CN209515637U - A kind of power module architectures - Google Patents

Abstract

The utility model discloses a kind of power module architectures, including substrate, chip and Pin needle, the chip are fixed on substrate, and the position of the fixed Pin needle of the substrate is equipped with the needle stand of tubular structure, and the Pin needle passes through needle stand and is fixed on substrate.The utility model has the advantage of the power module architectures to have higher production compatibility, and it can be produced using arrangement mode, it uses manpower and material resources sparingly, furthermore modular structure avoids the design of plastic package die salient point, entire cavity body of mould is more regular, the design difficulty and manufacturing cost for greatly reducing mold, improve production efficiency.

Description

A power module structure

technical field

The utility model relates to the field of power modules, and provides a power module structure and a manufacturing method thereof.

Background technique

With the rapid development of the country's industry and the needs of strategic development, power modules, as an important part of power electronics, are more and more widely used in aviation, new energy vehicles, photovoltaics, wind energy, aviation, industrial frequency conversion and other industries, and the market prospect will become more and more The more extensive, the power modules with different functions and packaging forms also emerge as the times require.

At present, this module on the market will have corresponding pin arrangement according to different application schemes. Correspondingly, the cavity of the plastic sealing mold needs to be designed with different bumps to form different vacancies during the molding process. And welding Pin, according to the design and operation characteristics of the plastic sealing mold, a set of plastic sealing mold can only form a colloid of one shape, so it is necessary to configure different plastic sealing molds to meet the plastic sealing shape requirements of different Pin pin arrangements, how to reduce The design and manufacturing difficulty of the plastic packaging mold, the effective compatibility with a variety of pin arrangements, and the realization of large-scale and low-cost mass production are the key points in the design and manufacture of the entire power module.

In the prior art, when designing a plastic sealing mold, design bumps at the corresponding positions of the mold. After molding, there will be corresponding pits in the corresponding positions of the product, and then spot tin and solder pins at the pit positions, so that for different The pin arrangement scheme is matched with the corresponding plastic sealing mold to work. Due to the flow of resin and the opening and closing of the mold in the process of compression molding, a certain friction force will be generated, which will cause the plastic sealing mold to be easily worn, especially this kind of belt. Molds with bump design are more prone to wear and tear than ordinary regular molds, which in turn affects the operation accuracy, resulting in poor products and shortened overall mold life. Low production UPH and frequent mold replacement also have a certain impact on product quality stability.

Utility model content

The technical problem to be solved by the utility model is to realize a power module structure with reasonable structure and convenient production.

In order to achieve the above purpose, the technical solution adopted by the present invention is as follows: a power module structure includes a substrate, a chip and a pin, the chip is fixed on the substrate, and the position where the pin is fixed on the substrate is provided with a needle of a tubular structure The pin is fixed on the base plate through the needle seat.

The bottom periphery of the pin seat is soldered to the substrate by solder paste, and the Pin pin is fixed on the substrate in the pin seat by spotting tin in the pin seat.

A layer of resin encapsulating one side of the substrate with the pin seat, the chip and the Pin pin covers all the pin seat and the chip on the substrate, and the thickness of the resin is equal to or slightly lower than the height of the pin seat.

The edge of the base is fixed with a frame extending laterally for connection with other power modules.

The frame, the chip and the pin seat are all welded on the substrate by solder paste.

Between the chip and the chip, and between the chip and the substrate, aluminum wire bonding is used to realize the electrical performance according to the pre-designed circuit.

The substrate is a ceramic copper-clad substrate.

The advantages of the utility model lie in that the power module has high production compatibility, and can be produced in an arrangement mode, saving manpower and material resources, in addition, the module structure avoids the design of the bumps of the plastic sealing mold, and the entire mold cavity is relatively regular, which greatly reduces the number of molds. design difficulty and manufacturing cost.

Description of drawings

Below is a brief description of the content expressed in each drawing in the description of the present utility model and the marks in the drawing:

Figure 1 is a schematic structural diagram of a power module;

The marks in the above figures are: 1, needle seat; 2, Pin needle; 3, chip; 4, substrate; 5, resin; 6, frame.

Detailed ways

As shown in Figure 1, the power module structure is mainly composed of a needle seat 1, a pin 2, a chip 3, a substrate 4, a resin 5 and a frame 6. The substrate 4 (DBC) can be a ceramic copper-clad substrate, and the resin 5 is a layer structure. For encapsulating the entire power module, epoxy resin is generally used.

The chip 3 and the pin seat 1 are soldered on the substrate 4 by solder paste. The welding position of the chip 3 and the pin seat 1 is determined according to the pre-designed circuit. The electrical performance between the chip 3 and the chip 3 and between the chip 3 and the substrate 4 Realized by aluminum wire bonding, the needle holder 1 is vertically fixed on the substrate 4 where the Pin needle 2 is pre-designed to be installed. The needle holder 1 is a tubular structure with open ends at both ends. The inner diameter of the needle holder 1 is slightly larger than the outer diameter of the Pin needle 2, which can The pin 2 is fixed on the substrate 4 through the pin seat 1, the pin 2 is fixed on the substrate 4 in the pin seat 1 by tinning in the pin seat 1, and the pin 2 is fixed through the middle pin seat 1, which can ensure The reliability of pin 2 fixing, this structure can help reduce the frequency of mold replacement, improve the stability of product quality, and improve the production UPH.

The substrate 4 has a pin seat 1, a chip 3 and a pin 2 on one side with a layer of encapsulated resin 5. The resin 5 covers all the pin seat 1 and the chip 3 on the substrate 4, and the thickness of the resin 5 is equal to or slightly lower than that of the pin seat 1. The resin 5 can insulate and seal the device to ensure the reliability of the power module.

The frame 6 is soldered on the edge of the substrate 4 by solder paste, and the frame 6 extends laterally for connection with other power modules. The modules are connected continuously, pass through the production equipment in turn, and are produced one by one to achieve the continuity of production and help improve production efficiency. In addition, the frame 6 is also convenient for the staff to hold and take the power module during manufacture.

The manufacturing method of the above-mentioned power module structure is as follows:

Step 1. Fix the frame 6, the chip 3 and the pin seat 1 on the substrate 4 by solder paste welding, and the welding position is determined according to the design drawings;

Step 2, according to the pre-designed circuit, use aluminum wire to bond the chip 3 and the chip 3, the chip 3 and the substrate 4 to realize the electrical performance of the power module;

Step 3. Use the equipment to encapsulate the surface of the substrate 4 with the resin 5 to form a resin encapsulation layer to seal all the components to the needle seat 1. The design height of the needle seat 1 is consistent with the height of the resin 5 sealing, or the needle seat 1 is slightly higher than the height of the resin 5 seal. The height of the resin 5 encapsulation, the anti-overflow glue operation is performed on the needle seat 1 before the resin 5 encapsulation is performed, and the anti-overflow glue structure is removed after the resin 5 encapsulation is completed, so as to ensure that the resin 5 does not It will flow into the hole of Pin 2, ensuring the electrical output of Pin 2;

Step 4. Put tin on the inner hole of the needle holder 1 and insert the Pin 2 into the needle holder 1;

Step 5. If multiple power modules are connected through the frame, the frame needs to be cut to separate the power modules.

The machining of the power module has since been completed.

The present utility model has been exemplarily described above in conjunction with the accompanying drawings. Obviously, the specific implementation of the present utility model is not limited by the above-mentioned methods, as long as various non-substantial improvements made by the method concept and technical solutions of the present utility model are adopted, or If the concept and technical solutions of the present invention are directly applied to other occasions without improvement, they all fall within the protection scope of the present invention.

Claims (7)

1. a kind of power module architectures, including substrate, chip and Pin needle, the chip are fixed on substrate, it is characterised in that: The position of the fixed Pin needle of the substrate is equipped with the needle stand of tubular structure, and the Pin needle passes through needle stand and is fixed on substrate.

2. power module architectures according to claim 1, it is characterised in that: the bottom periphery of the needle stand is welded by tin cream It connects on substrate, the Pin needle is fixed on the substrate in needle stand by putting tin in needle stand.

3. power module architectures according to claim 2, it is characterised in that: the substrate has needle stand, chip and Pin needle The resin for having one layer of encapsulating on one side, all needle stand and chip, the thickness of the resin are equal in the resin coating cover substrate Or the height of slightly below needle stand.

4. power module architectures according to claim 3, it is characterised in that: the substrate edges, which are fixed with, extends laterally use In the frame being connect with other power modules.

5. power module architectures according to claim 4, it is characterised in that: the frame, chip, needle stand pass through tin cream It is welded on substrate.

6. any power module architectures in -5 according to claim 1, it is characterised in that: between the chip and chip, Basis is pre-designed circuit and realizes electric property using aluminum wire bonding mode between chip and substrate.

7. power module architectures according to claim 6, it is characterised in that: the substrate is ceramic copper-clad base plate.