CN203015266U - Circuit board used for lighting device and lighting device having same circuit board - Google Patents
Circuit board used for lighting device and lighting device having same circuit board Download PDFInfo
- Publication number
- CN203015266U CN203015266U CN2012205911411U CN201220591141U CN203015266U CN 203015266 U CN203015266 U CN 203015266U CN 2012205911411 U CN2012205911411 U CN 2012205911411U CN 201220591141 U CN201220591141 U CN 201220591141U CN 203015266 U CN203015266 U CN 203015266U
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- circuit board
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Abstract
The utility model relates to a circuit board (100) used for a lighting device and a lighting device (200) having the same circuit board (100). The circuit board (100) comprises a substrate (1) and a conductive circuit arranged in the substrate (1) and/or on the substrate (1). At least one via hole which communicates one side of the substrate (1) with the opposite side of the substrate (1) is formed in the substrate (1). Each via hole (11) is internally provided with an auxiliary heat conducting block (2). The wall of the via hole (11) extends from one side of the substrate (1) to the opposite side of the substrate (1), and the length of the wall in the extension direction is larger than the thickness of the substrate.
Description
Technical field
The utility model relates to a kind of circuit board for lighting device.In addition, the utility model also relates to a kind of lighting device with circuit board of the above-mentioned type.
Background technology
Along with the continuous progress of LED technology, LED is applied in lighting device more and more widely as light source.LED chip often is placed on MCPCB plate (metal-core printed circuit board), passes to rapidly fin with the heat that LED chip self is produced.The MCPCB plate has good heat conductivility, but it is very expensive.In the LED light structures, the highest 10%-30% that can be total cost of the cost of MCPCB plate.With respect to the cost of MCPCB plate, the cost of FR4 printed circuit board (PCB) is only the 20%-35% of its cost.If with the FR4 printed circuit board applications in light structures, the total cost of the light structures 6.5%-24% that can descend so.But the lower conductive coefficient (0.2-0.5W/m*k) of FR4 material has caused restriction to the heat management of light structures.
In order to improve the heat conductivility of the printed circuit board (PCB) that adopts the FR4 material, usually in dispelling the heat through hole, carrying of FR4 printed circuit board (PCB) be mounted with the material that itself has high conductive coefficient, for example thermal conductive ceramic.These heat radiation through holes can pass to the radiator that is arranged on FR4 printed circuit board (PCB) opposite side with the part heat that LED chip itself produces.Yet, the gap inevitably occurs between the wall of heat radiation through hole and thermal conductive ceramic, and the thickness of circuit board being generally less, this can cause there is no enough creepage distances between LED chip and radiator.How to make inexpensively the LED lighting device, guarantee simultaneously an inevitable problem when enough creepage distances have become design LED lighting device.
The utility model content
For solving the problems of the technologies described above, the utility model proposes a kind of circuit board for lighting device, this circuit board with low cost, heat conductivility is good, can provide enough creepage distances simultaneously.In addition, the utility model has also proposed a kind of lighting device with circuit board of the above-mentioned type.
First purpose of the present utility model realizes thus by a kind of circuit board for lighting device, and this circuit board comprises: substrate; Be arranged in the conducting wire in substrate and/or on substrate, wherein be formed with at least one through hole that passes to a relative side from a side of substrate in substrate, be furnished with the auxiliary heat conduction piece in each through hole, wherein, the wall of through hole extends to a relative side from a side of substrate, and the length of this wall on bearing of trend is greater than the thickness of substrate.Limit in the creepage distance of the circuit board both sides length by the gap between through hole and auxiliary heat conduction piece.And in design of the present utility model, because the length in the gap between through hole and auxiliary heat conduction piece is extended significantly, thereby increased significantly creepage distance between circuit board both sides.
According to the utility model proposes, through hole comprises at least two section's sections, and the wall part of these at least two section's sections consists of the wall of through hole, and this wall zigzag ground extends to a relative side from a side of substrate.Because the gap between through hole and auxiliary heat conduction piece is not to pass to radiator one side from a side of circuit board point-blank, but wind in and out, this has increased the extended distance of gap between both sides to a great extent, that is to say the creepage distance that has increased significantly between both sides.
According to the utility model proposes, to see from top to bottom in the cross section perpendicular to substrate, adjacent section's section occupied area on substrate is different.In this case, the length sum of the wall part of adjacent section's section must be greater than the thickness of substrate, thereby increased significantly the creepage distance between circuit board both sides.
Preferably, in the cross section perpendicular to substrate, the wall part of section's section of through hole is straight line, and the wall part in adjacent section's section is not point-blank.Therefore the wall of through hole has formed tortuous trend, and this version is simpler, is easy to make.
Advantageously, in the cross section perpendicular to substrate, the wall of through hole has stair-stepping trend.This has further simplified the manufacturing of through hole, thereby has reduced the manufacture difficulty of circuit board, and then has reduced manufacturing cost.
Further advantageously, be parallel in the cross section of substrate, through hole has circular cross section, and wherein the diameter of adjacent section's section is different, and forms ladder between two adjacent section's sections.Through hole sees on the whole and can be regarded as the different cylindrical combination of a plurality of diameters, and these cylinders are so arranged, and make each cylindrical diameter diminish in turn.
Very advantageously, through hole comprises two section's sections, in the cross section perpendicular to substrate, and two T-shaped or inverted T shape profiles of the common formation of section's section.Because the thickness of circuit board itself is limited, distance between two openings of the through hole in circuit board is also very limited, if too much section's section is set, just inevitably increase manufacture difficulty, two section's sections are set also can provide enough creepage distances in the through hole both sides of circuit board.
According to an optional scheme of the present utility model, to see from top to bottom in the cross section perpendicular to substrate, the wall part of adjacent section's section has different angles with respect to substrate.Such structure can increase the extended distance of the wall of through hole equally, thus the creepage distance of increasing circuit plate both sides.
Advantageously, in the cross section perpendicular to substrate, the wall part of at least one section is curve, can certainly form the trend of other types, for example forms the trend of S type.
Propose according to utility model, auxiliary heat conduction is block-shaped to be contained in through hole ordinatedly.Block-shaped being contained in ordinatedly of auxiliary heat conduction can make the auxiliary heat conduction piece more closely to contact with through hole in through hole, thereby will make the heat of circuit board can pass to faster heat-conducting block, and then passes to radiator.
Another purpose of the present utility model realizes by a kind of lighting device, this lighting device comprises the circuit board of light source and radiator and the above-mentioned type, wherein, light source contacts with the heat conduction of auxiliary heat conduction piece in a side of the substrate of circuit board, and radiator contacts with the heat conduction of auxiliary heat conduction piece at the opposite side of substrate.Good according to the heat dispersion of lighting device of the present utility model, and have better safe class.Preferably, light source is LED light source.LED light source has advantages of that luminous efficiency is high, the life-span long and environmental protection.
It should be understood that if do not have other dated especially, the feature of different exemplary embodiment described herein can be bonded to each other.
Description of drawings
Accompanying drawing consists of the part of this specification, is used for helping further to understand the utility model.These accompanying drawings illustrate embodiment of the present utility model, and are used for illustrating principle of the present utility model together with specification.Identical parts represent with identical label in the accompanying drawings.Shown in figure:
Fig. 1 is the sectional view according to the first embodiment of circuit board of the present utility model;
Fig. 2 is the sectional view according to the second embodiment of circuit board of the present utility model;
Fig. 3 is the sectional view according to the 3rd embodiment of circuit board of the present utility model;
Fig. 4 is the sectional view according to the variant of the 3rd embodiment of circuit board of the present utility model;
Fig. 5 is the sectional view according to lighting device of the present utility model.
Embodiment
In being discussed in more detail below, with reference to the accompanying drawing of a part that forms this specification, wherein, showing in the mode of illustration and can implement specific embodiments of the invention.About figure, such as " on ", D score, " vertically ", " parallel " directional terms be with reference to the direction use of described accompanying drawing.Because the assembly of the embodiment of the present invention can be placed on many different directions, so the direction term only is used for explanation, and without any the meaning that limits.It should be understood that and to use other embodiment, and can carry out structure or logical changes under the prerequisite that does not deviate from scope of the present invention.So the below describes in detail should not be understood to the restrictive meaning, and the present invention is defined by the appended claims.
According to design of the present utility model, circuit board 100 comprises substrate 1; Be arranged in substrate 1 and/or the conducting wire on substrate 1 (not shown in Fig. 1 to 4), wherein be formed with at least one through hole 11 that passes to a relative side from a side of substrate 1 in substrate 1, and the length of the wall of this through hole 11 on bearing of trend is greater than the thickness of substrate 1.In addition, be furnished with auxiliary heat conduction piece 2 in each through hole 11.Of the present utility model focusing on, the length of the wall of through hole 11 on bearing of trend that is to say greater than the thickness of substrate 1, and the wall zigzag ground of through hole 11 extends to a relative side from a side of substrate 1.The effect of doing like this is, gap between through hole 11 and auxiliary heat conduction piece 2 is not to pass to opposite side from a side of circuit board 100 point-blank, but wind in and out, this has increased the extended distance of gap between both sides to a great extent, that is to say the creepage distance that has increased significantly between both sides.In addition, in a preferred embodiment of the present utility model, substrate 1 can be the FR-4 substrate, this substrate with low cost.Auxiliary heat conduction piece 2 is the ceramic piece, and certainly, this auxiliary heat conduction piece 2 also can be made by the insulating heat-conduction material of other types.
In addition, in a design of the present utility model, through hole 11 comprises at least two section's sections, the wall part of these at least two section's sections consists of the wall of through hole, wherein, in the cross section perpendicular to substrate 1, the wall part of each section is all straight line, and the wall part in adjacent section's section is not point-blank.
Fig. 1 shows the schematic diagram of the first embodiment of this design.As seen from the figure, the wall of through hole 11 looks up in the side perpendicular to substrate 1 and has stair-stepping trend, and sees from top to bottom in the cross section perpendicular to substrate 1, and adjacent section's section occupied area on substrate 1 is different.In the present embodiment, owing to only there being two section's sections, the section's section that therefore is in top in figure at area occupied on substrate 1 less than the occupied area on substrate 1 of the section's section under the section's section that is in above this.In an example, in the cross section that is parallel to substrate 1, through hole 11 has circular cross section, and wherein the diameter of adjacent section's section is different, wherein forms ladder between two adjacent section's sections.Certainly, in other example, in the cross section that is parallel to substrate 1, through hole 11 also can have the cross section of square or other shapes.In addition, in the first embodiment shown in Figure 1, through hole 11 comprises two section's sections, two adjacent section's sections T-shaped or inverted T shape profile of common formation in perpendicular to the cross section of substrate 1.Such structure makes the structure of through hole 11 oversimplify most.In addition, because auxiliary heat conduction piece 2 is contained in this through hole 11 with wanting form fit, therefore when assembling, auxiliary heat conduction piece 2 can be inserted into through hole 11 from the large side of opening more easily, thereby makes assembling more easily simple.
Fig. 2 shows the schematic diagram of the second embodiment of this design.In this embodiment, the basic structure of circuit board 100 does not change, and just variation has occured the shape of through hole 11.In this embodiment, in the cross section perpendicular to substrate 1, each wall part is perpendicular to being all straight line in substrate 1 cross section, and sees from top to bottom, and the wall part in adjacent section's section has different angles with respect to substrate 1.In fact through hole 11 has consisted of a kind of flaring shape, and just this flaring through hole 11 has section's section of two different opening angles, and the section's section that wherein is in the top of figure has the opening angle slightly less than section's section of below.
In other design of the present utility model, in the cross section perpendicular to substrate 1, the wall part of at least one section of through hole 11 is curves.
Fig. 3 shows the schematic diagram of the 3rd embodiment of this other design of basis of circuit board.As seen from the figure, see in the cross section perpendicular to substrate 1, the wall part that is in section's section of Fig. 3 top is designed to the linear perpendicular to substrate 1, and the wall part of section's section that is in the below of Fig. 3 is designed to curve, and this Curve Design is to make the internal diameter of section's section of below become gradually large.
Fig. 4 shows the schematic diagram of a variant of the 3rd embodiment of this other design of basis of circuit board.As seen from the figure, in the cross section perpendicular to substrate 1, the wall part of through hole 11 is all curve, and jointly forms the trend of S shape.Wherein, this so design of S shape trend makes from the top of the substrate 1 shown in figure, and it is large that the internal diameter of through hole 11 becomes at least gradually.
Each embodiment described above and variant thereof have just exemplarily been enumerated several citation forms of through hole; these above-mentioned forms should not produce restriction to protection range of the present utility model, and the through-hole type of other types drops in protection range of the present utility model equally.
Fig. 5 shows the sectional view according to lighting device 200 of the present utility model.As seen from the figure, this lighting device 200 comprises the circuit board 100 of the light source 3, radiator 4 and the above-mentioned type that are designed to LED light source, wherein, light source 3 contacts with 2 heat conduction of auxiliary heat conduction piece in a side of the substrate 1 of circuit board 100, and radiator contacts with 2 heat conduction of auxiliary heat conduction piece at the opposite side of substrate 1.Lighting device 200 shown in Fig. 5 has used the circuit board 100 shown in Fig. 1.The wall of the through hole in this circuit board 100 forms stepped, thereby make the wall of through hole 11 and the gap between auxiliary heat conduction piece 2 elongated at the extended distance on the direction of a side direction opposite side of circuit board 100, this has increased the creepage distance between the radiator of the LED light source of a side of circuit board 100 and opposite side significantly.
These are only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All any modifications of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model within spirit of the present utility model and principle.
Reference number
1 substrate
11 through holes
2 auxiliary heat conduction pieces
3 light sources
4 radiators
100 circuit boards
200 lighting devices
Claims (12)
1. a circuit board (100) that is used for lighting device, comprising: substrate (1); Be arranged in described substrate (1) and/or the conducting wire on described substrate (1), wherein be formed with at least one through hole (11) that passes to a relative side from a side of described substrate (1) in described substrate (1), be furnished with auxiliary heat conduction piece (2) in each described through hole (11), it is characterized in that, the wall of described through hole (11) extends to a relative side from a side of described substrate (1), and the length of described wall on bearing of trend is greater than the thickness of described substrate (1).
2. circuit board according to claim 1 (100), it is characterized in that, through hole (11) comprises at least two section's sections, and the wall part of described at least two section's sections consists of the wall of described through hole (11), and described wall zigzag ground extends to a relative side from a side of described substrate (1).
3. circuit board according to claim 2 (100), is characterized in that, sees from top to bottom in the cross section perpendicular to described substrate (1), and described adjacent section is different at the upper occupied area of described substrate (1).
4. according to claim 2 or 3 described circuit boards (100), is characterized in that, in the cross section perpendicular to described substrate (1), the wall part of described section is straight line, and the wall part of described adjacent section is not point-blank.
5. circuit board according to claim 4 (100), is characterized in that, in the cross section perpendicular to described substrate (1), the wall of described through hole (11) has stair-stepping trend.
6. circuit board according to claim 5 (100), it is characterized in that, in the cross section that is parallel to described substrate (1), described through hole (11) has circular cross section, wherein the diameter of described adjacent section is different, and forms ladder between two described adjacent sections.
7. circuit board according to claim 6 (100), is characterized in that, described through hole (11) comprises two section's sections, in the cross section perpendicular to described substrate (1), and two T-shaped or inverted T shape profiles of the common formation of described section.
8. circuit board according to claim 4 (100), is characterized in that, seeing from top to bottom perpendicular in described substrate (1) cross section, and the wall part of described adjacent section has different angles with respect to described substrate (1).
9. according to claim 2 or 3 described circuit boards (100), is characterized in that, in the cross section perpendicular to described substrate (1), the wall part of at least one described section is curve.
10. the described circuit board of any one (100) according to claim 1 to 3, is characterized in that, is contained in described through hole (11) to described auxiliary heat conduction piece (2) form fit.
A 11. lighting device (200), comprise light source (3) and radiator (4), it is characterized in that, described lighting device also comprises the described circuit board of any one (100) according to claim 1 to 10, wherein, described light source (3) contacts with auxiliary heat conduction piece (2) heat conduction in a side of the substrate (1) of described circuit board (100), and described radiator contacts with described auxiliary heat conduction piece (2) heat conduction at the opposite side of described substrate (1).
12. lighting device according to claim 11 (200) is characterized in that, described light source (3) is LED light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205911411U CN203015266U (en) | 2012-11-09 | 2012-11-09 | Circuit board used for lighting device and lighting device having same circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205911411U CN203015266U (en) | 2012-11-09 | 2012-11-09 | Circuit board used for lighting device and lighting device having same circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203015266U true CN203015266U (en) | 2013-06-19 |
Family
ID=48606817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205911411U Expired - Fee Related CN203015266U (en) | 2012-11-09 | 2012-11-09 | Circuit board used for lighting device and lighting device having same circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203015266U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104349597A (en) * | 2013-07-26 | 2015-02-11 | 集邦联合制造股份有限公司 | High heat dissipation circuit board set |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | a PCB |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A fast heat dissipation PCB |
-
2012
- 2012-11-09 CN CN2012205911411U patent/CN203015266U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104349597A (en) * | 2013-07-26 | 2015-02-11 | 集邦联合制造股份有限公司 | High heat dissipation circuit board set |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | a PCB |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A fast heat dissipation PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20161109 |