CN201513856U

CN201513856U - High-power LED lamp based on heat-conducting nanoparticle

Info

Publication number: CN201513856U
Application number: CN200920042415XU
Authority: CN
Inventors: 朱纪军; 洪思忠; 樊世才
Original assignee: Jiangsu Mingjiahui Electrical Equipment Co Ltd
Current assignee: Jiangsu Mingjiahui Electrical Equipment Co Ltd
Priority date: 2009-06-19
Filing date: 2009-06-19
Publication date: 2010-06-23
Anticipated expiration: 2019-06-19

Abstract

The utility model relates to a high-power LED lamp based on heat-conducting nanoparticles, which comprises LED particles (1), a lamp shade (2) and transparent heat-conducting gelatin (8). The LED particles (1) are fixedly arranged in the lamp shade (2) through the transparent heat-conducting gelatin (8). The high-power LED lamp is characterized in that the transparent heat-conducting gelatin (8) is mixed with heat-conducting nanoparticles with the content being 5 to 15 percent, and the heat-conducting nanoparticles are nano aluminum nitride particles, aluminum oxide particles, nano silicon carbide particles, nano copper particles or nano silver particles or a combination of a plurality of nano aluminum nitride particles, aluminum oxide particles, nano silicon carbide particles, nano copper particles or nano silver particles. The utility model can improve the thermal conductivity of plastics from original 0.3 to 5, more than 16 times. Simultaneously, due to the transparent gelatin package, the utility model can facilitate the improvement of the waterproofing capacity of the LED lamp.

Description

A kind of high-power LED lamp based on heat conduction nano particle

Technical field

The utility model relates to a kind of LED light fixture, especially a kind of high-power LED lamp, especially a kind of high-power LED lamp that combines heat conduction nano particle, transparent heat-conducting glue and LED light fixture manufacturing technology, specifically a kind of high-power LED lamp based on heat conduction nano particle.

Background technology

Directly the illuminating product that uses blue chip to excite YAG fluorescent material to send white light is referred to as semiconductor lighting product.The White LED illuminating product is compared the 80%-90% that can economize on electricity with traditional incandescent lamp; And the life-span can reach 8-10 ten thousand hours, was more than 10 times of incandescent lamp, and significant advantage such as have energy-conserving and environment-protective, luminous volume is little, reliability is high and the life-span is long is the most competitive green light source product of 21st century.Develop rapidly along with semiconductor technology, the trend of various traditional lighting light source products has appearred tentatively substituting in high-power LED illumination technology at present, countries and regions such as America and Japan Korea Spro and Europe have all been listed it in the state key development plan, research and develop targetedly.Street lighting is the second largest illumination market except that domestic lighting market, but the consumption of electric energy is maximum, so how the various advantages with great power LED apply to this field, thereby reduce use and maintenance cost, life-saving significantly, energy savings becomes very important problem.

Increasingly mature along with the LED technology, single led input power is more and more higher, can reach 5W even higher at present.The electric energy of LED input has 80%～95% to be transformed into heat, have only about 5%～20% to be converted into luminous energy, and the area of led chip is very little, and therefore, chip cooling is the key issue that LED must solve.Good cooling system can obtain lower operating temperature under equal input power, prolong the service life of LED; Or in same temperature limited region, increase input power or chip density, thereby increase the brightness of LED lamp.

Junction temperature is to weigh an important technology index of LED package cooling performance: junction temperature raises, and can directly reduce the photon of chip outgoing, and luminous efficiency is reduced; The rising of junction temperature also can make the emission spectrum generation red shift of chip, and the colour temperature quality descends, and is especially even more serious to excite the white light LED part of yellow fluorescent powder based on blue-ray LED, and wherein the conversion efficiency of fluorescent material also can and reduce along with the temperature rising.The various fuel factors that produce owing to the temperature rising can badly influence the service life and the reliability of LED device simultaneously, and when temperature surpassed certain value, the component failure rate was index law and raises.

Semiconductor LED lighting engineering development is very fast since 2000, and the white light LEDs luminous efficiency has reached about 40-60lm/W at present, has had in some special lighting fields very widely to use.But aspect single high power, high brightness, also significantly do not break through, needing very high street lamp field at luminous flux still is to adopt the LED with 1w or 3w to realize the lifting of luminous flux by the mode of assembled arrangement substantially, but thereupon will bring very many problems aspect heat radiation.

LED package cooling design focus on chip layout, material is selected (bonding material, baseplate material) and technology, heat sink design etc.Aspect the high-capacity LED heat dissipation problem, have a lot of reports at present both at home and abroad.M.Arik etc. have compared and have adopted the influence to the LED heat dispersion of different chip materials and bonding techniques, set up and analyzed the thermal model of fluorescent powder grain in the white light LEDs in 2003, and obtained about some the key heat problems in the led chip level encapsulation process by finite element analysis and experiment in 2004.Aspect heat dissipating method, the Jen-Hau Cheng in Taiwan adopts Si base thermo-electric device, has the advantage that volume is little, response speed is fast; Lan Kim has analyzed the radiating effect of heat pipe to led array.

Adopt at present many heat dissipation technologys to have the means such as area of dissipation of air-cooled, water-cooled, increase shell to come distribute heat.These traditional heat dissipation technology pluses and minuses are obvious equally: wind-cooling heat dissipating is that radiating effect is best at present, but maximum shortcoming is a fan need consume energy and also its life-span often not long, life-span is at most about 5000 hours in theory, but the various dust quantity on the actual cities road are a lot, thereby the rotating vane that is very easy to block fan at the use dust makes it not reach the theoretical life-span, the brightness of light source is with very fast decay and final the damage, so the factor of comprehensive each side sees not to be optimal mode if fan damages; The water-cooling effect secondly, if but the water temperature that is used to dispel the heat behind the light source long-play will significantly rise, radiating effect will sharply descend, moreover also will consider how to guarantee that heat eliminating medium-water can not leak the problem that other parts is produced shadow, equally neither very desirable radiating mode; The effect that the mode of increase shell area of dissipation is dispelled the heat is the poorest, but comprehensively sees still reasonable mode, and shortcoming is that the general power of heat radiation is little, and metal material uses more, causes the weight of whole finished product very heavy, and outward appearance is relatively heavier.This also is that the power of LED street lamp of the practicability on the market is all little, and power seldom surpasses the reason of 25w.The utility model proposes the comprehensive high-power LED lamp packaging technology of a kind of heat conduction nano particle, transparent heat-conducting glue and LED light fixture manufacturing technology, be intended to solve the heat dissipation problem of great power LED.

Summary of the invention

The purpose of this utility model is relatively poor at present high-powered LED lamp heat dispersion, needs to be equipped with the problem of special heat abstractor in the use, designs a kind of high-power LED lamp of carrying based on heat conduction nano particle.

The technical solution of the utility model is:

A kind of high-power LED lamp based on heat conduction nano particle, it is characterized in that it comprises LED particle 1, lampshade 2,

nano particle

3,4, cloche 5 and transparent heat-conducting glue 8, transparent heat-conducting glue 8 is arranged in lampshade 2, and be positioned in the lampshade 2 by cloche 5, LED particle 1 is fixed in the transparent heat-conducting glue 8, is provided with the

nano particle

3,4 of heat transmission in the transparent heat-conducting glue 8.Be mixed with content in the described transparent heat-conducting glue 8 and be the heat conduction nano particle about 5%-15%, described heat conduction nano particle is nano aluminum nitride, aluminium oxide, nanometer silicon carbide, nanometer copper or nano silver particles etc.

The beneficial effects of the utility model are:

The nano aluminum nitride powder can increase substantially the thermal conductivity of plastics.Product adds in the plastics with the ratio of 5-10% by experiment, and the thermal conductivity that can make plastics brings up to 5 from original 0.3.Thermal conductivity has improved more than 16 times.This way of transparent adhesive tape packaging also helps the waterproof ability that improves the LED light fixture simultaneously.

Description of drawings

The structural representation of Fig. 1 LED lamp of the present utility model.

Among the figure: 1, LED particle 2, lampshade 3, nano particle 4, nano particle 5,

cloche

6,7 light; 8 transparent heat-conducting glues.

The specific embodiment

Below in conjunction with drawings and Examples the utility model is further described.

As shown in Figure 1.

A kind of high-power LED lamp based on heat conduction nano particle, comprise LED particle 1, lampshade 2 and transparent heat-conducting glue 8, LED particle 1 is fixed in the lampshade 2 by transparent heat-conducting glue 8, be mixed with content in the described transparent heat-conducting glue 8 and be the heat conduction nano particle about 5-10%, described heat conduction nano particle is one or more the combination in nano aluminum nitride, aluminium oxide, nanometer silicon carbide, nanometer copper or the nano silver particles.The utility model is by comprehensively becoming to make with LED light fixture manufacturing technology with heat conduction nano particle, transparent heat-conducting glue, and its manufacture process is as follows:

Nano particle is mixed with transparent adhesive tape, and its proportionate relationship can be consulted relevant handbook according to the LED particle and be adjusted that (be example with the nano aluminum nitride powder wherein, it can increase substantially the thermal conductivity of plastics.The ratio that experimental results show that the adding proportion 5-10% of its nano particle is added in the plastics, and the adding proportion of all the other nano materials also is roughly between the 5-15%).LED particle 1 is installed on the PCB pedestal 2, and LED is exposed mounting base, the transparent adhesive tape that mixes nano heat-

conductive particle

3,4 is coated with 8 around the LED1 particle.By this packaged type, can improve the radiating effect of single LEDs.Described heat conduction nano particle is one or more the combination in nano aluminum nitride, aluminium oxide, nanometer silicon carbide, nanometer copper or the nano silver particles.

Essence of the present utility model is the comprehensive high-power LED lamp packaging technology of a kind of heat conduction nano particle, transparent heat-conducting glue and LED light fixture manufacturing technology, is intended to solve the heat dissipation problem of great power LED.The technical scheme of its realization is as follows: in LED particle alignment processes, utilize heat conducting nano mixing heat conductive transparent glue, LED is encapsulated with the substrate that is connected, reach the purpose of the surface area that improves the LED heat radiation.This packaged type provides a kind of simple package method for the LED light fixture with waterproof requirement.

The silica gel that super-high heat-conductive nanometer AlN is compound has good thermal conductivity, excellent electric insulating, the electrical insulating property serviceability temperature of broad (operating temperature-60 ℃--200 ℃), lower denseness and good construction performance.Be widely used in the heat transmission medium of electronic device, increase work efficiency.Heat transmission medium as CPU and radiator calking, large power triode, thyristor, diode, the finedraw place that contacts with base material.Nano heat-conductive cream is the space of filling between IC or triode and the fin, increases the contact area between them, reaches better radiating effect.Adopt the nano heat-conductive particle according to the utility model, improve the circumgranular heat conduction of LED, improve the radiating efficiency of LED particle.

Claims

1. high-power LED lamp based on heat conduction nano particle, it is characterized in that it comprises LED particle (1), lampshade (2), nano particle (3,4), cloche (5) and transparent heat-conducting glue (8), transparent heat-conducting glue (8) is arranged in lampshade (2), and be positioned in the lampshade (2) by cloche (5), LED particle (1) is fixed in the transparent heat-conducting glue (8), is provided with the nano particle (3,4) of heat transmission in the transparent heat-conducting glue (8).