CN202585367U - Containers for storing semiconductor components - Google Patents
Containers for storing semiconductor components Download PDFInfo
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- CN202585367U CN202585367U CN 201220120662 CN201220120662U CN202585367U CN 202585367 U CN202585367 U CN 202585367U CN 201220120662 CN201220120662 CN 201220120662 CN 201220120662 U CN201220120662 U CN 201220120662U CN 202585367 U CN202585367 U CN 202585367U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 238000005096 rolling process Methods 0.000 claims description 47
- 238000007789 sealing Methods 0.000 claims description 39
- 238000003825 pressing Methods 0.000 claims description 24
- 230000000670 limiting effect Effects 0.000 claims description 21
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 238000000151 deposition Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 239000003344 environmental pollutant Substances 0.000 description 6
- 231100000719 pollutant Toxicity 0.000 description 6
- 230000036961 partial effect Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
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Abstract
Description
技术领域 technical field
本实用新型是有关于一种容器,特别是指一种用于存放半导体元件的容器。The utility model relates to a container, in particular to a container for storing semiconductor elements.
背景技术 Background technique
现代的先进晶圆代工厂或半导体制造厂,在晶圆制造技术上不断地突破,现已达到90奈米以下的制程,随着制程线宽的的缩小与元件积集度的提高,单位晶圆内可制造的元件数目增加。但是这些高积集度的半导体元件对于污染物的容忍度下降,即便是极微量的污染物(微粒、粉尘、有机物、气体或挥发物等)都会导致半导体元件的缺陷,甚至使半导体元件受静电干扰而短路,造成损失。Modern advanced wafer foundries or semiconductor manufacturing plants have continuously made breakthroughs in wafer manufacturing technology, and have now reached a process of less than 90 nanometers. With the reduction of process line width and the increase of component integration, the unit wafer The number of manufacturable components within the circle increases. However, the tolerance of these highly integrated semiconductor components to pollutants is reduced. Even a very small amount of pollutants (particles, dust, organic matter, gas or volatiles, etc.) will cause defects in semiconductor components, and even cause semiconductor components to be subject to static electricity. Interference and short circuit, resulting in loss.
在一般的半导体制程中,都提供无尘室)的环境以避免空气中的微粒污染。而半导体元件运送的过程也必须避免污染,因此需要一个一个提供保护的容器,避免污染半导体元件的承载装置。In general semiconductor manufacturing processes, a clean room) environment is provided to avoid particulate pollution in the air. The process of transporting semiconductor components must also avoid contamination, so protective containers are required one by one to avoid contamination of the carrying device of the semiconductor components.
为了有效降低半导体元件在运送或储存时可能会造成的伤害,目前有许多技术针对容器中的结构以及用于容器内的锁固机构进行改良,希望可以提高对承载半导体元件的保护。在标准机械界面的作业系统中,机台的插销会插入容器内的锁固机构中的驱动件,用以进行容器开阖的操作。In order to effectively reduce the damage that semiconductor components may cause during transportation or storage, there are currently many technologies to improve the structure in the container and the locking mechanism used in the container, hoping to improve the protection of the semiconductor components. In the operating system of the standard mechanical interface, the latch of the machine will be inserted into the driving member of the locking mechanism in the container to open and close the container.
而现有驱动件是利用锁固方法固定于容器内,当机台的插销带动容器的驱动件时,驱动件的外周缘产生与其中心相反的作用力,导致驱动件转动不稳定,进而使锁固机构运作不稳定,如此容易使锁固机构的各构件或与容器内的其他构件间产生摩擦,并产生污染颗粒于容器中,进而污染存放于容器中的半导体元件。However, the existing driving part is fixed in the container by locking method. When the bolt of the machine drives the driving part of the container, the outer peripheral edge of the driving part will produce an opposite force to the center, which will cause the driving part to rotate unstable, and then make the lock The operation of the locking mechanism is unstable, so that it is easy to cause friction between the components of the locking mechanism or other components in the container, and pollute particles are generated in the container, thereby polluting the semiconductor elements stored in the container.
为了解决上述的问题,本新型提供一种用于存放半导体元件的容器,容器内的锁固机构非利用锁固方式固定,使驱动件可稳定的转动,进而使锁固机构运作稳定。In order to solve the above problems, the present invention provides a container for storing semiconductor components. The locking mechanism in the container is not fixed by locking means, so that the driving member can rotate stably, thereby making the locking mechanism operate stably.
实用新型内容 Utility model content
本新型的目的,在于提供一种用于存放半导体元件的容器,其非使用锁固方式固定一锁固机构,使锁固机构可稳定地运作,以使容器可顺利地进行开阖操作。The purpose of the present invention is to provide a container for storing semiconductor components, which does not use a locking mechanism to fix a locking mechanism, so that the locking mechanism can operate stably, so that the container can be opened and closed smoothly.
本新型的目的,在于提供一种用于存放半导体元件的容器,容器内的锁固机构的各构件间产生摩擦的机会减少,以避免于容器中产生污染颗粒而使存放于容器内的半导体元件遭受污染,进而使容器内部达到高洁度。The purpose of this model is to provide a container for storing semiconductor components, the chance of friction between the various components of the locking mechanism in the container is reduced, so as to avoid the generation of pollution particles in the container and make the semiconductor components stored in the container Suffer from pollution, and then make the interior of the container reach a high degree of cleanliness.
本新型提供一种用于存放半导体元件的容器,是包含:一承载本体,其侧壁具有至少一穿孔,其是包含:至少一锁固件,设置于该承载本体内,该锁固件包含一锁固本体、至少一固定部及一驱动部,该固定部设置于该锁固本体的一侧且对应该穿孔,该驱动部设置于该锁固本体的另一侧;以及一驱动件,枢设于该承载本体内,并抵接于该驱动部;一封板,固锁于该承载本体下方,并抵住该驱动件于该承载本体上;以及一罩体,罩设于该承载本体的上方,该罩体的侧壁具有至少一锁固部,该锁固部对应该穿孔;其中,当该驱动件转动时,该驱动件带动该锁固件于该承载本体内位移,该锁固件的该固定部穿过该承载本体的该穿孔并设置于该锁固部,以固定该罩体于该承载本体。The present invention provides a container for storing semiconductor components, which comprises: a carrying body, the side wall of which has at least one perforation, which comprises: at least one locking piece, which is arranged in the carrying body, and the locking piece includes a lock Solid body, at least one fixing part and a driving part, the fixing part is arranged on one side of the locking body and corresponds to the through hole, the driving part is arranged on the other side of the locking body; in the bearing body, and abut against the driving part; a sealing plate, fixedly locked under the bearing body, and resist the driving part on the bearing body; and a cover, arranged on the bearing body Above, the side wall of the cover has at least one locking portion, the locking portion corresponds to the perforation; wherein, when the driving member rotates, the driving member drives the locking member to displace in the bearing body, and the locking member’s The fixing part passes through the through hole of the bearing body and is disposed on the locking part, so as to fix the cover to the bearing body.
其中,更包含:Among them, it also includes:
一耐磨件,设置该封板,并对应该驱动件。A wear-resistant part is provided with the sealing plate and corresponds to the driving part.
其中,更包含:Among them, it also includes:
一密封件,设置于该罩体与该承载本体之间。A sealing element is arranged between the cover body and the bearing body.
其中,其中该承载本体更包含:Wherein, the bearer body further includes:
至少一支撑件,设置于该承载本体内,并位于该锁固件的下方,以支撑该锁固件。At least one supporting piece is arranged in the bearing body and is located below the locking piece to support the locking piece.
其中,其中该承载本体更包含:Wherein, the bearer body further includes:
二第一限位件,设置于该承载本体内,并分别位于该锁固件的两侧,并与该锁固件的移动方向平行。Two first limiting parts are arranged in the carrying body, are respectively located on both sides of the locking piece, and are parallel to the moving direction of the locking piece.
其中,其中该承载本体更包含:Wherein, the bearer body further includes:
二第二限位件,设置于该承载本体内,并分别位于该驱动件的二限位件之间,该二限位件分别活动于该二第二限位件之间。Two second limiting parts are arranged in the carrying body, and are respectively located between the two limiting parts of the driving part, and the two limiting parts respectively move between the two second limiting parts.
其中,其中该承载本体更包含:Wherein, the bearer body further includes:
至少一第三限位件,设置于该承载本体内,并穿设于该锁固本体的一定位孔。At least one third limiting member is arranged in the carrying body and passes through a positioning hole of the locking body.
其中,更包含:Among them, it also includes:
一弹性元件,其一端连接于该承载本体的一连接部,其另一端连接于该锁固件的一连接部。An elastic element, one end of which is connected to a connecting portion of the carrying body, and the other end of which is connected to a connecting portion of the locking member.
其中,其中该弹性元件具有一第一部及一第二部,该第一部的一端连接于该承载本体的该连接部,该第二部的一端连接于该锁固件的该连接部,该第二部相对于该第一部倾斜。Wherein, the elastic element has a first part and a second part, one end of the first part is connected to the connecting part of the bearing body, one end of the second part is connected to the connecting part of the locking member, the The second part is inclined relative to the first part.
其中,其中该驱动件是包含:Among them, the driver includes:
一驱动本体,具有一第一表面及与该第一表面相对应的一第二表面,该第一表面与该锁固件接触,该第二表面与该封板接触;以及A driving body has a first surface and a second surface corresponding to the first surface, the first surface is in contact with the locking member, and the second surface is in contact with the sealing plate; and
一旋转轴,设置于该驱动本体的该第一表面,该旋转轴枢设于该承载本体的一枢接部。A rotating shaft is arranged on the first surface of the driving body, and the rotating shaft is pivotally arranged on a pivot portion of the bearing body.
其中,其中该驱动件更包含:Among them, the driver further includes:
至少一滚动件,嵌设于该驱动本体,并与该封板接触。At least one rolling element is embedded in the driving body and contacts with the sealing plate.
其中,其中该滚动件是一轴承。Wherein, the rolling element is a bearing.
其中,其中该承载本体更包含:Wherein, the bearer body further includes:
一轴承,设置于该枢接部,该旋转轴枢设于该轴承。A bearing is arranged on the pivot joint, and the rotating shaft is pivotally arranged on the bearing.
其中,其中该驱动件更包含:Among them, the driver further includes:
至少一导引结构,凸设于该驱动本体的该第一表面,并从该旋转轴向该驱动本体的周缘延伸,且与该锁固件的该驱动部相抵接。At least one guiding structure protrudes from the first surface of the driving body, extends from the rotating shaft to the periphery of the driving body, and abuts against the driving portion of the locking member.
其中,其中该封板更包含:Among them, the sealing plate further includes:
至少一插入孔,对应该驱动本体的至少一驱动孔,并供至少一插销穿过,该插销穿过该插入孔而插入该驱动孔,并移动于该插入孔内,以转动该驱动件。At least one insertion hole corresponds to at least one driving hole of the driving body, and at least one pin passes through, and the pin passes through the insertion hole and is inserted into the driving hole, and moves in the insertion hole to rotate the driving member.
其中,其中该驱动件更包含:Among them, the driver further includes:
至少一抵压部,凸设于该驱动本体的该第一表面,以抵压该该驱动部的表面。At least one pressing portion protrudes from the first surface of the driving body to press against the surface of the driving portion.
其中,其中该抵压部对应该驱动部的表面为一导引面,该锁固件具有该驱动部的一侧沿着该导引面作升降。Wherein, the surface of the pressing portion corresponding to the driving portion is a guiding surface, and the side of the locking piece having the driving portion moves up and down along the guiding surface.
其中,更包含:Among them, it also includes:
二滚动件,分别嵌设于对应的该锁固件的该驱动部,并抵接对应的该抵压部的该导引面。The two rolling elements are respectively embedded in the corresponding driving portion of the locking element, and abut against the corresponding guiding surface of the pressing portion.
其中,其中该导引面的末端更具有一定位凹槽,该滚动件设置于该定位凹槽。Wherein, the end of the guiding surface further has a positioning groove, and the rolling element is arranged in the positioning groove.
其中,其中每一滚动件为一轴承。Wherein, each rolling member is a bearing.
其中,其中该驱动部的一侧具有一斜面,该斜面与该抵压部的该导引面接触。Wherein, one side of the driving part has an inclined surface, and the inclined surface is in contact with the guiding surface of the pressing part.
本实用新型的有益效果:The beneficial effects of the utility model:
本新型提供一种用于存放半导体元件的容器,其罩体透过设置于承载本体内的锁固机构固定于承载本体,以密封容器并防止外部的污染物进入容器内。而本新型的锁固机构是由至少一锁固件与驱动件搭配,锁固件与驱动件设置于承载本体,然利用封板抵住驱动件的方式固定驱动件于承载本体内,而非利用螺丝锁固方式固定,如此使驱动件可稳定地旋转。然驱动件设有二滚动件,二滚动件减少驱动件与封板接触的面积,避免驱动件与封板磨擦而产生污染颗粒于容器内,以防止存放于容器内的半导体元件受到污染;而更于封板与二滚动件接触的位置贴附耐磨件,如此减少二滚动件与封板摩擦而产生污染颗粒,更能降低于容器内产生污染颗粒的机会。The present invention provides a container for storing semiconductor elements. The cover body is fixed to the carrying body through a locking mechanism arranged in the carrying body to seal the container and prevent external pollutants from entering the container. However, the locking mechanism of the present invention is composed of at least one locking piece and a driving piece. The locking piece and the driving piece are arranged on the carrying body, and the driving piece is fixed in the carrying body by means of a sealing plate against the driving piece instead of using screws. The locking method is fixed, so that the driving member can rotate stably. However, the driving part is provided with two rolling parts, and the two rolling parts reduce the contact area between the driving part and the sealing plate, so as to avoid the friction between the driving part and the sealing plate to produce pollution particles in the container, so as to prevent the semiconductor elements stored in the container from being polluted; and Wear-resistant parts are attached to the contact position between the sealing plate and the second rolling element, so as to reduce the generation of pollution particles caused by the friction between the second rolling element and the sealing plate, and further reduce the chance of generating pollution particles in the container.
另外,本新型的锁固机构的每一锁固件设有一滚动件,滚动件与驱动件接触,如此减少驱动件与锁固件接触的面积,避免驱动件与锁固件产生磨擦而产生污染颗粒于容器内,以防止存放于容器内的半导体元件受到污染;而滚动件是随着驱动件转动而滚动,并减少与驱动件接触所产生的摩擦力,使驱动件可顺畅地带动锁固件位移于承载本体内,以使锁固机构可顺畅地运作,进而使容器可顺畅地进行开阖操作。In addition, each locking piece of the locking mechanism of the present invention is provided with a rolling element, and the rolling piece is in contact with the driving piece, thus reducing the contact area between the driving piece and the locking piece, and avoiding the friction between the driving piece and the locking piece to cause pollution particles in the container In order to prevent the semiconductor components stored in the container from being polluted; while the rolling element rolls with the rotation of the driving element, and reduces the friction generated by contact with the driving element, so that the driving element can smoothly drive the locking element to move on the bearing Inside the body, so that the locking mechanism can operate smoothly, so that the container can be opened and closed smoothly.
附图说明 Description of drawings
图1为本新型的第一实施例的容器的分解图;Fig. 1 is the exploded view of the container of the first embodiment of the present invention;
图2为本新型的第一实施例的容器的部分分解图;Fig. 2 is a partial exploded view of the container of the first embodiment of the present invention;
图3为本新型的第一实施例的容器的另一部分分解图;Fig. 3 is another partial exploded view of the container of the first embodiment of the present invention;
图4为本新型的第一实施例的驱动件的立体图;Fig. 4 is a perspective view of the driver of the first embodiment of the present invention;
图5为本新型的第一实施例的锁固件与驱动件的立体图;Fig. 5 is a perspective view of the locking member and the driving member of the first embodiment of the present invention;
图6为本新型的第一实施例的承载本体的立体图;Fig. 6 is a perspective view of the carrying body of the first embodiment of the present invention;
图7为本新型的第一实施例的弹性元件的示意图;Fig. 7 is a schematic diagram of the elastic element of the first embodiment of the present invention;
图8为本新型的第二实施例的容器的部分分解图;以及Figure 8 is a partially exploded view of a container of a second embodiment of the present invention; and
图9为本新型的第二实施例的锁固件与驱动件的立体图。FIG. 9 is a perspective view of the locking member and the driving member of the second embodiment of the present invention.
【图号对照说明】[Description of drawing number comparison]
1 容器 10 罩体1
102 锁固部 111 承载本体102
1110 穿孔 1111 内表面1110
1112 侧壁 1113 枢接部1112
1114 轴承 1115 第一限位件1114
11151 缺口 1116 第二限位件11151
1117 第三限位件 1118 支撑件1117
1119 连接部 112 封板1119
1121 插入孔 1122 耐磨件1121
121 锁固件 1211 锁固本体121
12110 滚动件 12111 斜面12110 rolling
1212 固定部 1213 驱动部1212
1214 定位孔 1215 连接部1214
122 驱动件 1221 驱动本体122 Driving
12211 第一表面 12212 第二表面12211
1222 旋转轴 1223 导引结构1222
1224 驱动孔 1225 限位件1224
1226 抵压部 12261 导引面1226 Resisting
12262 定位凹槽 1227 滚动件12262
13 弹性元件 131 第一部13
132 第二部 14 密封件132 Part Two 14 Seals
2 插销2 latch
具体实施方式 Detailed ways
为使对本实用新型的结构特征及所达成的功效有更进一步的了解与认识,用以较佳的实施例及附图配合详细的说明,说明如下:In order to have a further understanding and understanding of the structural features and the achieved effects of the utility model, a detailed description is provided in conjunction with preferred embodiments and accompanying drawings, as follows:
现有用于容器的锁固机构是利用锁固方式固定,导致锁固机构运作时不稳定,无法顺利进行容器的开阖。而且容易造成锁固机构与容器内的其他构件产生摩擦,并产生污染颗粒于容器内,进而污染存放于容器中的半导体元件。The existing locking mechanism for containers is fixed by a locking method, which makes the locking mechanism unstable during operation and cannot open and close the container smoothly. Moreover, it is easy to cause friction between the locking mechanism and other components in the container, and pollute particles are generated in the container, thereby polluting the semiconductor elements stored in the container.
请参阅图1、图2及图3,是本新型的第一实施例的容器的分解图及部分分解图。如图所示,本实施例是提供一种用于存放半导体元件的容器1,容器1包含一罩体10、一承载本体111及一封板112(请参阅图2及图3),承载本体111的外侧表面承载至少一半导体元件,罩体10罩设于承载本体111承载半导体元件的外侧表面上。且承载本体111内设有一锁固机构,封板112抵住锁固机构,以固定锁固机构于承载本体111内。罩体10透过锁固机构固定于承载本体111上,使容器1完全密封,进而防止外部的污染物进入容器1内,以避免存放于容器1内的至少一半导体元件(例如:光罩、晶圆或其他半导体元件)受到污染。然后,为了增加容器1的密封性,更于罩体10与承载本体111间设置一密封件14,更能防止外部的污染物进入容器1内,使容器1内部达到高洁度。Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are exploded views and partial exploded views of the container of the first embodiment of the present invention. As shown in the figure, the present embodiment provides a
承载本体111具有一内表面1111及一侧壁1112,侧壁1112环绕内表面1111的周缘,并形成一容置空间。而本实施例的锁固机构容置于容置空间内,并包含二锁固件121及一驱动件122。二锁固件121相互对称地设置于承载本体111的内表面1111上,每一锁固件121具有一锁固本体1211,锁固本体1211的一侧设有二固定部1212,而承载本体111的侧壁1112具有四穿孔1110,并分别对应二锁固件121的四固定部1212,然,罩体10的侧壁亦设有四锁固部102(请参阅图1),四锁固部102对应承载本体111的四穿孔1110,所以二锁固件121的四固定部1212可分别穿过承载本体111的二穿孔1110,并设置于对应的锁固部102,以锁固罩体10于承载本体111上。本实施例的固定部1212为凸件,对应固定部1212的锁固部102为一凹槽,此仅为本新型的一实施例,固定部1212与锁固部102可为其他结构并达到相互卡合即可,于此不再赘述。The bearing
请一并参阅图4,是本新型的第一实施例的驱动件的立体图。如图所示,驱动件122设置于承载本体111的内表面1111上,并位于二锁固件121之间。承载本体111的内表面1111具有一枢接部1113(请参阅图3),驱动件122具有一驱动本体1221,驱动本体1221具有一第一表面12211及一第二表面12212,驱动本体1221的第一表面12211上设有一旋转轴1222(请参阅图2),旋转轴1222枢接于枢接部1113(请参阅图3),使驱动件122转动于承载本体111上。此外,承载本体111更设有一轴承1114,并设置于枢接部1113,旋转轴1222枢接于轴承1114,以与枢接部1113枢接,轴承1114是可减少枢接部1113与旋转轴1222间的摩擦,使驱动件122可顺畅地旋转于承载本体111上。Please also refer to FIG. 4 , which is a perspective view of the driving member of the first embodiment of the present invention. As shown in the figure, the driving
再一并参阅图5,是本新型的第一实施例的锁固件与驱动件的立体图。如图所示,驱动件122具有二导引结构1223(参阅图2),本实施例的二导引结构1223分别为一凸柱,二导引结构1223凸设于驱动本体1221的第一表面12211,并分别从旋转轴1222向驱动本体1221的周缘延伸,而每一锁固件121的锁固本体1211的另一侧更设有一驱动部1213,二锁固件121的二驱动部1213分别位于驱动件122的二导引结构1223之间,二导引结构1223分别抵接于对应的驱动部1213。Referring to FIG. 5 together, it is a perspective view of the locking member and the driving member of the first embodiment of the present invention. As shown in the figure, the driving
封板112固锁于承载本体111下方,并抵住驱动件122的驱动本体1221的第二表面12212,使驱动件122被固定于承载本体111的内表面1111与封板112之间,以固定锁固机构于承载本体111内。本实施例的驱动件122的旋转轴1222非利用锁固方式固定于承载本体111上,如此避免驱动件122的外周缘产生与旋转轴1222相反的作用力,进而避免此作用力让驱动件122于旋转时不稳定。The sealing
复参阅图3,封板112具有二插入孔1121,本实施例的二插入孔1121分别呈弧状,而驱动件122的驱动本体1221更设有二驱动孔1224,本实施例二驱动孔1224分别贯穿驱动本体122至对应的导引结构1223内,但未贯穿导引结构1223,所以驱动孔1224即为一盲孔,而封板112的二插入孔1121对应驱动件122的二驱动孔1224。欲旋转驱动件122时,一插销2从插入孔1121插入,并插入二驱动孔1224,且于插入孔1121内移动,以带动驱动件122旋转。Referring back to Fig. 3, the sealing
当驱动件122旋转时,驱动件122的二导引结构1223推动二锁固件121的二驱动部1213,使二锁固件121横向位移于承载本体111内。当驱动件122作逆时针旋转时,二导引结构1223推动二锁固件121的二驱动部1213,二锁固件121分别往承载本体111的两侧移动,使每一锁固件121的固定部1212往罩体10的锁固部102移动,并卡设于锁固部102内,以锁固承载本体111于罩体10上。当驱动件122作顺时针旋转时,二导引结构1223推动二锁固件121的二驱动部1213向承载本体111中心移动,使每一锁固件121的固定部1212脱离罩体10的锁固部102,进而使罩体10与承载本体111分离。When the driving
再参阅图3,为了使锁固件121作线性位移,承载本体111更设有二第一限位件1115,二第一限位件1115分别位于二锁固件121的两侧,使二锁固件121横向移动于二第一限位件1115之间,即二第一限位件1115平行于二锁固件121的移动方向。然,承载本体111更设有二第二限位件1116,并位于驱动件122的两侧,而驱动件122的驱动本体1221的周缘更设有二限位件1225,二限位件1225分别位于二第二限位件1116之间。请一并参阅图6,当驱动件122旋转时,驱动件122的二限位件1225分别活动于二第二限位件1116之间,以限制驱动件122的旋转角度。此外,承载本体111的内表面1111更设有二第三限位件1117,而每一锁固件121的锁固本体1211更设有一定位孔1214,二第三限位件1117分别位于对应的锁固件121的定位孔1214内,如此限制二锁固件121于承载本体111内的位置。Referring to Fig. 3 again, in order to make the locking
然,承载本体111内更设有复数支撑件1118,该些支撑件1118设置于二第一限位件1115之间,并位于二锁固件121下方,以支撑二锁固件121,且使二锁固件121远离承载本体111的内表面1111,减少二锁固件121与承载本体111的内表面1111接触的面积,进而减少二锁固件121于移动时与承载本体111的内表面1111间的摩擦力,使二锁固件121可顺畅地位移于承载本体111的内表面1111上。However, a plurality of
复参阅图2至5,本实施例的驱动件122更包含二抵压部1226,每一抵压部1226为一凸块,抵压部1226是从驱动本体1221的第一表面12211凸起,二抵压部1226分别位于二导引结构1223之间。而抵压部1226具有一导引面12261,当驱动件122作逆时针旋转时,每一锁固件121具有驱动部1213的一侧抵接于对应的抵压部1226的导引面12261,随着驱动件122转动,导引面12261抵接于驱动部1213的表面,并沿着驱动部1213的表面前进,使锁固件121具有驱动部1213的一侧沿着导引面12261降低,而锁固件121具有固定部1212的一侧抬升,以使固定部1212卡设于罩体10的锁固部102,进而使容器1具有良好的气密性。而每一锁固件121的驱动部1213抵接于抵压部1226的一侧具有一斜面12111,斜面12111位于驱动部1213的一侧。抵压部1226容易沿着锁固本体1211的斜面12111移至驱动部1213的表面上并沿着驱动部1213的表面前进(请参阅图5)。Referring again to FIGS. 2 to 5 , the driving
驱动件122的驱动本体1221更设有二滚动件1227,二滚动件1227是嵌设于驱动本体1221,并位于抵压部1226的下方。当驱动件122旋转时,二滚动件1227是使驱动件122不与封板112直接接触,即减少驱动件122与封板112接触的面积,以减少驱动件122与封板112间的摩擦力,且二滚动件1227随着驱动件122旋转而滚动,使驱动件122可稳定地旋转,如此减少因驱动件122与封板112摩擦而产生污染颗粒的机会,以避免存放于容器1内的半导体元件2受到污染的问题产生。本实施例的滚动件1227为一轴承,亦可为其他元件,于此不再赘述。The driving
二滚动件1227可使驱动件122作稳定地旋转,可是会与封板112产生摩擦,亦有可能地于容器1内产生污染颗粒而污染容器1内的半导体元件2。因此本实施例是于封板112上贴附用于减少摩擦的一耐磨件1122,此耐磨件1122位于封板112与二滚动件1227产生摩擦的位置,减少二滚动件1227与封板112间的摩擦,并能减少二滚动件1227磨损封板112的机会,更能减少污染颗粒的产生而避免污染容器1内的半导体元件2。The
然,复参阅图6,承载本体111内更设有二连接部1119,二连接部1119分别位于对应的锁固件121的一侧,而每一锁固件121的锁固本体1211更设有一连接部1215,每一连接部1119透过一弹性元件13连接对应的锁固件121的连接部1215。而承载本体111的二第一限位件1115分别具有一缺口11151,该些缺口11151是供对应的弹性元件13穿过,使弹性元件13的高度小于承载本体111的厚度,以让容器1的封板112可密封承载本体111。于此限定二锁固件121锁固于罩体10的锁固部102时,二锁固件121的位置为原始位置,当二锁固件121往承载本体111中心移动时,弹性元件13随着锁固件121往承载本体111中心移动,亦受缺口11151的侧边抵挡,以限制锁固件121往承载本体111中心移动。弹性元件13因本身材质具有弹性,当弹性元件13接触口11151的侧边时,弹性元件13受缺口11151抵挡而产生一回复力,此回复力使锁固件121回复原始位置,如此,当驱动件122未正常运作时,弹性元件13可使锁固件121回复原始位置,即锁固件121锁固于罩体10的锁固部102,以防止承载本体111与罩体10脱离。However, referring to FIG. 6 again, two connecting
请一并参阅图7,是本新型的第一实施例的弹性元件的示意图。如图所示,弹性元件13具有一第一部131及与第一部131连接的一第二部132,弹性元件13的第二部132相对弹性元件13的第一部131向下倾斜。然,弹性元件13的第一部131的一端设置于承载本体111的连接部1119,弹性元件13的第二部132的一端设置于锁固件121的连接部1215。而弹性元件13的第二部132相对弹性元件13的第一部131向下倾斜,以抵压于锁固件121的锁固本体1211。Please also refer to FIG. 7 , which is a schematic diagram of the elastic element of the first embodiment of the present invention. As shown in the figure, the
当锁固件121的驱动部1213受驱动件122的抵压部1226抵压时,使锁固件121的固定部1212抬升并锁固于罩体10的锁固部102,而弹性元件13的第二部132相对弹性元件13的第一部131向下倾斜,以抵压于锁固件121的锁固本体1211,使锁固件121的固定部1212维持抬升状态并锁固于罩体10的锁固部102,进而使容器1具有良好的气密性。When the driving
请参阅图8及图9,是本新型的第二实施例的容器的部分分解图及立体图。如图所示,上述实施例中,当驱动件122旋转时,驱动件122与锁固件121的驱动部1213的部分表面接触,使驱动件122的抵压部1226与驱动部1213的表面之间产生摩擦。为了减少驱动件122与驱动部1213之间所产生的摩擦,因此于每一锁固件121的驱动部1213与驱动件122的抵压部1226产生摩擦的位置嵌设一滚动件12110,如此驱动件122的抵压部1226的导引面12261与位于锁固件121的驱动部1213的滚动件12110接触,以减少驱动部1213与抵压部1226接触的面积,进而减少驱动部1213与抵压部1226之间所产生的摩擦,并避免产生污染颗粒于容器内而污染存放于容器内的半导体元件。Please refer to FIG. 8 and FIG. 9 , which are partial exploded views and perspective views of the container of the second embodiment of the present invention. As shown in the figure, in the above-mentioned embodiment, when the driving
当驱动件122旋转时,驱动件122的抵压部1226的导引面12261与位于锁固件121的驱动部1213的滚动件12110接触,驱动件122带动滚动件12110滚动,滚动件12110是沿着导引面12261滚动并移动,而导引面12261的末端具有一定位凹槽12262,当滚动件12110沿着导引面12261移动至定位凹槽12262时,定位凹槽12262是阻挡滚动件12110移动并定位滚动件12110,使锁固件121的固定部1212锁固于罩体的锁固部。本实施例的滚动件12110可滚动于导引面12261,以减少滚动件12110与导引面12261间的摩擦力,使驱动件122可顺畅地带动锁固件121位移于承载本体111内,并使锁固机构可顺畅地运作,进而使容器可顺畅地进行开阖操作。本实施例的滚动件12110为一轴承,亦可为其他元件,于此不再赘述。本实施例的该些滚动件12110亦可用于驱动件122锁固于承载本体111的结构,于此不再赘述。When the driving
综上所述,本新型提供一种用于存放半导体元件的容器,其罩体透过设置于承载本体内的锁固机构固定于承载本体,以密封容器并防止外部的污染物进入容器内。而本新型的锁固机构是由至少一锁固件与驱动件搭配,锁固件与驱动件设置于承载本体,然利用封板抵住驱动件的方式固定驱动件于承载本体内,而非利用螺丝锁固方式固定,如此使驱动件可稳定地旋转。然驱动件设有二滚动件,二滚动件减少驱动件与封板接触的面积,避免驱动件与封板磨擦而产生污染颗粒于容器内,以防止存放于容器内的半导体元件受到污染;而更于封板与二滚动件接触的位置贴附耐磨件,如此减少二滚动件与封板摩擦而产生污染颗粒,更能降低于容器内产生污染颗粒的机会。To sum up, the present invention provides a container for storing semiconductor components, the cover body of which is fixed to the carrier body through the locking mechanism provided in the carrier body to seal the container and prevent external pollutants from entering the container. However, the locking mechanism of the present invention is composed of at least one locking piece and a driving piece. The locking piece and the driving piece are arranged on the carrying body, and the driving piece is fixed in the carrying body by means of a sealing plate against the driving piece instead of using screws. The locking method is fixed, so that the driving member can rotate stably. However, the driving part is provided with two rolling parts, and the two rolling parts reduce the contact area between the driving part and the sealing plate, so as to avoid the friction between the driving part and the sealing plate to produce pollution particles in the container, so as to prevent the semiconductor elements stored in the container from being polluted; and Wear-resistant parts are attached to the contact position between the sealing plate and the second rolling element, so as to reduce the generation of pollution particles caused by the friction between the second rolling element and the sealing plate, and further reduce the chance of generating pollution particles in the container.
另外,本新型的锁固机构的每一锁固件设有一滚动件,滚动件与驱动件接触,如此减少驱动件与锁固件接触的面积,避免驱动件与锁固件产生磨擦而产生污染颗粒于容器内,以防止存放于容器内的半导体元件受到污染;而滚动件是随着驱动件转动而滚动,并减少与驱动件接触所产生的摩擦力,使驱动件可顺畅地带动锁固件位移于承载本体内,以使锁固机构可顺畅地运作,进而使容器可顺畅地进行开阖操作。In addition, each locking piece of the locking mechanism of the present invention is provided with a rolling element, and the rolling piece is in contact with the driving piece, thus reducing the contact area between the driving piece and the locking piece, and avoiding the friction between the driving piece and the locking piece to cause pollution particles in the container In order to prevent the semiconductor components stored in the container from being polluted; while the rolling element rolls with the rotation of the driving element, and reduces the friction generated by contact with the driving element, so that the driving element can smoothly drive the locking element to move on the bearing Inside the body, so that the locking mechanism can operate smoothly, so that the container can be opened and closed smoothly.
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CX01 | Expiry of patent term |