CN201345415Y - Chip type antenna - Google Patents
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- CN201345415Y CN201345415Y CNU2008201382499U CN200820138249U CN201345415Y CN 201345415 Y CN201345415 Y CN 201345415Y CN U2008201382499 U CNU2008201382499 U CN U2008201382499U CN 200820138249 U CN200820138249 U CN 200820138249U CN 201345415 Y CN201345415 Y CN 201345415Y
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Abstract
Description
技术领域 technical field
本实用新型涉及一种芯片型天线,尤指一种具有金属片的芯片型天线。The utility model relates to a chip antenna, in particular to a chip antenna with a metal sheet.
背景技术 Background technique
随着无线通讯产业的快速发展,电子产品(例如移动电话、个人数字助理、笔记型计算机、感测设备等)目前大都具有利用无线通讯来传输信号的功能。而无线通讯主要发射与接收信号的设备为装设于电子产品上的天线(antenna)。因此,随着无线通讯产业的发展,天线的需求量也越来越大。With the rapid development of the wireless communication industry, most electronic products (such as mobile phones, personal digital assistants, notebook computers, sensing devices, etc.) currently have the function of transmitting signals through wireless communication. The main equipment for transmitting and receiving signals in wireless communication is an antenna (antenna) installed on an electronic product. Therefore, with the development of the wireless communication industry, the demand for antennas is also increasing.
为了降低天线本身的制作成本以及符合电子产品的轻、薄、短、小等设计要求,因此目前可无线通讯的电子产品大多数采用一体积较小的芯片型天线(chip antenna),来取代体积较大的传统天线(如杆状天线)。In order to reduce the production cost of the antenna itself and meet the design requirements of light, thin, short, and small electronic products, most of the current electronic products that can communicate wirelessly use a smaller chip antenna (chip antenna) to replace the bulky antenna. Larger conventional antennas (such as rod antennas).
一般芯片型天线,例如美国专利号US7,136,021所提出的Ceramic chipantenna或是美国专利号US6,222,489提出的antenna device,这些芯片型天线的外型大致呈现为一矩型板体,且由陶瓷材料制作而成。而这些芯片型天线设置有一曲折环绕的微带线(micro strips)作为辐射体,该芯片型天线即通过该微带线来发射或是接收无线信号。General chip antennas, such as the Ceramic chipantenna proposed by US Patent No. US7,136,021 or the antenna device proposed by US Patent No. US6,222,489, these chip antennas generally appear as a rectangular plate and are made of ceramic materials. made. These chip antennas are provided with a meandering microstrip line (microstrips) as a radiator, and the chip antenna transmits or receives wireless signals through the microstrip line.
虽然芯片型天线具有体积小的优点,但是也因为体积较小,所以能环绕的微带线的长度有限,因此芯片型天线的辐射面积明显比传统天线来得小。也因此,芯片型天线的频宽并不大。而为了改善此缺失,部分学者、厂商等提出一些方法,例如改变微带线的环绕方式,使得芯片型天线能环绕更多圈的微带线。或是如台湾专利公告号518801所提出的芯片天线及其制作方法,其让部分微带线伸出于天线外,借此增加微带线的总长度,然后增加天线的频宽。Although the chip antenna has the advantage of small size, but also because of the small size, the length of the microstrip line that can be surrounded is limited, so the radiation area of the chip antenna is obviously smaller than that of the traditional antenna. Therefore, the bandwidth of the chip antenna is not large. In order to improve this deficiency, some scholars and manufacturers have proposed some methods, such as changing the way around the microstrip line, so that the chip antenna can wrap more circles of the microstrip line. Or the chip antenna and its manufacturing method proposed in Taiwan Patent Publication No. 518801, which allows part of the microstrip line to protrude from the antenna, thereby increasing the total length of the microstrip line, thereby increasing the bandwidth of the antenna.
然而上述的改善方法对于微带线的长度或辐射面积的增加有限,所以对于天线的频宽改善也有限。However, the above-mentioned improvement method is limited to the increase of the length of the microstrip line or the radiation area, so the improvement of the bandwidth of the antenna is also limited.
实用新型内容 Utility model content
本实用新型的目的是提供一种芯片型天线,其通过一金属片来增加发射与接收无线信号的面积,使得该芯片型天线的频宽能因此增加。The purpose of the utility model is to provide a chip antenna, which increases the area for transmitting and receiving wireless signals through a metal sheet, so that the bandwidth of the chip antenna can be increased accordingly.
为达上述目的,本实用新型提出一种芯片型天线,包括:一本体,具有一第一表面及一第二表面;In order to achieve the above purpose, the utility model proposes a chip antenna, comprising: a body with a first surface and a second surface;
一微带线结构,设置于该本体的第一表面及第二表面上;以及a microstrip line structure disposed on the first surface and the second surface of the body; and
至少一金属片,设置于该本体内,并位于该第一表面及该第二表面之间,该金属片电性连接该微带线结构。At least one metal sheet is arranged in the body and between the first surface and the second surface, and the metal sheet is electrically connected to the microstrip line structure.
与现有技术相比,本实用新型具有以下有益效果:Compared with the prior art, the utility model has the following beneficial effects:
该金属片的面积几乎与该本体的第一表面或第二表面的面积相同,因此该金属片能大幅增加该芯片型天线的辐射面积,使得芯片型天线有更大的频宽及更好的电气特性。The area of the metal sheet is almost the same as the area of the first surface or the second surface of the body, so the metal sheet can greatly increase the radiation area of the chip antenna, so that the chip antenna has a larger bandwidth and better performance. electrical characteristics.
附图说明 Description of drawings
图1为本实用新型芯片型天线的立体图。FIG. 1 is a perspective view of the chip antenna of the present invention.
图2为本实用新型芯片型天线的另一视角的立体图。FIG. 2 is a perspective view of another viewing angle of the chip antenna of the present invention.
图3为本实用新型芯片型天线的立体分解图。Fig. 3 is a three-dimensional exploded view of the chip antenna of the present invention.
图4为本实用新型芯片型天线的俯视图。Fig. 4 is a top view of the chip antenna of the present invention.
图5为本实用新型芯片型天线设置于第二电路板上的示意图。FIG. 5 is a schematic diagram of the chip antenna of the present invention disposed on the second circuit board.
图6为本实用新型芯片型天线设置于第二电路板上的另一示意图。FIG. 6 is another schematic diagram of the chip antenna of the present invention disposed on the second circuit board.
图7为本实用新型芯片型天线之第二实施例的立体图。FIG. 7 is a perspective view of a second embodiment of the chip antenna of the present invention.
图8为本实用新型芯片型天线的第二实施例的立体分解图。FIG. 8 is an exploded perspective view of the second embodiment of the chip antenna of the present invention.
其中,in,
10芯片型天线10 Chip Antennas
11本体11 body
110第一电路板110 first circuit board
111第一表面111 first surface
112第二表面112 second surface
12微带线结构12 microstrip line structure
121第一微带线121 The first microstrip line
122第二微带线122 second microstrip line
123连接孔123 connection hole
13金属片13 sheet metal
20第二电路板20 second circuit board
21馈入电极端21 Feed into the electrode terminal
22连接电极端22 Connect the electrode terminal
23接地电极端23 Ground electrode terminal
24金属层24 metal layers
25导通孔25 vias
30同轴电缆线30 coaxial cable
31内层导线31 inner wire
32外层导线32 outer wire
具体实施方式 Detailed ways
请参阅图1至图3所示为本实用新型的芯片型天线10,该芯片型天线10包括:一本体11、一微带线结构12及一金属片13。Referring to FIGS. 1 to 3 , the
该本体11由三块第一电路板110所叠合而成,该本体11的尺寸大约为:长度5.4公厘、宽度4.5公厘以及厚度1.6公厘,其中较上方的两块第一电路板110厚度为0.4公厘,而最下方的第一电路板110厚度为0.8公厘。该第一电路板110的材料可为Flame Retardant 4(FR-4)等材料。The
为方便之后的说明,该本体11的上表面定义为一第一表面111,而本体11的下表面定义为一第二表面112,该微带线结构12即设置于该第一表面111及第二表面112上。该金属片13则设置于该本体11内,并且夹于其中两块第一电路板110之间,该金属片13的面积略小于该第一表面111或第二表面112的面积。该金属片13与该微带线结构12电性连接,且两者(该微带线结构12及该金属片13)都是由一高传导性的金属材料(例如铜)制作而成。本实用新型的芯片型天线10通过该微带线结构12及该金属片13作为辐射体来发射或接收无线信号。For the convenience of the following description, the upper surface of the
请参阅图4所示,以下将对该微带线结构12作更详细的说明。Referring to FIG. 4 , the
该微带线结构12具有多个第一微带线121、多个第二微带线122以及多个连接孔123。第一微带线121固定于该第一表面111上,第一微带线121之间并没有直接地相连,而是彼此具有一间隔。且第一微带线121与本体11的长边L垂直(夹角为90度)。The
而第二微带线122固定于该第二表面112上,彼此之间也无直接地相连,而第二微带线122与该本体11的长边L具有一小于90度的夹角。从俯视图(图4)来看,每一个第二微带线122除了两端外,其余部分都没有与第一微带线121重叠。The
连接孔123各设置于每个第一微带线121的两端,连接孔123的直径大于第一微带线121的线宽。每个连接孔123都贯穿该本体11而连接至对应的第二微带线122的一端。由于连接孔123内涂布有一金属(图略),因此连接孔123也能够传递电信号,使得第一微带线121与第二微带线122产生电性连接。而最末个(右下方)连接孔123贯穿该本体11时,连带贯穿该金属片13,使得金属片13与该连接孔123相接触而产生电性连接。The connection holes 123 are respectively disposed at two ends of each
连接孔123的另一特点为:由俯视图(图4)来看,两个相邻的连接孔123并无位于同一垂直位置上。也就是指,连接孔123为交错地排列。此特点可以让第一微带线121或第二微带线122更紧密地排列,增加第一微带线121或第二微带线122的数目。Another characteristic of the connecting
上述为该微带线结构12的特征说明,以下将说明本实用新型的芯片型天线10如何发射及接收无线信号。本实用新型的芯片型天线10是通过第一微带线121、第二微带线122及金属片13作为辐射体来发射及接收无线信号,最前个(左下方)连接孔123为该芯片型天线10的馈入点(feed point),欲发射的信号可由此连接孔123处输入,然后信号由最前个(最左边)第二微带线122传递至最前个第一微带线121,最前个第一微带线121再传递至第二个第二微带线122,第二个第二微带线122再传递至第二个第一微带线121。The above is the description of the characteristics of the
信号会依序在第一微带线121及第二微带线122间传递,当信号传递至最末个第二微带线122时,再经由后述的第二电路板20(如图5)的连接电极端22传递至最末个(右下方)连接孔123传递至金属片13内。信号在此传递的过程中,即会产生无线电波。反之,第一微带线121、第二微带线122及金属片13接收到无线信号时,接收到的信号将传递至馈入点,然后由馈入点输出至其它电子组件(图略)。该右下方的连接孔123及右上方的连接孔123也能直接以第二微带线122(图略)连接,则信号不需经由连接电极端22即可传递至金属片13内。The signal will be transmitted between the
本实用新型的芯片型天线10通过于金属片13的设置,大幅增加了发射及接收无线信号的辐射面积,因此本实用新型的芯片型天线10的频宽能够大幅地增加。且通过改变金属片13的形状,即能轻易地调整所需的频宽及场型。此外,本实用新型的芯片型天线10为圆形极化的天线,能产生全向性(omni-direction)的场型。The
请参阅图5及图6,以下将说明本实用新型的芯片型天线10如何设置于一第二电路板20上,以及如何与第二电路板20电性连接。Referring to FIG. 5 and FIG. 6 , how the
该第二电路板20具有一馈入电极端21、一连接电极端22、一接地电极端23、一金属层24以及两个导通孔25,该馈入电极端21、连接电极端22、接地电极端23、金属层24及导通孔25内的金属都为一高传导性的金属材料(例如铜)。该馈入电极端21、连接电极端22、接地电极端23设置于该第二电路板20的上表面,该接地电极端23位于第二电路板20的最左端,该连接电极端22位于第二电路板20的最右端,而馈入电极端21则位于连接电极端22及接地电极端23之间,三者彼此之间具有一间隔。该金属层24设置于该第二电路板20的下表面,并且该金属层24的面积与第二电路板20下表面的面积一样。这两个导通孔25设置于第二电路板20的上表面,并各设置于该接地电极端23的右上角及右下角,这两个导通孔25贯穿该第二电路板20而连接至该金属层24,且这两个导通孔25内涂有一层金属(图略),因此该接地电极端23与金属层24互相导通而产生电性连接。The
该芯片型天线10设置于第二电路板20上时,芯片型天线10的第二表面112朝向于该第二电路板20的上表面,最前个(左下方)连接孔123(馈入点)焊接于该馈入电极端21上而与馈入电极端21产生电性连接,最末个(右下方)连接孔123及倒数第二个(右上方)连接孔123则焊接于该连接电极端22上而与连接电极端22产生电性连接。该连接电极端22也可传递信号,将信号由右上方连接孔123传递至右下方连接孔123。这样,信号可由馈入电极端21输入至芯片型天线10然后发射成无线电波,或是芯片型天线10接收到无线信号后,由馈入电极端21输出。When the
该第二电路板20另与一同轴电缆线30连接,同轴电缆线30具有一内层导线(inner conductor)31及一外层导线(outer conductor)32,该内层导线31位于该外层导线32内。该内层导线31连接及焊接于至该馈入电极端21上,该外层导线32连接及焊接至该接地电极端23上。该同轴电缆线30可传输一信号给馈入电极端21,或是由馈入电极端21接收一信号,并且该同轴电缆线30以该接地电极端23及金属层24作为接地处,该金属层24大幅增加了接地面积,因此能让该芯片型天线10的天线效率增加。The
请参阅图7及图8,本实用新型的芯片型天线10另具有一第二实施例,该第二实施例与第一实施例不同之处在于:两个金属片13设置于该本体11内。每两块第一电路板110之间各夹有一块金属片13,而最末个(右下方)连接孔123贯穿这两个金属片13,并与这两个金属片13电性连接。通过再增加一块金属片13,可使得该芯片型天线10辐射面积更为增加,进而使得该芯片型天线10有更大的频宽及更好的电气特性。Please refer to Fig. 7 and Fig. 8, the
另外,本实用新型的芯片型天线10更具有一第三实施例(图略),该第三实施例与第一及第二实施例不同之处在于:除了最末个连接孔123与金属片13电性连接外,其余的连接孔123也能够与金属片13电性连接,借此增加该芯片型天线10的辐射频率。In addition, the
综合上述,本实用新型的芯片型天线10具有以下特点:Based on the above, the
1、通过该金属片13让本实用新型的芯片型天线10能大幅地增加辐射面积,使得本实用新型的芯片型天线10具有较大的频宽及较好的电气特性、辐射效率等。1. Through the
2、本实用新型的芯片型天线10的尺寸微小,适合用于体积较小的电子产品内。2. The
以上所述仅是本实用新型的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本实用新型原理的前提下,还可以作出若干改进和润饰,这些改进和润饰也应视为本实用新型的保护范围。The above is only a preferred embodiment of the utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the utility model, some improvements and modifications can also be made. These improvements and modifications It should also be regarded as the protection scope of the present utility model.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102800938A (en) * | 2011-05-31 | 2012-11-28 | 深圳光启高等理工研究院 | Antenna and multiple input multiple output (MIMO) antenna with same |
CN107994342A (en) * | 2017-11-24 | 2018-05-04 | 深圳市盛路物联通讯技术有限公司 | Chip-type antenna |
CN108879083A (en) * | 2017-05-09 | 2018-11-23 | 昌泽科技有限公司 | Method for manufacturing chip signal element |
-
2008
- 2008-10-16 CN CNU2008201382499U patent/CN201345415Y/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102800938A (en) * | 2011-05-31 | 2012-11-28 | 深圳光启高等理工研究院 | Antenna and multiple input multiple output (MIMO) antenna with same |
CN108879083A (en) * | 2017-05-09 | 2018-11-23 | 昌泽科技有限公司 | Method for manufacturing chip signal element |
CN107994342A (en) * | 2017-11-24 | 2018-05-04 | 深圳市盛路物联通讯技术有限公司 | Chip-type antenna |
CN107994342B (en) * | 2017-11-24 | 2021-01-26 | 深圳市盛路物联通讯技术有限公司 | Chip type antenna |
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