CN201766794U - Cooling device and electronic computing system using it - Google Patents

Abstract

The utility model provides a heat dissipation device, which comprises a first plate body, a second plate body and a third plate body. The first plate body provides and absorbs heat energy, the second plate body is connected with the first plate body through a first connecting plate, a heat dissipation space is arranged between the second plate body and the first plate body, and the third plate body is connected with the first plate body through a second connecting plate. The heat dissipation device can prevent the heat source from accumulating at the bottom, and can quickly dissipate the heat source to the air through natural convection in the heat dissipation space. In another embodiment, the present invention further provides an electronic computing system, wherein the heat dissipation device is connected to the computing unit capable of generating heat in the electronic computing device to absorb the heat generated by the computing unit, thereby maintaining the normal operation of the computing system.

Description

Cooling device and electronic computing system using it

technical field

The utility model relates to a cooling device and an electronic computing system using it, in particular to a cooling device that can be arranged in a limited space to reduce the temperature of a heat source and an electronic computing system using it.

Background technique

With the advancement of technology and business needs, small portable electronic computing devices, such as 10-inch notebook computers or thin clients, have gradually matured and become popular. Especially for users who need to go on business trips, display or teach frequently, a small and portable electronic computing device is an indispensable helper. In small portable electronic computing devices, the processing speed of electronic components is accompanied by the generation of high heat during high-speed operation. In order to prevent the heat generated by electronic components from being discharged in time, it will affect the stability of electronic components. In severe cases, electronic components will burn out, and heat dissipation design plays a very important role.

However, in a small portable electronic computing device, such as a notebook computer or a thin client, it is impossible to use any cooling device with a fan to dissipate heat due to space constraints. Therefore, how to take advantage of the fanless structure and use natural convection to remove the heat generated by the central processing unit (CPU) or the north and south bridge chips in the system to reduce the temperature of the system is an important issue. subject.

However, for small portable electronic computing devices, due to the limited space, the size of the heat sink must be made smaller to meet the currently used specifications. In order to overcome the above-mentioned problems, in the prior art, for example: a heat sink that can be combined according to the size of the space disclosed in the new patent M267823 of Taiwan Province of China is composed of a plurality of heat dissipation fins, and each heat dissipation fin At least one joint piece is formed on two opposite edges, and an extension part is formed on at least one end of the joint piece. When adjacent heat dissipation fins are arranged side by side in sequence, the joint pieces also abut against each other in order to form an appropriate distance, and the heat dissipation fins The extending part of the bonding piece of the sheet will be bent inwardly, and placed on the opposite back side of the adjacent heat dissipation fins, so that the adjacent heat dissipation fins can be stacked sequentially.

However, this kind of technology uses the stacking method to increase the complexity of the structure and increase the production cost. Therefore, how to design a simple structure with good heat dissipation effect and meet the constraints of limited space is the current situation. problems to be solved in this stage.

Contents of the invention

The purpose of this utility model is to provide a heat dissipation device, which forms a heat dissipation space between two plates, utilizes one of the plates to absorb the heat generated by the heat source, and then utilizes the dual heat dissipation mechanism of heat conduction and natural heat convection to effectively absorb the heat source The generated heat further reduces the temperature of the heat source, and a flat plate is connected to the heat dissipation space, which enhances the heat conduction capability and enables the heat to be discharged more effectively. The heat dissipation device has a simple structure and is suitable for being arranged in spaces of various sizes, thus greatly improving usability and convenience.

The purpose of this utility model is also to provide an electronic computing system, which is provided with a cooling device above the chip that can absorb the heat generated by the chip. The cooling device forms a cooling space between two flat plates in the limited space of the electronic computing system. A flat plate is further connected to the heat dissipation space, which enhances the ability of heat conduction, and quickly transfers heat to the top layer. Use one of the plates to connect to the chip to absorb the heat generated by the chip, and then use the dual heat dissipation mechanism of heat conduction and natural heat convection to effectively absorb the heat generated by the chip, avoid heat accumulation, and then reduce the temperature of the chip to maintain electronic computing The system is functioning normally.

In one embodiment, the utility model provides a heat dissipation device, which includes a first plate body, which provides heat absorption; a second plate body, which is connected to the first plate body through a connecting plate, and the The second plate is parallel to the first plate, so there is a heat dissipation space between the second plate and the first plate; and a third plate is arranged in the heat dissipation space, and the third plate passes through A second connection plate is connected with the first plate body.

During implementation, the second board and the third board further have a plurality of cooling holes.

During implementation, the first connecting plate further has at least one recess.

In practice, the heat dissipation device described in the present utility model further includes at least one fixing part, and each fixing part further has an elastic element and a locking element, wherein the elastic element is sleeved on the locking element, and the third The plate body further includes a slot corresponding to the at least one fixing portion to provide passage of the at least one fixing portion, and the second plate body further includes at least one through hole corresponding to the at least one fixing portion respectively. The fixing parts are corresponding to provide passage of the at least one fixing part.

During implementation, the heat dissipation device further includes a frame, the frame has a recessed space and a plurality of lock holes, the frame has at least one opening and at least one absorber corresponding to the at least one heat absorber respectively. Heat material, each of the heat-absorbing materials fills the corresponding opening so that the first plate is connected to a heat source through the at least one heat-absorbing material, and the plurality of lock holes correspond to the The opening of the first board, the locking element passes through the opening of the first board and the locking hole of the frame, and is fixed on a base material.

In another embodiment, the utility model further provides an electronic computing system, which includes an electronic computing device, which has a circuit substrate and a plurality of computing processing units; and a heat dissipation device, which has a first board and The at least one calculation processing unit is connected; a second board is connected with the first board through a connection board, and the second board is parallel to the first board, so the second board is connected to the first board. There is a heat dissipation space between the plates; and a third plate is arranged in the heat dissipation space, and the third plate is connected with the first plate through a second connecting plate.

During implementation, the second board and the third board further have a plurality of cooling holes.

During implementation, the second connecting plate further has at least one recess.

During implementation, the electronic computing system described in the utility model further includes at least one fixing part, each fixing part further has an elastic element and a locking element, the elastic element is sheathed on the locking element, and the locking The component passes through the first board to fix the heat sink on the circuit substrate, and the third board further includes a slot corresponding to the at least one fixing portion to provide the at least one fixing The second board body further includes at least one through hole corresponding to the at least one fixing part, so as to provide the at least one fixing part to pass through.

During implementation, the electronic computing device is a compact computer.

During implementation, it is characterized in that the arithmetic processing unit may be a central processing unit, a south bridge chip, a north bridge chip or a combination of the aforementioned elements.

During implementation, the heat dissipation device further includes a frame, the frame has a recessed space and a plurality of lock holes, the frame has at least one opening and at least one absorber corresponding to the at least one heat absorber respectively. heat-absorbing material, each of the heat-absorbing materials fills the corresponding opening so that the first board is connected to the at least one computing and processing unit through the at least one heat-absorbing material, and the plurality of locks The hole corresponds to the opening of the first board, and the locking element passes through the opening of the first board and the locking hole of the frame to fix the heat sink on the circuit board.

Compared with the prior art, the heat dissipation device of the utility model and the electronic computing system using it can be arranged in a limited space to reduce the temperature of the heat source.

Description of drawings

Fig. 1A and Fig. 1B are three-dimensional and exploded schematic diagrams of the embodiment of the heat dissipation device of the present invention;

Fig. 2 is the heat radiation schematic diagram of the present utility model;

Figure 3A and Figure 3B are schematic diagrams of the relationship between the electronic computing system and the cooling device of the present invention;

FIG. 4 is a schematic diagram of the connection between the electronic computing device and the circuit substrate of the present invention.

Description of reference signs: 1-electronic computing system; 2-radiating device; 21-first board; 211-opening; 22-second board; 221, 222-radiation holes; 223-through holes; 23-radiation Space; 24-third board; 241-grooving; 25-fixing part; 251-elastic element; 252-locking element; 253-riveting end; 26-first connecting plate; 261-recess; Connecting plate; 28-heat source; 29-frame; 290-opening; 291-recess space; 292-lock hole; 293-absorbing material; 30-substrate; 3-electronic computing device; keyhole; 32, 33-operation processing unit.

Detailed ways

In order to enable your examiners to have a better understanding of the features, purposes and functions of this utility model, the following is a description of the relevant detailed structure and design concept of the device of this utility model, so that the examiner can understand The features of the utility model are described in detail as follows:

Please refer to FIG. 1A , which is a three-dimensional schematic diagram of an embodiment of a heat dissipation device of the present invention. In this embodiment, the heat sink 2 has a first board 21 , a second board 22 and a third board 24 . The first board 21 is connected to a heat source 28 . The heat source 28 is an element that generates heat, such as a central processing unit (CPU) or a control chip (such as a south bridge chip or a north bridge chip) in a computer, but is not limited thereto. The second plate 22 is connected to the first plate 21 through a first connecting plate 26 , so that a heat dissipation space 23 is formed between the second plate 22 and the first plate 21 . The included angle between the second plate body 22 and the first plate body 21 is not limited, and can be determined according to needs. The angle between the second plate body 22 and the connecting plate 26 can be greater than or equal to 90 degrees. In this embodiment, the included angle between the second plate body 22 and the connecting plate 26 is greater than 90 degrees to increase the size of the heat dissipation space 23 so that the heat dissipation device 2 roughly forms a G-shaped structure. In another embodiment, the first plate body 21 and the second plate body 22 may also be parallel to each other, and the change of the angle may be determined according to needs, and there is no certain limitation.

The first connecting plate 26 has a concave portion 261 to increase the contact area between the connecting plate 26 and the air. The third plate 24 is disposed in the heat dissipation space 23 , and the third plate 24 is connected to the first plate 21 through a second connecting plate 27 . The heat sink 2 is made of a material with good heat conduction efficiency. Generally speaking, the material with good heat conduction efficiency can be metal, such as copper, aluminum or alloys thereof, but not limited thereto. Those skilled in the art can select appropriate materials for processing according to heat dissipation requirements to form the heat dissipation device of the present invention. In addition, the first plate body 21 , the second plate body 22 , the first connecting plate 26 , the second connecting plate 27 and the third plate body 24 can be integrally formed.

In order to enhance the effect of heat dissipation, a plurality of heat dissipation holes 221 and 222 are further provided on the second plate body 22 and the third plate body 24 . The cooling holes can be elliptical, circular, polygonal or other openings with a combination of curves and straight lines. In this embodiment, the heat dissipation holes 221 and 222 have two shapes, one of which is to set a plurality of rectangular heat dissipation holes 222 on the second plate body 22 and the third plate body 24; A plurality of circular cooling holes 221 can be further arranged on the second board body 22 and the third board body 24 . The combination of the circular heat dissipation holes 221 and the rectangular heat dissipation holes 222 increases the heat dissipation effect of the second plate body 22 and the third plate body 24 . In addition, please refer to FIG. 1B , which is a three-dimensional exploded schematic diagram of an embodiment of the heat dissipation device of the present invention. The heat sink 2 further has at least one fixing portion 25 , and the fixing portion 25 includes an elastic element 251 and a locking element 252 . The elastic element 251 is sleeved on the locking element 252 . In order to install the fixing part 25 conveniently, the second board 22 further defines a plurality of through holes 223 and the third board 24 defines a slot 241 for the fixing part 25 to pass through. The heat sink 2 has a frame 29, the frame 29 is an insulating frame, such as a polyester film (mylar) material, in this embodiment the frame 29 is L-shaped design and the first board 21 and the first The connection plates 26 are in contact. In addition, the frame 29 can also be designed as a plane to be in contact with the first board 21 and parallel to the heat source 28 . In this embodiment, the through hole 223 is opened at the center of the second board 22 and at two opposite sides and diagonal edges of the second board 22 . The frame 29 has a concave space 291 and a plurality of locking holes 292 . The frame 29 can be disposed between the heat source 28 and the first board 21 such that the first board 21 is accommodated in the concave space 291 . The position corresponding to the heat source 28 on the frame 29 has at least one opening 290 and corresponding at least one heat absorbing material 293, and the at least one heat absorbing material 293 fills the corresponding at least one opening 290 so that the first plate 21 is connected to the heat source 28 through the heat absorbing material 293 . The number of the openings 290 and the heat-absorbing material 293 is determined according to needs, and is not limited by the drawings of the present invention. The locking holes 292 correspond to the openings 211 of the first board 21 . The locking element 252 passes through the opening 211 of the first board 21 and the locking hole 292 of the frame 29 to fix the heat sink 2 on the base material 30 .

Please refer to FIG. 2 , which is a schematic diagram of the heat dissipation of the heat dissipation device of the present invention. In this embodiment, since the heat sink 2 is connected to the heat source 28 through the first plate body 21, when the heat source 28 emits high heat, the heat sink 2 can absorb the heat generated by the heat source 28 through the first plate body 21. The generated heat, because metal has a good heat conduction effect, so the first plate body 21 will pass the heat through the first connecting plate 26, and the heat will be conducted to the second plate body 22, and then the second plate body 22 will use the heat convection method, Dissipate heat to air. In addition, since there is a heat dissipation space 23 between the first plate body 21 and the second plate body 22, after the first plate body 21 absorbs the heat generated by the heat source 26, it can pass through the airflow in the heat dissipation space 23, The heat absorbed by the first plate body 21 is transferred to the air flow in the cooling space 23 by means of natural heat convection. On the other hand, the heat absorbed by the first plate body 21 is also transmitted to the third plate body 24 through conduction simultaneously. With the assistance of the second plate body 22 and the third plate body 24 , the effect of heat conduction can be accelerated to increase the heat dissipation efficiency. On the other hand, due to natural convection in the heat dissipation space 23 , the hot air flows through the heat dissipation holes 221 of the third plate 24 , and then is discharged into the air through the heat dissipation holes 221 and 222 of the second plate 22 . Utilizing the simplistic structure of the heat dissipation device 2 of the present invention, the heat of the heat source 28 can be reduced by means of heat convection and heat conduction at the same time.

Please refer to FIG. 3A and FIG. 3B , which are diagrams illustrating the relationship between the electronic computing system and the cooling device of the present invention. In this embodiment, the electronic computing system 1 has an electronic computing device 3 and a cooling device 2 . The electronic computing system 1 can be a notebook computer or a desktop computer, in this embodiment it is a thin client, but it is not limited thereto. The electronic computing device 3 includes a circuit substrate 31 and at least one computing processing unit 32 . The at least one processing unit 32 and 33 may be a central processing unit (CPU), a control chip (such as a south bridge chip or a north bridge chip) in a computer, or a combination thereof, but is not limited thereto. In this embodiment, the arithmetic processing units 32 and 33 are a central processing unit and a north bridge chip respectively. The heat sink 2 includes a first board 21 , a second board 22 and a third board 24 . The first board 21 is connected to the plurality of computing processing units 32 . In this embodiment, the first board 21 is connected to two computing processing units 32 and 33 at the same time. The structure of the heat sink 2 is as described above, and will not be repeated here. Since the design of the first plate body 21 of the present invention can be connected with multiple computing processing units 32 at the same time, it can simultaneously dissipate heat from multiple heat sources in a limited space, which can not only improve the space utilization rate, but also reduce the cost.

Please refer to FIG. 4 , which is a schematic diagram of the connection between the electronic computing device and the circuit substrate of the present invention. The heat sink 2 is locked on the circuit board 31 by the fixing portion 25 . In this embodiment, the circuit substrate 31 is provided with a plurality of locking holes 310 respectively corresponding to the fixing parts 25 . Since the front end of the locking element 252 has a riveting end 253 , it can be inserted into the corresponding locking holes on the circuit substrate 31 310 , so that the entire heat dissipation device 2 can be locked on the circuit substrate 31 . Since the heat sink 2 is connected to the computing processing unit 32 through the first board body 21, when the computing processing unit 32 emits high heat, the heat sink 2 can absorb the heat produced by the computing processing unit 32 through the first board body 21. The heat generated by the computing processing unit 32 is transferred out by means of conduction and natural convection. As for the principle of conduction and convection, as mentioned above, it will not be repeated here.

But above-mentioned, only embodiment of the present utility model, should not limit the scope of the present utility model with it. That is, all equal changes and modifications made according to the claims of the utility model will still not lose the gist of the utility model, nor depart from the spirit and scope of the utility model, so all should be regarded as further implementation status of the utility model .

Claims (10)

1. A cooling device, characterized in that it comprises: a first plate body, which provides heat absorption; a second board, which is connected to the first board through a first connecting plate, and there is a heat dissipation space between the first board and the second board; and A third plate body is arranged in the heat dissipation space, and the third plate body is connected with the first plate body through a second connecting plate. 2. The heat dissipation device according to claim 1, wherein the second board and the third board have a plurality of heat dissipation holes. 3. The heat dissipation device according to claim 1, further comprising at least one fixing portion, each fixing portion further having an elastic element and a locking element, wherein the elastic element is sleeved on the locking element On the other hand, the third board further includes a slot corresponding to the at least one fixing part to provide passage of the at least one fixing part, the second board further includes at least one through hole, and the at least one through hole Corresponding to the at least one fixing part respectively, so as to provide passage of the at least one fixing part. 4. The heat dissipation device according to claim 1, wherein the heat dissipation device further comprises a frame, the frame has a recessed space and a plurality of lock holes, and the frame has at least one opening corresponding to the At least one heat absorbing material corresponding to the at least one heat absorbing material, each of the heat absorbing materials fills the corresponding opening so that the first plate and a heat source pass through the at least one heat absorbing material The plurality of locking holes correspond to the openings of the first board, and the locking element passes through the openings of the first board and the locking holes of the frame, and is fixed on a base on the material. 5. An electronic computing system, characterized in that it comprises: An electronic computing device having a circuit substrate and at least one computing processing unit; and A heat dissipation device further has a first plate body and a second plate body, wherein: The first board is connected to the at least one processing unit; The second plate is connected to the first plate through a first connecting plate, and there is a heat dissipation space between the first plate and the second plate; and A third plate body is arranged in the heat dissipation space, and the third plate body is connected with the first plate body through a second connecting plate. 6. The electronic computing system as claimed in claim 5, wherein the second board and the third board have a plurality of cooling holes. the 7. The electronic computing system according to claim 5, further comprising at least one fixing part, each fixing part further has an elastic element and a locking element, and the elastic element is sleeved on the locking element On, the locking element passes through the first board to fix the heat sink on the circuit board, and the third board further includes a slot corresponding to the at least one fixing part respectively, so as to The at least one fixing part is provided to pass through, and the second plate body further includes at least one through hole corresponding to the at least one fixing part, so as to provide the at least one fixing part to pass through. 8. The electronic computing system according to claim 5, wherein the heat dissipation device further comprises a frame, the frame has a concave space and a plurality of lock holes, and the frame has at least one opening and The at least one heat-absorbing material corresponding to the at least one heat-absorbing material, each of the heat-absorbing materials fills the corresponding opening so that the first board and the at least one computing processing unit pass through the at least one heat-absorbing material. The at least one heat-absorbing material is connected, the plurality of locking holes correspond to the openings of the first board, the locking element passes through the openings of the first board and the locking holes of the frame, And the heat dissipation device is fixed on the circuit substrate. 9. The electronic computing system according to claim 5, wherein the electronic computing device is a thin client. 10. The electronic computing system according to claim 5, wherein the computing processing unit can be a central processing unit, a south bridge chip, a north bridge chip or a combination of the aforementioned components. the

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