TWM459541U - Patch type multiband antenna module - Google Patents

Description

SMD multi-frequency antenna module

This creation relates to an antenna, especially a multi-band antenna module with high gain and multi-band.

With the continuous development of wireless communication technology, portable electronic devices such as notebook computers, mobile phones, tablet computers and the like are designed and developed toward light and thin. In this thin and short electronic device, the size of the antenna for transmitting and receiving the electric wave signal is relatively reduced, or the antenna structure type is changed, and the built-in electronic device can be used internally.

The most common multi-band multi-frequency antenna currently on the market is the Planar Inverted-F Antenna (PIFA). The antenna adopts a simple two-dimensional design, which directly prints copper material on a printed circuit board through a printed circuit board (PCB) manufacturing process to form a flat multi-band multi-band antenna, or stamps a metal foil into a stamping technique. Multi-frequency antenna with three-dimensional design.

Because the PIFA antenna structure can change the antenna geometry on the printed circuit board two-dimensional or metal foil to achieve dual-frequency or even three-frequency transmission and reception. However, in order to satisfy the signal transmission and reception quality and avoid the influence of the surrounding environment, the frequency coordination is not accurate, so the printed circuit board or the foil is stamped and formed. It is bound to have a certain size. In order to be able to mount the PIFA antenna structure, an appropriate space must be reserved inside the electronic device to house the PIFA antenna structure. As a result, the size of the electronic device itself becomes large, which is bound to be violated. The demand for electronic devices to be light, thin and small is miniaturized.

Therefore, the main purpose of the present invention is to solve the traditional deficiency, so that a metal pattern of a multi-band multi-frequency antenna is placed on the ceramic carrier made of the high dielectric constant ceramic material to form a direct A multi-band multi-band antenna with high efficiency for surface adhesion engineering. At the same time, a compact, small, built-in surface-mountable multi-frequency antenna is also formed.

In order to achieve the above purpose, the present invention provides a patch type multi-frequency antenna module, comprising: a substrate having a first surface and a second surface, the first surface having a first ground layer and a first surface a first signal feeding line, a first gap is formed between the first signal feeding line and the first ground layer, and the first ground layer is electrically connected to a second signal feeding line located on the left side of the first signal feeding line. The second signal feeding line and the first signal feeding line have a second spacing. The first grounding layer is electrically connected to a third signal feeding line located on the right side of the first signal feeding line. The third signal feeding a first spacing between the incoming line and the first signal feeding line; a carrier having a first radiator, a second radiator, a third radiator and a fourth radiator, the first radiation The body and the second radiator are electrically Connecting, the first radiator and the second radiator are not electrically connected to the third radiator and the fourth radiator; wherein, when the carrier is electrically connected to the substrate, the first radiator and the second The electrical connection of the radiator is electrically connected to the first signal feeding line, the third radiator is electrically connected to the second signal feeding line, and the fourth radiator is electrically connected to the third signal feeding line. To form a multi-band multi-frequency antenna module.

The first signal feeding line has a front section and a rear section, and the front section has a through hole extending in the first ground layer to form the first gap with the first ground layer.

The second pitch width formed between the rear portion of the first signal feed line and the second signal feed line adjusts the coupling capacitance value to enable the first ground layer to form a high frequency resonance point.

The third pitch width formed between the rear portion of the first signal feed line and the third signal feed line adjusts the coupling capacitance value to enable the first ground layer to form a high frequency resonance point.

The first surface has a corresponding set of two fixed contacts, and the two fixed contacts electrically connect the first radiator and the second radiator on the carrier.

Wherein, the second surface has a second ground layer.

Among them, the carrier is made of a rectangular material having a high dielectric constant ceramic material.

The first radiator, the second radiator, the third radiator and the fourth radiation system are disposed on the carrier by different rectangular metal patterns and linear strip metal patterns.

The rectangular metal pattern and the straight strip metal pattern are disposed on at least one or both surfaces of the carrier.

Wherein, the connector further has a connector, the connector has a connector, the signal has a signal feeding probe, the signal feeding probe passes through the through hole of the first signal feeding line and the first signal feeding line Electrical connection.

1‧‧‧Substrate

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧First ground plane

14‧‧‧First signal feed line

141‧‧‧

142‧‧‧After

143‧‧‧Perforation

15‧‧‧First gap

16‧‧‧Second signal feed line

17‧‧‧Second spacing

18‧‧‧ third signal feed line

19‧‧‧ third spacing

101‧‧‧Fixed joints

102‧‧‧Second ground plane

2‧‧‧ Carrier

21‧‧‧First radiator

22‧‧‧Second radiator

23‧‧‧ Third radiator

24‧‧‧Fourth radiator

3‧‧‧Signal source

4‧‧‧Connector

41‧‧‧ Signal Feed Probe

42‧‧‧Connecting head

43‧‧‧Thread

5‧‧‧Bronze shaft cable

51‧‧‧Connectors

The first picture is an exploded view of the multi-frequency antenna module of the present invention.

The second figure is an exploded view of another perspective of the multi-frequency antenna module of the present invention.

The third figure is an exploded view of another perspective of the multi-frequency antenna module of the present invention.

The fourth picture is a stereoscopic view of the appearance of the multi-frequency antenna module of the present invention.

The fifth picture is a schematic diagram of the circuit of the multi-frequency antenna module circuit of the present invention.

The sixth picture is a schematic diagram of the use state of the multi-frequency antenna module of the present invention.

Figure 7 is a side cross-sectional view of the sixth figure.

Figure 8 is a schematic diagram of the frequency response curve of this creation (1).

Figure 8B is a schematic diagram of the frequency response curve of this creation (2).

Figure 8 is a schematic diagram of the frequency response table of Figure 8B.

The ninth figure is a schematic diagram of the LTE ANTENNA Peak Gain Parameter Summary.

The technical content and detailed description of this creation are as follows: Please refer to the first, second, third and fourth figures, which is the decomposition of the multi-frequency antenna module of this creation, the decomposition of another perspective, and another perspective. A schematic view of the decomposition and appearance. As shown in the figure, a surface-mount multi-frequency antenna module of the present invention comprises: a substrate 1 and a carrier 2.

The substrate 1 has a first surface 11 and a second surface 12. The first surface 11 has a first grounding layer 13 and a first signal feeding line 14. The first signal feeding line 14 has a front section 141 and a rear section 142. The front section 141 has a through hole 143. The front section 141 of the signal feed line 14 extends in the first ground layer 13 and forms a first gap 15 with the first ground layer 13. The first ground layer 13 is electrically connected to a second signal feeding line 16 on the left side of the rear portion 142 of the first signal feeding line 14 , and the second signal feeding line 16 and the rear portion 142 of the first signal feeding line 14 . Forming a second pitch 17, a width of the third pitch 17 formed between the rear segment 142 of the first signal feed line 14 and the second signal feed line 16, the coupling capacitance value can be adjusted to make the first ground layer 13 can form a high-frequency resonance point, thereby increasing the bandwidth. In addition, the first ground layer 13 is electrically coupled to a third signal feeding line 18 located on the right side of the rear portion 142 of the first signal feeding line 14 , and the third signal feeding line 18 and the rear portion 142 of the first signal feeding line 14 . Forming a third spacing 19 between the The width of the third pitch 19 formed between the rear portion 142 of the signal feed line 14 and the third signal feed line 18 can adjust the coupling capacitance value so that the first ground layer 13 can form a high frequency resonance point, thereby increasing Use for bandwidth. Moreover, the first surface 11 has a pair of corresponding fixed contacts 110 for fixing the carrier 2. Further, the second surface 12 has a second ground layer 102, and the second ground layer 102 is electrically connected to a grounding portion (not shown) of the joint of the copper shaft cable.

The carrier 2 is made of a high dielectric constant ceramic material having a rectangular body 21, a second radiator 22, a third radiator 23 and a fourth radiator 24. The first radiator 21, the second radiator 22, the third radiator 23, and the fourth radiator 24 are disposed on at least one or two surfaces of the carrier 2 with different rectangular metal patterns and straight strip metal patterns. Above, the volume of the antenna is miniaturized. The first radiator 21 and the second radiator 22 are electrically connected to each other, and the first radiator 21 and the second radiator 22 are not electrically connected to the third radiator 23 and the fourth radiator 24 . When the carrier 2 is electrically connected to the substrate 1 , the first radiator 21 and the second radiator 22 are electrically connected to the two fixed contacts 101 on the first surface 11 of the substrate 1 to make the carrier 2 It can be fixed to the first surface 11 of the substrate 1. The junction of the first radiator 21 and the second radiator 22 is electrically connected to the first signal feeding line 14 , the third radiator 23 is electrically connected to the second signal feeding line 16 , and the The fourth radiator is electrically coupled to the third signal feeding line 18 to form a multi-frequency antenna module.

Please refer to the fourth and fifth figures, which is the schematic diagram of the appearance of the multi-frequency antenna module and the circuit of the circuit. As shown in the figure: in the first radiator 21 and the second antenna The emitter 22 is electrically connected to the first signal feeding line 14 , the first radiator 21 forms a first antenna, and the second radiator 22 forms a second antenna, the third radiator 23 and the second signal The feed line 16 forms a third antenna and the third signal feed line 18 is electrically coupled to the fourth radiator 24 to form a multi-band multi-band antenna module of the fourth antenna.

After the signal source 3 is input by the first signal feeding line 14, the first radiator 21 and the second radiator 22 are formed to form a structure of high and low frequency branch resonance. The width of the second pitch 17 formed between the first signal feed line 14 and the second signal feed line 16 can be adjusted to adjust the coupling capacitance value so that the first ground layer 13 can form a high frequency resonance point. In order to increase the bandwidth. Similarly, the width of the third spacing 19 formed between the first signal feeding line 14 and the third signal feeding line 18 can also adjust the coupling capacitance value so that the first ground layer 13 can form a high frequency resonance. Point, in order to increase the bandwidth.

Please refer to the sixth and seventh figures, which are the use state of the multi-frequency antenna module of the present invention and the side cross-sectional view of the sixth figure. As shown in the figure, in the present application, the signal of the connector 4 connecting the copper shaft cable 5 is fed into the through hole 143 of the probe 41 passing through the front section 141 of the first signal feeding line 14 and the first signal. The feed line 14 is electrically connected. The connector 42 of the connector 4 is electrically connected to the second grounded metal surface 102.

When the multi-frequency antenna module is used, the connector 51 of the copper shaft cable 5 is locked to the thread 43 on the connector 42 of the connector 4, and is transmitted through the first radiator 21, the second radiator 22, and the The three radiators 23 and the fourth radiators 24 receive signals of different frequency bands to achieve a multi-frequency antenna module that can be used in multiple frequency bands.

Please refer to the eighth figure A~C, which is a schematic diagram of the frequency response curves of the frequency response curves (1), (2) and 8th and 8th B of the present example. As shown in FIG: Creation when present at many frequency antenna module 700MH _Z, the antenna return loss (Return Loss) -3.98, standing wave ratio (SWR) of 4.20.

When the present frequency antenna module in many authoring 824MH _Z, the reflection loss for the antenna -11.66, VSWR is 1.73.

When the present frequency antenna module in many authoring 960MH _Z, return loss of the antenna is -5.57, 3.02 VSWR.

When the present frequency antenna module in many authoring 1710MH _Z, the reflection loss for the antenna -10.39, VSWR is 1.76.

When the multi-frequency antenna module of the present invention is at 2170 MH _Z , the reflection loss of the antenna is -6.38, and the standing wave ratio is 2.88.

Please refer to the ninth figure, which is a schematic diagram of the LTE ANTENNA Peak Gain Parameter Summary. As shown in the figure: Therefore, the multi-frequency antenna module of the present invention can provide the long-term and long-term evolution antenna (LONG TERM EVOLUTION ANTENNA, LTE ANTENNA) technology and the short, small and small multi-band high-efficiency built-in stickers required for the fourth-generation communication system. Chip (SMT) antenna module structure. And this multi-band covers 700~960MH _Z and 1710~2170MH _Z, etc. It is LTE, Global System for Mobile Communications (GSM), Digital Communication System (DCS), Personal Communication System (Personal) Communication System, PCS), Wideband Code Division Multiple Access (WCDMA) and other system frequency bands.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equal changes and modifications made by the patent application scope of this creation are covered by the scope of the creation patent.

1‧‧‧Substrate

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧First ground plane

14‧‧‧First signal feed line

141‧‧‧

142‧‧‧After

143‧‧‧Perforation

15‧‧‧First gap

16‧‧‧Second signal feed line

17‧‧‧Second spacing

18‧‧‧ third signal feed line

19‧‧‧ third spacing

101‧‧‧Fixed joints

102‧‧‧Second ground plane

2‧‧‧ Carrier

21‧‧‧First radiator

22‧‧‧Second radiator

23‧‧‧ Third radiator

24‧‧‧Fourth radiator

Claims (10)

A patch type multi-frequency antenna module includes: a substrate having a first surface and a second surface, the first surface having a first ground layer and a first signal feeding line, the first A first gap is formed between the signal feeding line and the first ground layer, and the first ground layer is electrically connected to a second signal feeding line located on the left side of the first signal feeding line, and the second signal feeding line and the first signal feeding line a first pitch is electrically connected to a third signal feed line on a right side of the first signal feed line, and the third signal feed line and the first signal feed line are connected to each other. a third space; a carrier having a first radiator, a second radiator, a third radiator and a fourth radiator, wherein the first radiator and the second radiator are electrically The first radiator and the second radiator are electrically connected to the third radiator and the fourth radiator; wherein the first radiator and the first portion are electrically connected to the substrate The second radiator is electrically connected to the first signal feed Line is electrically connected to the third radiator and the second signal feed line is electrically connected, and the fourth radiator feed line electrically coupling the third signal to form a multi-band multi-band antenna assembly. The patch type multi-frequency antenna module of claim 1, wherein the first signal feed line has a front section and a rear section, the front section has a through hole, and the front section extends to the first In the ground layer, and the first ground layer The first gap is formed therebetween. The patch type multi-frequency antenna module according to claim 2, wherein the second pitch width formed between the rear portion of the first signal feeding line and the second signal feeding line adjusts coupling The capacitance value enables the first ground plane to form a high frequency resonance point. The patch type multi-frequency antenna module of claim 3, wherein the third pitch width formed between the rear portion of the first signal feed line and the third signal feed line adjusts coupling The capacitance value enables the first ground plane to form a high frequency resonance point. The patch type multi-frequency antenna module of claim 4, wherein the first surface has a corresponding set of two fixed contacts, and the two fixed contacts are electrically connected to the carrier. The first radiator and the second radiator. The patch type multi-frequency antenna module of claim 5, wherein the second surface has a second ground layer. The patch type multi-frequency antenna module according to claim 6, wherein the carrier is made of a rectangular material having a high dielectric constant ceramic material. The patch type multi-frequency antenna module according to claim 7, wherein the first radiator, the second radiator, the third radiator, and the fourth radiation system have different rectangular metal patterns and A linear strip metal pattern is formed on the carrier. The patch type multi-frequency antenna module of claim 8, wherein the rectangular metal pattern and the straight strip metal pattern are disposed on at least one or both surfaces of the carrier. The patch type multi-frequency antenna module according to claim 9 of the patent application, wherein Further having a connector, the connector has a connector having a signal feed probe therein, the signal feed probe passing through the through hole of the first signal feed line and the first signal feed line Sexual links.