CN203076791U - Device used for TOL touch and OGS touch upper conducting film layer laser etching - Google Patents
Device used for TOL touch and OGS touch upper conducting film layer laser etching Download PDFInfo
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- CN203076791U CN203076791U CN 201220738010 CN201220738010U CN203076791U CN 203076791 U CN203076791 U CN 203076791U CN 201220738010 CN201220738010 CN 201220738010 CN 201220738010 U CN201220738010 U CN 201220738010U CN 203076791 U CN203076791 U CN 203076791U
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- touch
- laser
- film layer
- tol
- etching
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- MZZBPDKVEFVLFF-UHFFFAOYSA-N cyanazine Chemical compound CCNC1=NC(Cl)=NC(NC(C)(C)C#N)=N1 MZZBPDKVEFVLFF-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 238000010329 laser etching Methods 0.000 title abstract 4
- 230000003287 optical effect Effects 0.000 claims abstract description 14
- 238000004891 communication Methods 0.000 claims abstract description 7
- 238000000608 laser ablation Methods 0.000 claims description 10
- 239000002516 radical scavenger Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 abstract description 18
- 239000011521 glass Substances 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 19
- 239000000428 dust Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
The utility model relates to a device used for TOL touch and OGS touch upper conducting film layer laser etching. Lasers emitted by a laser device enter a beam expander through an optical shutter. Laser beams enter a total reflection lens set adjusting optical path after being expanded and collimated by the beam expander. The lasers are all reflected to a vibration lens system and are accurately controlled to be focused on a conducting film of glass through a telecentric field lens. A focus light spot ranges from 20 micros to 40 micros. The laser device and the vibration lens system are in data communication through a communication system and an industrial personal computer and convert a scanned image into digital signals. The image is converted on a piece to be machined, wherein the piece to be machined needs etching and is absorbed on a vacuum absorption platform. A CCD counterpoint observing system is used for shooting an imported localizer, capturing a target and controlling machining. After one unit is subjected to laser etching, a next unit is moved by the vacuum absorption platform, the lasers start machining again, and the etching of the whole processed image is achieved through repeating of the process. According to the device used for the TOL touch and OGS touch upper conducting film layer laser etching, the machining method is concise, the machining efficiency is high, and consumable items are not needed.
Description
Technical field
The utility model relates to the device of a kind of TOL of being used for, OGS touch-control upper conductive film layer laser ablation, belongs to the laser micro-machining technology field.
Background technology
OGS(One glass solution) structure: directly form ITO conducting film and sensor on cover glass, a glass plays the double action of cover glass and touch sensor simultaneously.The advantage of OGS has: 1) saved one deck glass cost and reduced the cost of once fitting; 2) alleviated weight; 3) increased light transmittance.OGS can satisfy ultra-thinization of intelligent terminal demand preferably, and promotes display effect, is the inevitable choice of following high-end brand terminal.TOL(Touch On Lens) solution is solution on the concrete technology evolution of the OGS direction, i.e. touch-control module tempered glass Cover Lens fusion upstream is made in touch-control module on the Cover Lens.
Conductive film layer circuit preparation method on the TOL scheme of main flow is the gold-tinted etching process at present.But the gold-tinted etching technics needs early investment bigger, with high costs, selectivity for material is comparatively narrow, need to cooperate different photoresists, be not suitable for the preparation method of all conductive film layers on the market, it is bigger to add the regular maintenance expense, and consumptive material and human cost are brought the increase of whole production cost, and the application restriction is comparatively serious.
Laser ablation conductive film layer technology is to utilize pulse laser laser beam to be focused to 20 microns to 90 microns hot spot by optical focusing system, hot spot after the focusing, reach the removal energy threshold of material, by the accurate scanning fast of high-velocity scanning galvanometer system, thereby the circuit of realizing touch-screen upper conductive film layer is made purpose, the not visible zone of Zhi Zuoing is narrower like this, and practicality is stronger.
The utility model content
The purpose of this utility model is to overcome the deficiency that prior art exists, and the device of a kind of TOL of being used for, OGS touch-control upper conductive film layer laser ablation is provided.
The purpose of this utility model is achieved through the following technical solutions:
Be used for TOL, the device of OGS touch-control upper conductive film layer laser ablation, characteristics are: include laser instrument, optical gate, beam expanding lens, lens set is all-trans, galvanometer system and psychological field mirror far away, the output of described laser instrument is furnished with optical gate, the output of optical gate is provided with beam expanding lens, the output of beam expanding lens is furnished with the lens set that is all-trans, the output of the lens set that is all-trans is furnished with galvanometer system and psychological field mirror far away successively, the output of psychological field mirror far away is right against vacuum absorbing platform, the top of described vacuum absorbing platform is furnished with CCD contraposition observing system, one side of described vacuum absorbing platform is furnished with scavenger system, and opposite side is equipped with dust-precipitating system; Described laser instrument all links to each other with industrial computer by communication system with galvanometer system.
Further, the above-mentioned device that is used for TOL, OGS touch-control upper conductive film layer laser ablation, described laser instrument are that wavelength is 199nm～1064nm, pulsewidth at 1ps～500ns, the frequency laser instrument at 1KHz～2MKHz.
Substantive distinguishing features and obvious improvement that technical solutions of the utility model are outstanding are mainly reflected in:
By using high-frequency short-pulse laser as lasing light emitter, to the conductive film layer in the TOL scheme (as ITO, copper film and silver slurry) carry out laser-induced thermal etching, conductive film layer gasifies under the effect of high-frequency short pulse solid state laser and reaches the purpose of ablation, the etching of finishing these conductive film materials by the mobile splicing and the etching of small breadth galvanometer of high accuracy platform, the dust that produces processes touch-screen electronic product pollution-free, that linearity is stable, function is intact by scavenger system and big flow laying dust system control of dust.Processing mode is succinct, and working (machining) efficiency is higher and need not consumptive material.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: structural representation of the present utility model.
The specific embodiment
As shown in Figure 1, be used for TOL, the device of OGS touch-control upper conductive film layer laser ablation, include laser instrument 1, optical gate 2, beam expanding lens 3, lens set 4 is all-trans, galvanometer system 5 and psychological field mirror 6 far away, laser instrument 1 is that wavelength is 199nm～1064nm, pulsewidth is at 1ps～500ns, frequency is at the laser instrument of 1KHz～2MKHz, the output of laser instrument 1 is furnished with optical gate 2, the output of optical gate 2 is provided with beam expanding lens 3, the output of beam expanding lens 3 is furnished with the lens set 4 that is all-trans, the output of the lens set that is all-trans 4 is furnished with galvanometer system 5 and psychological field mirror 6 far away successively, the output of psychological field mirror 6 far away is right against vacuum absorbing platform 11, the top of described vacuum absorbing platform 11 is furnished with CCD contraposition observing system 7, one side of described vacuum absorbing platform 13 is furnished with scavenger system 9, and opposite side is equipped with dust-precipitating system 8; Laser instrument 1 all links to each other with industrial computer 12 by communication system 13 with galvanometer system 5.
When said apparatus was used for TOL, OGS touch-control upper conductive film layer laser ablation, processing step was:
(S101) obtain Cover Lens glass, at the glass back printing-ink, plating ITO conductive film layer on printing ink;
(S102) laser-induced thermal etching ITO conductive film layer, the laser that laser instrument 1 sends enters beam expanding lens 3 through optical gate 2 gauge tap light behind the optical gate 2 control laser beams, and 3 pairs of light beams of beam expanding lens carry out coaxial expansion bundle, improve the angle of divergence of beam propagation on the one hand, thereby reach the purpose of beam path alignment; In addition on the one hand, laser beams coaxial is expanded bundle, make that focusing back hot spot and depth of focus are littler, thereby realize the purpose of laser stabilization etching; Light beam enters the lens set 4 that is all-trans and adjusts light path behind beam expanding lens 3 beam-expanding collimations, and laser all reflexes to galvanometer system 5, and focuses on the conducting film on glass by psychological field mirror 6 accurate control laser far away, and focal beam spot is at 20um～40um; Laser instrument 1 and galvanometer system 5 carries out data communication through communication systems 13 and industrial computer 12, and scanning patter is converted into data signal, and figure transforms to be needed on to be processed 10 of etching, and to be processed 10 by absorption on the vacuum absorbing platform 11; Take and grasp target by the location mark that CCD contraposition observing system 7 will import, control processing; When laser carries out etching according to design configuration, open scavenger system 9 and dust-precipitating system 8 simultaneously, the dust that etching is produced all sucks in the dust-precipitating system 8; After a unit was finished in laser-induced thermal etching, vacuum absorbing platform 11 moved next unit, and laser begins processing again, so repeatedly, realizes the ITO circuit etching of whole processing breadth.(S103) plating laser reflectance coating on the printing ink;
(S104) conductive film layers such as printed silver slurry or copper plating film on the laser reflectance coating;
(S105) laser second etch conductive film layer is according to processing step (S102) etched edge circuit;
(S106) print insulating protective layer on the conducting film that etching is good.
It should be noted that above step (S101), (S102), (S106) are applicable to no frame cabling scheme, step (S101), (S102), (S103), (S104), (S105), (S106) have been applicable to frame cabling scheme.
In sum, the utility model is by using high-frequency short-pulse laser as lasing light emitter, to the conductive film layer in the TOL scheme (as ITO, copper film and silver slurry) carry out laser-induced thermal etching, conductive film layer gasifies under the effect of high-frequency short pulse solid state laser and reaches the purpose of ablation, the etching of finishing these conductive film materials by the mobile splicing and the etching of small breadth galvanometer of high accuracy platform, the dust that produces processes touch-screen electronic product pollution-free, that linearity is stable, function is intact by scavenger system and big flow laying dust system control of dust.Processing mode is succinct, and working (machining) efficiency is higher and need not consumptive material.
What need understand is: the above only is a preferred implementation of the present utility model; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (2)
1. be used for TOL, the device of OGS touch-control upper conductive film layer laser ablation, it is characterized in that: include laser instrument (1), optical gate (2), beam expanding lens (3), the lens set that is all-trans (4), galvanometer system (5) and psychological field mirror (6) far away, the output of described laser instrument (1) is furnished with optical gate (2), the output of optical gate (2) is provided with beam expanding lens (3), the output of beam expanding lens (3) is furnished with the lens set that is all-trans (4), the output of the lens set that is all-trans (4) is furnished with galvanometer system (5) and psychological field mirror (6) far away successively, the output of psychological field mirror (6) far away is right against vacuum absorbing platform (11), the top of described vacuum absorbing platform (11) is furnished with CCD contraposition observing system (7), one side of described vacuum absorbing platform (13) is furnished with scavenger system (9), and opposite side is equipped with dust-precipitating system (8); Described laser instrument (1) all links to each other with industrial computer (12) by communication system (13) with galvanometer system (5).
2. the device that is used for TOL, OGS touch-control upper conductive film layer laser ablation according to claim 1 is characterized in that: described laser instrument (1) is that wavelength is 199nm～1064nm, pulsewidth at 1ps～500ns, the frequency laser instrument at 1KHz～2MKHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220738010 CN203076791U (en) | 2012-12-28 | 2012-12-28 | Device used for TOL touch and OGS touch upper conducting film layer laser etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220738010 CN203076791U (en) | 2012-12-28 | 2012-12-28 | Device used for TOL touch and OGS touch upper conducting film layer laser etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203076791U true CN203076791U (en) | 2013-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220738010 Expired - Fee Related CN203076791U (en) | 2012-12-28 | 2012-12-28 | Device used for TOL touch and OGS touch upper conducting film layer laser etching |
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| Country | Link |
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| CN (1) | CN203076791U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056527A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for laser etching of conducting film layers on touch on lens (TOL) and one glass solution (OGS) touch components |
| CN106583346A (en) * | 2016-11-15 | 2017-04-26 | 惠科股份有限公司 | Method and apparatus for removing conductive film |
| CN108326416A (en) * | 2018-02-10 | 2018-07-27 | 陕西师范大学 | A kind of design producing apparatus on transparent conductive film and method |
-
2012
- 2012-12-28 CN CN 201220738010 patent/CN203076791U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056527A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for laser etching of conducting film layers on touch on lens (TOL) and one glass solution (OGS) touch components |
| CN106583346A (en) * | 2016-11-15 | 2017-04-26 | 惠科股份有限公司 | Method and apparatus for removing conductive film |
| CN106583346B (en) * | 2016-11-15 | 2019-06-11 | 惠科股份有限公司 | Method and apparatus for removing conductive film |
| US10799920B2 (en) | 2016-11-15 | 2020-10-13 | HKC Corporation Limited | Method and apparatus for removing conductive film |
| CN108326416A (en) * | 2018-02-10 | 2018-07-27 | 陕西师范大学 | A kind of design producing apparatus on transparent conductive film and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130724 Termination date: 20161228 |
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| CF01 | Termination of patent right due to non-payment of annual fee |