CN207431532U - A kind of laser aid for cutting transparent or semitransparent material - Google Patents
A kind of laser aid for cutting transparent or semitransparent material Download PDFInfo
- Publication number
- CN207431532U CN207431532U CN201721190762.8U CN201721190762U CN207431532U CN 207431532 U CN207431532 U CN 207431532U CN 201721190762 U CN201721190762 U CN 201721190762U CN 207431532 U CN207431532 U CN 207431532U
- Authority
- CN
- China
- Prior art keywords
- laser
- galvanometer
- measuring device
- zoom
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model is related to a kind of laser aids for cutting transparent or semitransparent material, structure in order to control system respectively with laser, coaxial automatic focusing/zoom and height measuring device, galvanometer or three-dimensional platform are connected, laser, beam shaping element, coaxial automatic focusing/zoom and height measuring device, galvanometer or fixed optical path cutting head are installed successively by optical path requirements, and the laser beam that laser is sent enters galvanometer or fixed optical path cutting head after beam shaping element and coaxial automatic focusing/zoom and height measuring device, control system controls galvanometer or three-dimensional platform, the laser that galvanometer or fixed optical path cutting head are emitted is made to focus on always on the exit facet of material to be processed.It the plasma that generates and splashes when the utility model is due to laser cutting not between incident beam and focus, efficiently avoids Plasma Shielding Effection, substantially increase the utilization ratio of energy.In addition, also have many advantages, such as that fuel factor is small, cutting speed is fast, cut surface zero draft.
Description
Technical field
The utility model is related to a kind of laser aids for cutting transparent or semitransparent material, belong to high-end devices field, should
Device can be widely used for the processing of the transparent or semitransparent materials such as glass, sapphire, Silicon Wafer.
Background technology
With the consumption electronic products such as smart mobile phone, LED, tablet computer, touch-screen and smartwatch technology development with
Demand growth, the industrial market demand with trnaslucent materials transparent to glass cover-plate, sapphire window, wafer etc. are also increasingly increasing
It is long.Efficiently, the cutter device of the transparent or semitransparent material of high quality be conducive to improve product engineering properties, reduce it is transparent crisp
Property material processing cost and increase electronic product competitiveness.
Traditional cutting mode of brittle transparent or trnaslucent materials controls break bar based on cutting with break bar by numerically-controlled machine tool
Position, utilize CCD positioning complete material cutting.Stress can be generated to material, be easy to cause material in break bar cutting process
Chipping or fragmentation；And break bar is easily damaged, need to often replace by wearing for a long time.It is contour hard especially for sapphire
The transparent material of degree, break bar cutting efficiency is very low, and wears very high.In addition break bar cutting is when cutting small size or complex figure
It can be extremely limited.
The shortcomings that in order to overcome break bar, laser equipment are also often used in cutting transparent or semitransparent fragile material.Often now
Laser equipment is mainly in a manner that laser spot is moved by material incidence towards exit facet, and successively ablator is until material
Material is cut through.This cutting mode can generate a large amount of plasmas and splashing in material incidence surface, hinder propagation (etc. of laser
Gas ions screen effect), the shortcomings of so as to cause processing efficiency is low, energy consumption is big, Thermal incubation effect is strong.In addition, this cutting side
The cut surface that formula obtains has certain taper.
In order to increase cutting efficiency, above-mentioned conventional laser cutting equipment also has using state-of-the-art ultrafast laser, utilizes height
The laser of power density and the nonlinear effect of transparent or semitransparent material improve the Recession rate of material, reduce chipping etc., but
This does not change the defects of this equipment substantially, and in many cases, Plasma Shielding Effection can be more serious.
The content of the invention
The purpose of the utility model is to overcome the deficiencies of tradition machinery cutting equipment and conventional laser cutting equipment, provide
A kind of laser aid of high efficiency, the cutting transparent or semitransparent material of high quality.
The technical implementation way of the utility model is：
A kind of laser aid for cutting transparent or semitransparent material, including laser, beam shaping element, coaxial automatic
Focusing/zooming and height measuring device, galvanometer, control system, it is characterised in that：Control system respectively with laser, coaxial automatic adjust
Coke/zoom and height measuring device, galvanometer are connected, and laser, beam shaping element, coaxial automatic focusing/zoom and height measuring device shake
Mirror is installed successively by optical path requirements, and the laser beam that laser is sent passes through beam shaping element and coaxial automatic focusing/zoom
And into galvanometer, control system control galvanometer the laser that galvanometer is emitted is made to focus on material to be processed always after height measuring device
On exit facet.
A kind of laser aid for cutting transparent or semitransparent material, including laser, beam shaping element, coaxial automatic tune
Coke/zoom and height measuring device, fixed optical path cutting head, control system, three-dimensional platform, it is characterised in that：Control system respectively with
Laser, coaxial automatic focusing/zoom and height measuring device, three-dimensional platform are connected, laser, beam shaping element, coaxial automatic
Focusing/zooming and height measuring device, fixed optical path cutting head are installed successively by optical path requirements, and the laser beam that laser is sent passes through
Into fixed optical path cutting head, control system control three after beam shaping element and coaxial automatic focusing/zoom and height measuring device
Platform is tieed up, the laser that fixed optical path cutting head is emitted is made to focus on the exit facet for being positioned over material to be processed on three-dimensional platform always
On.
The laser aid of transparent or semitransparent material is cut according to above two, further includes blowning installation, blowning installation peace
Mounted in the upper surface location of rapidoprint, using blowning installation in cutting process, rapidoprint is cooled down and is blown away
The dust or slag that upper surface generates.
The laser aid of transparent or semitransparent material is cut according to above two, further includes vacuum and air extractor, vacuum
And air extractor is mounted on the lower surface position in rapidoprint, and the substance cut down is enable to be removed rapidly.
The laser beam sent from laser is laggard by beam shaping element and coaxial automatic focusing/zoom and height measuring device
Enter galvanometer or into cutting head, be allowed to focus on always on the exit facet of material to be processed.Coaxial automatic focusing/zoom and survey are high
The thickness of device automatic measurement rapidoprint is with a distance from galvanometer or fixed optical path cutting head, and making laser beam start to focus on
On the exit facet of material.The graphics of cutting signal and are controlled scanning road of the galvanometer on x/y plane by control system in order to control
The motion path of footpath or three-dimensional platform on x/y plane.In processing, galvanometer is according to coaxial automatic focusing/zoom and height measuring device
Measured material thickness and predetermined leg speed shift to the upper surface away from rapidoprint in z-axis；Or three-dimensional platform is according to same
Material thickness and predetermined leg speed measured by axis automatic focusing/zoom and height measuring device are cut in z-axis to away from fixed optical path
Cut the direction movement of head, laser spot made gradually to shift to the upper surface of rapidoprint in z-axis, realize cutting from bottom to top until
Rapidoprint is cut through completely.
The optical maser wavelength sent of the laser is in 355-1064nm.
The beam shaping unit is made of a diffractive-optical element and a beam expanding lens.
The beam shaping unit is made of two gratings and a beam expanding lens.
The utility model has compared with the advantages of tradition machinery cutting equipment：Without mechanical stress, no mechanical wear, manuscript
Shape is not limited by the advantages that break bar, cutting line width.
The utility model has with respect to the advantages of conventional laser cutting equipment：Coaxially, automatic and quickly focusing, zoom and survey
The thickness and material of amount material are with a distance from galvanometer or fixed optical path cutting head.Simultaneously as during laser cutting the grade that generates from
Daughter and splashing efficiently avoid Plasma Shielding Effection, substantially increase energy not between incident beam and focus
Utilization ratio.In addition, also have many advantages, such as that fuel factor is small, cutting speed is fast, cut surface zero draft.
Description of the drawings
Fig. 1 is the structure diagram of one embodiment of the utility model.
Fig. 2 is the structure diagram of another embodiment of the utility model.
Fig. 3 is the particular example schematic diagram for the beam shaping unit that the utility model may be employed.
Fig. 4 is another particular example schematic diagram for the beam shaping unit that the utility model may be employed.
Specific embodiment
With reference to attached drawing, the utility model will be further described.
The laser of the utility model, coaxial automatic focusing/zoom and height measuring device, galvanometer, control system, dress of blowing
It puts, vacuum and air extractor, three-dimensional platform structure are existing.Beam shaping element according to the peak power of laser pulse compared with
Just, a diffractive-optical element and a beam expanding lens composition or two gratings and a beam expanding lens composition can be selected.
As shown in Figure 1, a kind of laser aid for cutting transparent or semitransparent material, including laser 1, beam shaping element
2nd, coaxial automatic focusing/zoom and height measuring device 3, galvanometer 4, control system 8, blowning installation 6, vacuum and air extractor 7, it is special
Sign is：Control system 8 is connected respectively with laser 1, coaxial automatic focusing/zoom and height measuring device 3, galvanometer 4, laser 1,
Beam shaping element 2, coaxial automatic focusing/zoom and height measuring device 3, galvanometer 4 are installed successively by optical path requirements, and laser 1
The laser beam sent is after beam shaping element 2 and coaxial automatic focusing/zoom and height measuring device 3 into galvanometer 4, control system
8 control galvanometer 4 of system, makes the laser that galvanometer 4 is emitted focus on always on the exit facet of material 5 to be processed.Blowning installation 6 is mounted on
The upper surface location of rapidoprint 5 using blowning installation 6 in cutting process, cools down rapidoprint 5 and is blown away upper
The dust or slag that surface generates；Vacuum and air extractor 7 are mounted on the lower surface position in rapidoprint 5, make to cut down
Substance can be removed rapidly.
As shown in Fig. 2, a kind of laser aid for cutting transparent or semitransparent material, including laser 1, beam shaping element
2nd, coaxial automatic focusing/zoom and height measuring device 3, fixed optical path cutting head 4, control system, three-dimensional platform, blowning installation 6, true
Empty and air extractor 7, fixed optical path cutting head 4 are made of transmitting mirror 4a and focus lamp 4b, it is characterised in that：Control system 8 is divided
It is not connected with laser 1, coaxial automatic focusing/zoom and height measuring device 3, three-dimensional platform 9, laser 1, beam shaping element
2nd, coaxial automatic focusing/zoom and height measuring device 3, transmitting mirror 4a and focus lamp 4b are installed successively by optical path requirements, and laser 1
The laser beam sent into transmitting mirror 4a and gathers after beam shaping element 2 and coaxial automatic focusing/zoom and height measuring device 3
Burnt mirror 4b, control system 8 control three-dimensional platform 9, and the laser that focus lamp 4b is emitted is made to focus on always and is positioned on three-dimensional platform 9
On the exit facet of material 5 to be processed；Blowning installation 6 is mounted on the upper surface location of rapidoprint 5, using blowing in cutting process
Device of air cools down rapidoprint and blows away the dust or slag that are generated in upper surface.Vacuum and air extractor 7 are mounted on
In the lower surface position of rapidoprint 5, the substance cut down is enable to be removed rapidly.
The laser beam sent from laser is laggard by beam shaping element and coaxial automatic focusing/zoom and height measuring device
Enter galvanometer or into cutting head, be allowed to focus on always on the exit facet of material to be processed.Coaxial automatic focusing/zoom and survey are high
The thickness of device automatic measurement rapidoprint is with a distance from galvanometer or fixed optical path cutting head, and making laser beam start to focus on
On the exit facet of material.The graphics of cutting signal and are controlled scanning road of the galvanometer on x/y plane by control system in order to control
The motion path of footpath or three-dimensional platform on x/y plane.In processing, galvanometer is according to coaxial automatic focusing/zoom and height measuring device
Measured material thickness and predetermined leg speed move in z-axis to the upper surface direction away from rapidoprint；Or three-dimensional platform
It is fixed according to the material thickness measured by coaxial automatic focusing/zoom and height measuring device and predetermined leg speed in z-axis to separate
The direction movement of light path cutting head, makes laser spot gradually shift to the upper surface of rapidoprint in z-axis, and realization is cut from bottom to top
It cuts until rapidoprint is cut through completely.
In the utility model, the wavelength of laser 1 used is generally in the range of 355nm to 1064nm, but be not excluded for
Other optical maser wavelengths, to some special materials, the wavelength of laser can be outside above-mentioned wave-length coverage.Specific optical maser wavelength
Depending on material and processing request to be processed, material to be processed is transparent or translucent.This is because this reality
With it is new the characteristics of one of be that cutting starts from the exit facet of transparent material, that is, need most of energy of laser beam must be first
Permeable material, therefore transparent material will have the laser of wavelength used in processing relatively low linear absorption coefficient, to ensure laser only
Stronger absorption is generated near focal point, without generating too strong absorption in the smaller region of power density.
In the utility model, laser pulse width used can be nanosecond (even broader), picosecond or femtosecond, specifically
Laser pulse width depend on material and processing request to be processed.Since the peak power of nanosecond laser is relatively low, generally
It need not consider self-focusing effect and other non-linear absorptions, generate linear absorption of the energy essentially from material of cutting process,
Therefore the material processed at this time cannot be fully transparent.If using ultrashort pulse, since the peak power of its laser is very high,
The laser cutting of high-quality can be carried out using its non-linear absorption.
In the utility model, if be cut by laser using the non-linear absorption properties of ultrashort laser pulse, at this time
It may need to do laser beam shaping or shaping pulse.This is because ultrafast (including picosecond and femtosecond laser, especially femtosecond
Laser) pulse peak power it is higher, it is more likely that material internal generate self-focusing, increase laser focus on material exit facet
Difficulty.Beam shaping or shaping pulse can realize space light splitting or time light splitting, reach and inhibit laser self-focusing effect.Tool
The shaping methods of body depend on laser and processing request used.In general beam shaping can be used in picosecond laser, using spreading out
It penetrates or reflects shaping device and shaping is carried out to wavefront, as shown in figure 3, its beam shaping unit 2 used is by an optical diffraction
2a and beam expanding lens 2b composition of element (DOE).Shaping pulse then can be used to femtosecond laser, as shown in figure 4, beam shaping list
Member 2 is added chirp grating on femtosecond pulse, is reached time light splitting by two gratings (2c, 2d) and a beam expanding lens 2b composition
Purpose.
The beam shaping and shaping pulse method mentioned in this section are only to illustrate the special case used, are not being taken off
In the case of principle from the utility model, other shaping methods also should be regarded as the scope of protection of the utility model.
In the utility model, coaxial automatic focusing/zoom and height measuring device 3 are by measuring the anti-of 5 upper and lower surface of material
It penetrates the optical path difference of light and calculates the focal position of exit facet so as to reach automatic focusing and zoom, the focus of manual setting laser is extremely
Exit facet is often relatively difficult.Furthermore it is possible to according to actual processing request, coaxial or paraxial can be increased on this device
Visual performance, to be accurately positioned or be monitored in real time or realize automation cutting etc. with reference to cutting software.
In the utility model, the laser facula after line focus need to have smaller depth of focus, to ensure in ablation exit facet
While larger destruction will not be caused to material internal because this destruction can cause huge scattering loss.This requires
Beam shaping unit expands multiplying power or focusing arrangement with smaller effective focal length, the selection of specific device parameters with larger
The requirement of material depending on processing, the laser used and processing.
In the utility model, movement of the focus in z-axis should be synchronous with the exit facet of material.With going for material
It removes, material is more and more thinner, and exit facet is also mobile.If the movement of focus is slower than exit facet, process velocity can be influenced simultaneously
It is likely to occur unnecessary heat accumulation；If the movement of focus is faster than exit facet, material is not cut off.Therefore focus is in z-axis
On movement and the exit facet of material can synchronously reach optimal cutting effect.
It is emphasized that：Above description is only a kind of basic embodiment of the utility model, in actual production,
Correlation engineering technical staff can carry out several modifications or improvement under the guidance of principle of this utility model according to actual demand,
These modification and improvement also should be regarded as the scope of protection of the utility model.
Claims (7)
1. a kind of laser aid for cutting transparent or semitransparent material, including laser, beam shaping element, coaxial automatic tune
Coke/zoom and height measuring device, galvanometer, control system, it is characterised in that：Control system respectively with laser, coaxial automatic focusing/
Zoom and height measuring device, galvanometer are connected, laser, beam shaping element, coaxial automatic focusing/zoom and height measuring device, galvanometer
Installed successively by optical path requirements, and the laser beam that sends of laser by beam shaping element and coaxial automatic focusing/zoom and
Into galvanometer, control system control galvanometer the laser that galvanometer is emitted is made to focus on going out for material to be processed always after height measuring device
It penetrates on face.
2. a kind of laser aid for cutting transparent or semitransparent material, including laser, beam shaping element, coaxial automatic tune
Coke/zoom and height measuring device, fixed optical path cutting head, control system, three-dimensional platform, it is characterised in that：Control system respectively with
Laser, coaxial automatic focusing/zoom and height measuring device, three-dimensional platform are connected, laser, beam shaping element, coaxial automatic
Focusing/zooming and height measuring device, fixed optical path cutting head are installed successively by optical path requirements, and the laser beam that laser is sent passes through
Into fixed optical path cutting head, control system control three after beam shaping element and coaxial automatic focusing/zoom and height measuring device
Platform is tieed up, the laser that fixed optical path cutting head is emitted is made to focus on the exit facet for being positioned over material to be processed on three-dimensional platform always
On.
3. the laser aid of cutting transparent or semitransparent material according to claim 1 or 2, it is characterised in that：It further includes
Blowning installation, blowning installation are mounted on the upper surface location of rapidoprint.
4. the laser aid of cutting transparent or semitransparent material according to claim 1 or 2, it is characterised in that：It further includes
Vacuum and air extractor, vacuum and air extractor are mounted on the lower surface position in rapidoprint.
5. the laser aid of cutting transparent or semitransparent material according to claim 1 or 2, it is characterised in that：It is described to swash
The optical maser wavelength sent of light device is in 355-1064nm.
6. the laser aid of cutting transparent or semitransparent material according to claim 1 or 2, it is characterised in that：The light
Beam shaping unit is made of a diffractive-optical element and a beam expanding lens.
7. the laser aid of cutting transparent or semitransparent material according to claim 1 or 2, it is characterised in that：The light
Beam shaping unit is made of two gratings and a beam expanding lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721190762.8U CN207431532U (en) | 2017-09-18 | 2017-09-18 | A kind of laser aid for cutting transparent or semitransparent material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721190762.8U CN207431532U (en) | 2017-09-18 | 2017-09-18 | A kind of laser aid for cutting transparent or semitransparent material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207431532U true CN207431532U (en) | 2018-06-01 |
Family
ID=62301597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721190762.8U Expired - Fee Related CN207431532U (en) | 2017-09-18 | 2017-09-18 | A kind of laser aid for cutting transparent or semitransparent material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207431532U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109454325A (en) * | 2018-11-26 | 2019-03-12 | 南京航空航天大学 | A kind of laser assisted cuts the device and its technique of the transparent hard brittle material of grinding |
| CN110977205A (en) * | 2019-12-20 | 2020-04-10 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
| CN114083155A (en) * | 2021-12-31 | 2022-02-25 | 杭州银湖激光科技有限公司 | Method for laser cutting silicon wafer |
| CN114619157A (en) * | 2022-03-16 | 2022-06-14 | 新代科技(苏州)有限公司 | A glass drilling device based on 2D galvanometer laser processing and Z-axis motion |
-
2017
- 2017-09-18 CN CN201721190762.8U patent/CN207431532U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109454325A (en) * | 2018-11-26 | 2019-03-12 | 南京航空航天大学 | A kind of laser assisted cuts the device and its technique of the transparent hard brittle material of grinding |
| CN110977205A (en) * | 2019-12-20 | 2020-04-10 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
| CN114083155A (en) * | 2021-12-31 | 2022-02-25 | 杭州银湖激光科技有限公司 | Method for laser cutting silicon wafer |
| CN114619157A (en) * | 2022-03-16 | 2022-06-14 | 新代科技(苏州)有限公司 | A glass drilling device based on 2D galvanometer laser processing and Z-axis motion |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207431532U (en) | A kind of laser aid for cutting transparent or semitransparent material | |
| CN102357738B (en) | Laser processing method | |
| TWI595953B (en) | Laser processing device and control method thereof, control method and adjustment method of laser device | |
| CN102133690B (en) | Laser dicing device | |
| CN105458530B (en) | A kind of device and method of femtosecond laser processing blade of aviation engine air film hole | |
| CN102310285B (en) | Laser processing device of silicon glass bonding slice and method thereof | |
| US20090045179A1 (en) | Method and system for cutting solid materials using short pulsed laser | |
| CN108031992A (en) | The ultrafast systems of processing of LTCC and its method | |
| US20120190175A1 (en) | Laser processing method and laser processing apparatus | |
| JP2013146747A (en) | Cleaving method by laser and laser cleaving device | |
| CN103008887A (en) | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser | |
| CN102814591B (en) | Laser processing and laser process equipment | |
| CN105127604A (en) | Laser processing system and method | |
| CN104972226A (en) | Double-head laser machining device and machining method | |
| CN108788451A (en) | A kind of processing method and device of ultrafast laser transparent material | |
| CN109676269A (en) | A kind of the laser pre-segmentation method and device of LED wafer | |
| CN106216856A (en) | Double focus laser system of processing and processing method thereof | |
| CN104944756A (en) | Laser machining strengthened glass | |
| CN104439715A (en) | Laser cutting device for transparent materials and laser cutting process applied to laser cutting device | |
| CN102718398B (en) | Method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser | |
| KR20160093593A (en) | Method and apparatus for internally marking a substrate having a rough surface | |
| CN111151895A (en) | Process and system for cutting transparent material by utilizing filamentation effect | |
| CN104237997A (en) | Device and method for carrying out laser machining on light guide board inside glass | |
| CN103387335B (en) | Cutter for substrate and method thereof | |
| JP2006179941A (en) | Method of cutting semiconductor material substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180601 Termination date: 20210918 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |