CN201187953Y - Heat exchange device and module thereof - Google Patents
Heat exchange device and module thereof Download PDFInfo
- Publication number
- CN201187953Y CN201187953Y CNU2008200022138U CN200820002213U CN201187953Y CN 201187953 Y CN201187953 Y CN 201187953Y CN U2008200022138 U CNU2008200022138 U CN U2008200022138U CN 200820002213 U CN200820002213 U CN 200820002213U CN 201187953 Y CN201187953 Y CN 201187953Y
- Authority
- CN
- China
- Prior art keywords
- heat
- fan
- sink unit
- opening
- exchange device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开了一种热交换模块和热交换装置。热交换模块包括热交换装置及壳体,壳体具有一孔洞,热交换装置被设置于孔洞中。热交换装置包括:具有至少一开口的散热单元;被设置于孔洞中的隔板,该隔板将壳体内外完全隔离;设置于散热单元中并穿过隔板的至少一导热管;及设置于所述开口中的至少一风扇。由于将风扇设置于开口中,不占据壳体内部及外部的额外空间。另外,风扇运转时,壳体外部的风扇能均匀地将热能从第一散热单元往四周导出,而壳体内部的风扇能均匀地将壳体内的热量平均散发在第一散热单元的散热片上,因此,热量能迅速导出,从而达到使壳体降温的效果。
The utility model discloses a heat exchange module and a heat exchange device. The heat exchange module includes a heat exchange device and a shell, the shell has a hole, and the heat exchange device is arranged in the hole. The heat exchange device includes: a heat dissipation unit with at least one opening; a partition plate arranged in the hole, the partition plate completely isolates the inside and outside of the shell; at least one heat-conducting pipe arranged in the heat dissipation unit and passing through the partition plate; and at least one fan arranged in the opening. Since the fan is arranged in the opening, no additional space inside and outside the shell is occupied. In addition, when the fan is running, the fan outside the shell can evenly conduct heat energy from the first heat dissipation unit to the surroundings, and the fan inside the shell can evenly dissipate the heat in the shell to the heat sink of the first heat dissipation unit. Therefore, the heat can be quickly conducted out, thereby achieving the effect of cooling the shell.
Description
技术领域 technical field
本实用新型涉及一种热交换模块及热交换装置,尤其涉及一种传递热能的热交换模块及热交换装置。The utility model relates to a heat exchange module and a heat exchange device, in particular to a heat exchange module and a heat exchange device for transferring heat energy.
背景技术 Background technique
热交换器是一种能够将某一空间的热能传递到另一空间的装置。热传递过程一般分为三种方式,即传导、对流和辐射,一般热交换器的热传递经常是三种方式同时存在,但根据不同场合,往往是以其中一种方式为主导,在工业中使用的热交换器的传热主要是通过传导方式或导热管将热能从热散热片区域传递到冷散热片区域,既有对流传热又有传导传热,此即为热交换器传热的基本理论。A heat exchanger is a device that transfers thermal energy from one space to another. The heat transfer process is generally divided into three ways, namely conduction, convection and radiation. Generally, the heat transfer of heat exchangers often exists in three ways at the same time, but according to different occasions, one of the ways is often dominant. In industry The heat transfer of the heat exchanger used is mainly to transfer heat energy from the hot fin area to the cold fin area through conduction or heat pipes. There are both convective heat transfer and conduction heat transfer. basic theory.
现有的一种热交换模块包括安装于机柜上方的热交换器,并于机柜内外各安装有风扇及散热片,以将热量传导至外部,但此种方式占据了机柜不少的空间,使用上亦不方便。An existing heat exchange module includes a heat exchanger installed above the cabinet, and fans and cooling fins are installed inside and outside the cabinet to conduct heat to the outside, but this method occupies a lot of space in the cabinet. It is also inconvenient to go up.
另一种热交换方式是在机柜内外可再增设两台风扇,以产生两股气流,并且将风扇置于上散热器及下散热器的一端,而往另一端吹送气流。但是,因空气阻力特性的关系,经由风扇所产生的气流到上散热器及下散热器后端时,因风压减少而使得导热效能减小,而且这种热交换方式亦占据机柜的空间,同时还增加了制作成本。Another heat exchange method is to add two more fans inside and outside the cabinet to generate two airflows, and place the fans at one end of the upper radiator and the lower radiator, and blow airflow to the other end. However, due to the relationship of air resistance characteristics, when the airflow generated by the fan reaches the rear end of the upper radiator and the lower radiator, the heat conduction efficiency is reduced due to the reduction of wind pressure, and this heat exchange method also occupies the space of the cabinet. Also increased production cost simultaneously.
实用新型内容Utility model content
鉴于此,本实用新型的目的是提供一种热交换装置及其模块,其能将风扇设置于热交换装置的开口内而不占据散热片以外的空间,且能维持较佳的导热效能。In view of this, the purpose of the present invention is to provide a heat exchange device and its module, which can arrange the fan in the opening of the heat exchange device without occupying the space other than the heat sink, and can maintain better heat conduction performance.
为实现所述目的,依据本实用新型,所提供的热交换模块包括一热交换装置及一壳体,壳体具有一孔洞,其中热交换装置被设置于孔洞中。热交换装置包括:一散热单元,其具有至少一开口;一隔板,其将散热单元分隔为一第一散热单元及一第二散热单元;至少一导热管,其被设置于散热单元中并穿透隔板;及至少一风扇,其被设置并连接于所述开口中。To achieve the above object, according to the present invention, the provided heat exchange module includes a heat exchange device and a casing, and the casing has a hole, wherein the heat exchange device is disposed in the hole. The heat exchanging device comprises: a heat dissipation unit having at least one opening; a separator separating the heat dissipation unit into a first heat dissipation unit and a second heat dissipation unit; at least one heat pipe disposed in the heat dissipation unit and penetrating the partition; and at least one fan disposed and connected in the opening.
导热管可将蓄积于第一散热单元的热能传递至第二散热单元,或将蓄积于第二散热单元的热能传递至第一散热单元。The heat pipe can transfer the heat energy accumulated in the first heat dissipation unit to the second heat dissipation unit, or transfer the heat energy accumulated in the second heat dissipation unit to the first heat dissipation unit.
如上所述,本实用新型所提供的热交换模块及热交换装置通过在热交换装置的开口中设置风扇,当壳体内的风扇运转时,在壳体的内部借助于风扇吸进壳体内部的热空气,经过第二散热单元吸收壳体内的热量并通过导热管将热量传到壳体外,壳体外的第一散热单元可迅速吸收热管的高温,再利用外部风扇运转吸入外界冷空气使第一散热单元的热量平均导出。与现有技术相较,本实用新型能够将风扇设置于热交换装置的开口内而不占据壳体内部及外部的额外空间。另外,当风扇运转时,壳体外部的风扇能均匀地将热能从第一散热单元往四周导出,而在壳体内部的风扇能均匀地将壳体内的热量平均散发在第一散热单元的散热片上,热量能迅速导出,进而达到壳体降温的效果。As mentioned above, the heat exchange module and the heat exchange device provided by the utility model are provided with a fan in the opening of the heat exchange device. The hot air absorbs the heat inside the casing through the second heat dissipation unit and transfers the heat to the outside of the casing through the heat pipe. The first heat dissipation unit outside the casing can quickly absorb the high temperature of the heat pipe, and then use the external fan to suck in cold air from the outside to make the first The heat of the cooling unit is evenly exported. Compared with the prior art, the utility model can arrange the fan in the opening of the heat exchange device without occupying extra space inside and outside the casing. In addition, when the fan is running, the fan outside the casing can evenly guide the heat energy from the first heat dissipation unit to the surroundings, while the fan inside the casing can evenly distribute the heat in the casing to the cooling area of the first heat dissipation unit. On-chip, the heat can be quickly exported, thereby achieving the effect of cooling the shell.
附图说明 Description of drawings
图1A为一种现有的热交换器的示意图;Fig. 1A is the schematic diagram of a kind of existing heat exchanger;
图1B为另一种现有的热交换器的侧视图;Fig. 1B is a side view of another existing heat exchanger;
图2A为本实用新型一优选实施例的热交换模块的示意图,图中示出了风扇运转于第一种情况;Figure 2A is a schematic diagram of a heat exchange module in a preferred embodiment of the present invention, in which the fan is running in the first situation;
图2B为本实用新型一优选实施例的热交换模块的示意图,图中示出了风扇运转于第二种情况;Fig. 2B is a schematic diagram of a heat exchange module in a preferred embodiment of the present invention, in which the fan is running in the second situation;
图3A为本实用新型一优选实施例的热交换装置的立体图;Fig. 3A is a perspective view of a heat exchange device in a preferred embodiment of the present invention;
图3B为本实用新型一优选实施例的热交换装置的侧视图;Fig. 3B is a side view of a heat exchange device in a preferred embodiment of the present invention;
图4为本实用新型另一实施例的热交换模块示意图。Fig. 4 is a schematic diagram of a heat exchange module according to another embodiment of the present invention.
附图标记说明Explanation of reference signs
1、2 热交换模块 11 热交换器1, 2 heat exchange module 11 heat exchanger
111上 散热片 112 下散热片111
114、214 风扇 12 机柜114, 214 fans 12 cabinets
121 孔洞 21 热交换装置121
210 散热单元 211 第一散热单元210
212 第二散热单元 213 开口212
213a 第一开口 213b 第二开口213a first opening 213b second opening
214a 第一风扇 214b 第二风扇214a
215 马达2 16 驱动电路215
217 轴心 218 顶盖217
219 支撑杆 22 壳体219
A、C 热空气流 B、D 冷空气流A, C hot air flow B, D cold air flow
A0、C0 气流A0, C0 Airflow
具体实施方式 Detailed ways
以下将参照相关附图说明本实用新型一优选实施例的热交换模块,其中相同的元件将以相同的附图标记表示。A heat exchange module according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same elements will be denoted by the same reference numerals.
图1A示出了一种现有的热交换模块12,其包括安装于机柜12上方的热交换器11,并于机柜内外各安装有风扇及散热片以将热传导至外,如上所述,此种方式占据机柜不少空间,使用上亦不方便。图1B示出了另一种热交换方式,在机柜12内外再增设有两台风扇114,以产生气流A0及气流B0,并将风扇114置于上散热器111及下散热器112的一端而往另一端吹送气流。在这种方式中,因空气阻力特性的影响,经由风扇114所产生的气流到了上散热器111及下散热器112后端,因风压减少而使得导热效能减小,而且其亦存在占据机柜12空间和增加制作成本的缺陷。Fig. 1A shows a kind of existing heat exchange module 12, and it comprises the heat exchanger 11 that is installed on the top of cabinet 12, and inside and outside the cabinet, fans and cooling fins are respectively installed to conduct heat to the outside, as mentioned above, this This method takes up a lot of space in the cabinet and is inconvenient to use. Fig. 1B has shown another kind of heat exchanging mode, is provided with two
请参照第2A、2B及图3A,这些附图分别示出了本实用新型一优选实施例的热交换模块和热交换装置。热交换模块2包括热交换装置21及壳体22,壳体22例如可以是机柜,当然不限于机柜,壳体22上方具有孔洞121,其中热交换装置21被设置于孔洞121中。热交换装置21包括:散热单元210,其具有至少一开口213;隔板2111,以将散热单元210分隔为第一散热单元211及第二散热单元212,并将壳体内外完全隔离;至少一导热管1112,其被设置于散热单元210的通孔中并穿过隔板2111;及至少一风扇214,其被设置于开口213中。散热单元210例如可以是散热器(heat sink),其由多个金属鳍片(fin)组成,开口213包括第一开口213a及第二开口213b;风扇214包括第一风扇214a及第二风扇214b。第一风扇214a被设置于第一开口213a内,而第一开口213a被设置于第一散热单元211中,第一散热单元211位于壳体22外部。第二风扇214b被设置于第二开口213b内,第二开口213b被设置于第二散热单元212中,第二散热单元212位于壳体22内部,其中隔板2111平行于第一散热单元211及第二散热单元212。Please refer to FIG. 2A, 2B and FIG. 3A, these figures respectively show a heat exchange module and a heat exchange device according to a preferred embodiment of the present invention. The
在第一种情况下,请参考图2A。当壳体22内部的第二风扇214b运转时,借由第二风扇214b吸进壳体22内部的热空气流(以虚线A表示)至第二散热单元212内,导热管1112将位于第二散热单元212的热能传递至第一散热单元211,经过导热管1112的冷却降温作用,并借由导热管1112迅速将热量传至隔板2111外面的散热单元210,隔板2111连结于壳体22。另外,可借由第二风扇214b将冷空气流(以虚线B表示)均匀地吹往第二散热单元212四周。当第一风扇214a处于运转状态时,可利用第一风扇214a将壳体22外部的冷空气吸入,将第二散热单元212与导热管1112所产生的热能平均地导往第一散热单元211四周。In the first case, please refer to Figure 2A. When the
在第二情况下,请参考图2B。当壳体22内部的第二风扇214b运转时,借由第二风扇214b将热空气流(以虚线C表示)经由第二散热单元212四周吸入冷却降温之后,冷空气流(以虚线D表示)经由第二风扇214b吹出,另外再借由导热管1112迅速将热量传至隔板2111外面的第一散热单元211。当第一风扇214a处于运转状态时,可利用第一风扇214a将壳体22外部的冷空气从第一散热单元211四周均匀吸入,将第二散热单元212与导热管1112所产生的热能均匀地导往第一散热单元211中间。In the second case, please refer to Fig. 2B. When the
特别需要注意的是,第一风扇214a及第二风扇214b可分别单独或同时设置于第一开口213a和/或第二开口213b内,而第一风扇214a及第二风扇214b也可分别单独或同时运转。此外,第一风扇214a及第二风扇214b可分别为轴流式风扇或离心式风扇。In particular, it should be noted that the
请参照图3B,其为热交换装置21的侧视图,由图中可得知热交换装置21还包括设置于第一风扇214a内的驱动电路板216及马达215,第一和第二风扇共享轴心217,用以驱动第一风扇214a及第二风扇214b。Please refer to FIG. 3B , which is a side view of the
请参照图4,热交换模块2还可包括顶盖218用以防水,顶盖218经由至少一支撑杆219被设置于壳体22上,其余内部元件与图2A至3B相同,故不再赘述。Please refer to FIG. 4 , the
综上所述,本实用新型的热交换模块及热交换装置借由在热交换装置的开口中设置风扇,当壳体内的风扇运转时,在壳体的内部借由风扇吸进壳体内部的热空气,经过第二散热单元吸收壳体内的热量并通过导热管将热量传到壳体外,壳体外的第一散热单元可迅速吸收热管的高温,再利用外部风扇运转吸入外界冷空气将第一散热单元的热量均匀导出。与现有技术相较,本实用新型能够将风扇设置于热交换装置的开口内而不占据壳体内部及外部额外的空间。另外,当风扇运转时,在壳体外部的风扇能均匀地将热能从第一散热单元往四周导出,而在壳体内部的风扇能均匀地将壳体内的热量匀均散发在第一散热单元的散热片上,热量能迅速传出,达到壳体降温的效果。此外,亦可保持壳体内部的恒温,用作精确的同步温度控制,以防止壳体内设备温度过高,再者,本实用新型的热交换机可应用于通讯用机柜、加工机或工作母机等。To sum up, the heat exchange module and the heat exchange device of the present invention are provided with a fan in the opening of the heat exchange device. The hot air absorbs the heat inside the casing through the second cooling unit and transfers the heat to the outside of the casing through the heat pipe. The first cooling unit outside the casing can quickly absorb the high temperature of the heat pipe, and then use the external fan to suck in the cold air from the outside to dissipate the first heat. The heat of the cooling unit is evenly exported. Compared with the prior art, the utility model can arrange the fan in the opening of the heat exchange device without occupying extra space inside and outside the casing. In addition, when the fan is running, the fan on the outside of the casing can evenly guide heat energy from the first heat dissipation unit to the surroundings, while the fan inside the casing can evenly dissipate the heat in the casing to the first heat dissipation unit On the heat sink, the heat can be quickly transmitted to achieve the effect of cooling the shell. In addition, the constant temperature inside the housing can also be maintained for accurate synchronous temperature control to prevent the temperature of the equipment in the housing from being too high. Furthermore, the heat exchanger of the present invention can be applied to communication cabinets, processing machines or working machines, etc. .
以上所述仅为举例性的,而不是对本实用新型的限制。任何未超出本实用新型的构思与范围的等同变换或变型均应落入所附权利要求请求保护的范围内。The above descriptions are merely exemplary, rather than limiting the present utility model. Any equivalent transformation or modification that does not exceed the concept and scope of the present utility model shall fall within the protection scope of the appended claims.
Claims (21)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200022138U CN201187953Y (en) | 2008-01-04 | 2008-01-04 | Heat exchange device and module thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200022138U CN201187953Y (en) | 2008-01-04 | 2008-01-04 | Heat exchange device and module thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201187953Y true CN201187953Y (en) | 2009-01-28 |
Family
ID=40310977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008200022138U Expired - Lifetime CN201187953Y (en) | 2008-01-04 | 2008-01-04 | Heat exchange device and module thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201187953Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102076202A (en) * | 2009-11-24 | 2011-05-25 | 台达电子工业股份有限公司 | Heat exchange device and sealed electrical equipment using heat exchange device |
CN105815157A (en) * | 2015-01-05 | 2016-08-03 | 金宝生物科技股份有限公司 | Plant planting box |
-
2008
- 2008-01-04 CN CNU2008200022138U patent/CN201187953Y/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102076202A (en) * | 2009-11-24 | 2011-05-25 | 台达电子工业股份有限公司 | Heat exchange device and sealed electrical equipment using heat exchange device |
CN102076202B (en) * | 2009-11-24 | 2015-07-22 | 台达电子工业股份有限公司 | Heat exchange device and sealed electrical equipment using heat exchange device |
CN105815157A (en) * | 2015-01-05 | 2016-08-03 | 金宝生物科技股份有限公司 | Plant planting box |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7826217B2 (en) | Cooling device and electronic apparatus using the same | |
US8462504B2 (en) | Air-cooled heat exchanger and electronic device with same | |
US20110277967A1 (en) | Liquid cooled condensers for loop heat pipe like enclosure cooling | |
JP5227380B2 (en) | Heat dissipation module | |
CN106714525A (en) | Heat dissipation device and electronic equipment | |
CN202887087U (en) | Semiconductor central processing unit (CPU) radiator having heat insulation protection | |
TW200406663A (en) | Computer main body cooling system | |
TW201324098A (en) | Housing of electronic device | |
CN201187953Y (en) | Heat exchange device and module thereof | |
CN207674759U (en) | A kind of semiconductor cooling device | |
CN112437588B (en) | Electronic radiator | |
CN107072118B (en) | A cabinet drawer partition type heat pipe cooling device | |
CN203689298U (en) | Liquid cooling device | |
CN102564175B (en) | Air-cooled heat exchanger and its applicable electronic equipment | |
CN206162313U (en) | A server for scenic spot integrated management system uses | |
TW201325421A (en) | Cooling system | |
CN207489679U (en) | A kind of radiator for capacitor case | |
CN103917074B (en) | The display of special purpose | |
CN207783408U (en) | Head-mounted display and its cooling system | |
CN112099607A (en) | A cooling device based on big data cloud computing equipment | |
CN206022995U (en) | Energy-saving and heat-dissipating structure of air-conditioning substation | |
CN221650891U (en) | Radiator with dual heat sources and independent heat dissipation | |
CN207705183U (en) | Electronic chip cooling device | |
CN219999846U (en) | Heat abstractor, computing device and vehicle | |
CN221488159U (en) | Cabinet with heat dissipation device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20090128 |
|
CX01 | Expiry of patent term |