CN202363203U - Inductive structure of the filter - Google Patents
Inductive structure of the filter Download PDFInfo
- Publication number
- CN202363203U CN202363203U CN2011204711150U CN201120471115U CN202363203U CN 202363203 U CN202363203 U CN 202363203U CN 2011204711150 U CN2011204711150 U CN 2011204711150U CN 201120471115 U CN201120471115 U CN 201120471115U CN 202363203 U CN202363203 U CN 202363203U
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- Prior art keywords
- lead
- electrode
- layer
- electrode points
- circuit substrate
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- Expired - Fee Related
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- 230000001939 inductive effect Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 230000004888 barrier function Effects 0.000 claims description 29
- 230000006698 induction Effects 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 abstract 3
- 239000010409 thin film Substances 0.000 abstract 3
- 238000009434 installation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 3
- 229910000976 Electrical steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Coils Or Transformers For Communication (AREA)
Abstract
The utility model provides an inductance structure of wave filter, include: film wire, circuit substrate and iron core. The thin film wire is provided with a thin film layer, the surface of the thin film layer is provided with more than two first wires, and the first wires are provided with first electrode points and second electrode points. The circuit substrate is provided with a binding surface, the binding surface is provided with a groove, more than two second leads cross between the binding surface and the groove, and the second leads are provided with a third electrode point and a fourth electrode point. The iron core is arranged between the groove of the circuit substrate and the film wire. When the film wire is attached to the circuit substrate, the second electrode point of the first wire is electrically connected with the third electrode point of the second wire, and the fourth electrode point of the second wire is electrically connected with the first electrode point of the first wire, so that the wire wound on the iron core is formed. Therefore, the size of the filter can be reduced, the shell or the size of the electronic device is further reduced, and the weight is reduced.
Description
Technical field
The relevant a kind of filter of the utility model refers to the employed induction structure of a kind of filter especially.
Background technology
Continuous progress along with science and technology; Now existing many electronic installations have additional network connector; After this network connector can make the user connect Network transmission line; Through the modulator-demodulator online, let the user can upgrade the operating system of this electronic installation, perhaps supply the user to upload or download required related data or picture.
In order to let the signal of network delivery have good quality; All be electrically connected with filter in network connector inside; The noise that the function of this filter is just carried secretly when erasure signal transmits is exactly the different gain of difference generation according to frequency, and the signal of CF is highlighted; The signal of other frequency is then decayed, and reaches the purpose of eliminating noise.
Though the filter of network connector can be eliminated the noise of being carried secretly when network signal transmits.But; Have two above induction structures on the filter of network connector; Each induction structure has on iron core and this iron core and is wound with coil groups, and the line footpath and the number of turns that are wound in the coil on the iron core all can make the inductance volume become big, and it is heavy that weight also becomes; It is big to make that filter accounts for the network connector inner space, makes the volume of network connector also become big relatively.Causing the volume or the housing of the electronic installation that network connector is installed also to become greatly, all certainly will be an obstruction greatly towards the compact direction design concerning any product in flourish cyberage therefore.
The utility model content
In view of this, the main purpose of the utility model is to provide a kind of compact induction structure, and this induction structure can make the housing or the volume-diminished of electronic installation, weight saving.
For reaching above-mentioned purpose; The utility model provides a kind of induction structure of filter, and this induction structure comprises: film wire has thin layer on it; Have plural first lead on the surface of this thin layer, have first electrode points and second electrode points on this first lead; Circuit substrate has binding face on it, have groove on this binding face, is crossed with second lead more than two between this binding face and this groove, has third electrode point and the 4th electrode points on this second lead; Iron core is disposed between the groove and this film wire of this circuit substrate; Wherein, When this film wire and the applying of this circuit substrate; Second electrode points of this first lead and the third electrode point of this second lead electrically connect, and the 4th electrode points of this second lead and first electrode points of this first lead electrically connect, and form and are wrapped in the lead on this iron core.
Wherein, said film wire is soft transparent plastic material, utilizes galvanoplastics on the surface of said thin layer, to be formed with plural said first lead.
Wherein, have first insulating barrier on the surface of said first lead and said thin layer, have first through hole that supplies said first electrode points and said second electrode points to expose on this first insulating barrier.
Wherein, said first insulating barrier with the reverse surface of said thin layer and said first lead on have adhesion coating, this adhesion coating supplies this thin layer to adhere on the surface of said circuit substrate or sticks on the release liners.
Wherein, said third electrode point and the 4th electrode points are located on this binding face.
Wherein, arbitrary said third electrode point or said the 4th electrode points electrically connect and are positioned at the tie point on the said binding face.
Wherein, have second insulating barrier on said binding face, said groove and said second lead, have said third electrode point that supplies this second lead and second through hole that said the 4th electrode points exposes on this second insulating barrier.
Wherein, said circuit substrate is that rigid glass mat or ceramic material processed.
Wherein, said iron core is the ring body of hollow, is that two above silicon steel sheets pile up composition.
Wherein, said iron core is the iron powder material.
Wherein, Also include the two-layer first above lead on the surface of said thin layer; Have first electrode points and second electrode points on each this first lead of layer; This of each layer first electrode points electrically connects, and this second electrode points electric connection of each layer, between each this first lead of layer, has first insulating barrier.
Wherein, Also be crossed with two second leads between said binding face and this groove with the upper strata; Have third electrode point and the 4th electrode points on each this second lead of layer; This third electrode point of each layer electrically connects, and the electric connection of the 4th electrode points of each layer, between each this second lead of layer, has second insulating barrier.
Compared to prior art, the induction structure of the utility model makes the volume-diminished of filter, and the inner too much space of the connector that can not account for also dwindles the volume of the connector of utilization filter relatively.Simultaneously, make the housing or the volume-diminished of electronic installation, weight saving.
Description of drawings
Fig. 1 is the combination schematic perspective view of induction structure of the filter of the utility model;
Fig. 2 a is the exploded perspective sketch map of induction structure of the filter of the utility model;
Fig. 2 b is the local enlarged diagram of Fig. 2 a;
Fig. 3 a is that the master of the film wire of the utility model looks sketch map;
Fig. 3 b is that the master of the circuit substrate of the utility model looks sketch map;
Fig. 4 is that the film wire of the utility model and the combination master of circuit substrate look sketch map;
Fig. 5 is the combination cross-sectional schematic of the film wire and the circuit substrate of the utility model;
Fig. 6 looks sketch map for the master of another embodiment of the film wire of the utility model;
Fig. 7 is the partial schematic sectional view of an embodiment again of the utility model.
Description of reference numerals
First lead, 12 first electrode points 121
Second electrode points, 122 first insulating barriers 13
First through hole, 131 adhesion coatings 14
Groove 22 second leads 23
Third electrode is put 231 the 4th electrode points 232
Second through hole, 251 iron cores 3
Embodiment
Detailed description of relevant the utility model and technology contents, with the conjunction with figs. explanation as follows, yet appended accompanying drawing is not to be used to limit to the utility model only as illustrative purposes.
See also Fig. 1, be the combination schematic perspective view of the induction structure of the filter of the utility model; Fig. 2 a is the exploded perspective sketch map of the induction structure of the filter of the utility model; And Fig. 2 b, be the local enlarged diagram of Fig. 2 a.As shown in the figure: the induction structure of the filter of the utility model comprises: film wire 1, circuit substrate 2 and iron core 3.
This film wire 1 has the thin layer 11 that soft transparent plastic material is processed on it, utilize galvanoplastics on the surface of this thin layer 11, to be formed with plural first lead 12, has first electrode points 121 and second electrode points 122 on this first lead 12.In addition, on the surface of this first lead 12 and this thin layer 11, have first insulating barrier 13, have first through hole 131 that supplies this first electrode points 121 and this second electrode points 122 to expose on this first insulating barrier 13.In addition, this first insulating barrier 13 with the reverse surface of this thin layer 11 and this first lead 12 on have adhesion coating 14, this adhesion coating 14 supplies these thin layers 11 to adhere on the surface of this circuit substrate 2 or sticks on the release liners (not shown).
This circuit substrate 2; Side on it has binding face 21; Has groove 22 on this binding face 21; Be crossed with second lead 23 more than two between this binding face 21 and this groove 22, have third electrode point 231 and the 4th electrode points 232 on this second lead 23, this third electrode point 231 and the 4th electrode points 232 are located on this binding face 21.In addition, this arbitrary third electrode point 231 or the 4th electrode points 232 electrically connect and are positioned at the tie point 24 on the binding face 21, to form power input or power output end.In addition, on this binding face 21, groove 22 and this second lead 23, have second insulating barrier 25, have third electrode point 231 that supplies this second lead 23 and second through hole 251 that the 4th electrode points 232 exposes on this second insulating barrier 25.In this figure, this circuit substrate 2 is rigid glass mat or ceramic wafer.
This iron core 3 is the ring body of hollow, utilizes silicon steel sheet to pile up to form or utilizes iron powder compacting or sintering to form.This iron core 3 is disposed in the groove 22 and this film wire 1 of this circuit substrate 2, contacts with this first lead 12 and second lead 23 by this first insulating barrier 13 and this second insulating barrier 25 these iron cores 3 of isolation.
See also Fig. 3 a and 3b, be respectively the film wire of the utility model and the master of circuit substrate and look sketch map; And Fig. 4 and Fig. 5, be respectively the film wire of the utility model and the combination master of circuit substrate and look sketch map and combination cross-sectional schematic.As shown in the figure: this iron core 3 is disposed in the groove 22 of this circuit substrate 2, this film wire 1 is pasted on the binding face 21 of this circuit substrate 2 again, and this film wire 1 is isolated with this iron core 3 with this first insulating barrier 13 and second insulating barrier 25 with this circuit substrate 2.
When this film wire 1 is fitted with the binding face 21 of this circuit substrate 2; Because this film wire 1 is processed for soft transparent plastic material; Can know the third electrode point 231 of seeing second lead 23 on this circuit substrate 2 and the position of the 4th electrode points 232; Make second electrode points 122 of this first lead 12 and third electrode point 231 applyings of this second lead 23 be electric connection; And first electrode points, 121 applyings of the 4th electrode points 232 of this second lead 23 and this first lead 12 are electric connection; After this first lead 12 and this second lead 23 electrically connect, be wound in the coil groups on this iron core 3 with formation, promptly accomplish the induction structure of filter and make.
See also Fig. 6, for the master of another embodiment of the film wire of the utility model looks sketch map.As shown in the figure: as when making the film wire 1 of the utility model, two that complete above film wires 1 to be sticked on the release liners 4 by adhesion coating 14,, make these two above film wires 1 like pasting on release liners 4 as the paster through after cutting.When following process, the processor be as long as after single film wire 1 peeled, can paste on circuit substrate 2, forms the induction structure of filters with this circuit substrate 2 and iron core 3.
Further, when being coated with a layer insulating, need not make first insulating barrier 13 and second insulating barrier 25 on this film wire 1 and this circuit substrate 2, make man-hour and operation to save on the surface of this iron core 3.
See also Fig. 7, be the partial schematic sectional view of an embodiment again of the utility model.As shown in the figure: in this figure; Be formed with the two-layer first above lead 12 on the surface of this thin layer 11; Have first electrode points 121 and second electrode points 122 on each this first lead 12 of layer; This of each layer first electrode points 121 electrically connects and this second electrode points 122 of each layer electrically connects, and between each this first lead 12 of layer, has first insulating barrier 13, with first lead 12 of isolated each layer.Be crossed with the two-layer second above lead 23 between this binding face 21 and this groove 22; Have third electrode point 231 and the 4th electrode points 232 on each this second lead 23 of layer; This third electrode point 231 of each layer electrically connects; And the 4th electrode points 232 electric connections of each layer, on each this second lead 23 of layer, have second insulating barrier 25, with second lead 23 of isolated each layer.Design by multilayer produces different magnetic signatures.
The above is merely the specifying of preferred embodiment of the utility model, is not the protection range in order to limitation the utility model, and other any equivalent transformation all should belong to the application's claim scope.
Claims (9)
1. the induction structure of a filter is characterized in that, this induction structure comprises:
Film wire has thin layer on it, have plural first lead on the surface of this thin layer, has first electrode points and second electrode points on this first lead;
Circuit substrate has binding face on it, have groove on this binding face, is crossed with second lead more than two between this binding face and this groove, has third electrode point and the 4th electrode points on this second lead;
Iron core is disposed between the groove and this film wire of this circuit substrate;
Wherein, When this film wire and the applying of this circuit substrate; Second electrode points of this first lead and the third electrode point of this second lead electrically connect, and the 4th electrode points of this second lead and first electrode points of this first lead electrically connect, and form and are wrapped in the lead on this iron core.
2. induction structure as claimed in claim 1 is characterized in that, has first insulating barrier on the surface of said first lead and said thin layer, has first through hole that supplies said first electrode points and said second electrode points to expose on this first insulating barrier.
3. induction structure as claimed in claim 2; It is characterized in that; Said first insulating barrier with the reverse surface of said thin layer and said first lead on have adhesion coating, this adhesion coating supplies this thin layer to adhere on the surface of said circuit substrate or sticks on the release liners.
4. induction structure as claimed in claim 3 is characterized in that, said third electrode point and the 4th electrode points are located on this binding face.
5. induction structure as claimed in claim 4 is characterized in that, arbitrary said third electrode point or said the 4th electrode points electrically connect and be positioned at the tie point on the said binding face.
6. induction structure as claimed in claim 5; It is characterized in that; Have second insulating barrier on said binding face, said groove and said second lead, have said third electrode point that supplies this second lead and second through hole that said the 4th electrode points exposes on this second insulating barrier.
7. induction structure as claimed in claim 6 is characterized in that, said iron core is the ring body of hollow.
8. induction structure as claimed in claim 1; It is characterized in that; Also include the two-layer first above lead on the surface of said thin layer, have first electrode points and second electrode points on each this first lead of layer, this of each layer first electrode points electrically connects; And this second electrode points electric connection of each layer, between each this first lead of layer, have first insulating barrier.
9. induction structure as claimed in claim 1; It is characterized in that; Also be crossed with the two-layer second above lead between said binding face and the said groove, have third electrode point and the 4th electrode points on each this second lead of layer, this third electrode point of each layer electrically connects; And the electric connection of the 4th electrode points of each layer, between each this second lead of layer, have second insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204711150U CN202363203U (en) | 2011-11-23 | 2011-11-23 | Inductive structure of the filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204711150U CN202363203U (en) | 2011-11-23 | 2011-11-23 | Inductive structure of the filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202363203U true CN202363203U (en) | 2012-08-01 |
Family
ID=46574372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204711150U Expired - Fee Related CN202363203U (en) | 2011-11-23 | 2011-11-23 | Inductive structure of the filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202363203U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105719788A (en) * | 2014-12-19 | 2016-06-29 | 株式会社村田制作所 | Coil Component And Method Of Making The Same |
| CN109599249A (en) * | 2018-10-30 | 2019-04-09 | 北京航空航天大学 | A kind of back-shaped solenoid transformer of MEMS and its manufacturing method |
| US12266470B2 (en) | 2018-10-30 | 2025-04-01 | Beihang University | MEMS solenoid transformer and manufacturing method thereof |
-
2011
- 2011-11-23 CN CN2011204711150U patent/CN202363203U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105719788A (en) * | 2014-12-19 | 2016-06-29 | 株式会社村田制作所 | Coil Component And Method Of Making The Same |
| CN109599249A (en) * | 2018-10-30 | 2019-04-09 | 北京航空航天大学 | A kind of back-shaped solenoid transformer of MEMS and its manufacturing method |
| CN109599249B (en) * | 2018-10-30 | 2020-11-10 | 北京航空航天大学 | MEMS (micro-electromechanical system) loop solenoid transformer and manufacturing method thereof |
| US12266470B2 (en) | 2018-10-30 | 2025-04-01 | Beihang University | MEMS solenoid transformer and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120801 Termination date: 20161123 |