CN201946583U - Glass passivation rectifying chip - Google Patents
Glass passivation rectifying chip Download PDFInfo
- Publication number
- CN201946583U CN201946583U CN2011200143469U CN201120014346U CN201946583U CN 201946583 U CN201946583 U CN 201946583U CN 2011200143469 U CN2011200143469 U CN 2011200143469U CN 201120014346 U CN201120014346 U CN 201120014346U CN 201946583 U CN201946583 U CN 201946583U
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- China
- Prior art keywords
- covered
- layer
- base material
- rectification
- rectifying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011521 glass Substances 0.000 title claims abstract description 12
- 238000002161 passivation Methods 0.000 title claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000007747 plating Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract 6
- 239000000956 alloy Substances 0.000 abstract 3
- 229910045601 alloy Inorganic materials 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 description 6
- 210000003323 beak Anatomy 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of electronic apparatuses, in particular to a glass passivation rectifying chip, which comprises a rectifying substrate (4), an upper metal layer (1) which is covered on the upper surface of the rectifying substrate (4) and a metal layer (7) which is covered on the bottom of the rectifying substrate (4). The glass passivation rectifying chip is characterized in that the upper surface of the rectifying substrate (4) is covered with an upper alloy layer (3) which is covered with an upper nickel plating layer (2). The upper metal layer (1) is covered on the upper nickel plating layer (2). The bottom of the rectifying substrate (4) is covered with an alloy layer (9). The alloy layer (9) is covered with a nickel plating layer (8). The metal layer (7) is covered on the nickel plating layer (8). A groove (10) is arranged on the periphery of the upper surface of the rectifying substrate (4) and is covered with a glass passivation layer (6). The glass passivation rectifying chip utilizes three sequential metal plating processes, thereby improving the capability of the through current. The glass passivation rectifying chip utilizes a quadrilateral with arc corners, thereby effectively protecting the corners on a table-board and preventing the corners from damage during processing.
Description
Technical field
The utility model relates to technical field of electronic components, especially a kind of glassivation rectification chip.
Background technology
Along with continuous progress in science and technology, rectification chip is as requisite device in the power electronic equipment, and demand is very big, and along with the lifting of modern comfort design performance, the performance requirement of rectification chip is also more and more higher.Traditional diffusion chip has been difficult to satisfy the demand gradually.In order further to promote the electrical parameter of rectification chip, mainly improve from material and manufacture craft two aspects.The epitaxial wafer of the many employings of some high-end products (especially foreign vendor) at present is that base material is produced, but cost is higher; On the other hand, products such as mesa chip improve from aspects such as technology and outside coating, and Financial cost and performance boost are all more satisfactory.
The mesa rectification chip is developed exploitation and is widely used as high performance rectification chip; because the difference of production technology separately; the design of mask blank in the mesa chip production is different to cause the mesa shape that forms difference to some extent; simultaneously the difference of etch process has also caused the difference of sidewall etch angle, and protective material, coating are also all because technology difference and difference simultaneously.
There is following shortcoming in existing mesa chip: 1. mostly be straight flange right angle figure when mask blank designs, production process easily causes the damage of corner; 2. production process is not noted the protection of beak or is protected not in placely, easily causes the damage of beak and influences product performance; 3. select for use the difference of protective material and the difference of coating material technology to cause protective material to be abound with raceway groove, cause follow-up cutting difficulty; 4. the coat of metal adopts individual layer more, conductivity and stretching resistance poor performance.This is the existing in prior technology weak point.
Summary of the invention
The purpose of this utility model is exactly at the existing in prior technology deficiency, and a kind of novel, simple, practical a kind of glassivation rectification chip is provided.
In order to solve the technical problem of above-mentioned existence, the utility model adopts following technical proposals: include the rectification base material, the last metal level that the rectification base material is covered with above, the metal level that rectification base material bottom surface is covered with, on described rectification base material, be covered with alloy-layer, nickel coating on described, being covered with above the alloy-layer, the described metal level of going up covers described going up above the nickel coating, bottom surface at described rectification base material has been covered with alloy-layer, on described alloy-layer, be covered with nickel coating, described metal level covers above the described nickel coating, around on described rectification base material a groove is arranged, described groove has been covered with glass passivation layer.Groove is a width of stopping etch channels when reticle designs.
Further improvement of the utility model has, and above-mentioned rectification base material top is the quadrangle boss, and the bottom is the quadrangle platform.Be fillet around the described boss, and be connected with the four edges of described boss is slick and sly.Chip table adopts quadrangle, but adopts the arc chord angle of certain radian on four angles, rather than adopts tetragonal right angle.Prevent because the right angle of quadrangle right-angle structure is relatively more sharp-pointed in the right angle damage that production process causes.
Described rectification base material is a silica-base material.
Described upward metal level and described metal level are Gold plated Layer.The chip surface Gold plated Layer adopt chemical gilding technology to form one deck Gold plated Layer on the surface of chip, and raceway groove is interior because the protection of glassivation is arranged, and does not have gold-plated.Can improve the conductivity of chip and increase conductive current by surface gold-plating.
In sum, the utility model advantage is to select for use the method for chemical plating aspect the coat of metal, successively carry out the process of three platings, sintering forms alloy-layer and increases stretching resistance after the nickel plating, secondary nickel plating increases the platability of conductivity and outer layer metal, and gold-plated for the third time increase solderability and raising are by the ability of electric current.Adopt the quadrangle of circular arc corner, adopt glass passivation layer simultaneously, the table top corner is effectively protected, prevent the corner damage of the course of processing.
This shows that the utility model compared with prior art has substantive distinguishing features and progress, the beneficial effect of its enforcement also is conspicuous.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Fig. 2 is a vertical view.
Fig. 3 is Figure 1A partial enlarged drawing.
Among the figure, 1 is last metal level, and 2 is last nickel coating, and 3 is last alloy-layer, and 4 are the rectification base material, and 5 is beak, and 6 is glass passivation layer, and 7 is metal level, and 8 is nickel coating, and 9 is alloy-layer, and 10 is groove, and 11 is the quadrangle boss, and 12 is the quadrangle platform.
Embodiment
For clearly demonstrating the technical characterstic of this programme,, and, this programme is set forth in conjunction with its accompanying drawing below by an embodiment.
By accompanying drawing 1 as can be seen, this programme provides a kind of glassivation rectification chip, include rectification base material 4, the last metal level 1 that rectification base material 4 is covered with above, the metal level 7 that rectification base material 4 bottom surfaces are covered with, on rectification base material 4, be covered with alloy-layer 3, on last alloy-layer 3, be covered with nickel coating 2, last metal level 1 is incumbent on above the nickel coating 2, be covered with alloy-layer 9 in the bottom surface of rectification base material 4, on alloy-layer 9, be covered with nickel coating 8, metal level 7 covers above the nickel coating 8, state above the rectification base material 4 around a groove 10 is arranged, groove 10 is covered with glass passivation layer 6.Adopt twice nickel plating, nickel plating for the first time forms alloy-layer by sintering, and coating and base material are combined closely, and increases the chip stretching resistance; Secondary nickel plating then increases conductivity and platability, makes easier, the more uniform chip surface that is plated in of outer field gold.
By accompanying drawing 2 as can be seen, rectification base material 4 tops are quadrangle boss 11, and the bottom is quadrangle platform 12.Be fillet around the boss 11, and be connected with the four edges of boss 11 is slick and sly.
Rectification base material 4 is a silica-base material.Last metal level 1 is Gold plated Layer with metal level 6.
By accompanying drawing 3 as can be seen, beak 5 is parts that glass passivation layer 6 covers, so played protective effect.
The utility model can pass through existing techniques in realizing without the technical characterictic of describing, and does not repeat them here.Certainly; above-mentioned explanation is not to be to restriction of the present utility model; the utility model also is not limited in above-mentioned giving an example, and variation, remodeling, interpolation or replacement that those skilled in the art are made in essential scope of the present utility model also should belong to protection range of the present utility model.
Claims (5)
1. glassivation rectification chip, include rectification base material (4), the last metal level (1) that rectification base material (4) is covered with above, the metal level (7) that rectification base material (4) bottom surface is covered with, it is characterized in that: on described rectification base material (4), be covered with alloy-layer (3), be covered with nickel coating (2) above the alloy-layer on described (3), the described metal level (1) of going up covers described going up above the nickel coating (2), be covered with alloy-layer (9) in the bottom surface of described rectification base material (4), on described alloy-layer (8), be covered with nickel coating (7), described metal level (6) covers described nickel coating 8) above, around on described rectification base material (4) groove (10), described groove 10 arranged) be covered with glass passivation layer (6).
2. a kind of glassivation rectification chip according to claim 1 is characterized in that: described rectification base material (4) top is quadrangle boss (11), and the bottom is quadrangle platform (12).
3. a kind of glassivation rectification chip according to claim 1 and 2 is characterized in that: be fillet around the described boss (11), and be connected with the four edges of described boss (11) is slick and sly.
4. a kind of glassivation rectification chip according to claim 1 and 2 is characterized in that: described rectification base material (4) is a silica-base material.
5. a kind of glassivation rectification chip according to claim 1 is characterized in that: the described metal level (1) of going up is Gold plated Layer with described metal level (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200143469U CN201946583U (en) | 2011-01-18 | 2011-01-18 | Glass passivation rectifying chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200143469U CN201946583U (en) | 2011-01-18 | 2011-01-18 | Glass passivation rectifying chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201946583U true CN201946583U (en) | 2011-08-24 |
Family
ID=44473919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200143469U Expired - Fee Related CN201946583U (en) | 2011-01-18 | 2011-01-18 | Glass passivation rectifying chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201946583U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114937645A (en) * | 2022-05-17 | 2022-08-23 | 江苏长电科技股份有限公司 | Chip package structure |
-
2011
- 2011-01-18 CN CN2011200143469U patent/CN201946583U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114937645A (en) * | 2022-05-17 | 2022-08-23 | 江苏长电科技股份有限公司 | Chip package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20140118 |