CN202127013U - Semiconductor lead frame of whole substrate surface - Google Patents
Semiconductor lead frame of whole substrate surface Download PDFInfo
- Publication number
- CN202127013U CN202127013U CN2011202113307U CN201120211330U CN202127013U CN 202127013 U CN202127013 U CN 202127013U CN 2011202113307 U CN2011202113307 U CN 2011202113307U CN 201120211330 U CN201120211330 U CN 201120211330U CN 202127013 U CN202127013 U CN 202127013U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- semiconductor lead
- whole matrix
- frame body
- terminal pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a semiconductor lead frame of whole substrate surface, which comprises a frame body (1). The frame body (1) consists of a plurality of single pieces, a whole substrate (2) is disposed at the upper portion of each single piece, and a terminal pin combination (3) is disposed at the lower portion of each single piece. A locating hole (4) is arranged respectively between the terminal pin combinations of the single pieces, and the single pieces are connected to form the frame body (1) through connecting ribs (5). The semiconductor lead frame of the whole substrate surface is wide in range of application and meets packaging requirements of large devices.
Description
Technical field
The utility model provides a kind of semiconductor lead frame of whole matrix surface.
Background technology
Along with the development of electron trade, the chip of semiconductor device is increasing.This just requires the corresponding increasing of basal plane of lead frame, yet the basal plane of current chip is the demand of the large-scale semiconductor chip that can't satisfy.
Summary of the invention
The utility model provides a kind of semiconductor lead frame of whole matrix surface, and it is applied widely, satisfies the encapsulation requirement of large-scale device.
The utility model has adopted following technical scheme: a kind of semiconductor lead frame of whole matrix surface; It comprises frame body; Described frame body is made up of some monolithics, and the top of each monolithic is set to whole matrix, and the bottom is the terminal pin combination; Between the terminal pin combination of each monolithic, be provided with location hole, each monolithic is interconnected to form frame body through dowel.
Described monolithic is the KFC copper strips.Described frame body is made up of 10 monolithics, and the lengths of frame of 10 monolithic compositions is 170mm, and width is 35.8mm.Described whole matrix surface is of a size of 13mm * 13mm, and flatness is 0.05mm, and thickness all is 2mm.The thickness of described terminal pin combination is 0.6mm, and tolerance be ± 0.01mm, and terminal pin makes up and comprises three pins, and the thickness of three outside bendings of pin is 2.5mm.
The utlity model has following beneficial effect: the utility model is provided with whole matrix, like this can enlarging application range, can satisfy the encapsulation requirement of large-scale device.
Description of drawings
Fig. 1 is the structural representation of the utility model
Embodiment
In Fig. 1, the utility model provides a kind of semiconductor lead frame of whole matrix surface, and it comprises frame body 1, and frame body 1 is made up of 10 monolithics; Monolithic is shaped through punching press, surface treatment and cut-out successively by the KFC copper strips and processes, and the lengths of frame of 10 monolithic compositions is 170mm, and tolerance is ± 0.15mm that width is 35.8mm; The top of each monolithic is set to whole matrix 2, and whole matrix 2 surfaces are of a size of 13mm * 13mm, and flatness is 0.05mm; Thickness all is 2mm, and tolerance is ± 0.015mm that the bottom is terminal pin combination 3; The thickness of terminal pin combination 3 is 0.6mm, and tolerance is ± 0.01mm that terminal pin combination 3 comprises three pins; The thickness of three outside bendings of pin is 2.5mm, between the terminal pin combination of each monolithic, is provided with location hole 4, and each monolithic is interconnected to form frame body 1 through dowel 5.
Claims (5)
1. the semiconductor lead frame of a whole matrix surface; It comprises frame body (1); It is characterized in that described frame body (1) is made up of some monolithics, the top of each monolithic is set to whole matrix (2), and the bottom is terminal pin combination (3); Between the terminal pin combination of each monolithic, be provided with location hole (4), each monolithic is interconnected to form frame body (1) through dowel (5).
2. the semiconductor lead frame of whole matrix surface according to claim 1 is characterized in that described monolithic is the KFC copper strips.
3. the semiconductor lead frame of whole matrix surface according to claim 1 is characterized in that described frame body (1) is made up of 10 monolithics, and the lengths of frame that 10 monolithics are formed is 170mm, and width is 35.8mm.
4. the semiconductor lead frame of whole matrix surface according to claim 1 is characterized in that described whole matrix (2) surface is of a size of 13mm * 13mm, and flatness is 0.05mm, and thickness all is 2mm.
5. the semiconductor lead frame of whole matrix surface according to claim 1; The thickness that it is characterized in that described terminal pin combination (3) is 0.6mm; Tolerance is ± 0.01mm, and terminal pin combination (3) comprises three pins, and the thickness of three outside bendings of pin is 2.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202113307U CN202127013U (en) | 2011-06-16 | 2011-06-16 | Semiconductor lead frame of whole substrate surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202113307U CN202127013U (en) | 2011-06-16 | 2011-06-16 | Semiconductor lead frame of whole substrate surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202127013U true CN202127013U (en) | 2012-01-25 |
Family
ID=45490077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202113307U Expired - Fee Related CN202127013U (en) | 2011-06-16 | 2011-06-16 | Semiconductor lead frame of whole substrate surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202127013U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332444A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Semiconductor lead frame of whole matrix surface |
| CN103531569A (en) * | 2013-10-28 | 2014-01-22 | 沈健 | Plastic package lead frame with super-high power |
-
2011
- 2011-06-16 CN CN2011202113307U patent/CN202127013U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332444A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Semiconductor lead frame of whole matrix surface |
| CN103531569A (en) * | 2013-10-28 | 2014-01-22 | 沈健 | Plastic package lead frame with super-high power |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200802774A (en) | Semiconductor die packages using thin dies and metal substrates | |
| WO2007127552A3 (en) | Semiconductor die package including multiple dies and a common node structure | |
| EP2816589A3 (en) | Die substrate with reinforcement structure | |
| CN202127013U (en) | Semiconductor lead frame of whole substrate surface | |
| CN203277357U (en) | Leading wire frame for semiconductor | |
| CN102332444A (en) | Semiconductor lead frame of whole matrix surface | |
| CN203277358U (en) | Leading wire frame for MOS semiconductor device | |
| CN102339807A (en) | Lead frame with T-shaped gaps among radiating fins | |
| EP2595186A3 (en) | High frequency semiconductor package | |
| CN203826370U (en) | Lead framework for small power device | |
| CN101794761A (en) | Lead frame for use in IC packaging | |
| CN203826369U (en) | Semiconductor lead frame | |
| CN203209541U (en) | L-shaped bending die with positioning function | |
| CN203277356U (en) | Split type leading wire frame | |
| CN202127012U (en) | Lead frame for plastic semiconductor | |
| CN2739798Y (en) | Semiconductor integrated circuit lead frame | |
| CN204651308U (en) | A lead frame for realizing high-density pins | |
| CN202127007U (en) | Lead frame with T-shaped notches between cooling fins | |
| CN203617271U (en) | High-power plastic package lead frame | |
| CN202461257U (en) | Stamping die Male die punch of four-side pins of high-precision integrated circuit | |
| CN202127015U (en) | Lead frame with blank holders at backs of matrixes | |
| CN203774321U (en) | Duodiode packaging structure applied in SOT23 semiconductor | |
| SG153683A1 (en) | 3d integrated circuit package and method of fabrication thereof | |
| CN203277360U (en) | Leading wire frame for large power semiconductor device | |
| CN204348713U (en) | A kind of multichip packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Taizhou Dongtian Electronics Co., Ltd. Assignor: Shen Jian Contract record no.: 2012320000223 Denomination of utility model: Semiconductor lead frame of whole matrix surface Granted publication date: 20120125 License type: Exclusive License Record date: 20120314 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120125 Termination date: 20140616 |
|
| EXPY | Termination of patent right or utility model |