheres to this metal-based layer 1; Copper layer line road 3, it is formed at another surface of PI insulating barrier 2; Solder mask 4, it also is formed at another surface of PI insulating barrier 2, offers window on this solder mask 4, thus described copper layer line road 3 exposed formation that are positioned at the window place are electrically connected the zone, are used for connecting electronic devices and components.Wherein, offer V-type groove 5 on another surface that described metal-based layer 1 does not adhere to described PI insulating barrier 2.The degree of depth of described V-type groove 5 is less than the thickness of described metal-based layer 1.
Described metal-based layer 1 is the thin plate with certain toughness that is prepared from by aluminium, copper or stainless steel and other metal materials, and its thickness can be between 0.5-2.0mm.
The degree of depth of V-type groove 5 is preferably the 1/3-2/3 of metal-based layer 1 thickness.
The angle of V-type groove 5 and the degree of depth can design according to the material of metal-based layer 1 and the angle of bend of thickness and Metal Substrate pcb board needs, and preferably the drift angle of V-type groove 5 is greater than 30 °, and satisfy the angle of bend greater than described Metal Substrate pcb board needs simultaneously.
Because metal substrate 1 can be along the 5 places bending of V-type groove, and PI insulating barrier 2 is fit to carry out bending process, thus the Metal Substrate pcb board can be as shown in Figure 2 along V-type groove 5 to a lateral bending song opposite with described copper layer line road 3, thereby realize the bending of Metal Substrate pcb board.
Because metal-based layer 1 thickness at described V-type groove 1 place is less, therefore when metal-based layer 1 is crooked, the bending resistance at V-type groove 5 places is little than the metal-based layer 1 at unslotted place, and metal-based layer 1 is easy to carry out bending at these V-type groove 5 places, makes described V-type groove 5 play the effect of location bending position; On the other hand, V-type groove 5 can reduce the stress that the Metal Substrate pcb board produces when crooked, avoids bending position stress excessive and cause the Metal Substrate pcb board to damage.
Embodiment two:
As shown in Figure 3, present embodiment described Metal Substrate pcb board and embodiment one described Metal Substrate pcb board structure proximate for structure led light source module, difference is: the metal-based layer 10 of present embodiment is with what offer is not U-shaped groove 50 on the side surface of PI insulating barrier 20 adhesions.
Compare with the V-type groove, it is littler to offer the Metal Substrate pcb board of U-shaped groove 50 resistance when crooked, so the Metal Substrate pcb board is easier to carry out bending operation, in addition, the stress that produces when crooked than the V-type groove when U-shaped groove 50 is crooked is little, is conducive to guarantee the electric property of Metal Substrate pcb board.
The width of described U-shaped groove and the degree of depth can be set as the case may be, and preferably, the degree of depth of U-shaped groove is 1/4 to 3/4 of these metal-based layer 10 thickness, and the width of U-shaped groove is 1.0-5.0mm.
Should be understood that, the groove of offering on the metal-based layer of a kind of novel metal base pcb board of the utility model is not limited to V-type groove, the U-shaped groove in above-mentioned two embodiments, in fact, the shape of groove can not be restricted, as long as it makes the thickness of bending position of Metal Substrate pcb board be thinned, for example can also offer deep-slotted chip breaker, dovetail groove etc.; Also can offer multiple difform groove at the metal-based layer of same Metal Substrate pcb board, to satisfy the different bending needs of Metal Substrate pcb board different piece.
Embodiment three:
Present embodiment provides a kind of bent led light source module of Application Example two described Metal Substrate pcb boards, and as shown in Figure 4, this led light source module comprises: metal-based layer 10; The PI(polyimides) insulating barrier 20, and surface thereof adheres to this metal-based layer 10; Copper layer line road 30, it is formed at another surface of described PI insulating barrier 20; Solder mask 40, it also is formed at another surface of PI insulating barrier 20, offers window on this solder mask 40, and copper layer line road 30 exposed formation that are positioned at the window place are electrically connected the zone, and described electrical connection zone comprises the LED pad 70 for assembled LED lamp pearl; LED lamp pearl 60, it is fixed on the described LED pad 70 and with described LED pad 70 by welding or other modes and is electrically connected.Wherein, offer U-shaped groove 50 on the side surface that does not adhere to described PI insulating barrier 20 of described metal-based layer 10.
As shown in Figure 5, described U-shaped groove 50 is divided into first area 80 and second area 90 with described led light source module, the led light source module can be along this U-shaped groove 50 to a lateral bending song relative with described LED lamp pearl 60 so that first area 80 and second area 90 form certain angle.
Understand easily, can be as required at the metal-based layer 10 of led light source module a plurality of U-shaped grooves 50 be set, thereby can make the led light source module form predetermined 3D shape along these U-shaped groove 50 bendings, to satisfy the LED lighting device to the diversified demand of led light source module shape.
Understand easily, the led light source module of the utility model is not limited to embodiment three described technical schemes, for example: described U-shaped groove can also be substituted by embodiment one described V-type groove, deep-slotted chip breaker or dovetail groove etc., also can offer multiple difform groove at the metal-based layer of same led light source module, to satisfy the different bending needs of led light source module different piece.
Claims (6)
1. a bent led light source module is characterized in that, comprising:
Metal-based layer;
PI insulating barrier, surface thereof adhere to described metal-based layer;
Copper layer line road, it is formed at another surface of described PI insulating barrier;
Solder mask, another surface that it also is formed at the PI insulating barrier offers window on this solder mask, and exposed formation the in copper layer line road that is positioned at the window place is electrically connected the zone, and described electrical connection zone comprises the LED pad for assembled LED lamp pearl;
LED lamp pearl, it is fixed on the described LED pad and with described LED pad and is electrically connected;
Wherein, offer at least one groove on the side surface that does not adhere to described PI insulating barrier of described metal-based layer, the degree of depth of described groove is less than the thickness of described metal-based layer.
2. bent led light source module according to claim 1, it is characterized in that: described metal-based layer is the thin plate with toughness that is prepared from by aluminium, copper or stainless steel, and its thickness is between 0.5-2.0mm.
3. bent led light source module according to claim 1 and 2, it is characterized in that: described groove is V-type groove, U-shaped groove, deep-slotted chip breaker or dovetail groove.
4. bent led light source module according to claim 3, it is characterized in that: the degree of depth of described V-type groove is the 1/3-2/3 of the thickness of described metal-based layer.
5. bent led light source module according to claim 4, it is characterized in that: the drift angle of described V-type groove (5) is greater than 30 °.
6. bent led light source module according to claim 3, it is characterized in that: the degree of depth of described U-shaped groove is 1/4 to 3/4 of described metal-based layer thickness, and its width is 1.0-5.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201015819U CN203131524U (en) | 2013-03-06 | 2013-03-06 | Bendable light-emitting diode (LED) light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201015819U CN203131524U (en) | 2013-03-06 | 2013-03-06 | Bendable light-emitting diode (LED) light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203131524U true CN203131524U (en) | 2013-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013201015819U Expired - Fee Related CN203131524U (en) | 2013-03-06 | 2013-03-06 | Bendable light-emitting diode (LED) light source module |
Country Status (1)
| Country | Link |
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| CN (1) | CN203131524U (en) |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104456182A (en) * | 2014-10-09 | 2015-03-25 | 邓放明 | Bendable LED aluminum substrate light source and manufacturing method thereof |
| CN104681693A (en) * | 2015-02-16 | 2015-06-03 | 刘镇 | LED light emitting device |
| CN104786015A (en) * | 2014-03-11 | 2015-07-22 | 浙江利都不锈钢有限公司 | Method for machining metal special-shaped material |
| CN106090662A (en) * | 2016-06-30 | 2016-11-09 | 何忠亮 | A kind of LED with safety protection structure and manufacture method thereof |
| CN106287248A (en) * | 2016-08-24 | 2017-01-04 | 深圳市环基实业有限公司 | A kind of LED batten and manufacture method thereof |
| CN106369337A (en) * | 2015-08-28 | 2017-02-01 | 林广华 | A self-cleaning lighting device with a light-emitting surface |
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- 2013-03-06 CN CN2013201015819U patent/CN203131524U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20190306 |
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| CF01 | Termination of patent right due to non-payment of annual fee |