CN201590028U - Universal radiating fixing piece structure for mainboard - Google Patents

Abstract

The utility model relates to a general type heat dissipation mounting structure for mainboard, it contains: the device comprises a main board, a first board body and a second board body. The first and second plate bodies are respectively formed with a first opening and a second opening, and can be combined into a whole by a combining piece and can be rotationally opened and closed by taking the combining piece as a center. In addition, a first positioning piece and a second positioning piece are respectively arranged at the positions close to the central parts of the first plate body and the second plate body, and a combination opening corresponding to the first positioning piece and the second positioning piece is also arranged on the main board, so that the first positioning piece and the second positioning piece can be mutually buckled and fixed with the combination opening to fix the opening and closing angle between the first plate body and the second plate body, and the convenience of installing and fixing the heat dissipation piece by a user is further improved.

Description

Universal thermal mount structure for motherboards

technical field

The utility model relates to a general-purpose heat dissipation fixing part structure for a mainboard, in particular to a heat dissipation fixing part structure suitable for the mainboard to assemble heat dissipation parts of various sizes and specifications.

Background technique

With the rapid development of information technology, both personal computers and notebook computers need faster processing speeds to process data with heavier logic operations. Because internal devices in personal computers and notebook computers, such as motherboards, central processing units (CPUs) and integrated circuit components, will generate high heat during operation, and the faster the processing speed, the higher the relative heat generated. Therefore, if the heat energy cannot be dissipated in a timely manner, its normal operation will be affected, resulting in a reduction in execution speed or even affecting its service life.

In order to improve the above-mentioned problems, the most common way in the prior art is to directly install a heat sink on the heating element to assist the heating element to dissipate heat. For example, after the central processing unit is assembled on the main board, a cooling element can be installed, and the cooling element can be in contact with the central processing unit, so that the heat energy generated by the central processing unit can be dissipated by the cooling element. However, in order to securely install the heat sink, a heat sink fixing structure is usually used to fix the position between the heat sink and the central processing unit, so that the heat sink does not slide easily and maintains a better heat dissipation effect.

In addition, in order to cooperate with the installation of the heat dissipation fixture structure, most of the main boards are provided with perforations for the heat dissipation fixture structure to be locked thereon, but the positions of the perforations are often set differently with different specifications of the mainboard, so manufacturing Businesses need to manufacture or replace heat dissipation fixture structures of different sizes in accordance with the specifications of the motherboard. Therefore, it will cause an increase in the cost of material preparation and cause inconvenience in assembly.

Contents of the invention

The purpose of this utility model is to provide a new general-purpose heat dissipation fixture structure for motherboards. The technical problem to be solved is to make it applicable to motherboards and radiators of different specifications, thereby improving the heat dissipation fixtures in the past. Inconvenience and lack of commonality in the use of the structure.

Another object of the present invention is to provide a new general-purpose heat dissipation fixture structure for motherboards. The technical problem to be solved is to make it suitable for fixing heat dissipation elements of various sizes.

Another object of the present invention is to provide a new general-purpose heat dissipation fixture structure for motherboards, and the technical problem to be solved is to improve the convenience for users to install the heat dissipation fixture structure.

The purpose of this utility model and the solution to its technical problems are achieved by adopting the following technical solutions. According to the utility model, a general-purpose heat dissipation fixture structure for a motherboard is proposed, which includes: a motherboard, which has a plurality of joint openings; a first board body, which is elongated and has a first In the central part, a first opening is formed at both ends of the first plate, and a first positioning member is provided near the first central part; and a second plate, which is elongated and has a second central A second opening is formed at both ends of the second plate, and a second positioning member is provided near the second central part; wherein, the second central part and the first central part are rotated by a joint Combined into one body, the first positioning piece and the second positioning piece are respectively fastened and fixed with the combining openings.

The purpose of the utility model and the solution to its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned universal heat dissipation fixture structure, the first positioning member is a positioning column or a positioning hole.

In the aforementioned universal heat dissipation fixture structure, the first plate body further has at least one third opening, the third opening is formed between the first opening and the first central part, and the first positioning member It is a T-shaped piece, and the first positioning piece is slidably passed through the third opening.

In the aforementioned general heat dissipation fixture structure, the first opening and the third opening communicate with each other.

In the aforementioned general-purpose heat dissipation fixture structure, the communication between the first opening and the third opening has a restricting portion that restricts the sliding range of the first positioning member.

In the aforementioned universal heat dissipation fixture structure, the second positioning member is a positioning column or a positioning hole.

In the aforementioned universal heat dissipation fixture structure, the second plate body further has at least one third opening, the third opening is formed between the second opening and the second central part, and the second positioning member It is a T-shaped piece, and the second positioning piece is slidably passed through the third opening.

In the aforementioned general heat dissipation fixture structure, the second opening communicates with the third opening.

In the aforementioned universal heat dissipation fixture structure, the place where the second opening communicates with the third opening further has a restricting portion that restricts the sliding range of the second positioning member.

The aforementioned universal heat dissipation fixture structure further has at least one screw, and each screw is slidably passed through the first openings and the second openings.

Compared with the prior art, the utility model has obvious advantages and beneficial effects. By means of the above technical solution, the general-purpose heat dissipation fixture structure used in the motherboard of the present invention has at least the following advantages and beneficial effects:

1. The general-purpose heat dissipation fixture structure for motherboards of the present invention can be applied to radiators and motherboards of various sizes and specifications, so as to improve the inconvenience and lack of commonality in the past.

2. The utility model’s general-purpose heat-dissipating fixture structure for the mainboard utilizes positioning pieces provided on the heat-dissipating fixture structure, and correspondingly sets joint openings on the mainboard, so as to facilitate corresponding fastening and fixing of the heat-dissipating fixture structure On the main board, the convenience for users to install the heat dissipation fixture structure can be improved.

3. The utility model’s general-purpose heat-dissipating fixture structure for motherboards can reduce the material cost of preparing materials, and also reduce the time and manpower spent on designing and manufacturing the heat-dissipating fixture structure. cost.

4. The utility model is used in the general-purpose heat dissipation fixture structure of the main board. By designing the heat dissipation fixture structure into a rotatable opening and closing form, it is beneficial to change its size, and is suitable for fixing heat dissipation elements of various sizes.

To sum up, the present invention relates to a universal heat dissipation fixture structure for a motherboard, which includes: a motherboard, a first board body, and a second board body. A first opening and a second opening are respectively formed on the first and second boards, and can be integrated with each other by means of a connecting piece, and can be rotated and opened with the connecting piece as the center. In addition, a first locating piece and a second locating piece are respectively provided near the central parts of the first and second boards, and corresponding to the first and second locating pieces can also be provided on the main board. Combining the openings so that the first and second positioning parts can be fastened and fixed with the combining openings to fix the opening and closing angle between the first board and the second board, thereby improving the user's installation and fixing of the heat sink convenience. The utility model has remarkable progress in technology, and has obvious positive effects, and is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present utility model. In order to better understand the technical means of the present utility model, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present utility model better It is obvious and easy to understand. The preferred embodiments are specifically cited below, together with the accompanying drawings, and detailed descriptions are as follows.

Description of drawings

FIG. 1 is an exploded schematic diagram of an embodiment of a general-purpose heat dissipation fixture structure of the present invention.

FIG. 2A is a combined schematic diagram of FIG. 1 .

FIG. 2B is an exploded schematic view of a general-purpose heat dissipation fixture structure combined with heat dissipation elements of the present invention.

Fig. 3 is a schematic diagram of the first embodiment of the structure of the universal heat dissipation fixture of the present invention.

Fig. 4 is a schematic diagram of a second embodiment of the structure of the universal heat dissipation fixture of the present invention.

FIG. 5 is an exploded schematic diagram of a first embodiment of the utility model in which the structure of the general-purpose heat dissipation fixing member for the motherboard is applied to fix the heat dissipation element.

FIG. 6A is a combined schematic diagram of FIG. 5 .

FIG. 6B is a schematic cross-sectional view along line A-A in FIG. 6A.

FIG. 7 is an exploded schematic diagram of a second embodiment of the utility model in which the structure of the general-purpose heat dissipation fixing member for the motherboard is applied to fix the heat dissipation element.

FIG. 8A is a combined schematic diagram of FIG. 7 .

FIG. 8B is a schematic cross-sectional view along line B-B in FIG. 8A .

1: Heat dissipation fixture structure 10: The first board

11: First Central Part 111, 211: Holes

12: First opening 121: Track

13: The first positioning piece 14, 24: The third opening

15, 25: Restricted part 20: Second plate body

21: Second central part 22: Second opening

23: Second positioning piece 30: Screw

31: groove 40: joint

50: Motherboard 51, 72: Screw holes

52, 71: Combined opening 53: Perforation

60: Heating element 70: Heat sink

80: fixed lock

Detailed ways

In order to further explain the technical means and effects adopted by the utility model to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the structure of the general-purpose heat dissipation fixture for the motherboard proposed according to the utility model is specifically described. Embodiments, structures, features and effects thereof are described in detail below.

FIG. 1 is an exploded schematic diagram of an embodiment of a general-purpose heat dissipation fixture structure of the present invention. FIG. 2A is a combined schematic diagram of FIG. 1 . FIG. 2B is an exploded schematic view of a general-purpose heat dissipation fixture structure combined with heat dissipation elements of the present invention. Fig. 3 is a schematic diagram of the first embodiment of the structure of the universal heat dissipation fixture of the present invention. Fig. 4 is a schematic diagram of a second embodiment of the structure of the universal heat dissipation fixture of the present invention. FIG. 5 is an exploded schematic diagram of a first embodiment of the utility model in which the structure of the general-purpose heat dissipation fixing member for the motherboard is applied to fix the heat dissipation element. FIG. 6A is a combined schematic diagram of FIG. 5 . FIG. 6B is a schematic cross-sectional view along line A-A in FIG. 6A. FIG. 7 is an exploded schematic diagram of a second embodiment of the utility model in which the structure of the general-purpose heat dissipation fixing member for the motherboard is applied to fix the heat dissipation element. FIG. 8A is a combined schematic diagram of FIG. 7 . FIG. 8B is a schematic cross-sectional view along line B-B in FIG. 8A .

As shown in FIG. 1 , a general-purpose heat dissipation fixture structure 1 according to an embodiment of the present invention includes: a first plate body 10 ; and a second plate body 20 .

The first plate body 10 is a strip-shaped plate body, and has a first central portion 11 at its center, and a first opening 12 is formed at both ends, and the first opening 12 can be an elongated Openings (or called long holes) to form a structure similar to slide rails. Therefore, when the user passes the screw 30 through the first opening 12 , the screw 30 can slide freely in the first opening 12 .

At least one first positioning piece 13 is provided close to the first central portion 11. When the first plate body 10 has only one first positioning piece 13, the first positioning piece 13 can be arranged on one of the first central portion 11. side (as shown in FIG. 2A ), and when the first plate body 10 has two first positioning members 13 , they can be respectively provided on both sides of the first central part 11 (as shown in FIG. 3 ).

The second plate body 20 is also a strip-shaped plate body, which has a second central part 21 at its center, and a second opening 22 is respectively formed at both ends of the second plate body 20, which can also be An elongated opening forms a structure similar to a slide rail. When the user passes the screw 30 through the second opening 22 , the screw 30 can also slide freely in the second opening 22 .

Similarly, at least one second positioning piece 23 is provided near the second central portion 21. When the second plate body 20 has only one second positioning piece 23, the second positioning piece 23 can be arranged at the second central portion 21 One side of the second plate body 20 (as shown in FIG. 2A ), and when the second plate body 20 has two second positioning members 23, they can be respectively provided on both sides of the second central part 21 (as shown in FIG. 3 ).

Wherein, the first positioning member 13 and the second positioning member 23 may be a positioning post or a positioning hole. For example, when the part used for corresponding combination is a combination opening 71, 52 (as shown in Figure 5 or Figure 7), the first positioning part 13 and the second positioning part 23 can be a positioning column (as shown in Figure 1 and Figure 7). 2A), and can respectively protrude from the first plate 10 and the second plate 20, for inserting in the corresponding combination openings 71, 52, and then fix the first plate 10 and the second plate 20 positions.

As shown in FIG. 2B , for example, if the heat dissipation fixture structure 1 is to be fixedly combined with a heat dissipation element 70, when the first positioning piece 13 and the second positioning piece 23 are a positioning hole, then the first positioning piece 13 and the second positioning piece 23 can be used to form a positioning hole. The second positioning piece 23 and the combination opening 71 on the heat sink 70 are aligned with each other to form a connected space, and then the fixing lock piece 80 passes through the first positioning piece 13, the second positioning piece 23 and the corresponding combination opening respectively. The holes 71 are used to fix the positions of the first board body 10 and the second board body 20 .

Wherein, a hole 111, 211 can be formed at the first central part 11 and the second central part 21, when the user penetrates the hole 111, 211 with a binding piece 40 (such as a rivet), the second A central part 11 and a second central part 21 are combined with each other. Therefore, when the first board body 10 and the second board body 20 are integrated with each other, they can be opened and closed by rotation based on the joint part 40 (as shown in FIG. 2A ). Since the angle and distance between the first plate body 10 and the second plate body 20 can be adjusted, the heat dissipation fixture structure 1 can be applied to fix heat dissipation elements of various sizes and specifications.

As shown in FIG. 3 , it is another preferred embodiment of the general-purpose heat dissipation fixture structure 1 of the present invention, wherein both the first plate body 10 and the second plate body 20 can further have at least one third opening 14, 24, And the third opening 14 is formed between the first opening 12 and the first central portion 11 , and the third opening 24 is formed between the second opening 22 and the second central portion 21 . Likewise, the third opening 14, 24 can also be an elongated opening and form a structure similar to a slide rail.

The first locating member 13 and the second locating member 23 can be a T-shaped member, and can slide through the third opening 14, 24, so as to match different sizes of heat sinks or joint holes on the motherboard. Moreover, the lengths of the third openings 14, 24 can be less than the lengths of the first opening 12 and the second opening 22 respectively, thereby increasing the distance and degree of freedom for the screw 30 to slide in the first opening 12 and the second opening 22, so as to dissipate heat. The fixing member structure 1 can be locked on heat sinks or motherboards of various sizes and specifications.

Also as shown in FIG. 4 , the first opening 12 and the third opening 14 on the first board 10 can communicate with each other, and the second opening 22 and the third opening 24 on the second board 20 can also communicate with each other. In a preferred embodiment of the present utility model, the interconnection between the first opening 12 and the third opening 14 and the interconnection between the second opening 22 and the third opening 24 can further have a restricting part 15, 25 to respectively restrict The sliding range of the first positioning member 13 and the second positioning member 23 .

Wherein, both the first positioning member 13 and the screw 30 can enter the third opening 14 and the first opening 12 respectively through the restricting part 15 (marked by a dotted line frame), and can restrict the screw 30 from sliding between the first opening 12 and the restricting part 15. and limit the first positioning piece 13 to slide between the third opening 14 and the limiting portion 15, and the second positioning piece 23 and the screw 30 can also enter the third opening 24 and the second opening 22 through the limiting portion 25, and can The limiting screw 30 slides between the second opening 22 and the limiting portion 25 and limits the second positioning member 23 to slide between the third opening 24 and the limiting portion 25 .

In addition, as shown in FIG. 4 , since there is a groove 31 on the screw 30 , and the slide rail formed by the first opening 12 has a corresponding track 121 , the screw 30 can slide on the track 121 through the groove 31 , and there is a similar structure in the second opening 22, so the screw 30 can slide freely in the first opening 12 and the second opening 22 respectively.

Therefore, as shown in FIG. 5 , the user can adjust the position of the first positioning member 13 and the second positioning member 23 to correspond to the heat sink 70 , and can adjust the position of the screw 30 to correspond to the motherboard 50 fixed.

The implementation of the heat dissipation fixture structure 1 applied on the motherboard 50 will be described in detail below.

As shown in FIG. 5 , a heating element 60 (such as a central processing unit) is disposed on the motherboard 50 , and a heat sink 70 can be disposed on the heating element 60 to assist the heating element 60 to dissipate heat. As shown in FIG. 5 , the heat dissipation fixture structure 1 can fix the heat dissipation element 70 on the front side of the motherboard 50 (the same side as the heating element 60 ).

Wherein, the heat dissipation element 70 can be provided with a plurality of combining openings 71, for the first positioning element 13 and the second positioning element 23 of the heat dissipation fixture structure 1 to be fastened and fixed with the combining openings 71 of the heat dissipation element 70, so as to The angle between the first plate body 10 and the second plate body 20 is firstly fixed, and the relative position between the heat sink 70 and the heat dissipation fixture structure 1 can be fixed at the same time. Then, because many screw holes 51 are arranged on the main board 50, the user can lock the screws 30 in the first opening 12 and the second opening 22 to the screw holes 51 on the main board 50 to achieve The effect of fixing the heat sink 70 on the heating element 60 (as shown in FIG. 6A and FIG. 6B ).

Since the screw 30 can slide freely in the first opening 12 and the second opening 22, the screw 30 can easily slide to the position of the screw hole 51, and is suitable for fixing heat sinks 70 and motherboards of various sizes and specifications. 50.

As shown in FIG. 7 , the heat dissipation fixture structure 1 can also fix the heat dissipation element 70 on the reverse side of the motherboard 50 (a side different from the heating element 60 ). Among them, the main board 50 is provided with a plurality of combination openings 52, and the first positioning member 13 and the second positioning member 23 can be fastened and fixed with the combination openings 52 to fix the first board body 10 and the second board body 20. The included angle can also fix the relative position between the motherboard 50 and the heat dissipation fixture structure 1 , so as to simplify the steps of installing the heat dissipation fixture structure 1 .

Many screw holes 72 are also arranged on the heat sink 70, and there are also through holes 53 corresponding to the positions of the screw holes 72 on the motherboard 50, so the screws 30 can slide to the through holes in the first opening 12 and the second opening 22. 53 position and through the perforation 53, and then locked on the screw hole 72 on the radiator 70, to achieve the effect of fixing the radiator 70 on the heating element 60 on the motherboard 50 (as shown in Figure 8A and Figure 8B ).

In this way, since the angle between the first plate body 10 and the second plate body 20 can be adjusted according to the positions of the combined openings 52, 71, screw holes 51, 72 or through holes 53, it can be used universally for heat sinks of different sizes. 70 or the main board 50, thereby reducing the material cost of preparing materials, and also reducing the time and labor costs spent in designing and manufacturing the heat dissipation fixture structure 1.

The above are only preferred embodiments of the present utility model, and do not limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not intended to limit the utility model. Any Those skilled in the art can use the technical content disclosed above to make some changes or modify them into equivalent embodiments without departing from the technical solution of the present utility model. Content, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the utility model still belong to the scope of the technical solution of the utility model.

Claims (10)

1. universal heat radiation anchor structure that is used for motherboard is characterized in that it comprises:

One motherboard, it has most in conjunction with perforate;

One first plate body, it is for strip and have one first central part, and the two ends of this first plate body respectively are formed with one first opening, are provided with one first keeper near this first central part place; And

One second plate body, it is for strip and have one second central part, and the two ends of this second plate body respectively are formed with one second opening, are provided with one second keeper near this second central part place;

Wherein, this second central part and this first central part are combined as a whole by conjunction rotation, and combine perforate with those respectively by this first keeper and this second keeper and be fastened mutually.

2. universal heat radiation anchor structure according to claim 1 is characterized in that wherein said first keeper is a reference column or a pilot hole.

3. universal heat radiation anchor structure according to claim 1, it is characterized in that wherein said first plate body further has at least one the 3rd opening, the 3rd opening is formed between this first opening and this first central part, and this first keeper is a T type spare, and this first keeper slidably is arranged in the 3rd opening.

4. universal heat radiation anchor structure according to claim 3 is characterized in that wherein said first opening and the 3rd opening are interconnected.

5. universal heat radiation anchor structure according to claim 4 is characterized in that wherein said first opening and the 3rd opening place of being interconnected have a restrictions that limits this first keeper sliding scale.

6. universal heat radiation anchor structure according to claim 1 is characterized in that wherein said second keeper is a reference column or a pilot hole.

7. universal heat radiation anchor structure according to claim 1, it is characterized in that wherein said second plate body further has at least one the 3rd opening, the 3rd opening is formed between this second opening and this second central part, and this second keeper is a T type spare, and this second keeper slidably is arranged in the 3rd opening.

8. universal heat radiation anchor structure according to claim 7 is characterized in that wherein said second opening and the 3rd opening are interconnected.

9. universal heat radiation anchor structure according to claim 8 is characterized in that wherein said second opening and the 3rd opening place of being interconnected further have a restrictions that limits this second keeper sliding scale.

10. universal heat radiation anchor structure according to claim 1 is characterized in that it further has at least one screw, and each this screw slidably is arranged in those first openings and those second openings.

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