CN201163855Y - Radiating assembly and radiator with same - Google Patents

Abstract

The utility model discloses a heat dissipation component and a heat sink with the heat dissipation component, wherein the heat sink comprises at least one base plate part and a plurality of heat dissipation components, the base plate part comprises a base part and a plurality of extension arms, and a slot is arranged between each extension arm and another two adjacent extension arms; each radiating component is inserted in the corresponding slot of the substrate piece, one side wall surface forming the two opposite side wall surfaces of each extension arm tightly presses the butt to form one surface of two opposite surfaces of each radiating component, and at least one surface of each radiating component is extended with a plurality of embossed radiating parts, and the top end part and the bottom end part of each radiating component are extended with the top surface and the bottom surface of the substrate piece, thereby the utility model has the advantages of avoiding using solder to avoid heat conduction loss, increasing the radiating surface area of the radiating component by means of the embossed radiating parts, and improving the radiating efficiency.

Description

Heat dissipation component and radiator with the heat dissipation component

technical field

The utility model relates to a radiator and a heat dissipation assembly, in particular to a radiator and a heat dissipation assembly with an embossed heat dissipation part formed on the surface of the heat dissipation assembly.

Background technique

Radiators are widely used. They are generally used on electronic components that generate heat (such as CPU) or in lamps (such as halogen, LED lamps), etc. to assist in heat dissipation. Radiators with cooling fins It is the most common. As shown in FIG. 11 , it is a well-known heat sink. On the top surface 111 of the base body 11, a plurality of heat dissipation fins 13 arranged side by side and equidistantly arranged are affixed by means of solder 12. on the top surface 111 of the seat body 11 .

The purpose of the heat dissipation fins 13 is to increase the area of heat dissipation in a large amount. The bottom surface 112 of the base body 11 can contact the heat source, and then it is absorbed by the base body 11 and then quickly transferred to each surface 131 of each heat dissipation fin 13, so as to achieve assistance in heat dissipation. the goal of.

However, since the heat dissipation fins 13 are welded on the top surface 111 of the base body 11 by means of the solder 12, and the thermal conductivity coefficient of the solder 12 is different from that of the base body 11 and the heat dissipation fins 13, when the heat source is conducted to the heat dissipation fins 13, the solder 12 will cause a situation of heat conduction loss, so that the effect of heat dissipation from the heat source to the heat dissipation fins 13 will be deteriorated.

Secondly, each surface 131 of the above-mentioned heat dissipation fins 13 is a flat plane, although the purpose of assisting heat dissipation can be achieved, but the heat dissipation surface area of a flat plane is still insufficient, so that the heat dissipation effect is still not good; therefore, how to design It is a subject that can be improved to develop a heat sink that can effectively dissipate heat from a heat source, and to improve the heat dissipation effect of heat dissipation components such as heat dissipation fins.

Contents of the invention

The purpose of the utility model is to provide a heat dissipation component and a heat sink with the heat dissipation component, which avoids the use of solder to avoid heat conduction loss and improves the heat dissipation efficiency of the heat dissipation component.

In order to achieve the above object, the present invention provides a heat dissipation component, which has a plurality of embossed heat dissipation parts protruding from at least one surface forming the heat dissipation component.

In order to achieve the above object, the present invention also provides a heat sink with a heat dissipation component, comprising: at least one substrate component, which includes a base and a plurality of extension arms extending from the base, each extension arm is adjacent to another There is a slot between the two extension arms; and a plurality of heat dissipation components, which are inserted into the corresponding slots of the substrate part, and the one side wall surface of the opposite side wall surface of each extension arm formed by the substrate part is tightly abutted to form each One of the two opposite surfaces of the heat dissipation component forms a plurality of embossed heat dissipation parts protruding from at least one surface of each heat dissipation component, and the top end and bottom end of each heat dissipation component protrude from the top of the substrate component. face and bottom.

The utility model has the benefits: the surface of the heat dissipation assembly forms an embossed heat dissipation part, so that the heat dissipation surface area of the heat dissipation assembly is improved, and compared with the heat dissipation assembly known as a flat plane such as heat dissipation fins, the heat dissipation can be improved The speed, in order to improve the heat dissipation effect of electronic components.

Furthermore, the radiator proposed by the utility model can be inserted into the slot between each extension arm of the base plate for the heat dissipation assembly, and the heat dissipation assembly can be tightly fixed by means of the two side walls of each extension arm. If it is firmly fixed, compared with the known way of fixing the heat dissipation component by welding, the utility model avoids the use of solder and has the effect of avoiding heat conduction loss.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

Fig. 1A is a three-dimensional schematic diagram of a heat dissipation assembly of the present invention;

Fig. 1B is a three-dimensional schematic diagram of another heat dissipation assembly of the present invention;

Fig. 2 is the three-dimensional exploded view of radiator of the present invention;

Fig. 3 is the three-dimensional assembly drawing of radiator of the present utility model;

Fig. 4 is the front view of part A of Fig. 3;

Fig. 5 is another three-dimensional exploded view of the utility model radiator;

Fig. 6 is a schematic diagram showing the implementation state of the utility model in which the blade presses the extension arm of the substrate to make it plastically deform;

7 is a perspective view of another embodiment of the utility model radiator;

Fig. 8 is the front view of part B of Fig. 7;

Fig. 9 is a partial perspective exploded view of another embodiment of the radiator of the present invention;

Fig. 10 is another perspective exploded view of another embodiment of the radiator of the present invention;

FIG. 11 is a schematic perspective view of a conventional radiator.

Among them, reference signs:

Seat body 11 top surface 111

Bottom side 112 Solder 12

Radiating fins 13 Surface 131

Substrate parts 2, 2’

Base 21, 21' Top 211, 211'

Bottom 212 Sidewall 213

Extension arm 22, 22' side wall surface 221, 221'

Slot 23, 23’

Thermal components 3

Top part 301 Bottom part 302

Surface 31 Embossed heat sink 311

connecting piece 4

Blade 5

Implementation

Please refer to FIG. 1A and FIG. 1B first. The utility model proposes a heat dissipation component 3, which protrudes from at least one surface 31 of the heat dissipation component 3 with a plurality of embossed heat dissipation parts 311, so as to increase the heat dissipation surface area of the heat dissipation component 3. Further improve heat dissipation efficiency, and each embossed heat dissipation portion 311 is in the shape of a rhombus; wherein, as shown in FIG. 1A, the heat dissipation component 3 is a heat dissipation fin. An embossed heat dissipation part 311 to achieve the best effect of improving heat dissipation; or, as shown in Figure 1B, the heat dissipation assembly 3 is a metal lamp cup, and the embossed heat dissipation part 311 is formed on its outer surface to enhance the heat dissipation effect. When the metal lamp cup is used, it can further increase the heat dissipation surface area to improve the heat dissipation effect. However, forming a plurality of embossed heat dissipation parts 311 on the surface of the heat dissipation assembly 3 can increase the heat dissipation efficiency by about 5%.

Please refer to FIG. 2 to FIG. 6 again. The utility model also proposes a heat sink with heat dissipation components, which includes a base plate 2 and a plurality of heat dissipation components 3 .

The substrate member 2 includes a base 21 and a plurality of extension arms 22, the base 21 has a top surface 211, a bottom surface 212 and a side wall 213, each extension arm 22 is formed by extending from the side wall 213 of the base 21 at intervals, and each There is a slot 23 between the extension arm 22 and the other two adjacent extension arms 22 . Wherein, the base 21 can be a circular plate or a polygonal plate, and in the drawings of the present utility model, a circular plate is used as an example.

Each heat dissipation assembly 3 is a heat dissipation fin, which can be a circular plate (as shown in Figure 2) or a polygonal plate (as shown in Figure 5), and each heat dissipation assembly 3 has a relative The top end portion 301 and the bottom end portion 302, and have two opposite surfaces 31, at least one surface 31 of each heat dissipation component 3 protrudes from a plurality of embossed heat dissipation portions 311, preferably, the two opposite surfaces 31 are An embossed heat dissipation portion 311 is extended, and the embossed heat dissipation portion 311 of each heat dissipation assembly 3 is in the shape of a rhombus, which is formed by embossing technology.

Each heat dissipation assembly 3 is inserted into the corresponding slot 23 of the substrate part 2, and the side wall surface 221 of the side wall surface 221 of the two side wall surfaces 221 of each extension arm 22 of the substrate part 2 is pressed against the two surfaces forming each heat dissipation assembly 3 A surface 31 of 31 is used to directly fix each heat dissipation component 3 , and the top end 301 and bottom end 302 of each heat dissipation component 3 protrude from the top surface 211 and bottom surface 212 of the substrate component 2 .

In this embodiment, the connection between each heat dissipation component 3 and the substrate component 2 can be riveted to press each extension arm 22 of the substrate component 2 so that it is tightly abutted against the corresponding heat dissipation component 3 Surface 31.

Please refer to FIG. 7 , the above-mentioned riveting technique consists of a plurality of blades 5 pressing in a two-way manner on the top surface and bottom surface of the extension arm 22 corresponding to the substrate part 2, so that the extension arm 22 is plastically deformed, so that The two side wall surfaces 221 of each extension arm 22 are pressed against the corresponding surface 31 of the heat dissipation component 3 .

Please refer to FIG. 7 and FIG. 8 , which is another embodiment of the present utility model, which is different from the above-mentioned embodiment in that each extension arm 22 of the substrate member 2 bends from the side wall 213 of the base 21 Folded and extended to shape.

In addition, there may be a connecting piece 4 between every two heat dissipation components 3 , the two sides of which are integrally connected to the two heat dissipation components 3 , so that the two heat dissipation components 3 can be connected together in pairs.

Each heat dissipation assembly 3 is similarly inserted into the corresponding slot 23 of the substrate part 2, and as described above, the one side wall surface 221 of the opposite two side wall surfaces 221 of each extension arm 22 formed by the substrate part 2 is tightly abutted against A surface 31 of two opposite surfaces 31 of each heat dissipation component 3 is formed.

In this embodiment, the free end of the extension arm 22 of the substrate member 2 can be folded toward the base 21, so that each extension arm 22 is bent and extended, and each extension arm 22 is pressed together so that both sides The wall surface 221 can be tightly abutted against the corresponding heat dissipation component 3 , so that each heat dissipation component 3 can be directly and stably fixed on the side edge of the substrate component 2 .

Please refer to Fig. 9 and Fig. 10, which is another embodiment of the present utility model, which is different from the above-mentioned embodiments in that it includes two symmetrical substrate parts 2, 2', the two substrates The parts 2, 2' are stacked with each other, and each extension arm 22' of one base part 2' corresponds to the slot 23 of the other base part 2, and each extension arm 22, 22 of the two base parts 2, 2' 22 ′ is formed by bending and extending from the sidewalls 213 , 213 ′ of the two base portions 21 .

Each heat dissipation component 3 is arranged in the corresponding slot 23, 23' between the two substrate parts 2, 2', and the same two substrate parts 2, 2' form opposite sides of each extension arm 22, 22' One side wall surface 221 , 221 ′ of the wall surface 221 , 221 ′ is in tight contact with a surface 31 forming two opposite surfaces 31 of each heat dissipation component 3 .

In this way, as shown in Figure 9, the free ends of the extension arms 22, 22' of the two substrate components 2, 2' can extend in the same direction; or, as shown in Figure 10, the extension arms 22 of the two substrate components 2, 2' , The free ends of 22' extend oppositely to each other.

In this embodiment, the free ends of the extension arms 22, 22' of the two base parts 2, 2' can be folded back toward the two bases 21, 21', so that each extension arm 22, 22' can be bent and extended, And press each extension arm 22, 22' so that the two side walls 221, 221' can press against the corresponding heat dissipation component 3, so that each heat dissipation component 3 can be directly and stably fixed on the two substrate components 2, 2' at the side edge.

In this way, it can be seen from each of the above-mentioned embodiments that the heat dissipation assembly 3 of the present invention has a plurality of embossed heat dissipation parts 311 protruding from the two opposite surfaces 31 of the heat dissipation assembly 3, so as to increase the heat dissipation. The heat dissipation surface area of the heat dissipation component 3. In addition, it is worth mentioning that the heat dissipation assembly 3 of the present invention can be applied to any type of heat sink, and is not limited to the heat sink mentioned in the present invention.

Based on the above description, the utility model provides the insertion of the heat dissipation assembly 3 through the slot 23, 23' between each extension arm 22, 22' of one or two substrate parts 2, 2', and with the help of each extension arm 22, The two side wall surfaces 221, 221' of 22' tightly fix the heat dissipation assembly 3 so that it can be firmly fixed. Compared with the known way of fixing the heat dissipation assembly by welding, the utility model avoids the use of solder and avoids heat conduction loss. As a result, at the same time, the use of solder is exempted, and it is more environmentally friendly (usually the solder contains lead; lead-free solder increases the cost).

Secondly, the top surface 211 or the bottom surface 212 of the substrate part 2, or a top surface 211' or a bottom surface 212 of the two substrate parts 2, 2' can be used to attach and touch electronic components that generate heat sources (such as LED lamps). etc.), the top and bottom ends 301, 302 of each heat dissipation component 3 protrude from the top surface 211, 211' and bottom surface 212 of one or two substrate components 2, 2', so that the airflow of the cooling/heat source can be The direction of flow into/out of the top surface 211 , 211 ′ and bottom surface 212 of the substrate 2 , 2 ′ is conducted bidirectionally, so that the heat dissipation effect of the electronic components can be more easily achieved.

In addition, at least one surface 31 of each heat dissipation component 3 forms an embossed heat dissipation portion 311, so that the heat dissipation surface area of each heat dissipation component 3 is improved, compared with the heat dissipation components known as a flat plane such as heat dissipation fins, etc. Under this condition, the heat dissipation rate can be increased, and the heat dissipation effect can be increased by about 5%, so as to further improve the heat dissipation effect of electronic components.

Certainly, the utility model also can have other various embodiments, under the situation of not departing from the spirit and essence of the utility model, those skilled in the art can make various corresponding changes and distortions according to the utility model, but these Corresponding changes and deformations should all belong to the scope of protection of the appended claims of the utility model.

Claims (10)

1, a kind of radiating subassembly is characterized in that, at least one surperficial projection that forms this radiating subassembly most embossing radiating parts is arranged.

2, radiating subassembly according to claim 1 is characterized in that, each embossing radiating part body that assumes diamond in shape.

3, radiating subassembly according to claim 1 is characterized in that, this radiating subassembly is a radiating fin or is a metalized lamp cup.

4, a kind of radiator of tool radiating subassembly is characterized in that, comprising:

At least one substrate spare, it comprises a base portion and most the adjutages that extend from this base portion, and what each adjutage was adjacent has slot between two adjutages in addition; And

A most radiating subassembly, it is inserted in the corresponding slot of this substrate spare, the urgent butt of a side wall surface that this substrate spare forms the relative two side walls of each adjutage forms a surface of each radiating subassembly two opposite surfaces, at least one surperficial projection that forms each radiating subassembly has most embossing radiating parts, and the top ends that has of each radiating subassembly and bottom this substrate spare of the projection end face and the bottom surface that have.

5, the radiator of tool radiating subassembly according to claim 4, it is characterized in that, combine each adjutage of oppressing this substrate spare with the technical approach of riveted between each radiating subassembly and this substrate spare, so that the surface of the corresponding radiating subassembly of its urgent butt, by most blades in two-way compressing mode, oppress end face and bottom surface respectively in the corresponding adjutage of this substrate spare, this adjutage plastic deformation, the surface of the corresponding radiating subassembly of the urgent butt of the two side walls of each adjutage.

6, the radiator of tool radiating subassembly according to claim 4 is characterized in that, the extension that the sidewall that each adjutage of this substrate spare has from this base portion bends.

7, the radiator of tool radiating subassembly according to claim 4, it is characterized in that, include two substrate spares, the mutual storehouse of this two substrates spare, wherein each adjutage of this substrate spare is corresponding to the slot of another this substrate spare, each adjutage of this two substrates spare is from the extension of the sidewall bending of this two base portion, and each radiating subassembly is located at corresponding slot between this two substrates spare.

8, according to the radiator of claim 6 or 7 described tool radiating subassemblies, it is characterized in that also having a connecting piece between per two radiating subassemblies, this brace both sides one connects this two radiating subassembly.

9, the radiator of tool radiating subassembly according to claim 7 is characterized in that, the extension in the same way of the free end of the adjutage of this two substrates spare, or the reverse extension mutually of the free end of the adjutage of this two substrates.

According to the radiator of claim 4,5,6 or 7 described tool radiating subassemblies, it is characterized in that 10, each radiating subassembly is a radiating fin, the embossing radiating part of each radiating subassembly body that all assumes diamond in shape.

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