CN201893335U - Dual-chip integrated circuit lead frame - Google Patents

Abstract

The utility model relates to a double-chip integrated circuit lead frame, which comprises a base island, a small base island and pins, the pins 7 and 8 of the pins are connected to the base island, and at least one locking position is set on the base island hole. The hole diameter of the locking hole is 0.7-0.72mm. In the actual production process of the utility model, due to the added locking holes on the base island, the bonding force between the plastic sealing material and the lead frame can be increased, and product delamination or cracking can be reduced.

Description

A two-chip integrated circuit lead frame

technical field

The utility model relates to a lead frame, in particular to a double-chip integrated circuit lead frame.

Background technique

Multi-chip packaging is a very hot topic in the market today. Putting more than one chip in the cavity of an integrated circuit can greatly save the application space and facilitate the design and application of the whole machine. Some devices, due to the different processes used, cannot be implemented in one chip or integrated in one chip during the chip manufacturing process. Dual-chip packaging is a method to solve the problem of putting two chips of different manufacturing processes in the same circuit. There are many types of DIP8 dual-chip lead frames on the market, and one of the lead frames used a lot is designed with 7 pins, 8 pins and the base island connected together, as shown in Figure 1. The lead frame operation product has a large area because the 7-pin, 8-pin and the base island are connected together. When the frame in the plastic package is stressed during the cutting and forming process, the product is prone to delamination or even cracking.

Contents of the invention

Aiming at the above-mentioned problems in the prior art, the purpose of the present invention is to provide a lead frame for a two-chip integrated circuit, which will not be delaminated or cracked during the process of trimming and forming.

The technical scheme adopted by the utility model for realizing its object: a kind of double-chip integrated circuit lead frame, comprises base island, small base island and pins, and 7 pins and 8 pins in the pins are connected with the base island, so At least one locking hole is set on the base island. The hole diameter of the locking hole is 0.7-0.72mm.

The beneficial effects of the utility model: in the actual production process, due to the added locking holes on the base island, the bonding force between the plastic sealing compound and the lead frame can be increased, and product delamination or cracking can be reduced.

Description of drawings

Below in conjunction with accompanying drawing and specific embodiment the utility model is further described.

Fig. 1 is the structure diagram of DIP8 double-chip lead frame in the prior art;

Fig. 2 is a structural schematic diagram of the utility model.

Detailed ways

Referring to FIG. 1 , this embodiment takes a DIP8 double-chip lead frame as an example, and the lead frame includes a base island 2 , a small base island 3 and pins 1 . The DIP8 double-chip lead frame contains 8 pins, wherein pins 7 and 8 are connected to the base island 2, and a locking hole 4 is provided on the base island 2. 1-3 locking holes can be established, and 2 are established in this example. The hole diameter of the locking hole is 0.711mm. Due to the added locking holes on the base island, the bonding force between the molding compound and the lead frame can be increased, and product delamination can be reduced.

Claims (2)

1. A double-chip integrated circuit lead frame comprises a base island, a small base island and pins, and 7 pins and 8 pins in the pins are connected to the base island, and it is characterized in that: the base island is provided with at least one Lock hole. 2. The two-chip integrated circuit lead frame according to claim 1, characterized in that: the locking hole has a diameter of 0.7-0.72mm.

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