CN202957278U - Carrier plate packaging structure with induction device - Google Patents

Abstract

A substrate packaging structure with a sensing device includes providing a substrate with an isolation wall, a first side wall, a second side wall, a first plane, a second plane, a light-emitting element, a light sensing element and a corresponding packaging layer. This packaging structure can be used for the manufacture of a light sensing device, which can effectively reduce the manufacturing process, elements and manufacturing cost of the light sensing device, and further reduce the size of the light sensing device.

Description

Carrier package structure with sensing device

technical field

The utility model relates to a carrier board package structure with an induction device, in particular to a package structure in which a light emitting element and a light sensing element are arranged on the same carrier board.

Background technique

Arranging a light-emitting element and a light-sensing element on the same substrate can form a light-sensing device with a wide range of uses. When an object blocks the light path between the light-emitting element and the light-sensing element, the light-sensing element will The existence of the object can be determined. On the contrary, if the light-sensing element can successfully receive the light emitted by the light-emitting element, the light-sensing element can determine the absence of the object. The reflective light sensing device is to install the light-emitting element and the light-sensing element on the same side, relying on whether there is an object to reflect the light of the light-emitting element back to the light-sensing element to determine whether the object exists.

In order to ensure the accuracy of the light-sensing device, in the general known technology, it is hoped that the light-sensing element will only receive the light reflected back by the object, so how to avoid the light-sensing element from being affected additionally, especially to avoid It is very important that the light-emitting element directly illuminates the light-sensing element from the inside of the light-sensing device.

As mentioned above, there are several types of packaging structures of light sensing devices used in known technologies as follows. First, please refer to FIG. 1A , which is a schematic diagram of a packaging structure of light sensing devices disclosed in US Patent No. 8,232,541. As shown in FIG. 1A, a light-emitting element 92 and a light-sensing element 94 are arranged on a carrier board 90, and are packaged on the carrier board with a transparent material to form a packaging cover 98. A groove 96 is cut out on the packaging cover 98, and the groove 96 is formed in the groove. 96 is filled with an opaque material to form light blocking 91 .

Next, please refer to FIG. 1B , which is a schematic diagram of a packaging structure of a light sensing device disclosed in Taiwan Patent M363080. As shown in FIG. 1B, a light-emitting element 92 and a light-sensing element 94 are arranged on a carrier board 90, and are packaged on the carrier board with a transparent material to form a package cover 98. A groove 96 is cut out on the package cover 98, and a groove 96 is formed in the groove. 96 and the surface of the package cover 98 are coated with an opaque paint 95 .

Please refer to FIG. 1C , which is a schematic diagram of a package structure of a light sensing device disclosed in US Patent No. 20100327164. As shown in FIG. 1C , there are light-emitting elements 92 and light-sensing elements 94 on the carrier 90 , and three light barriers 91 are placed in the middle and both sides of the two elements, and the entire carrier 90 is covered with a transparent cover 93 .

Next, please refer to FIG. 1D , which is a schematic diagram of a package structure of a light sensing device disclosed in US Patent No. 7,652,244. As shown in Figure 1D, lead frame 97 is installed on the lower cover 99 of a plastic material, then light-emitting element 92 and light-sensing element 94 are placed on lead-frame 97, finally install light-emitting element 92 and light-sensing element The transparent material 990 is filled in the space of 94 .

The above packaging structures all have some disadvantages. First, the process is troublesome. The size of the above-mentioned components is mostly calculated in millimeters. Each additional process in such a size will cause a large increase in cost; secondly, due to the number of components Many, relatively make the thickness of the light sensing device can not be reduced, and further make it impossible to reduce the size of the product using the light sensing device.

Therefore, the utility model proposes a substrate packaging structure with sensing devices. This packaging structure can be used for the packaging of light sensing devices. By improving the packaging structure, the manufacturing process of light sensing devices is reduced, and the production process is relatively reduced. The cost can also further produce a photosensitive device with a smaller size.

Utility model content

In order to solve the above-mentioned related problems, a main purpose of the present invention is to provide a substrate packaging structure with sensing devices, which can be applied to the packaging of light sensors. By using a carrier board with blocking elements, it is not necessary to add too many elements on the carrier board when making the photo-sensing device, so that a photo-sensing device with a smaller size can be produced.

According to the above-mentioned objectives, the utility model proposes a carrier board packaging structure with an induction device, which includes a carrier board, including an upper surface and a lower surface opposite to the upper surface, and is equipped with a plurality of The through hole of the carrier board, wherein the upper surface has a partition wall, a first side wall and a second side wall parallel to each other, and divides the upper surface into two planes, wherein the partition wall and the first side wall are separated by the second One plane, between the partition wall and the second side wall is the second plane, and at least one carrier wire is arranged in the carrier board through hole of the first plane, and multiple carrier boards are arranged in the carrier board through hole of the second plane Wire; a light-emitting element configured on the first plane, wherein the light-emitting element is electrically connected to the carrier wire in the carrier plate through hole of the first plane through at least one first outer wire; a light-sensing element configured on the second plane Two planes, wherein the photo-sensing element is electrically connected to the carrier wire in the through hole of the second plane through a plurality of second outer wires; a plurality of wire pins are arranged on the lower surface and connected to the carrier wire electrical connection; a first transparent sealant layer coated on the first plane to cover the first plane, light-emitting elements and first outer wires; and a second transparent sealant layer coated on the second plane , so as to cover the second plane, the light sensing element and the second external wire.

Wherein the first and second transparent sealant layers are coated with opaque paint, and an irradiation hole and a receiving hole are respectively left on the corresponding positions of the light-emitting element and the light-sensing element.

The first and second transparent sealing layers are transparent epoxy resin.

The opaque paint is black epoxy.

There is further a first metal plate between the light-emitting element and the carrier.

There is further a second metal flat plate between the photo-sensing element and the carrier.

Wherein the carrier plate is made of a polymer material.

The thickness of the carrier board packaging structure with the induction device is 0.1-1.5mm.

Wherein the carrier board is integrally formed with the partition wall, the first side wall and the second side wall.

The utility model further proposes a carrier board packaging structure with an induction device, including: a carrier board, including an upper surface and a lower surface opposite to the upper surface, and is equipped with a plurality of carrier board through holes penetrating from the upper surface to the lower surface , wherein the upper surface has a partition wall, a first side wall and a second side wall parallel to each other, and divides the upper surface into two planes, wherein the first plane is between the partition wall and the first side wall, and the partition wall and the second side wall is the second plane, the partition wall, the first side wall and the second side wall further have a plurality of retaining wall through holes corresponding to the through holes of the carrier plate, and between the carrier plate through holes and the retaining wall through holes A plurality of internal wires are arranged in the center; a light-emitting element is arranged on the first plane, wherein the light-emitting element is electrically connected to the inner wire in the through-hole of the barrier wall of the isolation wall and the corresponding through-hole of the carrier board through at least one first outer wire ; A light sensing element, configured on the second plane, wherein the light sensing element is electrically connected to the inner wire in the through hole of the barrier wall of the isolation wall and the corresponding through hole of the carrier plate through a plurality of second outer wires, and A plurality of third outer wires are electrically connected to the through-holes of the retaining wall of the second side wall and the inner wires in the corresponding carrier plate through-holes; a plurality of wire pins are arranged on the lower surface and electrically connected to the inner wires ; and a transparent encapsulation layer, which is arranged on the upper surface of the carrier board, and covers the first plane and the second plane, and at the same time, the light-emitting element, the light-sensing element, the isolation wall, the first side wall, the second side wall and the The outer wires are covered together.

Wherein the light-emitting element is further electrically connected to the inner wire in the through hole of the carrier board of the first sidewall by at least one fourth outer wire.

Wherein the transparent encapsulation layer is coated with an opaque paint, and an illuminating hole and a receiving hole are respectively left on the corresponding positions of the light-emitting element and the light-sensing element.

The transparent encapsulation layer is transparent epoxy resin.

Wherein the opaque paint is black epoxy resin.

There is further a first metal plate between the light-emitting element and the carrier.

There is further a second metal flat plate between the photo-sensing element and the carrier.

Wherein the carrier plate is made of a polymer material.

Wherein the carrier board is integrally formed with the partition wall, the first side wall and the second side wall.

The beneficial effect of the utility model is that the optical sensing device with a smaller size can be produced with fewer processes and less manufacturing cost, and the size of the product using the optical sensing device can be further reduced.

Description of drawings

In order to enable the examiner to further understand the structure, features and purpose of the utility model, the following will be described in detail in conjunction with the accompanying drawings and preferred specific embodiments, in which:

FIG. 1A is a schematic diagram of a package structure of a known light sensing device;

FIG. 1B is a schematic diagram of a known packaging structure of an optical sensing device;

FIG. 1C is a schematic diagram of a known packaging structure of an optical sensing device;

FIG. 1D is a schematic diagram of a known packaging structure of an optical sensing device;

Fig. 2 is a sectional view of the carrier plate of the first embodiment of the present utility model;

Fig. 3 is a cross-sectional view of a substrate package structure with an induction device according to the first embodiment of the present invention;

Fig. 4 is a top view of the package structure of the carrier board with the induction device according to the first embodiment of the present invention;

5 is a cross-sectional view of other light-emitting elements used in the substrate package structure with an induction device according to the first embodiment of the present invention;

Fig. 6 is a sectional view of the carrier plate of the second embodiment of the present invention;

Fig. 7 is a cross-sectional view of a substrate package structure with an induction device according to a second embodiment of the present invention;

Fig. 8 is a top view of the package structure of the carrier board with the induction device according to the second embodiment of the present invention;

FIG. 9 is a cross-sectional view of other light-emitting elements used in the substrate package structure with sensing device according to the second embodiment of the present invention.

Detailed ways

Since the utility model mainly discloses a substrate packaging structure with a sensing device, by providing a substrate with a blocking element itself, the current process is changed to reduce the production cost and produce a photosensitive device with a smaller size product. The semiconductor packaging technology related to the present invention has been understood by those with ordinary knowledge in the relevant technical field, so the following description will only describe in detail the features of the substrate packaging structure with the sensing device of the present invention. In addition, the drawings in the following texts are not completely drawn according to the actual relevant dimensions, and their function is only to express the schematic diagrams related to the features of the present invention.

First, please refer to FIG. 2 , which is a cross-sectional view of the carrier board of the first embodiment of the present invention. As shown in Figure 2, the carrier 12 is made of polymer materials, such as: polyimide (Polyimide; PI) or printed circuit board (Printed circuit board; PCB), the thickness of which is 0.1-1.5mm; The preferred thickness of the embodiment is 0.3-1.3 mm. The carrier 12 has an upper surface 12a and a lower surface 12b opposite to the upper surface 12a, and the carrier 12 is configured with a plurality of carrier through holes (not shown) that run through the upper surface 12a to the lower surface 12b; the upper surface 12a has A partition wall 127, a first side wall 120 and a second side wall 121, and the upper surface 12a is divided into a first plane 122 and a second plane 124, wherein the first plane 122 is located at the partition wall 127 and the first side wall 120, the second plane 124 is located between the partition wall 127 and the second side wall 121; a carrier board wire (trace) 123 is arranged in the carrier board through hole (not shown in the figure) of the first plane 122, and The through-holes (not shown in the figure) of the second plane 124 are equipped with a plurality of carrier wires 123; the carrier wires 123 are electrically connected to a plurality of wire pins 125 configured on the lower surface 12b of the carrier 12, and the wires are connected The pin 125 is used as a connection point of the carrier board 12 to the outside.

Next, please refer to FIG. 3 , which is a cross-sectional view of the package structure of the carrier with the induction device according to the first embodiment of the present invention. As shown in Figure 3, in the above-mentioned carrier board 12 of Figure 2, a light-emitting element 14 is arranged on the first plane 122 of the carrier board 12, and communicates with the carrier board of the first plane 122 through an external wire (wire) 18a. The carrier board wire 123 in the hole (not shown in the figure) is electrically connected; in addition, a light sensing element 16 is arranged on the second plane 124 of the carrier board 12, and connects to the second plane 124 through a plurality of outer wires 18b The carrier board wires 123 in the carrier board through holes (not shown in the figure) are electrically connected; wherein, the outer wires 18a, 18b are formed by wire bonding.

After the light-emitting element 14 and the light-sensing element 16 are configured, they are coated with transparent epoxy resin on the first plane 122 and the second plane 124 respectively to form the first transparent sealant layer 1220 and the second transparent sealant layer. layer 1240; the first transparent sealant layer 1220 simultaneously covers the first plane 122, the light-emitting element 14 and the outer wire 18a on the first plane 122; and the second transparent sealant layer 1240 simultaneously covers the second plane 124, The light sensing element 16 and the outer wire 18b located on the second plane 124 are covered, and the thickness of the first transparent sealant layer 1220 and the second transparent sealant layer 1240 can be lower than, equal to or higher than the partition wall 127, the second The height of the side wall 120 and the second side wall 121 . And when the height of the transparent sealant layer 1220, 1240 is lower than or equal to the height of the partition wall 127, the first side wall 120 and the second side wall 121, the thickness of the carrier board packaging structure 1 with the sensing device is the carrier board 12 thickness (0.1-1.5mm).

In addition, before installing the light-emitting element 14 and the light-sensing element 16 on the carrier board 12, a first metal plate 1224 and a second metal plate 1224 can be installed respectively on the positions where the light-emitting element 14 and the light-sensing element 16 are to be installed. 1244, which is used as a slot for installing the light-emitting element 14 and the light-sensing element 16.

Next, please refer to FIG. 4 , which is a top view of the package structure of the carrier board with the induction device according to the first embodiment of the present invention. As shown in FIG. 4, an opaque paint 126 made of black epoxy resin is coated on the first transparent sealing layer 1220 of the first plane 122, and an illumination hole 1222 is left at the corresponding position of the light-emitting element 14 for The light from the light-emitting element 14 passes through; in addition, an opaque paint 126 made of black epoxy resin is also coated on the top of the second transparent sealing layer 1240 of the second plane 124, and a corresponding position of the light-sensing element 16 is left. The receiving hole 1242 is used for the light sensing element 16 to sense the external light source.

Next, please refer to FIG. 3 and FIG. 5 at the same time; FIG. 5 is a cross-sectional view of other light-emitting elements used in the substrate package structure with the sensing device according to the first embodiment of the present invention. As shown in Figure 3, the substrate package structure 1 with the sensing device of the present invention uses a light-emitting element 14; in this embodiment, the light-emitting element 14 is a kind of infrared light-emitting diode (IR-LED); - LED is the upper and lower electrodes, so the light-emitting element 14 only needs to be connected to a carrier wire 123 through an outer wire 18a; in addition, if the light-emitting element 14 is changed to an LED with the same side electrode (for example: a green LED or a blue LED), then As shown in FIG. 5 , at this time, the light-emitting element 14 ′ of the carrier package structure 1 ′ with the induction device needs to be connected to the through-hole of the carrier board (not shown in the figure) of the first plane 122 with a plurality of external wires 18 a. A plurality of carrier wires 123 and other component configurations are the same as those shown in FIG. 3 , and will not be repeated here.

The above embodiments only illustrate that the carrier board 12 is additionally equipped with a partition wall 127, a first side wall 120 and a second side wall 121. In addition, the utility model can also be processed, such as: etching, stamping or digging, etc. , to form a first flat surface 122 and a second flat surface 124 on the carrier board 12 , so that the carrier board 12 is integrally formed with the partition wall 127 , the first side wall 120 and the second side wall 121 .

Please refer to FIG. 6 , which is a sectional view of the carrier board of the second embodiment of the present invention. As shown in FIG. 6 , the carrier board 22 is made of polymer materials, such as PI or PCB, and its thickness is 0.1-1.5 mm; the preferred thickness of this embodiment is 0.3-1.3 mm. The carrier plate 22 has an upper surface 22a and a lower surface 22b opposite to the upper surface 22a, and the carrier plate 22 is configured with a plurality of carrier plate through holes (not shown) passing through the upper surface 22a to the lower surface 22b; the upper surface 22a has A partition wall 227, a first side wall 220 and a second side wall 221, and the upper surface 22a is divided into a first plane 222 and a second plane 224, wherein the first plane 222 is located at the partition wall 227 and the first side wall 220, the second plane 224 is located between the partition wall 227 and the second side wall 221; the partition wall 227 and the second side wall 221 further have a through hole ( not shown in the figure), and a plurality of internal wires 229 are arranged in the wall through-holes (not shown in the figure) of the partition wall 227 and the second side wall 221 and the corresponding carrier plate through-holes (not shown in the figure); The wires 229 are electrically connected to a plurality of wire pins 225 disposed on the lower surface 22 b of the carrier board 22 , and the wire pins 225 are used as connection points of the carrier board 22 to the outside.

Next, please refer to FIG. 7 , which is a cross-sectional view of the package structure of the carrier with the sensing device according to the second embodiment of the present invention. As shown in FIG. 7, in the above-mentioned carrier board 22 of FIG. The internal wires 229 disposed in the corresponding carrier board through holes (not shown in the figure) are electrically connected; in addition, a light sensing element 26 is disposed on the second plane 224, and is connected to the isolation wall 227 through a plurality of external wires 28b The through holes (not shown in the figure) of the retaining wall are electrically connected with the plurality of inner wires 229 arranged in the corresponding carrier board through holes (not shown in the figure), and are connected to the second side wall 221 through a plurality of outer wires 28c The through-holes of the retaining wall (not shown in the figure) are electrically connected to the plurality of inner wires 229 arranged in the corresponding through-holes of the carrier board (not shown in the figure); wherein, the outer wires 28a, 28b, and 28c are formed by bonding .

After the light-emitting element 24 and the light-sensing element 26 are configured, the upper surface 22a of the carrier 22 is covered with a transparent encapsulation layer 228 made of transparent epoxy resin, including: a first plane 222, a second plane 224, and a separation wall 227 , the first side wall 220 , the second side wall 221 , and the light emitting element 24 , the light sensing element 26 and the external wires 28 a , 28 b , 28 c on the first plane 222 and the second plane 224 .

In addition, before installing the light-emitting element 24 and the light-sensing element 26 on the carrier board 22, a first metal plate 2224 and a second metal plate can be respectively installed on the positions where the light-emitting element 24 and the light-sensing element 26 are to be installed. 2244, used as a slot for installing the light emitting element 24 and the light sensing element 26.

Next, please refer to FIG. 8 , which is a top view of the package structure of the carrier board with the sensing device according to the second embodiment of the present invention. As shown in FIG. 8 , an opaque paint 226 made of black epoxy resin is coated on the top of the transparent encapsulation layer 228 , and an irradiation hole 2222 is left at the corresponding position of the light emitting element 24 for the light of the light emitting element 24 to pass through; In addition, a receiving hole 2242 is reserved at a corresponding position of the light sensing element 26 for the light sensing element 26 to sense an external light source.

Next, please refer to FIG. 7 and FIG. 9 at the same time; FIG. 9 is a cross-sectional view of other light-emitting elements used in the substrate package structure with sensing devices according to the second embodiment of the present invention. As shown in Fig. 7, the substrate packaging structure 2 with induction device of the present invention uses a light-emitting element 24; in this embodiment, the light-emitting element 24 is an IR-LED; because the IR-LED is an upper and lower electrode, it emits light The element 24 only needs to be connected to an inner lead 229 through an outer lead 28a; in addition, if the light-emitting element 24 is changed to an LED (for example: a green LED or a blue LED) with electrodes on the same side, then as shown in Figure 9, at this time, The light-emitting element 24' of the substrate packaging structure 2' with the induction device is connected to the barrier wall through hole (not shown in the figure) of the isolation wall 227 and the corresponding carrier board through hole (not shown in the figure) with an external wire 28a. ), at least another outer wire 28d needs to be connected to the wall through hole (not shown in the figure) of the first side wall 220 and the corresponding carrier board through hole (not shown in the figure). The arrangement of the inner conductor 229 and other components are the same as those in FIG. 7 , and will not be repeated here.

The above embodiment only illustrates that the carrier board 22 is additionally equipped with a partition wall 227, a first side wall 220 and a second side wall 221. In addition, the utility model can also be processed, such as: etching, stamping or digging, etc. A first flat surface 222 and a second flat surface 224 are formed on the carrier board 22 , so that the carrier board 22 is integrally formed with the partition wall 227 , the first side wall 220 and the second side wall 221 .

The carrier board packaging structures 1 and 2 with sensing devices proposed by the utility model can produce smaller photo-sensing devices with fewer processes and less manufacturing cost, and also reduce the size of products using photo-sensing devices. can be further reduced.

Although the present invention is disclosed above with the aforementioned preferred embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some modifications and changes without departing from the spirit and scope of the present invention. Retouching, so the patent protection scope of the utility model must be defined by the scope of claims attached to this specification.

Claims (18)

1. A carrier board packaging structure with induction device, characterized in that, comprising: A carrier board includes an upper surface and a lower surface opposite to the upper surface, and is provided with a plurality of carrier board through holes passing through the upper surface to the lower surface, wherein the upper surface has a partition wall parallel to each other, a a first side wall and a second side wall, and divide the upper surface into two planes, wherein the first plane is between the partition wall and the first side wall, and the space between the partition wall and the second side wall is a second plane, and at least one carrier wire is arranged in the carrier through hole of the first plane, and a plurality of carrier wires are arranged in the carrier through hole of the second plane; A light-emitting element configured on the first plane, wherein the light-emitting element is electrically connected to the carrier wire in the carrier through hole of the first plane through at least one first outer wire; A photo-sensing element configured on the second plane, wherein the photo-sensing element is electrically connected to the carrier wire in the carrier through-hole of the second plane through a plurality of second outer wires; A plurality of wire pins are arranged on the lower surface and electrically connected with the wires of the carrier board; a first transparent sealant layer coated on the first plane to cover the first plane, the light-emitting element and the first outer wire; and A second transparent sealant layer is coated on the second plane to cover the second plane, the light sensing element and the second outer wire. 2. The substrate package structure with sensing device according to claim 1, wherein opaque coatings are coated on the top of the first and second transparent sealant layers, and are respectively at the corresponding positions of the light-emitting element and the light-sensing element An irradiation hole and a receiving hole are left on the top. 3. The substrate package structure with sensing devices according to claim 1, wherein the first and second transparent sealing layers are transparent epoxy resin. 4. The carrier package structure with sensing device according to claim 2, wherein the opaque paint is black epoxy resin. 5 . The carrier package structure with sensing device according to claim 1 , further having a first metal plate between the light-emitting element and the carrier. 6. The carrier package structure with sensing device according to claim 1, further having a second metal flat plate between the light sensing element and the carrier. 7. The carrier package structure with sensing device according to claim 1, wherein the carrier is made of a polymer material. 8 . The carrier package structure with sensing device according to claim 1 , the thickness of the carrier package structure with sensing device is 0.1-1.5 mm. 9 . The carrier package structure with sensing device according to claim 1 , wherein the carrier board is integrally formed with the partition wall, the first side wall and the second side wall. 10 . 10. A substrate packaging structure with an induction device, characterized in that it comprises: A carrier board includes an upper surface and a lower surface opposite to the upper surface, and is provided with a plurality of carrier board through holes passing through the upper surface to the lower surface, wherein the upper surface has a partition wall parallel to each other, a a first side wall and a second side wall, and divide the upper surface into two planes, wherein the first plane is between the partition wall and the first side wall, and the space between the partition wall and the second side wall is On the second plane, the partition wall, the first side wall, and the second side wall further have a plurality of retaining wall through holes corresponding to the through holes of the carrier plate, and the through holes of the carrier plate are connected to the retaining wall. Multiple inner wires are arranged in the hole; A light-emitting element, arranged on the first plane, wherein the light-emitting element is electrically connected to the inner wire in the through-hole of the barrier wall and the corresponding through-hole of the carrier plate through at least one first outer wire; A photo-sensing element configured on the second plane, wherein the photo-sensing element communicates with all the through-holes of the barrier wall of the partition wall and the corresponding through-holes of the carrier board through a plurality of second outer wires. The internal wires are electrically connected, and are electrically connected to the inner wires in the through-holes of the second side wall and the corresponding through-holes of the carrier plate through a plurality of third outer wires; a plurality of wire pins are arranged on the lower surface and electrically connected with the inner wire; and A transparent encapsulation layer is arranged on the upper surface of the carrier board, and covers the first plane and the second plane, and at the same time, the light-emitting element, the light-sensing element, the partition wall, and the first side wall , the second side wall and the outer wire are covered together. 11. The substrate package structure with sensing device according to claim 10, wherein the light-emitting element is further electrically connected to the inner conductor in the carrier through-hole of the first sidewall by at least one fourth outer conductor . 12. The substrate packaging structure with sensing device according to claim 10, wherein an opaque paint is coated on the top of the transparent packaging layer, and an illumination hole is left on the corresponding positions of the light emitting element and the light sensing element respectively and a receiving hole. 13. The substrate packaging structure with sensing devices according to claim 10, wherein the transparent packaging layer is transparent epoxy resin. 14. The substrate package structure with sensing device according to claim 12, wherein the opaque paint is black epoxy resin. 15 . The carrier package structure with sensing device according to claim 10 , wherein there is further a first metal plate between the light-emitting element and the carrier. 16 . The carrier package structure with a sensing device according to claim 10 , wherein a second metal plate is further provided between the photo-sensing element and the carrier. 17. The carrier package structure with sensing device according to claim 10, wherein the carrier is made of a polymer material. 18 . The carrier package structure with sensing device according to claim 10 , wherein the carrier is integrally formed with the partition wall, the first sidewall and the second sidewall. the

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