CN202839740U - White-light LED package structure - Google Patents
White-light LED package structure Download PDFInfo
- Publication number
- CN202839740U CN202839740U CN 201220531747 CN201220531747U CN202839740U CN 202839740 U CN202839740 U CN 202839740U CN 201220531747 CN201220531747 CN 201220531747 CN 201220531747 U CN201220531747 U CN 201220531747U CN 202839740 U CN202839740 U CN 202839740U
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- Prior art keywords
- blue
- support cup
- powder layer
- light
- blue chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000843 powder Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 6
- 210000003141 lower extremity Anatomy 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 5
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 230000005855 radiation Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 239000003292 glue Substances 0.000 description 4
- 241000227425 Pieris rapae crucivora Species 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000260 silastic Polymers 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model belongs to the technical field of semiconductor devices, and particularly relates to a white-light LED package structure. The white-light LED package structure comprises a blue-light chip, a support cup, a glass lens and a substrate, the blue-light chip is disposed at the bottom of the support cup, an electrode end of the blue-light chip is connected with an electrode lead which is electrically connected with the substrate, an adhesive layer is covered on the bottom of the support cup, a fluorescent powder layer is arranged on the inner wall of the support cup, and the height from the lower edge of the fluorescent powder layer to the bottom of the support cup is larger than the thickness of the blue-light chip. When the white-light LED package structure is compared with the prior art, the adhesive layer is covered on the bottom of the support cup, and the fluorescent powder layer is arranged above the blue-light chip without wrapping the blue-light chip, so heat radiation of the blue-light chip is improved, heating of fluorescent powder in the fluorescent powder layer is reduced, and credibility of finished products is improved. Meanwhile, since the fluorescent powder layer is arranged above the blue-light chip, blue light of the blue-light chip can activate the fluorescent powder effectively, and light emitting efficiency is improved.
Description
Technical field
The utility model belongs to technical field of semiconductor device, relates in particular to a kind of encapsulating structure with white light LEDs of high light-emitting efficiency and high reliability.
Background branch art
Common white light is to coat YAG fluorescent material at blue chip, utilizes blue-ray LED to shine this fluorescent material with the gold-tinted of generation with the blue light complementation, and gold-tinted and the blue light with complementation mixed again, just can draw the required white light of naked eyes, thereby make white light LEDs.
But, can emit light and heat during blue chip energising work, fluorescent material is to wrap up blue chip fully in the encapsulating structure of common white light LEDs, the fluorescent material around blue chip decay occurs easily owing to be heated for a long time, thereby causes reliability to reduce.
And the positive luminous efficiency of blue chip is higher, and the luminous efficiency of side is then more positive low all around, the fluorescent material in the encapsulating structure of the prior art concentrate on blue chip around so that the light efficiency of blue chip is not excited comprehensively, efficient is lower.
In view of this, necessaryly provide a kind of encapsulating structure with white light LEDs of high light-emitting efficiency and high reliability.
The utility model content
The purpose of this utility model is: for the deficiencies in the prior art, and provide a kind of encapsulating structure with white light LEDs of high light-emitting efficiency and high reliability.
In order to achieve the above object, the utility model adopts following technical scheme:
A kind of encapsulating structure of white light LEDs, comprise blue chip, the support cup, glass lens and substrate, described glass lens and described substrate form closed cavity by bonding connection, described support cup places in the described closed cavity, described blue chip places the bottom of described support cup, the electrode tip of described blue chip is connected with contact conductor, described contact conductor is connected with described electrical property of substrate, the bottom of described support cup is coated with glue-line, the inwall of described support cup is provided with phosphor powder layer, and the lower limb of described phosphor powder layer arrives the height of described support bottom of cups greater than the thickness of described blue chip.
As a kind of improvement of the encapsulating structure of the utility model white light LEDs, the height of the top edge of described glue-line is more than or equal to the thickness of described blue chip.
As a kind of improvement of the encapsulating structure of the utility model white light LEDs, the top edge of described glue-line overlaps with the lower limb of described phosphor powder layer.
As a kind of improvement of the encapsulating structure of the utility model white light LEDs, the thickness of described phosphor powder layer is 1 μ m-3mm.
With respect to prior art, the utility model passes through at the bottom of support cup covering glue layer, so that the position of phosphor powder layer is positioned at the top of blue chip, and can not wrap up blue chip, thereby improve the thermal diffusivity of blue chip, fluorescent material is heated the reliability of raising finished product in the minimizing phosphor powder layer; Simultaneously, because the position of phosphor powder layer is above blue chip, the blue light that blue chip (especially its front) sends is excitated fluorescent powder effectively, thereby improves light extraction efficiency.
Description of drawings
Fig. 1 is the encapsulating structure schematic diagram of the utility model white light LEDs.
Embodiment
Below in conjunction with specification drawings and specific embodiments the utility model and beneficial effect thereof are further described.
As shown in Figure 1, the encapsulating structure of the white light LEDs that the utility model provides comprises blue chip 1, support cup 2, glass lens 3 and substrate 4, glass lens 3 and substrate 4 form closed cavity by bonding connection, support cup 2 places in this closed cavity, blue chip 1 places the bottom of support cup 2, the electrode tip of blue chip 1 is connected with contact conductor 11, this contact conductor 11 is electrically connected with substrate 4, the bottom of support cup 2 is coated with glue-line 21, the inwall of support cup 2 is provided with phosphor powder layer 22, and the lower limb of phosphor powder layer 22 is to the height of the support cup 2 bottoms thickness greater than blue chip 1.
Wherein, the height of the top edge of glue-line 21 is more than or equal to the thickness of blue chip 1.At least a as in liquid silastic, epoxide-resin glue or the silicones of the glue that uses in the glue-line 21, be preferably the dual composition addition type sulfuration liquid silastic of heating, this silicon rubber transparency is good, soft, good springiness, thermo oxidative stability is good, electrical insulation capability is excellent, moisture resistance, waterproof, antirust, cold-resistant, anti-ozone and weather resistance are remarkable, even also can xanthochromia under the long condition of high temperature.
The top edge of glue-line 21 overlaps with the lower limb of phosphor powder layer 22.
The thickness of phosphor powder layer 22 is 1 μ m-3mm.If the thickness of phosphor powder layer 22 is too large, can cause the waste to phosphor material powder etc., and if the thickness of phosphor powder layer 22 is too little, again can be so that the finished product that obtains be photochromic inhomogeneous.
The utility model passes through at the bottom of support cup covering glue layer, so that the position of phosphor powder layer is positioned at the top of blue chip, and can not wrap up blue chip, thereby improve the thermal diffusivity of blue chip, fluorescent material is heated the reliability of raising finished product in the minimizing phosphor powder layer; Simultaneously, because the position of phosphor powder layer is above blue chip, the blue light that blue chip (especially its front) sends is excitated fluorescent powder effectively, thereby improves light extraction efficiency.
Need to prove, the according to the above description announcement of book and elaboration, the utility model those skilled in the art can also change and revise above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the utility model is not limited to also should be in the protection range of claim of the present utility model to equivalent modifications more of the present utility model and change.In addition, although used some specific terms in this specification, these terms do not consist of any restriction to the utility model just for convenience of description.
Claims (4)
1. the encapsulating structure of a white light LEDs, comprise blue chip, the support cup, glass lens and substrate, described glass lens and described substrate form closed cavity by bonding connection, described support cup places in the described closed cavity, described blue chip places the bottom of described support cup, the electrode tip of described blue chip is connected with contact conductor, described contact conductor is connected with described electrical property of substrate, it is characterized in that: the bottom of described support cup is coated with glue-line, the inwall of described support cup is provided with phosphor powder layer, and the lower limb of described phosphor powder layer arrives the height of described support bottom of cups greater than the thickness of described blue chip.
2. the encapsulating structure of white light LEDs according to claim 1, it is characterized in that: the height of the top edge of described glue-line is more than or equal to the thickness of described blue chip.
3. the encapsulating structure of white light LEDs according to claim 1, it is characterized in that: the top edge of described glue-line overlaps with the lower limb of described phosphor powder layer.
4. the encapsulating structure of white light LEDs according to claim 1, it is characterized in that: the thickness of described phosphor powder layer is 1 μ m-3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220531747 CN202839740U (en) | 2012-10-16 | 2012-10-16 | White-light LED package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220531747 CN202839740U (en) | 2012-10-16 | 2012-10-16 | White-light LED package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202839740U true CN202839740U (en) | 2013-03-27 |
Family
ID=47951375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220531747 Expired - Fee Related CN202839740U (en) | 2012-10-16 | 2012-10-16 | White-light LED package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202839740U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9539941B2 (en) | 2013-11-21 | 2017-01-10 | Ford Global Technologies, Llc | Photoluminescent cupholder illumination |
-
2012
- 2012-10-16 CN CN 201220531747 patent/CN202839740U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9539941B2 (en) | 2013-11-21 | 2017-01-10 | Ford Global Technologies, Llc | Photoluminescent cupholder illumination |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20161016 |