CN201158702Y - A dynamic magnetron arc source device for improving arc ion plating deposition process - Google Patents

Abstract

The utility model relates to the field of film preparation, in particular to a novel dynamic magnetron arc source device for improving the arc ion plating deposition process. The dynamic magnetron arc source device for improving the arc ion plating deposition process is provided with a dynamic control magnetic field generator, a target, and a target base, the target is installed on the target base, and the dynamic control magnetic field generator is the main control magnetic field generator It is composed of an auxiliary magnetic field generating device, the main control magnetic field generating device is placed behind the target, and placed coaxially with the target, and the auxiliary magnetic field generating device is sleeved around the main control magnetic field generating device. The utility model uses two sets of magnetic field generating devices to form a dynamically distributed arched magnetic field on the target surface, so as to improve the arc spot discharge form and work stability, control the arc spot movement trajectory, and improve the etching uniformity of the target. and target utilization, reducing the emission of large particles of the target for the purpose of preparing high-quality thin films.

Description

A dynamic magnetron arc source device for improving arc ion plating deposition process

technical field

The utility model relates to the field of film preparation, in particular to a dynamic magnetron arc source device for improving the arc ion plating deposition process.

Background technique

Arc ion plating is one of the most important technologies in industrial coating production and scientific research. Due to its simple structure and process, high ionization rate (70%-80%), high incident particle energy, and good diffraction, it can achieve low temperature A series of advantages such as deposition have enabled the rapid development and wide application of arc ion plating technology, showing great economic benefits and industrial application prospects.

Arc ion plating is a coating technology based on the principle of gas discharge plasma physical vapor deposition. This technology relies on the local high temperature of the arc spot generated on the surface of the cathode target in the vacuum coating chamber, so that the cathode material as the target is evaporated and ionized instantaneously, and a plasma with high ionization degree and high ion energy is generated. Adding a negative potential can coat a layer of various hard films with high hardness, dense structure and good bonding on the surface of the workpiece under the condition of relatively low heating temperature of the workpiece.

The arc source structure used in arc ion plating is a cold cathode arc source. The behavior of the arc is controlled by many fast-moving, highly bright cathode spots on the cathode surface. The movement of the cathode spots has an impact on the physical characteristics of the arc plasma and the subsequent coating properties. big impact. Vacuum arc discharge is actually a series of arc events. Due to its rapid and continuous occurrence, it gives the impression of a moving arc. The movement of the cathode spot and the arc root determines the movement of the entire arc. The sequence of adjacent arc spots is ignited and Extinction constitutes the motion of the arc spot. Although the process of the internal structure of the arc spot is not well understood, in order to better improve the quality of the deposited film, effectively use the target material, and improve the discharge stability, the movement of the arc spot must be reasonably controlled.

Due to the physical characteristics of the vacuum arc, applying an external electromagnetic field is an effective method to control the movement of the arc spot. Different magnetic field components have different influences on the movement of the arc spot. When a magnetic field parallel to the cathode target surface is applied (transverse magnetic field, magnetic induction intensity B, see Fig. 1(a)), the arc spot does a reverse motion against the ampere force (Retrograde motion), that is, the direction of motion is opposite to the direction of the current force (-I×B), see Figure 1(b). The moving speed of the arc spot has a parabolic relationship with the strength of the transverse magnetic field, so it can be used to increase the moving speed of the arc spot. When the magnetic field intersects the cathode surface at a certain angle θ (sharp magnetic field, magnetic induction intensity B, see Figure 1(c)), the arc spot 17 also superimposes a drift motion (Robson drift) on the reverse motion, and the drift motion The direction of the direction points to the acute angle θ _B area between the magnetic force line and the cathode target surface, which is the acute angle principle (Acute angle principle), see Figure 1(d); in Figure 1(d), Φ _R represents the direction of the arc spot movement and the magnetic force line The angle between the intersecting lines with the target surface, θ _B ≈ Φ _R . The acute angle rule can be used to limit the movement direction of the arc spot and control the appearance position of the arc spot on the target surface. This rule is very important for the control of the arc spot movement and the uniformity of target etching. The above-mentioned law is the basic law of the influence of the magnetic field on the movement of the arc spot, and it is also the law that must be considered in the design of the magnetic field.

In the current arc ion plating technology, the magnetic field applied near the target mainly includes adding an axial magnetic field under a small-sized cylindrical target, such as CN89200444.4, US3,793,179, US3,625,878, etc., and applying an arched magnetic field to a large planar target, such as CN1157335A, and the longitudinal confinement magnetic field submerging the entire target in the Russian arc source structure. Although these magnetic fields with a certain shape applied near the target surface can effectively control the movement of the arc spot on the target surface, but according to the influence of the above-mentioned different magnetic field components on the movement of the arc spot, the arc spot in the axial magnetic field and the arc magnetic field The lower movement will be limited to a certain range on the target surface, and long-term etching will form obvious etching tracks on the target surface, which is not conducive to uniform etching of the target material, resulting in waste of target material. Although the magnetic field structure in the Russian arc source can make the arc spot etched on the entire target surface and effectively use the target material, the structure of the entire arc source is complicated, the operation is troublesome, and the special shape of the target material makes the target material difficult to process and high in cost. Moreover, the size of the target is small, and the comprehensive utilization rate is low. Since the magnetic fields controlling the movement of arc spots are all static, it is difficult to break through the limitation of mutual influence.

Ramalingam proposed a dynamic magnetic field design idea in patents WO8503954 and US4,673,477, which can achieve uniform etching of arc spots on large-area targets with simple structures. This method relies on the mechanical rotation of permanent magnets behind the target To change the distribution of the magnetic field on the target surface, thereby affecting the etching position of the arc spot on the target surface. However, this method needs to add a complex mechanical control mechanism, and involves many problems such as sealing and cooling, so it is difficult to popularize and apply. But this dynamic magnetic field design idea is worth thinking about and learning from.

Utility model content

The purpose of this utility model is to provide a new type of dynamic magnetron arc source device for improving the deposition process of arc ion plating, which is used to improve the discharge form and work stability of the arc spot of the arc ion plating cathode, control the movement track of the arc spot, and improve the Target etching uniformity and target utilization, reduce the emission of large particles of the target, to prepare high-quality thin films.

In order to achieve the above object, the technical solution of the utility model is:

A dynamic magnetron arc source device for improving the arc ion plating deposition process, the dynamic magnetron arc source device is provided with a dynamic control magnetic field generator, a target, and a target base, the target is installed on the target base, and the dynamic control The magnetic field generating device is composed of a main control magnetic field generating device and an auxiliary magnetic field generating device. The main controlling magnetic field generating device is placed behind the target and placed coaxially with the target, and the auxiliary magnetic field generating device is set around the main controlling magnetic field generating device.

The main control magnetic field generating device is composed of an electromagnetic coil and a magnetic yoke. The magnetic yoke is composed of a magnetically permeable cylinder on the periphery and a magnetically permeable column at the center. The lower ends of the magnetically permeable cylinder and the magnetically permeable column are connected or made of the same magnetically permeable material. In one piece, the upper end of the yoke remains open; the electromagnetic coil is sleeved on the magnetic post in the center of the yoke, and placed in the gap between the magnetic permeable cylinder and the magnetic permeable post.

The shapes of the electromagnetic coil and the yoke in the main control magnetic field generating device are round or square, and the shapes of the magnetically permeable cylinder, the magnetically permeable column and the coil in the yoke are consistent, and the three are coaxial.

The inner diameter of the coil in the main control magnetic field generating device is slightly larger than the diameter of the magnetically permeable cylinder, the outer diameter is slightly smaller than the inner diameter of the magnetically permeable cylinder, and the height of the coil is lower than the height of the magnetic yoke.

The electromagnetic coil in the main control magnetic field generating device is wound on the coil frame by enameled wire, the inside and outside of the coil are protected by insulation, and the magnetic yoke is made of nickel-plated pure iron with high magnetic permeability or other materials.

The tops of the magnetic tube and the magnetic column in the main control magnetic field generating device are flat or have slopes; when the tops of the magnetic tube and the magnetic column are sloped, the slopes at the top of the magnetic column are axisymmetrically narrow at the top and wide at the bottom. In the shape of a boss, the slope at the top of the magnetic cylinder is symmetrical to the slope at the top of the magnetic column, and the slope of the magnetic yoke is W-shaped.

The auxiliary magnetic field generating device is set on the outer periphery of the magnetic cylinder in the main control magnetic field generating device or the outer periphery of the target base column of the target base, and is coaxial with the main control magnetic field generating device or the target bottom column, and the auxiliary magnetic field generating device and the target base column are coaxial. The main control magnetic field generating device or the bottom pillars of the target are protected by insulation, and the position of the auxiliary magnetic field generating device is adjustable.

The shape of the auxiliary magnetic field generating device is consistent with that of the main control magnetic field generating device, and it is composed of an electromagnetic coil wound with enameled wire.

The coils in the main control magnetic field generating device and the auxiliary magnetic field generating device are adjusted individually or jointly, and a reverse current is passed between the two; the dynamic magnetic field is adjusted by adjusting the coil current in the main control magnetic field generating device and the auxiliary magnetic field generating device. Intensity, the current form of the coil is DC, AC or pulse, which can realize a variety of control methods for arc spots.

The target is directly water-cooled or indirectly water-cooled. The direct water-cooled main control magnetic field generating device is placed in the cooling water between the target base cylinders or between the target base cylinders outside the cooling water channel. The indirect water-cooled main control magnetic field The generating device is placed between the cylinders of the outer bottom column of the cooling water channel.

The technical principle of the utility model is:

As shown in Figure 2, according to the influence of different magnetic field components on the movement of the arc spot, if an arched magnetic field 15 with a certain curvature is formed on the target surface, the arc spot can be confined in the arched area under a certain magnetic field strength, and the arc The place where the spot is preferentially etched is the position where the longitudinal magnetic field on the target surface is zero and the transverse magnetic field is the largest, that is, the apex position of the arch. Under this magnetic field configuration, the arc spot will be constrained to move around the area centered on this position , forming a relatively narrow fixed etching track 16 . If the position of the arched magnetic field on the target surface can be adjusted reasonably, the position of its apex (the longitudinal magnetic field is zero and the transverse magnetic field is maximum) can be changed so that it can dynamically move across the entire target surface instead of being fixed at a specific position. constant, then the arc spot will appear in different positions on the entire target surface with the dynamic change of the magnetic field, instead of being limited to a specific area, so as to achieve uniform etching of the target and form a uniform etch track.

The dynamic control magnetic field of the utility model is composed of two sets of magnetic field generating devices, the main control magnetic field generating device and the auxiliary magnetic field generating device. The main control magnetic field generating device is placed behind the target and placed coaxially with the target, and is mainly used to generate an arched magnetic field that restricts the arc spot movement range. The auxiliary magnetic field generating device is set around the main control magnetic field generating device, which is mainly used to adjust the configuration of the arched magnetic field, change the position of the maximum value of the horizontal component of the magnetic field on the target surface and the position of the longitudinal component of zero, thereby adjusting the position of the arc spot on the target surface etched area. Two sets of magnetic field generators are used together to form a dynamically distributed arched magnetic field on the target surface to improve the arc spot discharge form and work stability, control the arc spot movement track, and improve target etching uniformity and target utilization Efficiency, reducing the emission of large particles of the target, for the purpose of preparing high-quality thin films.

The utility model has the following advantages:

1. The utility model realizes the dynamic control of the arc spot movement through the dynamic adjustable coupling magnetic field generated by the main control magnetic field generator and the auxiliary magnetic field generator, and improves the discharge form and working stability of the arc spot of the arc ion plating cathode. Control the trajectory of the arc spot, improve the uniformity of target etching and target utilization, reduce the emission of large target particles, and prepare high-quality thin films.

2. In the utility model, the main control magnetic field passes direct current, and the auxiliary magnetic field passes reverse currents of different forms and sizes, which can realize various control methods for arc spots and adapt to different conditions and needs.

3. The coupled use of two sets of magnetic field generating devices in the utility model can not only change the distribution of the magnetic field and control the movement track of the arc spot, but also can adjust the size of the magnetic field and control the movement speed of the arc spot.

4. The two sets of magnetic field generating devices in the utility model are easy to adjust and easy to operate. Only by changing the current ratio between the two can realize effective control of the arc spot, which meets the requirements of humanized operation in industrial production and scientific research.

5. The coil and yoke in the main control magnetic field generating device of the utility model are manufactured independently, easy to assemble and disassemble, and can be replaced separately; the coil position of the auxiliary magnetic field generating device is adjustable and can also be replaced separately.

6. The magnetic field generating device in the utility model is simple to manufacture, has a large adjustment range, low cost, and is easy to popularize.

Description of drawings

Figure 1(a)-Figure 1(d) are schematic diagrams of the influence of different magnetic field components on arc spot motion. Among them, Figure 1(a) is the application of a transverse magnetic field parallel to the cathode target surface; Figure 1(b) is the effect of the transverse magnetic field on the movement of the arc spot (reverse motion); Figure 1(c) is the application of a transverse magnetic field that intersects with the cathode surface A sharp-angle magnetic field at a certain angle; Figure 1(d) shows the influence of the sharp-angle magnetic field on the movement of the arc spot (the sharp-angle rule).

Fig. 2 is a schematic diagram of the movement law of the arc spot under the arched magnetic field.

3 is a schematic diagram of a dynamic magnetron arc source device for improving the arc ion plating deposition process in Embodiment 1.

Fig. 4 is a diagram of configuration changes of the magnetic lines of force under different ratios of "current × number of turns" between the coil of the auxiliary magnetic field generator and the coil of the main control magnetic field generator in Embodiment 1.

Fig. 5 is a schematic diagram of an arc ion plating arc source device with adjustable static magnetron control in Embodiment 2.

Fig. 6 is a schematic diagram of the movement track of the arc spot under different magnetic field conditions in Example 2.

Fig. 7 is a schematic diagram of a dynamic magnetron arc source device for improving the arc ion plating deposition process in Embodiment 3.

Figure 8(a)-Figure 8(b) is a schematic diagram of the movement track of the arc spot under different magnetic field conditions in Example 3; wherein, Figure 8(a) refers to the spiral expansion of the arc spot when the alternating current of the auxiliary magnetic field generating device changes from small to large Motion trajectory; Fig. 8(b) refers to the helical contraction trajectory of the alternating current of the auxiliary magnetic field generating device changing the arc spot from large to small.

Figure 9(a)-Figure 9(d) is the size distribution diagram of the longitudinal magnetic field component under different target thicknesses and different "current × turns" ratios in Example 1, and the zero point position is the position of the etching track; among them, Figure 9 (a) means that the thickness of the target is 1cm; Figure 9(b) means that the thickness of the target is 2cm; Figure 9(c) means that the thickness of the target is 3cm; Figure 9(d) means the thickness of the target The thickness is 4cm.

Fig. 10(a)-Fig. 10(b) are the size distribution diagrams of transverse magnetic field components on the surface of targets with different thicknesses under the same ratio of "current × turns" in Example 1; among them, Fig. 10(a) is "current × turns" The "number" ratio is -0.5; Figure 10(b) means that the "current × turns" ratio is -1.5.

Fig. 11 is a distribution diagram of magnetic field configurations of different magnetic yoke structures under the same ratio of "current × number of turns" in Embodiment 1 to Embodiment 3.

Fig. 12 is the size distribution diagram of the longitudinal magnetic field on the surface of the target with the same thickness under the same "current × number of turns" ratio and different yoke structures in Example 1-Example 3.

In the figure, 1 target; 2 target base; 3 target bottom column; 4 insulating ring; 5 magnetic yoke; 6 main control magnetic field generating device coil; 7 water inlet; 8 water outlet; Arc needle; 11 Coil of auxiliary magnetic field generating device; 12 Shielding cover; 13 Bolt; 14 Dynamic magnetic force line; 15 Arched magnetic field; 16 Fixed etching track; 17 Arc spot; 18 Static magnetic force line; 21 insulating thin plate; 22 circular etching track with changing position; 23 dynamic spiral etching track.

Detailed ways

The dynamic magnetron arc source device for improving the arc ion plating deposition process of the utility model mainly includes a dynamic control magnetic field generator, a target material, and a target base. The target material is installed on the target base. The main structure of the dynamic control magnetic field generator is as follows :

1. The main control magnetic field generating device placed behind the target in this utility model consists of two parts, an electromagnetic coil and a magnetic yoke. The magnetic yoke is composed of a magnetically permeable cylinder on the periphery and a magnetically permeable column at the center. The lower ends of the magnetically permeable cylinder and the magnetically permeable column are connected by the same magnetically permeable material or integrated, and the upper end remains open. The electromagnetic coil is sleeved on the magnetic post in the center of the yoke, and placed in the gap between the magnetic permeable cylinder and the magnetic permeable post. The magnitude of the magnetic induction is adjusted by adjusting the magnitude of the coil current, and the direction of the magnetic pole is changed by adjusting the direction of the current.

2. The shapes of the electromagnetic coil and the magnetic yoke in the main control magnetic field generating device of the present invention are round or square, and the shapes of the magnetic-conducting cylinder, the magnetic-conducting column and the coil in the magnetic yoke are consistent, and the three are coaxial.

3. The size of the electromagnetic coil and the magnetic yoke in the main control magnetic field generating device of the utility model is not limited, and it is made according to the specific target material. The inner diameter of the coil is slightly larger than the diameter of the magnetic conducting cylinder, the outer diameter is slightly smaller than the inner diameter of the magnetic conducting cylinder, and the height of the coil is lower than that of the magnetic yoke. The thickness of the magnetic cylinder in the yoke is about half of the diameter of the magnetic cylinder.

4. The electromagnetic coil in the main control magnetic field generating device of the utility model is wound on the coil frame by enameled wire. The type of enameled wire is not limited, and the inside and outside of the coil are protected by insulation. The yoke is made of nickel-plated pure iron with high magnetic permeability or other materials.

5. The tops of the magnetic tube and the magnetic column in the main control magnetic field generating device of the utility model are flat or inclined at a certain angle. The slope at the top of the magnetic cylinder is symmetrical to the slope at the top of the magnetic column, the slope of the magnetic yoke is W-shaped, and the angle of the slope is not limited.

6. The auxiliary magnetic field generating device of the utility model is set on the outer periphery of the magnetic tube or the outer periphery of the target bottom column in the main control magnetic field generating device, and is coaxial with the main control magnetic field generating device or the target bottom column, and generates The device or the base of the target is protected by insulation.

7. The shape of the auxiliary magnetic field generating device of the utility model is consistent with that of the main control magnetic field generating device, and the size is not limited, and it is composed of an electromagnetic coil wound by enameled wire. The position of the auxiliary magnetic field generating device can be adjusted, and the distribution of the main control magnetic field can be changed by adjusting the magnitude of the current.

8. The coils in the main control magnetic field generating device and the auxiliary magnetic field generating device of the utility model can be adjusted individually or jointly, and a reverse current is passed between the two. In order to achieve different effects, the current form of the electromagnetic coil can be DC, AC or pulse, and the current size can be adjusted by a voltage-regulated power supply.

(1) The main control magnetic field passes a certain size of direct current to form an arched magnetic field with a fixed configuration, and the auxiliary magnetic field generator can pass reverse direct current. By adjusting the magnitude of the current, the different "current × number of turns" between the two can be changed. Ratio, thereby changing the distribution of the arched magnetic field, to achieve the etching of the arc spot at different positions.

(2) The main control magnetic field passes a certain size of direct current to form an arched magnetic field in a fixed position, and the auxiliary magnetic field generating device can pass an alternating current (frequency can be adjusted) with the same size and change in the opposite direction, so that the " The ratio of "current × turns" changes continuously, and the movement of the arc spot is dynamically and continuously changed.

9. The target material of this utility model is directly water-cooled or indirectly water-cooled, and the main control magnetic field generating device behind the directly water-cooled target material is placed in the cooling water between the target bottom column cylinders or between the target material bottom column cylinders outside the cooling water channel The main control magnetic field generating device behind the indirect water-cooled target is placed between the outer bottom cylinder of the cooling water channel, and the yoke of the main control magnetic field placed in the cooling water is made of a material with high magnetic permeability that is not easy to rust, or Protected by nickel plating. The main control magnetic field generating device placed outside the cooling water channel and the base of the target are insulated and fixed.

10. In the utility model, the direct water-cooled target and the target base are connected by thread, and the indirect water-cooled target and the target base can be fixed by thread or other methods, such as rivets or bolts.

11. The base of the target material, the bottom column of the target material and the cooling water channel of the utility model are made of non-magnetic stainless steel, and are protected by insulation from the magnetic field generating device.

Below by embodiment and accompanying drawing, the utility model is described in further detail.

Example 1:

Accompanying drawing 3 is the schematic diagram of the dynamic magnetron arc source device for improving the arc ion plating deposition process in Embodiment 1 of the present utility model.

The dynamic magnetron arc source device for improving the arc ion plating deposition process mainly includes: target 1; target base 2; target bottom column 3; insulating ring 4; yoke 5; main control magnetic field generating device coil 6; water inlet 7 ; water outlet 8; arc coil 9; arc needle 10; auxiliary magnetic field generator coil 11; shield 12; bolt 13; The insulating ring 4 is used for the insulation between the bottom column 3 of the target and the coil 11 of the auxiliary magnetic field generator. The coil 6 of the main control magnetic field generator is set on the magnetic guide column 19 in the yoke 5 and placed behind the target 1 together. The coil 11 of the auxiliary magnetic field generator is set outside the cylinder of the target base 2 . The circulating water circulates through the water inlet 7 and the water outlet 8 to cool the target 1 . Bolts 13 are used to fix the yoke 5 on the target base. The arc starting needle 10 is connected to the arc starting coil 9 outside the target base 2, and the arc starting coil 9 drives the arc starting needle 10 to contact the target material 1 to start the arc. The shielding cover 12 is installed on the outside of the target 1, and its function is to restrain the arc spot and prevent the arc spot from running to the side of the target; the coil 6 of the main control magnetic field generating device is connected with direct current to generate an arched magnetic field that restricts the movement range of the arc spot; the auxiliary magnetic field The coil 11 of the generating device passes through a DC or AC with varying magnitudes, and the varying magnetic field generated by it is mainly used to adjust the configuration of the arched magnetic field, and the coupling of the two magnetic fields generates dynamic magnetic force lines 14 . The movement of the arc spot is controlled by the dynamic magnetic field confinement to generate a high-density plasma with fewer particles, which is deposited into a film under the action of a negative substrate bias.

The target 1 is a cylindrical metal target with a diameter of 200 mm, and the target base 2 is non-magnetic stainless steel. The target 1 and the target base 2 are connected by threads and directly cooled by water. The coil 6 of the main control magnetic field generator is placed between the cylinders of the target bottom post 3 outside the cooling water channel, and is protected with the target bottom post 3 by an insulating ring 4 (insulating thin tube). The yoke 5 in the main control magnetic field generator and the coil 6 of the main control magnetic field generator are all cylindrical, the magnetic guide column 19 in the center of the yoke 5 has a diameter of 30 mm, the outer diameter of the magnetic guide tube 20 is 130 mm, and the inner diameter is 100 mm. The lower end of the magnetic tube 20 and the magnetic column 19 is integrated, and the upper end is flush to keep the opening, and the magnetic yoke 5 is made of nickel-plated pure iron. The coil 6 of the main control magnetic field generating device is sleeved on the magnetically permeable column 19 at the center of the yoke 5 , and placed in the gap between the magnetically permeable cylinder 20 and the magnetically permeable column 19 . The coil 6 of the main control magnetic field generator has an inner diameter of 35 mm, an outer diameter of 95 mm, and a height of 35 mm. The main control magnetic field generator is protected by an insulating sheet 21 on the cooling water pipe at the bottom, and fixed on the target base 2 by bolts 13.

The auxiliary magnetic field generating device is set outside the cylinder of the target base 2, and is protected by an insulating ring 4 (insulating thin tube) between the target base 3 and the target bottom column 3. The coil 11 of the auxiliary magnetic field generating device has an outer diameter of 220mm, an inner diameter of 170mm, and a height of 40mm. The position of the auxiliary magnetic field generator can be adjusted. The coil 11 of the auxiliary magnetic field generator used is made of QZY-2 enameled wire with a wire diameter of 1.25mm wound on the coil frame.

In this example, the coils in the main control magnetic field generator and the auxiliary magnetic field generator are individually adjusted by the voltage regulating power supply, and the coil of the main control magnetic field generator passes a 2A direct current to form an arched magnetic field with a fixed configuration on the target surface, and the auxiliary magnetic field generates The coil of the device passes reverse direct current or alternating current. Changing the magnitude of the current can change the ratio of "current × turns" between the two, thereby changing the distribution of the arched magnetic field and achieving the etching of the arc spot at different positions. Accompanying drawing 4 is embodiment 1 auxiliary magnetic field generating device coil and main control magnetic field generating device coil different " electric current × number of turns " ratio the configuration change diagram of magnetic field line. It can be seen that with the increase of the reverse current of the auxiliary magnetic field (0.5A, 1A, 1.5A, 2A), the configuration of the arched magnetic field changes, and its apex (the longitudinal magnetic field is zero and the transverse magnetic field is the largest) is at the position of the target surface Continuously moving from the edge of the target to the center of the target, instead of being fixed at a specific position, the arc spot will appear at different positions on the entire target surface with the dynamic change of the magnetic field, rather than being limited to a specific position. area, so as to achieve uniform etching of the target. The schematic diagram of the dynamic magnetic force line in Figure 4 shows the change of the arc spot etching area. The movement speed of the arc spot can be changed by adjusting the strength of the magnetic field. Increasing the movement speed of the arc spot can reduce the emission of particles and improve the surface quality of the deposited film.

Example 2:

Accompanying drawing 5 is the schematic diagram of the arc ion plating arc source device of the adjustable static magnetron of embodiment 2 of the present utility model. The basic structure is the same as that of Embodiment 1, except that the inner side of the top end of the magnetic tube 20 of the yoke 5 adopts an outward 15° slope structure, and the slope at the top of the magnetic column 19 is an axisymmetric boss shape (narrow at the top and wide at the bottom). ), the slope at the top of the magnetic cylinder is symmetrical to the slope at the top of the magnetic column, and the slope of the magnetic yoke is W-shaped. The coil 6 of the main control magnetic field generating device passes direct current to generate a certain arched magnetic field; the coil 11 of the auxiliary magnetic field generating device passes direct current of different sizes to generate a certain reverse magnetic field, and the coupling of the two magnetic fields generates static magnetic lines 18 of position changes.

The coils in the main control magnetic field generator and the auxiliary magnetic field generator are individually regulated by the voltage regulating power supply, the coil of the main control magnetic field generator passes a 2A direct current to form an arched magnetic field with a fixed configuration on the target surface, and the coil of the auxiliary magnetic field generator is turned on and off direct current to adjust the distribution of the arched magnetic field. After working for a period of time, change the magnitude of the coil current of the auxiliary magnetic field generating device, thereby changing the "current × turns" ratio with the coil of the main magnetic field generating device, changing the distribution of the arched magnetic field, and achieving the engraving of the arc spot at different positions. Etching to avoid forming obvious etching tracks on the target surface by etching at a fixed position for a long time. Accompanying drawing 6 is the change schematic diagram of the etching position of the arc spot when the coil of the auxiliary magnetic field generating device passes through the direct current of different sizes. The etching track of the arc spot is circular under different current values, and the position of the track will change with the change of the magnetic field configuration caused by the change of the current (ie, the circular etching track 22 with changing position in FIG. 6 ).

Example 3:

Accompanying drawing 7 is the schematic diagram of the dynamic magnetron arc source device for improving the arc ion plating deposition process in Embodiment 3 of the present invention. The basic structure is the same as that of Embodiment 2, except that the inside of the top end of the magnetic permeable cylinder 20 of the yoke 5 adopts a 30° outward slope structure.

The coils in the main control magnetic field generator and the auxiliary magnetic field generator are individually regulated by the voltage regulating power supply, the coil of the main control magnetic field generator passes a 2A direct current to form an arched magnetic field with a fixed configuration on the target surface, and the coil of the auxiliary magnetic field generator is turned on and off Directional alternating current adjusts the distribution of the arched magnetic field, the magnitude of the alternating current changes continuously (0-2A), and the direction remains unchanged, thereby continuously changing the ratio of "current × turns" between the coil of the main control magnetic field generating device and changing the arched shape The distribution of the magnetic field makes its apex (the longitudinal magnetic field is zero and the transverse magnetic field is the largest) continuously move on the target surface between the edge of the target and the center of the target, instead of being fixed at a specific position, so that With the dynamic change of the magnetic field, the arc spot appears at different positions on the entire target surface, rather than being limited to a specific area, so as to achieve uniform etching of the target and change of the discharge form. Fig. 8(a) - Fig. 8(b) are schematic diagrams of the change of the etching position of the arc spot under the alternating current with the coil flux of the auxiliary magnetic field generator changing in magnitude and direction unchanged. The arc spot will form a spiral etching track (ie, the dynamic spiral etching track 23 in Fig. 8(a)-Fig. a)) and shrinkage (Fig. 8(b)), uniform etching of the target.

Example 4: Requirements for target thickness

In order to make better use of the magnetic field generated by the utility model to dynamically control the movement of the arc spot and achieve the effect of effectively using the target. Embodiment 4 makes a detailed analysis and description of the magnetic field distribution of the present invention in combination with the finite element simulation results. This simulation is carried out with respect to the device structure in Example 1, and the results of this analysis are the same for the coil of the auxiliary magnetic field generating device passing reverse direct current and alternating current.

Figure 9(a)-Figure 9(d) are the size distribution diagrams of the longitudinal magnetic field component under different target thicknesses and different "current × turns" ratios in Example 1, and the zero point position is the position of the etched track. The thickness of the target is 1cm, 2cm, 3cm, 4cm respectively. Under the same target thickness, the zero point position of the longitudinal magnetic field will change with the change of the "current × turns" ratio, and the zero point position of the longitudinal magnetic field is the position where the arc spot is preferentially etched, that is, the position of the etched track. As the thickness of the target increases, the zero point position of the longitudinal magnetic field changes more with the ratio of "current × turns", indicating that the thicker the target, the larger the etching area of the arc spot, which is more conducive to the utilization of the target. However, another important parameter to control the movement of the arc spot is the magnitude of the transverse magnetic field component, and the transverse magnetic field can change the movement speed of the arc spot. In Fig. 9(a)-Fig. 9(d), n ₀ I ₀ /n _i I _i is the difference between the "current × number of turns" of the coil of the auxiliary magnetic field generating device and the "current × number of turns" of the coil of the main control magnetic field generating device Compare.

Fig. 10(a) - Fig. 10(b) are distribution diagrams of transverse magnetic field components on the surface of targets with different thicknesses under the same ratio of "current × number of turns" in Example 1. It can be seen that the magnitude of the transverse magnetic field component decreases rapidly as the thickness of the target increases, which is not conducive to the effective etching of the target and the increase of the arc spot speed to reduce the emission of particles, so the thickness of the target should not be too large. big.

To sum up, the thickness of the target must be controlled within a certain range in order to achieve the comprehensive effect of not only etching a large area to improve the utilization of the target, but also increasing the moving speed of the arc spot, reducing particle emission and improving the surface quality of the film. In Example 1, the optimum target thickness is 2.5 cm.

Example 5: Effect of different yoke structures

Embodiment 1-Embodiment 3 adopt three different yoke structures respectively, and the yoke has a great influence on the configuration of the magnetic field in the magnetic field generating device, so a reasonable yoke structure must be adopted. The influence of different yoke structures on the basis of finite element simulation results will be described below.

Accompanying drawing 11 is the magnetic field configuration distribution diagram of different magnetic yoke structures under the same "current x turns" ratio of embodiment 1-embodiment 3, and the "current x turns" ratio is -1. It can be seen that with the change of the top structure of the yoke, the configuration of the magnetic field has a certain change. The magnetic yoke with a certain slope structure can reduce the curvature of the arched magnetic field. Fig. 12 is the size distribution diagram of the longitudinal magnetic field on the surface of the target with the same thickness under the same "current × number of turns" ratio and different yoke structures in Example 1-Example 3. It can be seen that the "V"-shaped distribution angle of the longitudinal magnetic field changes with the change of the top structure of the yoke, and the "V"-shaped distribution angle of the longitudinal magnetic field generated by the yoke with a certain slope structure is larger. The curvature of the arched magnetic field is reduced, and the degree of "V"-shaped distribution angle is expanded. For the magnetic field adjusted by DC, the area of the etching track can be widened and the etching efficiency can be increased. For AC regulated magnetic fields, the effect is not significant.

Claims (10)

1, a kind of dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating, it is characterized in that: described dynamic magnetic control arc source apparatus is provided with dynamic controlling magnetic field generating unit, target, target base, target is installed on the target base, dynamically the controlling magnetic field generating unit is that master control field generator for magnetic and auxiliary magnetic field generating unit constitute, the master control field generator for magnetic is positioned over the target back, with the coaxial placement of target, the auxiliary magnetic field generating unit is enclosed within around the master control field generator for magnetic.

2, according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 1, it is characterized in that: described master control field generator for magnetic is that solenoid and yoke constitute, yoke is made of the magnetic conductive cylinder of periphery and the conducting magnetic column at center, the lower end of magnetic conductive cylinder and conducting magnetic column is connected by same magnetically permeable material or is made of one, and the yoke upper end keeps opening; Solenoid is enclosed within on the magnetic post at yoke center, is positioned over magnetic conductive cylinder and position, conducting magnetic column intermediary space.

3, according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 2, it is characterized in that: the solenoid in the described master control field generator for magnetic and the shape of yoke are circle or square, the shape of magnetic conductive cylinder in the yoke and conducting magnetic column and coil is consistent, and the three is coaxial.

4. according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 2, it is characterized in that: the internal diameter of the coil in the described master control field generator for magnetic is slightly larger than the diameter of conducting magnetic column, external diameter is slightly less than the internal diameter of magnetic conductive cylinder, and the height of coil is lower than the height of yoke.

5. according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 2; it is characterized in that: the solenoid in the described master control field generator for magnetic is wound on the coil rack by enameled wire; coil is inside and outside by insulation protection, and yoke is made by the nickel plating pure iron or the other materials of high magnetic permeability.

6. according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 2, it is characterized in that: magnetic conductive cylinder in the described master control field generator for magnetic and conducting magnetic column top are flat or the inclined-plane are arranged; When magnetic conductive cylinder and conducting magnetic column top were the inclined-plane, the vertical inclined-plane of conducting magnetic column was the up-narrow and down-wide boss shape of rotational symmetry, vertical inclined-plane of magnetic conductive cylinder and the vertical inclined-plane of conducting magnetic column symmetry, and the inclined-plane of yoke is W shape.

7. according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 2; it is characterized in that: described auxiliary magnetic field generating unit is enclosed within the periphery of the magnetic conductive cylinder in the master control field generator for magnetic or the target foundation periphery of target base; coaxial with master control field generator for magnetic or target foundation; by insulation protection, the position of auxiliary magnetic field generating unit is adjustable between auxiliary magnetic field generating unit and master control field generator for magnetic or the target foundation.

8. according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 1, it is characterized in that: described auxiliary magnetic field generating unit shape is consistent with the master control field generator for magnetic, is made up of the solenoid of enameled wire coiling.

9. according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 1, it is characterized in that: the coil in described master control field generator for magnetic and the auxiliary magnetic field generating unit is regulated separately or common the adjusting, logical between the two reversible circulation; By regulating the intensity of coil current size adjustment dynamic magnetic field in master control field generator for magnetic and the auxiliary magnetic field generating unit, the current forms of coil is direct current, interchange or pulse, can realize the multiple control modes to the arc spot.

10. according to the described dynamic magnetic control arc source apparatus that improves deposition technique of arc ion plating of claim 1, it is characterized in that: described target direct water-cooling or indirect water-cooling, the master control field generator for magnetic of direct water-cooling be placed between the target foundation cylinder in the water coolant or the outer target foundation cylinder of cooling-water duct between, the master control field generator for magnetic of indirect water-cooling is placed between the outer foundation cylinder of cooling-water duct.

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