CN202930385U - Package structure of image sensor chip - Google Patents

Abstract

The utility model discloses a packaging structure of an image sensing chip, comprising a substrate, a frame, an image sensing chip and a light-transmitting layer. The substrate has a through hole. The frame is connected to the substrate and is partially located in the through hole. An abutting portion extends outward from the upper end of the frame to abut against the edge of the through hole. The frame has a convex portion, which is arranged on the inner side wall of the frame. The image sensing chip is located in the frame and connected to the lower end of the convex portion. The light-transmitting layer is located in the frame and connected to the upper end of the convex portion, and a sensing cavity is formed between the image sensing chip and the light-transmitting layer.

Description

Package structure of image sensor chip

technical field

The utility model relates to a semiconductor packaging structure, and in particular to a packaging structure of an image sensing chip.

Background technique

The rapid development of science and technology drives the progress of information electronic products, and all kinds of electronic product components are moving towards the goal of thinner and smaller. How to make the product more user-friendly and the concept of multi-machine integration, making the product smaller and more convenient to carry is in line with human factors engineering, and more in line with the expectations and needs of consumers in pursuit of convenience and fashion, is one of the main development issues in the current electronic product market.

Combining mobile phones with digital camera functions or combining digital camera functions with tablet computers is an important improvement and breakthrough in current technology. Among them, the digital camera combined with a tablet computer or a mobile phone is mainly provided with an image sensor at the position of the lens. The image sensor can sensitively receive the light emitted by the object and convert the light into a digital signal. Since these image sensing chips need to receive light sources, their packaging methods are different from those of general electronic products.

The image sensor chips used in current electronic products must not only have high photographic performance, but also meet the requirements of thinness, lightness and compactness. The packaging volume of the image sensing chip is one of the main factors determining the size of the imaging module. How to make the packaging volume of the image sensor chip lighter and thinner, and the manufacturing process simpler and easier to assemble will also be the main goal of the development of the industry.

Utility model content

In view of the problems caused by the prior art, the utility model provides a package structure of an image sensing chip to overcome the problems caused by the prior art.

According to an embodiment of the present invention, a packaging structure of an image sensing chip includes a substrate, a frame, an image sensing chip, and a light-transmitting layer. The substrate has a through hole. The frame body is connected to the substrate and partly located in the through hole. An abutting portion extends outward from the upper end of the frame to abut against the edge of the perforated hole. Wherein, the frame body has a convex portion, and the convex portion is arranged on the inner side wall of the frame body. The image sensor chip is located in the frame and connected to the lower end of the protrusion. The light-transmitting layer is located in the frame and connected to the upper end of the protrusion, and forms a sensing cavity between the image sensing chip and the light-transmitting layer.

In one embodiment of the present invention, the upper surface of the edge of the perforation is recessed to form a recess, and the abutting portion of the frame abuts against the recess, so that the upper and lower surfaces of the frame are respectively in contact with the upper surface of the substrate. , and the lower surface is roughly coplanar.

In one embodiment of the present invention, the lower surface of the frame body is provided with a first accommodating space for accommodating the image sensing chip, and the upper surface of the frame body is provided with a second accommodating space for accommodating the light-transmitting layer, and the upper and lower surfaces of the frame are approximately coplanar with the light-transmitting layer and the image sensing chip respectively.

In one embodiment of the present invention, the frame body further includes a plurality of welding pads disposed on the lower surface of the abutting portion of the frame body for soldering to the substrate.

In one embodiment of the present invention, it further includes a plurality of wires respectively connected to the frame body and the substrate for electrically connecting the frame body and the substrate.

In one embodiment of the present utility model, the frame body is a ceramic frame body.

According to another embodiment of the present invention, a packaging structure of an image sensing chip includes a substrate, a frame, an image sensing chip, and a light-transmitting layer. The base plate has a perforation, and the lower surface of the edge of the perforation of the base plate is depressed to form a depression. The frame body is connected to the base plate and is partly located in the through hole. The lower end of the frame body extends outwards with an abutting portion for abutting against the bottom surface of the recessed portion, wherein the frame body has a convex portion which is arranged around the frame inner wall of the body. The image sensor chip is located in the frame and connected to the lower end of the protrusion. The light-transmitting layer is located in the frame and connected to the upper end of the protrusion, and forms a sensing cavity between the image sensing chip and the light-transmitting layer.

In another embodiment of the present invention, when the abutting portion of the frame abuts against the bottom surface of the recess, the upper and lower surfaces of the frame are substantially coplanar with the upper and lower surfaces of the substrate respectively.

In another embodiment of the present utility model, the lower surface of the frame is provided with a first accommodating space for accommodating the image sensing chip, and the upper surface of the frame is provided with a second accommodating space for accommodating the transparent The optical layer, the upper surface and the lower surface of the frame are approximately coplanar with the transparent layer and the image sensing chip respectively.

In another embodiment of the present invention, the frame body further includes a plurality of welding pads disposed on the upper surface of the contact portion of the frame body for welding to the substrate.

In another embodiment of the present invention, it further includes a plurality of wires respectively connected to the frame body and the substrate for electrically connecting the frame body and the substrate.

In another embodiment of the present utility model, the frame body is a ceramic frame body.

In another embodiment of the present utility model, the substrate is a printed circuit board.

When the frame body of the packaging structure of the image sensing chip of the utility model is connected and fixed to the substrate, the frame body is partially inserted into the perforation of the substrate, thereby reducing the overall volume and thickness of the packaging structure of the image sensing chip.

Description of drawings

In order to make the above and other purposes, features, advantages and embodiments of the present invention more obvious and understandable, the accompanying drawings are described as follows:

FIG. 1 is a top view illustrating a packaging structure of an image sensing chip according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view showing the packaging structure of the image sensing chip according to FIG. 1 along the section line A-A';

FIG. 2A is a cross-sectional exploded view showing the packaging structure of the image sensing chip according to FIG. 1 along the section line A-A';

3 is a bottom view of a frame showing the packaging structure of the image sensing chip according to FIG. 1;

FIG. 4 is an exploded view illustrating the packaging structure of the image sensing chip according to FIG. 1;

5 is a top view illustrating a packaging structure of an image sensing chip according to another embodiment of the present invention;

Fig. 6 is a cross-sectional view showing the packaging structure of the image sensing chip according to Fig. 5 along the section line B-B';

FIG. 7 is a cross-sectional view illustrating a packaging structure of an image sensing chip according to yet another embodiment of the present invention.

[Description of main component symbols]

100: package structure

110: Substrate

110a: perforation

120: frame

120a: the first storage space

120b: Second storage space

122: contact part

124: convex part

126: welding pad

130: Image sensor chip

140: transparent layer

150: Sensing cavity

200: package structure

210: Substrate

210a: perforation

220: frame

222: contact part

226: wire

230: Image sensor chip

240: transparent layer

300: package structure

310: Substrate

310a: perforation

320: frame

322: contact part

324: Convex

326: wire

330: Image sensor chip

340: transparent layer

350: Sensing cavity

A-A': hatching

B-B': hatching

Detailed ways

The following will clearly illustrate the spirit of the utility model with the accompanying drawings and detailed descriptions. After any person with ordinary knowledge in the technical field understands the preferred embodiments of the utility model, he or she can change and modify the technology taught by the utility model. modifications without departing from the spirit and scope of the present invention.

Please refer to FIG. 1 , which shows a top view of a packaging structure 100 for an image sensor chip according to an embodiment of the present invention. As shown in FIG. 1 , the packaging structure 100 of the image sensor chip is to fix the image sensor chip (not shown in this figure) and the light-transmitting layer 140 respectively on the opposite ends of the frame body 120 , and then pass through the frame body 120 and the substrate. 110 combined.

Please refer to FIG. 2 and FIG. 2A. FIG. 2 is a cross-sectional view showing the packaging structure 100 of the image sensor chip according to FIG. 1 along the section line A-A'. FIG. 2A is a cross-sectional exploded view showing the packaging structure 100 of the image sensor chip according to FIG. 1 along the section line A-A'. As shown in FIG. 2 and FIG. 2A , the packaging structure 100 of the image sensing chip includes a substrate 110 , a frame 120 , an image sensing chip 130 and a light-transmitting layer 140 .

Circuits are configured on the substrate 110 to be connected to an external power source. The substrate 110 has a through hole 110a, so that the frame body 120 can be partially located in the through hole 110a. In this embodiment, the substrate 110 may be a printed circuit board (Printed Circuit Board, PCB), but not limited thereto.

The frame body 120 is connected to the substrate 110 and partially located in the through hole 110 a, so that only a part of the volume of the frame body 120 is exposed to the substrate 110 . Therefore, the overall volume and thickness of the packaging structure 100 of this embodiment are smaller than the known packaging structure in which the frame is directly disposed on the substrate. In this embodiment, the frame body 120 is a cuboid structure, and the frame body 120 is provided with an opening connected up and down. The frame body 120 is a ceramic frame body, but not limited thereto. In addition, an abutting portion 122 extends outward from the upper end of the frame body 120 along the periphery of the frame body 120 . The lower surface of the abutting portion 122 abuts against the upper surface of the edge of the through hole 110a, and the abutting portion 122 and the substrate 110 can be fixed by glue sealing, but the fixing method of the abutting portion 122 and the substrate 110 is not limited to this . In addition, the frame body 120 has a convex portion 124, and the convex portion 124 is disposed on the inner side wall of the frame body 120 so that the image sensor chip 130 and the light-transmitting layer 140 are respectively connected to opposite ends of the convex portion 124, so as to fix It is provided in the frame body 120 .

The image sensor chip 130 is located in the frame body 120 and glued to the lower end of the protrusion 124 , but the connection method is not limited to this. In this embodiment, the image sensor chip 130 may be a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). In addition, the transparent layer 140 is located in the frame body 120 and glued to the upper end of the protrusion 124 . However, the transparent layer 140 and the image sensing chip 130 form a sensing cavity 150 due to the separation of the protrusion 124 . Since the light-transmitting layer 140 is closely connected and fixed to the protrusion 124 , moisture, dust and other foreign matter cannot enter the sensing cavity 150 . Therefore, through the tight connection between the transparent layer 140 and the protrusion 124 , the image sensor chip 130 can be protected from being damaged by moisture, dust and other foreign objects. It should be understood that the "gluing" mentioned in this specification refers to laying an adhesive colloid between two elements, and after the adhesive colloid is solidified, the two elements can be connected and fixed to each other. In this embodiment, the adhesive colloid can be thermosetting glue, ultraviolet curing glue, hot melt glue or silicon melt glue, but not limited thereto.

Preferably, the lower surface of the frame body 120 is provided with a first accommodating space 120a for accommodating the image sensing chip 130, so that the image sensing chip 130 is embedded in the frame body 120; the upper surface of the frame body 120 A second accommodating space 120b is provided for accommodating the light-transmitting layer 140 so that the light-transmitting layer 140 is embedded in the frame body 120. Therefore, when the light-transmitting layer 140 and the image-sensitive side chip 130 are combined with the frame body 120 , the upper and lower surfaces of the frame body 120 are approximately coplanar with the transparent layer 140 and the image sensing chip 130 respectively.

Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a bottom view illustrating the frame body 120 according to the packaging structure of the image sensor chip in FIG. 1 . FIG. 4 is an exploded view illustrating the packaging structure 100 of the image sensing chip according to FIG. 1 . As shown in FIG. 3 , the frame body 120 includes several solder pads 126 made of tin or tin-lead, which are disposed around the lower surface of the abutting portion 122 of the frame body 120 , but the materials constituting the solder pads 126 are not limited thereto. Please refer to FIG. 3 and FIG. 4 at the same time below. The substrate 110 is provided with an electrical connection portion (not shown) corresponding to the welding pad 126 at the periphery of the through hole 110a. ) is welded on the substrate 110 , so that the substrate 110 and the frame body 120 are adhesively fixed and electrically connected to each other. That is to say, when the frame body 120 is partially inserted into the through hole 110a of the substrate 110, the solder pads 126 surrounding the lower surface of the contact portion 122 of the frame body 120 are melted due to heat during the reflow process of the surface mount technology. , and then adhered to the electrical connection portion at the edge of the through hole 110 a of the substrate 110 . Therefore, after the pads 126 are cooled and solidified, the abutting portion 122 is fixed on the upper surface of the edge of the through hole 110 a , and the circuit on the frame body 120 can be electrically connected to the electrical connection portion of the substrate 110 through the pads 126 . When the substrate 110 is connected to an external power source to transmit electrical signals to the frame body 120 , the image sensor chip 130 connected to the frame body 120 is energized to perform its function. It should be understood that this embodiment is only an illustration, and is not intended to limit the present utility model.

Please refer to FIG. 5 , which shows a top view of a package structure 200 of an image sensor chip according to another embodiment of the present invention. As shown in FIG. 5 , the packaging structure 200 of the image sensor chip is to fix the image sensor chip (not shown in this figure) and the light-transmitting layer 240 on the opposite ends of the frame body 220 respectively, and then through the frame body 220 and the substrate 210 combined. In this embodiment, the frame body 220 is electrically connected to the substrate 210 by wire bonding, so that the frame body 220 and the substrate 210 transmit electrical signals to each other through wires 226 , but the connection method is not limited thereto.

FIG. 6 is a cross-sectional view showing the packaging structure 200 of the image sensor chip along the section line B-B' according to FIG. 5 . As shown in FIG. 6 , the upper end of the frame body 220 extends outward along the periphery of the frame body 220 to form a contact portion 222 , and the upper surface of the edge of the through hole 210 a of the substrate 210 is recessed to form a concave portion 212 . Wherein, the abutting portion 222 of the frame body 220 and the recessed portion 212 are abutted against each other and glued and fixed, so that after the frame body 220 and the substrate 210 are assembled, the upper and lower surfaces of the frame body 220 are approximately the same as the upper and lower surfaces of the substrate 210 respectively. Coplanar. Therefore, the space occupied by the packaging structure 200 of this embodiment is smaller than the known packaging structure in which the frame is directly disposed on the substrate. In addition, the package structure 200 of this embodiment includes several wires 226 , and the frame body 220 and the substrate 210 are respectively connected through the wires 226 , so that the frame body 220 and the substrate 210 are electrically connected to each other through the wires 226 . Therefore, the electrical signal can be transmitted from the substrate 210 to the frame body 220 through the wire 226 , and further transmitted to the image sensor chip 230 through the frame body 220 , but the electrical transmission method of the package structure 200 is not limited thereto.

Please refer to FIG. 7 , which shows a cross-sectional view of a package structure 300 of an image sensor chip according to yet another embodiment of the present invention. As shown in FIG. 7 , the packaging structure 300 of the image sensing chip includes a substrate 310 , a frame 320 , an image sensing chip 330 and a light-transmitting layer 340 .

Circuits are disposed on the substrate 310 to be connected to an external power source. The substrate 310 has a through hole 310a, so that the frame body 320 can be partially located in the through hole 310a. In this embodiment, the substrate 310 may be a printed circuit board (Printed Circuit Board, PCB), but not limited thereto.

The frame body 320 is connected to the substrate 310 and partly located in the through hole 310 a, so that only a part of the volume of the frame body 320 is exposed to the substrate 310 . In this embodiment, the frame body 320 is a ceramic frame body, but not limited thereto. In addition, a contact portion 322 extends outward from the lower end of the frame body 320 along the periphery of the frame body 320 . The upper surface of the contact portion 322 can be used to contact the lower surface of the edge of the through hole 310a. However, in this embodiment, the lower surface of the edge of the through hole 310 a is recessed to form a concave portion 312 . The abutting portion 322 of the frame body 320 and the recessed portion 312 are abutted against each other and fixed by gluing, so that after the frame body 320 and the substrate 310 are assembled, the upper and lower surfaces of the frame body 320 are substantially coplanar with the upper and lower surfaces of the substrate 310 respectively. . Therefore, the volume and thickness of the packaging structure 300 of this embodiment are smaller than the known packaging structure in which the frame is directly disposed on the substrate. In addition, the frame body 320 has a protruding portion 324, which is disposed on the inner wall of the frame body 320 so that the image sensor chip 330 and the light-transmitting layer 340 are respectively connected to opposite ends of the protruding portion 324, and at the same time It is accommodated in the frame body 320 .

The image sensor chip 330 is located in the frame body 320 and glued to the lower end of the protrusion 324 , but the connection method is not limited thereto. In this embodiment, the image sensor chip 330 may be a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). In addition, the transparent layer 340 is located in the frame body 320 and is glued to the upper end of the protrusion 324 . However, the transparent layer 340 and the image sensing chip 330 form a sensing cavity 350 due to the separation of the protrusion 324 . Since the light-transmitting layer 340 is tightly connected and fixed to the protrusion 324 , moisture, dust and other foreign matter cannot enter the sensing cavity 350 . Therefore, through the tight connection between the transparent layer 340 and the protrusion 324 , the image sensor chip 330 can be protected from being damaged by moisture, dust and other foreign matter. It should be understood that the "gluing" mentioned in this specification refers to laying an adhesive colloid between two elements, and after the adhesive colloid is solidified, the two elements can be connected and fixed to each other. In this embodiment, the adhesive colloid can be thermosetting glue, ultraviolet curing glue, hot melt glue or silicon melt glue, but not limited thereto.

In addition, the packaging structure 300 includes a plurality of wires 326 through which the frame body 320 and the substrate 310 are respectively connected, so that the frame body 320 and the substrate 310 are electrically connected to each other through the wires 326 . Therefore, the electrical signal can be transmitted from the substrate 310 to the frame body 320 through the wire 326, and further transmitted to the image sensor chip 330 through the frame body 320, but the electrical transmission method of the package structure 300 is not limited to this, and can also be used. With the aforementioned pad-type package structure, only the position of the pad should match the package structure 300 and the pad is provided on the upper surface of the abutting portion 322 .

As can be seen from the above-mentioned embodiments of the utility model, the application of the utility model has the following advantages:

When the frame body of the packaging structure of the image sensing chip of the utility model is connected and fixed to the substrate, the frame body is partially inserted into the perforation of the substrate, thereby reducing the overall volume and thickness of the packaging structure of the image sensing chip.

Claims (13)

1. A packaging structure for an image sensing chip, characterized in that it comprises: a substrate with a through hole; A frame body, connected to the substrate and partly located in the through hole, the upper end of the frame body extends outwards with an abutment portion for abutting against the edge of the perforation hole, wherein the frame body has a convex portion, and the convex portion is arranged on the the inner side walls of the frame; an image sensor chip, located in the frame and connected to the lower end of the protrusion; and A light-transmitting layer is located in the frame and connected to the upper end of the protrusion, and forms a sensing cavity between the image sensing chip and the light-transmitting layer. 2. The packaging structure of the image sensor chip according to claim 1, wherein a recess is formed on the upper surface of the edge of the through hole, and the abutting portion of the frame abuts against the recess, so that the frame The upper and lower surfaces of the body are coplanar with the upper and lower surfaces of the substrate, respectively. 3. The packaging structure of the image sensing chip according to claim 1, wherein the lower surface of the frame is provided with a first accommodating space for accommodating the image sensing chip, and the upper surface of the frame is A second accommodating space is provided for accommodating the light-transmitting layer, and the upper and lower surfaces of the frame are coplanar with the light-transmitting layer and the image sensing chip respectively. 4 . The packaging structure of the image sensor chip according to claim 1 , wherein the frame body further comprises a plurality of welding pads disposed on the lower surface of the contact portion of the frame body for soldering to the substrate. 5 . 5 . The packaging structure of the image sensor chip according to claim 1 , further comprising a plurality of wires respectively connected to the frame and the substrate for electrically connecting the frame and the substrate. 6 . The packaging structure of an image sensor chip according to claim 1 , wherein the frame is a ceramic frame. 7. A packaging structure for an image sensing chip, characterized in that it comprises: a substrate having a perforation, the lower surface of the perforation edge of the substrate forming a depression; A frame body, connected to the substrate and partly located in the through hole, the lower end of the frame body extends outwards with an abutting portion for abutting against the bottom surface of the recessed portion, wherein the frame body has a convex portion, and the convex portion Surroundingly arranged on the inner side wall of the frame; an image sensor chip, located in the frame and connected to the lower end of the protrusion; and A light-transmitting layer is located in the frame and connected to the upper end of the protrusion, and forms a sensing cavity between the image sensing chip and the light-transmitting layer. 8. The packaging structure of an image sensor chip according to claim 7, wherein when the abutting portion of the frame body abuts against the bottom surface of the recessed portion, the upper and lower surfaces of the frame body are respectively in contact with the bottom surface of the concave portion. The upper and lower surfaces of the substrate are coplanar. 9. The packaging structure of the image sensing chip according to claim 7, characterized in that, the lower surface of the frame is provided with a first accommodating space for accommodating the image sensing chip, and the upper surface of the frame is A second accommodating space is provided for accommodating the light-transmitting layer, and the upper and lower surfaces of the frame are coplanar with the light-transmitting layer and the image sensing chip respectively. 10 . The packaging structure of the image sensor chip according to claim 7 , wherein the frame body further comprises a plurality of welding pads disposed on the upper surface of the abutting portion of the frame body for soldering to the substrate. 11 . 11 . The packaging structure of the image sensor chip according to claim 7 , further comprising a plurality of wires respectively connected to the frame body and the substrate for electrically connecting the frame body and the substrate. 12. The packaging structure of an image sensor chip according to claim 7, wherein the frame is a ceramic frame. 13. The packaging structure of the image sensor chip according to claim 7, wherein the substrate is a printed circuit board.

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