CN104344200A - Composite board and manufacturing method thereof - Google Patents
Composite board and manufacturing method thereof Download PDFInfo
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- CN104344200A CN104344200A CN201410524449.8A CN201410524449A CN104344200A CN 104344200 A CN104344200 A CN 104344200A CN 201410524449 A CN201410524449 A CN 201410524449A CN 104344200 A CN104344200 A CN 104344200A
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- 239000002131 composite material Substances 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000011324 bead Substances 0.000 claims abstract description 12
- 238000005304 joining Methods 0.000 claims description 32
- 238000003466 welding Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 238000004080 punching Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
一种复合板材及其制造方法,包含第一板体与第二板体。第一板体由第一材料制成具有第一热传导系数,第一板体设置有第一接合部;第二板体由第二材料制成具有第二热传导系数,第二板体设置有第二接合部;第一接合部与第二接合部对应拼接,且第一接合部与第二接合部拼接处形成有焊道,第一热传导系数大于第二热传导系数。藉由本发明所提供的复合板材及其制造方法,是结合两种不同材料制成的板体,可维持必要的热传导性能,且板体拼接的方式在接合处不会额外增加厚度,亦不会过度增加材料成本。
A composite plate and its manufacturing method include a first plate body and a second plate body. The first plate body is made of a first material and has a first thermal conductivity coefficient, and the first plate body is provided with a first joint part; the second plate body is made of a second material and has a second thermal conductivity coefficient, and the second plate body is provided with a first joint part. Two joint parts; the first joint part and the second joint part are spliced correspondingly, and a weld bead is formed at the joint between the first joint part and the second joint part, and the first thermal conductivity coefficient is greater than the second thermal conductivity coefficient. The composite plate and its manufacturing method provided by the present invention combine plates made of two different materials, which can maintain the necessary thermal conductivity, and the way the plates are spliced does not increase the thickness at the joint, nor does it Excessive increase in material costs.
Description
【技术领域】【Technical field】
本发明涉及异种材料的结合,特别是结合两种板体的复合板材及其制造方法。The invention relates to the combination of dissimilar materials, in particular to a composite board combined with two boards and a manufacturing method thereof.
【背景技术】【Background technique】
电子装置中通常会设置高发热组件,例如高功率芯片或发光二极管模块,前述高发热组件需要有良好的散热措施,才能维持高发热组件的运作。Electronic devices are usually equipped with high-heat components, such as high-power chips or light-emitting diode modules. The above-mentioned high-heat components need good heat dissipation measures to maintain the operation of high-heat components.
以发光二极管模块为例,发光二极管模块通常被固定于一高导热金属板上,藉以透过金属板传导热量而将发光二极管模块产生的热量对外逸散。Taking the LED module as an example, the LED module is usually fixed on a metal plate with high thermal conductivity, so as to conduct heat through the metal plate and dissipate the heat generated by the LED module to the outside.
前述的金属板通常也是电子装置的重要结构组件,例如LED背光模块的背板。最常被应用于导热的金属材料则为铜,若以铜(或其他高导热金属)制作整片大面积的背板,将会使得背板的材料成本过度提高。The aforementioned metal plate is usually also an important structural component of an electronic device, such as a backplane of an LED backlight module. Copper is the most commonly used metal material for heat conduction. If copper (or other metals with high thermal conductivity) is used to make a large-area backplane, the material cost of the backplane will be excessively increased.
为解决成本问题,前述背板会采用复合板材的方式制作。发光二极管模块会设置在一片面积较小但是导热系数高的金属板,而高导热金属板在进一步结合于另一片材料成本较低的金属板,而结合形成一完整的背板。In order to solve the cost problem, the above-mentioned backboard will be made of composite board. The light-emitting diode module is arranged on a metal plate with a small area but high thermal conductivity, and the high thermal conductivity metal plate is further combined with another metal plate with lower material cost to form a complete backplane.
前述两个金属板的结合,通常都是使得两个金属板局部叠合,再透过螺丝、铆接、胶贴等方式,将重叠部分材料接合。The above-mentioned combination of the two metal plates is usually to partially superimpose the two metal plates, and then join the materials of the overlapped parts by means of screws, riveting, and glue.
前述的接合方式,螺丝、铆接有额外零组件成本问题,且组装方式相对复杂;而采用胶贴贴合方式会造成导热能力下降。The above-mentioned joining methods, screws and riveting have the problem of additional component costs, and the assembly method is relatively complicated; and the use of adhesive bonding will cause a decrease in thermal conductivity.
此外,两个金属板局部叠合会使得局部厚度增加,同时因为不同材料的热膨胀系数不同,叠合部分容易产生翘曲及局部性凹凸等问题,使材料产生不必要的变形并降低两个金属板之间的热传导效率。In addition, the partial superposition of two metal plates will increase the local thickness. At the same time, due to the different thermal expansion coefficients of different materials, the superimposed part is prone to warpage and local unevenness, which will cause unnecessary deformation of the material and reduce the thickness of the two metal plates. Efficiency of heat transfer between plates.
【发明内容】【Content of invention】
为解决上述问题,本发明提供一种复合板材及其制造方法,是结合两种不同材料制成的板体,且板体拼接的方式在接合处不会额外增加厚度。In order to solve the above problems, the present invention provides a composite board and its manufacturing method, which combines two boards made of different materials, and the boards are spliced without adding additional thickness at the junction.
本发明所提供的一种复合板材,包含第一板体与第二板体。第一板体由第一材料制成具有第一热传导系数,第一板体设置有第一接合部;第二板体由第二材料制成具有第二热传导系数,第二板体设置有第二接合部。A composite board provided by the present invention includes a first board body and a second board body. The first board is made of a first material and has a first thermal conductivity, and the first board is provided with a first joint; the second board is made of a second material and has a second thermal conductivity, and the second board is provided with a first joint. Two joints.
前述第一接合部与第二接合部对应拼接,且第一接合部与第二接合部拼接处形成有焊道,且第一热传导系数大于第二热传导系数。The aforementioned first joint portion and the second joint portion are spliced correspondingly, and a weld bead is formed at the joint of the first joint portion and the second joint portion, and the first heat transfer coefficient is greater than the second heat transfer coefficient.
更进一步的,本发明的至少一实施例中,第一接合部设置有至少一凸出部,第二接合部设置有至少一凹口部,凸出部与凹口部对应拼接。Furthermore, in at least one embodiment of the present invention, the first joint part is provided with at least one protruding part, the second joint part is provided with at least one notch part, and the protruding part and the notch part are spliced correspondingly.
更进一步的,本发明的至少一实施例中,第一接合部设置有至少一凹口部,第二接合部设置有至少一凸出部,凹口部与凸出部对应拼接。Furthermore, in at least one embodiment of the present invention, the first joint part is provided with at least one notch part, the second joint part is provided with at least one protrusion part, and the recess part and the protrusion part are spliced correspondingly.
更进一步的,本发明的至少一实施例中,第一接合部设置有多个凸出部及多个凹口部,第二接合部亦设置有多个凹口部及多个凸出部,第一接合部的多个凸出部对应第二接合部的多个凹口部,第一接合部的多个凹口部对应第二接合部的多个凸出部。Furthermore, in at least one embodiment of the present invention, the first joint part is provided with a plurality of protrusions and a plurality of notches, and the second joint part is also provided with a plurality of recesses and a plurality of protrusions, The plurality of protrusions of the first engaging portion correspond to the plurality of notches of the second engaging portion, and the plurality of notches of the first engaging portion correspond to the plurality of protrusions of the second engaging portion.
更进一步的,本发明的至少一实施例中,凸出部及凹口部为楔形。Furthermore, in at least one embodiment of the present invention, the protrusion and the notch are wedge-shaped.
更进一步的,本发明的至少一实施例中,第一接合部及第二接合部设置有冲压部。Furthermore, in at least one embodiment of the present invention, the first joint part and the second joint part are provided with stamping parts.
再者,本发明所提供的一种复合板材制造方法,其制造步骤为:Furthermore, a kind of composite plate manufacturing method provided by the present invention, its manufacturing steps are:
步骤1:提供第一板体,第一板体是由第一材料制成具有第一热传导系数,且第一板体设置有第一接合部。Step 1: providing a first plate body, the first plate body is made of a first material with a first thermal conductivity, and the first plate body is provided with a first joint portion.
步骤2:提供第二板体,第二板体是由第二材料制成具有第二热传导系数,且第二板体设置有第二接合部。Step 2: providing a second plate body, the second plate body is made of a second material with a second thermal conductivity, and the second plate body is provided with a second joint portion.
步骤3:将第一板体的第一接合部与第二板体的第二接合部进行拼接;并在第一接合部与第二接合部拼接处以焊接的方式进行接合,形成复合板材。Step 3: splicing the first joint part of the first plate body and the second joint part of the second plate body; and welding the first joint part and the second joint part to form a composite plate.
步骤4:对第一板体的冲压部及/或第二板体的冲压部进行冲压。Step 4: Stamping the stamped part of the first plate body and/or the stamped part of the second plate body.
本发明所提出的复合板材及其制造方法,结合两种不同材料制成的板体,可维持必要的热传导性能,而又不会过度增加材料成本。同时,本发明的第一板体与第二板体之间的结合结构,是采用平面嵌接(in-plane)的形式,结合处不会因为板体重叠而增加厚度,但仍可维持有效的结合力。同时,平面嵌接(in-plane)的结合形式,热膨胀反而会使得凸出部及凹口部之间的紧配效果加强,并避免因热膨胀系数差异造成非预期的变形。The composite plate and its manufacturing method proposed by the present invention can maintain the necessary heat conduction performance without excessively increasing the material cost by combining two plates made of different materials. At the same time, the bonding structure between the first plate and the second plate of the present invention adopts the form of plane embedding (in-plane), and the thickness of the joint will not increase due to overlapping of the plates, but it can still maintain an effective combination. At the same time, in the in-plane combination form, the thermal expansion will strengthen the tight fitting effect between the protruding part and the notch part, and avoid unexpected deformation caused by the difference in thermal expansion coefficient.
【附图说明】【Description of drawings】
图1为本发明第一实施例的爆炸图。Fig. 1 is an exploded view of the first embodiment of the present invention.
图2为本发明第一实施例的立体图。Fig. 2 is a perspective view of the first embodiment of the present invention.
图3为本发明第二实施例的爆炸图。Fig. 3 is an exploded view of the second embodiment of the present invention.
图4为本发明第二实施例的立体图。Fig. 4 is a perspective view of the second embodiment of the present invention.
图5为本发明第三实施例的爆炸图。Fig. 5 is an exploded view of the third embodiment of the present invention.
图6为本发明第三实施例的立体图。Fig. 6 is a perspective view of a third embodiment of the present invention.
图7为本发明第一实施例的一变化例的立体图。FIG. 7 is a perspective view of a modification example of the first embodiment of the present invention.
图8为本发明第二实施例中,第一板体与第二板体的一变化例的爆炸图。FIG. 8 is an exploded view of a modification example of the first plate body and the second plate body in the second embodiment of the present invention.
图9为本发明复合板材制造方法的实施步骤流程图。Fig. 9 is a flow chart of the implementation steps of the manufacturing method of the composite plate of the present invention.
【元件符号说明】[Description of component symbols]
复合板材 10Composite sheet 10
焊道 10aWeld bead 10a
第一板体 100The first board body 100
第一接合部 110First junction 110
第一凸出部 112First protrusion 112
第一凹口部 114First notch 114
吸热部 130Heat absorbing part 130
第一冲压部 140The first stamping department 140
第二板体 200Second plate body 200
第二接合部 210Second junction 210
第二凸出部 212Second protrusion 212
第二凹口部 214Second notch 214
第二冲压部 240The second stamping department 240
热源 300Heat source 300
复合板材制造步骤 S01、S02、S03、S04Composite sheet manufacturing steps S01, S02, S03, S04
【具体实施方式】【Detailed ways】
本发明主要揭露一种复合板材及其制造方法,其中焊接的基本原理已为相关技术领域的技术人员所熟知,故以下文中的说明,不再对焊接过程作完整描述。同时,以下文中所对照的图式,主要表达与本发明特征有关的结构示意,并未亦不需要依据实际尺寸完整绘制,在先说明。The present invention mainly discloses a composite plate and its manufacturing method, wherein the basic principle of welding is well known to those skilled in the relevant technical field, so the following description will not fully describe the welding process. At the same time, the diagrams compared below mainly express the structural representations related to the features of the present invention, and are not and need not be completely drawn according to the actual size, and will be explained first.
请参考图1与图2所示,为本发明第一实施例所揭露的一种复合板材10,包含第一板体100与第二板体200。第一板体100与第二板体200用以被拼接成面积相对较大的复合板材10。Please refer to FIG. 1 and FIG. 2 , which is a composite board 10 disclosed in the first embodiment of the present invention, including a first board body 100 and a second board body 200 . The first plate body 100 and the second plate body 200 are used to be spliced into a relatively large composite plate 10 .
更进一步的,第一板体100由第一材料制成具有第一热传导系数,第一板体100设置有第一接合部110;第二板体200由第二材料制成具有第二热传导系数,第二板体200设置有第二接合部210。Furthermore, the first plate body 100 is made of a first material with a first thermal conductivity coefficient, and the first plate body 100 is provided with a first joint portion 110; the second plate body 200 is made of a second material with a second thermal conductivity coefficient , the second plate body 200 is provided with a second joint portion 210 .
请参考图2所示,第一接合部110的第一凸出部112拼接于第二接合部210的第二凹口部214,使第一接合部110紧密接触第二接合部210而形成焊道10a(如图2中所示),用以供焊接第一接合部110与第二接合部210。同理,也可以由第一接合部110设置第一凹口部(图中未表式)拼接于第二接合部210的第二凸出部(图中未表式),使第一接合部110紧密接触第二接合部210而形成焊道10a,用以供焊接第一接合部110与第二接合部210。Please refer to FIG. 2, the first protrusion 112 of the first joint 110 is spliced to the second notch 214 of the second joint 210, so that the first joint 110 is in close contact with the second joint 210 to form a weld. The channel 10a (as shown in FIG. 2 ) is used for welding the first joint portion 110 and the second joint portion 210 . In the same way, the first notch portion (not represented in the figure) can also be provided with the first engaging portion 110 to be spliced to the second protruding portion (not represented in the figure) of the second engaging portion 210, so that the first engaging portion 110 closely contacts the second joint portion 210 to form a weld bead 10 a for welding the first joint portion 110 and the second joint portion 210 .
前述的焊接方式可以是有焊料的焊接或无焊料的焊接,第一板体100与第二板体200焊接方式最佳为激光焊接;此外,第一接合部110的第一凸出部112与第二接合部210的第二凹口部214的结合,可以延长焊道10a,并提供额外的紧配结合力,而加强第一板体100与第二板体200之间的结合。The aforementioned welding method can be welding with solder or welding without solder, and the best welding method between the first board body 100 and the second board body 200 is laser welding; The combination of the second notch portion 214 of the second joint portion 210 can extend the weld bead 10 a and provide additional close-fitting force, thereby strengthening the combination between the first plate body 100 and the second plate body 200 .
更进一步的,在一个具体实施例中,第一板体100由第一材料制成具有第一热传导系数与第二板体200由第二材料制成具有第二热传导系数不同,例如第一板体100为铜,而第二板体200为铝,使得第一热传导系数大于第二热传导系数。如此一来,第一板体100相对于第二板体200具有相对较为优异的热传导性能,第一板体100不同于第一接合部110的一个边上可以装设热源300(例如高功率芯片、发光二极管模块等),并可透过第一板体100进行快速导热,避免第一板体100接触热源300处形成高温的热点区域。在图1与图2中,第一板体100还可以包含有一个吸热部130,吸热部130可由第一板体100装设热源300的一边弯折形成,吸热部130可将热源300所产生的热传递至第一板体100,再由第一板体100通过焊道10a扩散至第二板体200以进行散热。Furthermore, in a specific embodiment, the first plate body 100 is made of a first material with a first thermal conductivity and the second plate body 200 is made of a second material with a second thermal conductivity, for example, the first plate The body 100 is copper, and the second plate body 200 is aluminum, so that the first thermal conductivity is greater than the second thermal conductivity. In this way, the first board body 100 has relatively excellent heat conduction performance compared with the second board body 200, and a heat source 300 (for example, a high-power chip , light-emitting diode module, etc.), and conduct rapid heat conduction through the first board 100 , preventing the first board 100 from contacting the heat source 300 to form a high-temperature hotspot. In Fig. 1 and Fig. 2, the first plate body 100 can also include a heat absorbing portion 130, the heat absorbing portion 130 can be formed by bending one side of the first plate body 100 where the heat source 300 is installed, and the heat absorbing portion 130 can turn the heat source The heat generated at 300 is transferred to the first plate body 100 , and then diffused from the first plate body 100 to the second plate body 200 through the weld bead 10 a for heat dissipation.
在实际操作过程中,第二板体200可以使用成本相对较低的材料制作,从而降低复合板材10的制作成本,使得复合板材10的制作成本可以低于完全使用第一板体100制作的板材。In actual operation, the second board body 200 can be made of relatively low-cost materials, thereby reducing the manufacturing cost of the composite board 10 , so that the manufacturing cost of the composite board 10 can be lower than that of a board made entirely of the first board body 100 .
请参考图3与图4所示,为本发明第二实施例所揭露的一种复合板材10,包含第一板体100与第二板体200。Please refer to FIG. 3 and FIG. 4 , which is a composite board 10 disclosed in the second embodiment of the present invention, including a first board body 100 and a second board body 200 .
在第二实施例中,第一接合部110设置有多个第一凸出部112,第二接合部210设置有多个第二凹口部214,第一凸出部112与第二凹口部214设置的位置形成对应;自然地,当第一接合部110设置有多个第一凸出部112时,第一凸出部112之间会形成有第一凹口部114,同理,第二接合部210设置多个第二凹口部214时,第二凹口部214之间会形成多个第二凸出部212,且第一凹口部114与第二凸出部214的位置形成对应;藉此,第一接合部110与第二接合部210可以相互对应进行拼接,使得第一接合部110紧密接触第二接合部210而形成焊道10a。通过多个第一凸出部112、多个第一凹口部114、多个第二凸出部212、多个第二凹口部214的组合,可有效地延伸焊道10a的长度,并且降低第一板体100与第二板体200之间的接触热阻。特别是第一凸出部112朝向至第二板体200的中间部分延伸,且第二凸出部212朝向第一板体100的中间部分延伸,可以加强第一板体100与第二板体120之间的热交换,使得热源的热量可以快速地由第一板体100传递至第二板体200,避免热量持续集中于第一板体100。In the second embodiment, the first joint part 110 is provided with a plurality of first protrusions 112, the second joint part 210 is provided with a plurality of second notches 214, and the first protrusions 112 and the second notches The positions of the parts 214 are corresponding; naturally, when the first joint part 110 is provided with a plurality of first protruding parts 112, a first notch part 114 will be formed between the first protruding parts 112. Similarly, When the second joint portion 210 is provided with a plurality of second notches 214, a plurality of second protrusions 212 will be formed between the second notches 214, and the first notches 114 and the second protrusions 214 The positions are corresponding; thereby, the first joint part 110 and the second joint part 210 can be spliced corresponding to each other, so that the first joint part 110 closely contacts the second joint part 210 to form the weld bead 10a. Through the combination of the plurality of first protrusions 112, the plurality of first notches 114, the plurality of second protrusions 212, and the plurality of second notches 214, the length of the weld bead 10a can be effectively extended, and The thermal contact resistance between the first plate body 100 and the second plate body 200 is reduced. In particular, the first protruding portion 112 extends toward the middle portion of the second plate body 200, and the second protruding portion 212 extends toward the middle portion of the first plate body 100, which can strengthen the first plate body 100 and the second plate body. The heat exchange between 120 enables the heat from the heat source to be quickly transferred from the first plate body 100 to the second plate body 200 , avoiding continuous heat concentration on the first plate body 100 .
请参考图5与图6所示,为本发明第三实施例所揭露的一种复合板材10,包含第一板体100与第二板体200。Please refer to FIG. 5 and FIG. 6 , which are a composite board 10 disclosed in the third embodiment of the present invention, including a first board body 100 and a second board body 200 .
在第三实施例中,第一接合部110设置多个第一凸出部112及多个第一凹口部114,第二接合部210对应第一凸出部112及第一凹口部114的位置设置多个第二凹口部214及多个第二凸出部212,第一凸出部112与第二凹口部214及第一凹口部114及第二凸出部212可对应拼接。在本实施例中,各第一凸出部112的宽度随向外延伸的长度而渐增,且第二凸出部212的宽度随向外延伸的长度而渐增;各第一凹口部114的宽度随内凹的长度而渐增,且第二凹口部214的宽度随内凹的长度而渐增;具体来说,各第一凸出部112、各第一凹口部114、各第二凸出部212及各第二凹口部214形成楔形的形状,可进一步延长焊道10a的长度,并加强紧配结合力。焊道10a长度的延长,同时也增加了第一板体100与第二板体200之间的接触面积,从而更进一步降低第一板体100与第二板体200之间的接触热阻。同理,第一接合部110及第二接合部210所形成的多个凸出部或多个凹口部不仅限于楔形,可以为方形或梯形,甚至可为锯齿状结构,主要目的在于增加拼接后焊道10a的长度,强化第一板体100及第二板体200之间的接合力及导热效果。In the third embodiment, the first engaging portion 110 is provided with a plurality of first protrusions 112 and a plurality of first notches 114 , and the second engaging portion 210 corresponds to the first protrusions 112 and the first notches 114 A plurality of second notches 214 and a plurality of second protruding parts 212 are set at the positions, and the first protruding parts 112 and the second notches 214 and the first notches 114 and the second protruding parts 212 can correspond stitching. In this embodiment, the width of each first protruding portion 112 gradually increases with the length extending outward, and the width of the second protruding portion 212 gradually increases with the length extending outward; each first notch portion The width of 114 gradually increases with the length of the indentation, and the width of the second notch portion 214 gradually increases with the length of the indentation; specifically, each first protruding portion 112, each first notch portion 114, Each second protruding portion 212 and each second notch portion 214 form a wedge-shaped shape, which can further extend the length of the welding bead 10a and strengthen the tight-fitting bonding force. The extension of the length of the weld bead 10 a also increases the contact area between the first plate body 100 and the second plate body 200 , thereby further reducing the contact thermal resistance between the first plate body 100 and the second plate body 200 . Similarly, the multiple protrusions or multiple notches formed by the first joint 110 and the second joint 210 are not limited to wedge shapes, but may be square or trapezoidal, or even zigzag, the main purpose of which is to increase splicing The length of the rear weld bead 10 a strengthens the bonding force and heat conduction effect between the first plate body 100 and the second plate body 200 .
请参考图7与图8所示,在另外一种实施状态下,第一板体100的第一接合部110可进一步设置第一冲压部140,更具体的说,第一冲压部140设于第一凸出部112上,用以被冲压;同理,第二板体200的第二接合部210也可设置有第二冲压部240,第二冲压部240设于第二凸出部212上,同样可用以被冲压。在具体操作过程中,可以仅设置第一冲压部140或仅设置第二冲压部240,也可以同时设置第一冲压部140及第二冲压部240。当第一凸出部112拼接于第二凹口部214,且第一冲压部140被冲压变形时,第一凸出部112的边缘可向外扩张,使得第一凸出部112的边缘更紧密地接触第二凹口部214的边缘;同理,当第二凸出部212拼接于第一凹口部114,且第二冲压部240被冲压变形时,第二凸出部212的边缘可向外扩张,使得第二凸出部212的边缘更紧密地接触第一凹口部114的边缘,藉此,加强紧配结合力,并降低接触热阻。Please refer to FIG. 7 and FIG. 8 , in another implementation state, the first joint portion 110 of the first plate body 100 may be further provided with a first stamping portion 140 , more specifically, the first stamping portion 140 is disposed on The first protruding part 112 is used to be stamped; similarly, the second joint part 210 of the second plate body 200 may also be provided with a second stamping part 240, and the second stamping part 240 is arranged on the second protruding part 212 on, can also be used to be stamped. In a specific operation process, only the first stamping part 140 or only the second stamping part 240 may be provided, or both the first stamping part 140 and the second stamping part 240 may be provided. When the first protruding portion 112 is spliced to the second notch portion 214, and the first punching portion 140 is stamped and deformed, the edge of the first protruding portion 112 can expand outward, so that the edge of the first protruding portion 112 is more closely contact the edge of the second notch portion 214; similarly, when the second protruding portion 212 is spliced to the first notch portion 114, and the second stamping portion 240 is stamped and deformed, the edge of the second protruding portion 212 It can expand outward, so that the edge of the second protruding portion 212 is in closer contact with the edge of the first notch portion 114 , thereby enhancing the close-fit bonding force and reducing contact thermal resistance.
请参考图9所示,本发明所提供的一种复合板材制造方法,其步骤为:Please refer to Figure 9, a method for manufacturing a composite panel provided by the present invention, the steps are:
步骤1S01:提供第一板体,第一板体是由第一材料制成具有第一热传导系数,且第一板体设置有第一接合部。Step 1S01: providing a first plate body, the first plate body is made of a first material with a first thermal conductivity coefficient, and the first plate body is provided with a first joint portion.
步骤2S02:提供第二板体,第二板体是由第二材料制成具有第二热传导系数,且第二板体设置有第二接合部。Step 2S02 : providing a second plate body, the second plate body is made of a second material with a second thermal conductivity, and the second plate body is provided with a second joint portion.
其中第一板体由第一材料制成具有第一热传导系数与第二板体由第二材料制成具有第二热传导系数不同,例如第一板体为铜,而第二板体为铝,使得第一热传导系数大于第二热传导系数。如此一来,第一板体相对于第二板体具有相对较为优异的热传导性能,第一板体不同于第一接合部的一个边上可以装设热源(例如高功率芯片、发光二极管模块等),并可快速导热,避免第一板体接触热源处形成高温的热点区域。Wherein the first plate body is made of a first material and has a first thermal conductivity and the second plate body is made of a second material and has a second heat conductivity coefficient, for example, the first plate body is copper and the second plate body is aluminum, Make the first thermal conductivity greater than the second thermal conductivity. In this way, the first plate body has relatively excellent heat conduction performance compared with the second plate body, and a heat source (such as a high-power chip, a light-emitting diode module, etc.) can be installed on one side of the first plate body different from the first joint portion ), and can quickly conduct heat, avoiding the formation of high-temperature hot spots where the first board contacts the heat source.
步骤3S03:将第一板体的第一接合部与第二板体的第二接合部进行拼接;并在第一接合部与第二接合部拼接处以焊接的方式进行接合,形成复合板材。Step 3S03: splicing the first joint portion of the first plate body and the second joint portion of the second plate body; and joining the first joint portion and the second joint portion by welding to form a composite plate.
更进一步的,第一接合部可以设置一个或多个第一凸出部及第一凹口部,第二接合部也可对应设置有一个或多个第二凸出部及第二凹口部,各第一凸出部、各第一凹口部、各第二凸出部及各第二凹口部可以为楔形、方形或梯形等形状。Furthermore, the first joint part can be provided with one or more first protrusions and first notches, and the second joint part can also be provided with one or more second protrusions and second notches correspondingly , each first protruding portion, each first notch portion, each second protruding portion and each second notch portion may be wedge-shaped, square or trapezoidal in shape.
步骤4S04:对第一板体的冲压部及/或第二板体的冲压部进行冲压;第一板体进一步可设置有第一冲压部,第一冲压部设于第一凸出部上,用以被冲压,第二板体也可设置有第二冲压部,第二冲压部设于第二凸出部上,同样用以被冲压。Step 4S04: Stamping the stamping part of the first plate body and/or the stamping part of the second plate body; the first plate body may further be provided with a first stamping part, and the first stamping part is provided on the first protruding part, To be stamped, the second plate body may also be provided with a second stamping portion, which is arranged on the second protruding portion and is also used to be stamped.
当第一凸出部拼接于第二凹口部后,对第一冲压部进行冲压使其变形时,第一凸出部的边缘可向外扩张,使得第一凸出部的边缘更紧密地接触第二凹口部的边缘;同理,当第二凸出部拼接于第一凹口部,对第二冲压部进行冲压使其变形时,第二凸出部的边缘可向外扩张,使得第二凸出部的边缘更紧密地接触第一凹口部的边缘,藉此,加强紧配结合力,并降低接触热阻。After the first protruding part is spliced to the second notch part, when the first punching part is stamped to deform, the edge of the first protruding part can expand outward, so that the edge of the first protruding part can be more tightly Contact the edge of the second notch; similarly, when the second protrusion is spliced to the first notch, and the second stamping part is stamped to deform it, the edge of the second protrusion can expand outwards, The edge of the second protruding portion is made to more closely contact the edge of the first notch portion, thereby enhancing the close-fit bonding force and reducing contact thermal resistance.
藉由本发明所提供的复合板材及其制造方法,是结合两种不同材料制成的板体,可维持必要的热传导性能,而又不会过度增加材料成本。同时,本发明的第一板体与第二板体之间的结合结构,是采用平面嵌接(in-plane)的形式,结合处不会因为板体重叠而增加厚度,但仍可维持有效的结合力。The composite board and its manufacturing method provided by the present invention combine boards made of two different materials, which can maintain the necessary heat conduction performance without excessively increasing the material cost. At the same time, the bonding structure between the first plate and the second plate of the present invention adopts the form of plane embedding (in-plane), and the thickness of the joint will not increase due to overlapping of the plates, but it can still maintain an effective combination.
以上所述仅为本发明较佳的实施方式,并非用以限定本发明的权利范围;同时以上的描述,对于相关技术领域专门人士应可明了及实施,因此其他未脱离本发明所揭示的精神下所完成的等效改变或修饰,均应包含在权利要求中。The above description is only a preferred implementation mode of the present invention, and is not intended to limit the scope of rights of the present invention; at the same time, the above description should be clear and implementable for those skilled in the relevant technical field, so others do not depart from the spirit disclosed in the present invention The equivalent changes or modifications accomplished below shall be included in the claims.
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TW103206690U TWM493071U (en) | 2014-04-17 | 2014-04-17 | Composite sheet |
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CN110340527A (en) * | 2019-07-16 | 2019-10-18 | 西南交通大学 | Engagement tabs sheet welding method based on galvanometer laser |
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TWM493071U (en) | 2015-01-01 |
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