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CN202736973U - Three-dimensional cladded and packaged LED chip - Google Patents

Three-dimensional cladded and packaged LED chip Download PDF

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Publication number
CN202736973U
CN202736973U CN2012203483715U CN201220348371U CN202736973U CN 202736973 U CN202736973 U CN 202736973U CN 2012203483715 U CN2012203483715 U CN 2012203483715U CN 201220348371 U CN201220348371 U CN 201220348371U CN 202736973 U CN202736973 U CN 202736973U
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CN
China
Prior art keywords
led chip
coated
transparent material
chip
dimensional
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Expired - Fee Related
Application number
CN2012203483715U
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Chinese (zh)
Inventor
瞿崧
严华锋
文国军
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Shanghai Dangoo Electronic Trading Co Ltd
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Shanghai Dangoo Electronic Trading Co Ltd
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Priority to CN2012203483715U priority Critical patent/CN202736973U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种立体包覆封装的LED芯片，特点是，选用正装或倒装的单颗LED芯片或多颗串并联组成的LED芯片的六个面上涂敷有荧光粉并在其外围通过透明材料固定,进行立体包覆或将单颗LED芯片或多颗串并联组成的LED芯片选用正装或倒装的结构置于透明材料制成的球状或管状的壳体中，通过壳体内壁涂敷有荧光粉层或在透明材料中混入荧光粉来立体包覆LED芯片或于LED芯片上先通过透明材料包覆，再于透明材料上涂覆荧光粉；或在荧光粉涂覆完毕后再加一层透明壳体材料加以保护荧光粉的立体包覆。本实用新型的有益效果是：采用最简单的荧光粉包覆工艺，使LED芯片全方位发光，相比较于传统的单侧发光方式，减少LED芯片发光的损耗。

The utility model discloses a three-dimensional encapsulation LED chip. The periphery is fixed by a transparent material, and the three-dimensional coating is carried out, or a single LED chip or multiple LED chips connected in series and parallel are placed in a spherical or tubular shell made of a transparent material in a forward or reverse structure, and pass through the shell. The wall is coated with a phosphor layer or mixed with a phosphor in a transparent material to three-dimensionally cover the LED chip or the LED chip is first coated with a transparent material, and then coated with a phosphor on the transparent material; or after the phosphor is coated Finally, a layer of transparent shell material is added to protect the three-dimensional coating of the phosphor powder. The beneficial effect of the utility model is that: the LED chip can emit light in all directions by adopting the simplest fluorescent powder coating process, and compared with the traditional single-side light emitting method, the loss of light emission of the LED chip can be reduced.

Description

A kind of three-dimensional led chip that coats encapsulation
Technical field
The utility model relates to a kind of led chip, and particularly a kind of three-dimensional led chip that coats encapsulation belongs to led chip and makes the field.
Background technology
LED is light-emitting diode (LED, Lighting emitted diode), is to utilize under electric field action the Sony ericsson mobile comm ab that PN junction is luminous.Having high life/environmental protection/energy-conservation characteristics, is the new light sources of environmental protection.The LED technology is increasingly full-fledged, and at present usually to emit white light be to excite the yellow-green fluorescence powder by blue chip to LED, carries out that wavelength is in harmonious proportion and the white light that produces, and the warm white efficient of large-scale production on the market reaches 120 lm/W, surpasses most of conventional light source.Generally speaking, LED is by MOCVD (Metal-organic Chemical Vapor Deposition, the metallo-organic compound chemical gaseous phase deposition) grows p-type layer, N-shaped layer and p-n junction luminescent layer in Sapphire Substrate or silicon carbide substrates, then by the chip of lighting, the technique such as cutting, granule proliferation, graduation is made different size, generally speaking 10*10 mil is arranged, 10*23 mil, 24*24 mil, 40*40 mil equidimension can be born the continuous current driving from 10mA ~ 1A.Traditional encapsulation is that these chips are fixed on the package support, by negative electrode and the anode of gold thread welding chip, passes into electric current and comes driving LED to send blue single wavelength light, thereby excite the yellow-green fluorescence powder to form white light.Support generally adopts engineering plastics or with the plastics of metal heat sink, then increase its light extraction yield by bottom reflection, or by silica gel, resin or glass ware forming or change the refractive index of internal material with secondary optical lens, thus its bright dipping increased.
Traditional packaged type, light utilization efficiency for led chip is quite low, in general, the light that the led chip back side surface sends is through after reflection/refraction, its light utilization efficiency is no more than 40%, and led chip overleaf the light that sends of side account for 60% of its whole chip light-emitting, meaning to approach has 40% only be wasted.Traditional fluorescent material gluing process because fluorescent material is pressed close to the higher chip pyrotoxin of temperature, thereby causes the fluorescent material Efficiency Decreasing in addition, also can affect light effect.The reduction of light extraction efficiency then means the increase of caloric value, thereby the reliability of electronic devices and components is exerted an influence, and this all is interactional result.Because led chip by being packaged into the LED assembly, then is being welded on respectively on the aluminium base, mixes suitable driving power and structure housing, makes at last whole lamp and sells.There is too much link to cause the waste of efficient and cost in the middle of this.Therefore, based on the purpose of simplifying, by designing the simplest a kind of encapsulating structure, improve the total system light extraction efficiency and reduce cost.
Summary of the invention
The purpose of this utility model is to make the low shortcoming of led chip light utilization efficiency in order to overcome in the led chip manufacturing owing to having encapsulating structure now, and a kind of three-dimensional led chip that coats encapsulation is provided.
For this reason; the technical solution of the utility model is; a kind of three-dimensional led chip that coats encapsulation; comprise single LEDs chip or many led chips that connection in series-parallel forms; characteristics are; select and be coated with fluorescent material on six faces of single LEDs chip of formal dress or inverted structure or the led chip that many connection in series-parallel form and fix by transparent material at the foreign exchange that is coated with fluorescent material; carry out three-dimensional coat or selecting the structure of formal dress or upside-down mounting to place the housing of the spherical or tubulose that transparent material makes the led chip that described single LEDs chip and many connection in series-parallel form; be coated with phosphor powder layer or in transparent material itself, sneak into the three-dimensional coating led chip of fluorescent material or on led chip, apply first fluorescent material by inner walls and coat again transparent material, also or transparent material coat after the led chip again in applying fluorescent material on the transparent material. or apply at fluorescent material and to add again the layer of transparent case material after complete and protected the solid of fluorescent material to coat.
Described led chip comprises single chips or many series connection chips, selects positive cartridge chip and flip-chip variety according to different packaged types; The wire of drawing that described led chip comprises single chips and many connection in series-parallel chips is plain conductor, the transparent wire of metallic film wire or tin indium oxide (ITO); Packed LED chip adds that with gold thread the ball bonding technology welds, and flip LED chips also is welded on the wire with the eutectic solder technology.
Described transparent material is glass, silica gel, resin or organic film.
The beneficial effects of the utility model are: the three-dimensional led chip of encapsulation that coats of the present utility model is so that the omnibearing luminous fluorescent material that can comprehensively excite around being coated on of led chip, be compared to traditional one-sided illumination mode, can the minimum luminous loss of minimizing led chip.And adopt the simplest fluorescent material cladding process, reduced simultaneously cost.
Description of drawings
Fig. 1 is flip LED chips, places inner walls to be coated with the encapsulating structure schematic diagram of phosphor powder layer;
Fig. 2 is packed LED chip, places inner walls to be coated with the encapsulating structure schematic diagram of phosphor powder layer;
Fig. 3 is the encapsulating structure schematic diagram that flip LED chips is coated with the fluorescent powder silica gel layer;
Fig. 4 is the encapsulating structure schematic diagram that packed LED chip is coated with fluorescent powder silica gel;
Fig. 5 is the encapsulating structure schematic diagram that seals with transparent membrane behind the flip LED chips surface-coated fluorescent material;
Fig. 6 is the encapsulating structure schematic diagram that seals with transparent membrane behind the packed LED chip surface-coated fluorescent material;
Fig. 7 is many and connects led chip, places the encapsulating structure floor map that is coated with phosphor powder layer in housing or the film;
Fig. 8 is many and connects led chip, is coated with the encapsulating structure floor map of fluorescent powder silica gel layer.
Among the figure: the tubular shell that 1 transparent material is made or film; 2 phosphor powder layers; 3 flip LED chips; 4 Eutectic solder joints; 5 wires; 6 is transparent silica gel, transparent resin or clear glass; 7 packed LED chips; 8 gold threads; 9 ball bondings point; 10 fluorescent powder silica gel; 11 liang of terminated line pads.
Embodiment
In conjunction with the accompanying drawings and embodiments the utility model is made and being further specified.
Embodiment 1:
By shown in Figure 1, the spherical shell 1 that places transparent material to make by single flip LED chips 3, be coated with phosphor powder layer 2 three-dimensional coating led chips by inner walls, for flip-chip, directly be connected on the wire 5 by Eutectic solder joints 4, place single flip LED chips in the transparent shell fixing by perfusion transparent silica gel 6.
Embodiment 2:
By shown in Figure 2, the spherical shell 1 that places transparent material to make by single packed LED chip 7, be coated with phosphor powder layer 2 three-dimensional coating led chips by inner walls, for positive cartridge chip, are connected with gold thread by ball bonding point 9 and are connected connection with wire, place single the packed LED chip 7 in the transparent shell fixing by perfusion transparent silica gel 6.
Embodiment 3:
By shown in Figure 3, directly be connected on the wire 5 by Eutectic solder joints 4 by single flip LED chips 3.Fluorescent material is coated on around six of the led chips by techniques such as spraying, dip, forms phosphor powder layer 2, and coat and fixing with the film 1 that transparent material is made, evenly be coated on around the led chip, form stereo luminous.
Embodiment 4:
By shown in Figure 4, be connected with gold thread by ball bonding point 9 by single packed LED chip 7 and be connected connection with wire.Fluorescent material is coated on around six of the led chips by techniques such as spraying, dip, forms phosphor powder layer 2, and coat and fixing with the film 1 that transparent material is made, evenly be coated on around the led chip, form stereo luminous.
Wire 5 usefulness materials can be plain conductors among the embodiment 1,2,3,4, also can be the transparent indium tin oxide wires.Embodiment 1 and embodiment 2 middle shell coated inner wall have phosphor powder layer 2 three-dimensional coating led chips, namely by coating fluorescent powder on glass or organic film, this method that coats by remote fluorescent material, its not direct contact chip, both heats are mutually isolation effectively, significantly promote external quantum efficiency and lower heat, the volume that the lifting of external quantum efficiency can reduce radiating element reaches the purpose that reduces light blocking, improves photoelectric conversion efficiency; Can enter the benign cycle of lowering the heat raising efficiency.
Embodiment 3 and embodiment 4 adopt another three-dimensional coating mode, by direct coating fluorescent powder, and fix with the transparent material film coated, form stereo luminously, form the light source luminescent device; Fluorescent material can pass through different coating methods, coats led chip such as techniques such as spraying, print or dip.
Embodiment 5:
By shown in Figure 5, fluorescent powder silica gel layer 10 is that the silica gel that is filled with fluorescent material passes through injection molded.Fluorescent powder silica gel is poured in the mould that presets in advance, and in 150 ℃ of accurate baking ovens baking molding, Design of Dies can be hemispherical also can be plane.The fluorescent powder silica gel layer of moulding can be arranged wire 5 in advance, and flip LED chips 3 directly is connected on the wire 5 by Eutectic solder joints 4.The fluorescent powder silica gel layer surface of the good led chip of cloth covered injection mold again, and in mould, pour into fluorescent powder silica gel, because it is the fluid material, fluorescent powder silica gel layer 10 evenly is coated on around the led chip, then by the last moulding of baking;
Embodiment 6:
By shown in Figure 6, fluorescent powder silica gel layer 10 is that the silica gel that is filled with fluorescent material passes through injection molded.Fluorescent powder silica gel is poured in the mould that presets in advance, and in 150 ℃ of accurate baking ovens baking molding, Design of Dies can be hemispherical also can be plane.The fluorescent powder silica gel layer of moulding can be arranged wire 5 in advance, and packed LED chip 7 is connected with gold thread by ball bonding point 9 and is connected connection with wire.The fluorescent powder silica gel layer surface of the good led chip of cloth covered injection mold again, and in mould, pour into fluorescent powder silica gel, because it is the fluid material, fluorescent powder silica gel layer 10 evenly is coated on around the led chip, then by the last moulding of baking;
Embodiment 5 and embodiment 6 adopts another three-dimensional coating mode, forms stereo luminous, formation light source luminescent device; Fluorescent powder silica gel 10 is fluorescent material mixing silica gel; The material of used wire 5 can be plain conductor, also can be the transparent indium tin oxide wire; Its wire circuit is for being arranged in advance on the fluorescent powder silica gel layer.The fluorescent powder silica gel that embodiment 5 and embodiment 6 adopt also can replace with the fluorescent material hybrid resin or with perfusion fluorescent material in the glass material.
Embodiment 7:
By shown in Figure 7, adopt many connection led chips 3 or 7 of upside-down mounting or formal dress to place in the glass tube housing 1, be coated with phosphor powder layer 2 in the glass tube housing 1, connect led chip in 1 many of the interior coating encapsulation of glass tube housing and be connected with external power supply by wire 5, pad 11.Housing also can be made by organic film.
Embodiment 8:
By shown in Figure 8, adopt upside-down mounting or formal dress many to connect led chips 3 or 7 and be coated with fluorescent powder silica gel 10, many of the upside-down mounting that is coated by fluorescent powder silica gel 10 or formal dress connect led chips 3 or 7 and are connected with external power supply by wire 5, pad 11.
According to user's needs; a kind of simple three-dimensional coating still arranged in addition; be coated and fixed by transparent material first on the led chip of upside-down mounting or formal dress; on the coating transparent material, apply again fluorescent material and carry out the solid coating, or after the fluorescent material coating is complete, add again the solid coating that transparent material layer is protected fluorescent material.

Claims (3)

1.一种立体包覆封装的LED芯片，包括单颗LED芯片或多颗串并联组成的 1. A three-dimensional encapsulation of LED chips, including a single LED chip or a combination of multiple LED chips connected in series and parallel LED芯片，特征在于，选用正装或倒装结构的单颗LED芯片或多颗串并联组成的LED芯片的六个面上涂敷有荧光粉并在涂敷有荧光粉的外围通过透明材料固定, 进行立体包覆或将所述的单颗LED芯片和多颗串并联组成的LED芯片选用正装或倒装的结构置于透明材料制成的球状或管状的壳体中，通过壳体内壁涂敷有荧光粉层或在透明材料本身中混入荧光粉来立体包覆LED芯片或于LED芯片上先通过透明材料包覆，再于所包覆透明材料上涂覆荧光粉进行立体包覆，或在荧光粉涂覆完毕后再加一层透明壳体材料加以保护荧光粉的立体包覆。 The LED chip is characterized in that a single LED chip with a front-mounted or flip-chip structure or a plurality of LED chips composed of series and parallels are coated with phosphor powder on six sides and fixed by a transparent material on the periphery coated with phosphor powder. Carry out three-dimensional coating or put the single LED chip and LED chips composed of multiple series and parallels into a spherical or tubular shell made of transparent material in a front-mounted or inverted structure, and coat through the inner wall of the shell. There is a phosphor powder layer or mixed with phosphor powder in the transparent material itself to three-dimensionally coat the LED chip, or the LED chip is first coated with a transparent material, and then coated with phosphor powder on the coated transparent material for three-dimensional coating, or in After the phosphor powder is coated, a layer of transparent shell material is added to protect the three-dimensional coating of the phosphor powder. 2.根据权利要求1所述的立体包覆封装的LED芯片，其特征在于，所述的正装芯片和倒装芯片的引出导线为金属导线，金属薄膜导线或者是氧化铟锡ITO透明导线；正装LED芯片通过金线加上球焊点进行连接，倒装LED芯片用共晶焊点焊接在导线上。 2. The LED chip of three-dimensional encapsulation according to claim 1, characterized in that, the lead-out wires of the front chip and the flip chip are metal wires, metal thin film wires or indium tin oxide ITO transparent wires; The LED chips are connected by gold wires and ball solder joints, and the flip-chip LED chips are soldered on the wires by eutectic solder joints. 3.  根据权利要求1所述的立体包覆封装的LED芯片，其特征在于，所述的透明材料为玻璃,硅胶,树脂或者是有机薄膜。 3. The LED chip of three-dimensional encapsulation and packaging according to claim 1, wherein the transparent material is glass, silica gel, resin or organic film.
CN2012203483715U 2012-07-18 2012-07-18 Three-dimensional cladded and packaged LED chip Expired - Fee Related CN202736973U (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751274A (en) * 2012-07-18 2012-10-24 上海顿格电子贸易有限公司 Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip
CN104300073A (en) * 2014-11-04 2015-01-21 常州晶玺照明有限公司 360-degree complete cycle type LED lamp filament based on purple light chips
CN106838641A (en) * 2017-02-09 2017-06-13 上海顿格电子贸易有限公司 A kind of all-round luminous LED

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751274A (en) * 2012-07-18 2012-10-24 上海顿格电子贸易有限公司 Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip
CN104300073A (en) * 2014-11-04 2015-01-21 常州晶玺照明有限公司 360-degree complete cycle type LED lamp filament based on purple light chips
CN106838641A (en) * 2017-02-09 2017-06-13 上海顿格电子贸易有限公司 A kind of all-round luminous LED

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130213

Termination date: 20150718

EXPY Termination of patent right or utility model