CN201138905Y - Integrated cooling device under the condition of small space and multiple heat sources - Google Patents

Abstract

An integrated heat dissipation device under the condition of multiple heat sources in a small space, which includes a water jacket with an inlet and an outlet. The corresponding side is a heat-absorbing surface. A plurality of mutually independent heat dissipation modules and pipelines connecting each heat dissipation module are arranged on the heat dissipation surface of the substrate. The heat dissipation modules communicate with the inlet and outlet.

Description

Integrated cooling device under the condition of small space and multiple heat sources

technical field

The utility model is an efficient and integrated cooling device developed for small spaces and multiple heat sources, and belongs to the field of heat transfer in tiny spaces.

Background technique

With the continuous improvement of the integration density of large-scale integrated circuits, electronic devices are gradually developing in the direction of miniaturization, miniaturization, high power, and concentrated distribution of multiple heat sources. The subsequent system heating problem is becoming more and more prominent, and this problem The quality of the solution directly affects the life and reliability of the entire electronic system. However, the heat dissipation space provided by the small multi-heat source heating system is limited, the distribution of each heat source is irregular, and the heat generation is also different. To solve the heat dissipation problem of multiple heating elements in a limited space, a small and compact And it can be done with an efficient cooling system.

At present, in the small space and multi-heat source system shown in Figure 1, there are mainly two commonly used heat dissipation methods: air cooling and liquid cooling. Air cooling is a cheap cooling method, generally composed of a heating element and a fan, sometimes some fins are installed on the surface of the heating element to increase the heat exchange area to enhance heat exchange, the heat of the heating element is directly obtained by The fan drives the wind to take it away. This cooling method is widely used in low-heat systems, but its heat dissipation efficiency is relatively low, and it is increasingly unable to meet the needs of today's heat-generating systems. For liquid cooling, it is a commonly used cooling method. For multiple heat sources at the same time, a set of liquid cooling system is used for cooling. There are two current solutions, one is contact type and the other is non-contact type. The contact type means that the heating element is directly in contact with the cooling liquid. This technical solution requires very high insulation of the entire heating system. At the same time, the sealing problem of the system is also a technical difficulty, and the application is still in the research and development stage; the non-contact type is usually adopted. One solution, in this solution, is generally to cover a metal water jacket on the substrate where the heating element is distributed, so that it can cover all heat sources. In this system, for different uneven heating parts, the method of filling heat-conducting cotton between the water jacket and the heating parts is used to make the two fully contact. For a small system, the multi-heating module adopts an overall structure Heat dissipation is a reasonable idea in terms of scale, but because the inner cavity of the water jacket is connected as a whole, this leads to the mutual influence between various heating elements, and the heat dissipation effect can reach an ideal level.

From the above analysis, it can be seen that liquid cooling is feasible and necessary in a small multi-heat source high-heating system. In the liquid cooling system, the key is the structural form of the heat dissipation module. There is no big difference in the secondary heat dissipation system, which is composed of an external secondary heat dissipation device and a circulating power device. We know that, on a large scale, in a multi-heat source heating system, the liquid cooling mode of multiple heat dissipation modules is adopted, and the modules are often connected by pipelines. This is a common layout of a liquid cooling system in a large-scale system, but in In a small space, the heating module is often very small, which determines that the cooling module cannot be too large. At the same time, because the distance between the heating modules is also very small, there are insurmountable technical problems in the connection and sealing between the connecting pipeline and the module. . Therefore, it is not feasible to adopt the above mode in a small space multi-heat source system.

Contents of the invention

The utility model proposes a new integrated heat dissipation device aiming at the deficiencies in the prior art to solve the cooling problem of small space and multiple heat sources.

This solution is realized through the following technical measures: it includes a water jacket with an inlet and an outlet, and it is characterized in that the water jacket is composed of a base plate and a cover plate that are water-tight with each other, and the base plate and the cover plate are matched One side of the substrate is a heat dissipation surface, and the corresponding other surface is a heat absorption surface. A plurality of independent heat dissipation modules and pipelines connecting each heat dissipation module are arranged on the heat dissipation surface of the substrate. The heat dissipation modules and the inlet connected to the exit.

The specific feature of this solution is that the pipelines connected between the heat dissipation modules are channels directly processed on the heat dissipation surface of the substrate. The channels are grooves etched on the heat dissipation surface of the substrate.

The heat dissipation module is a group of fins directly processed on the heat dissipation surface of the substrate. The modules are machined into required internal structures according to specific load conditions, including different fin shapes and combinations. The heat-absorbing surface of the substrate is provided with a groove corresponding to the heat-generating component, so that the heating module is closely combined with the entire substrate. For the difference in height and shape of each heat-generating component of multiple heat sources, we can directly measure the heat-absorbing surface of the substrate. Corresponding processing can be carried out without dealing with the connection problem of the pipeline. The inlet and outlet are arranged on the edge of the substrate to realize the connection with the external working fluid circulation equipment.

The substrate is made of red copper or aluminum alloy. The material selection of this integrated module mainly considers the metal with high thermal conductivity and low density. The thermal conductivity of metal mainly depends on the type and temperature of the material. Different metals can be selected according to the needs. Generally, the core of the heat dissipation module is non-ferrous. Copper with high thermal conductivity among metal materials, especially the heat-absorbing surface, has a thermal conductivity as high as 388W/K.m. Considering that the weight of the entire module should not be too large, aluminum alloy with high thermal conductivity can also be selected as the substrate of the heat dissipation module.

The beneficial effects of this scheme can be known from the description of the above scheme. It is a heat dissipation device that can meet the requirements of efficient heat dissipation under the high heat flow of multiple heat sources in a small space. Compared with ordinary heat dissipation devices with multiple heat sources, this heat dissipation device has a volume Small, compact structure, high heat transfer efficiency and other characteristics, these characteristics are mainly realized by the integrated design of multiple miniature heat dissipation modules, integrating multiple heat dissipation modules and the connection channels between modules on one substrate has the following advantages: (1) Since the module and the channel are directly processed on a substrate 3, multiple heat dissipation modules become a whole, which reduces the difficulty of processing and packaging, and makes the entire substrate safer and more reliable; (2) each heat dissipation module is processed on the same substrate It is more conducive to the uniformity of the temperature of each module; (3) Reasonable module distribution and channel design can improve the overall performance of the entire heat dissipation system, and because the pipeline is directly etched on the substrate, so The flow hydraulic diameter of the pipeline can be maximized without considering the size of the interface, so this structural form can minimize the flow resistance of the liquid working medium. Therefore, compared with the prior art, the utility model has achieved the technical purpose.

Description of drawings

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Figure 1 Schematic diagram of distribution of multi-heat source heating modules;

Figure 2 Schematic diagram of the structure of the integrated cooling device;

Figure 3 is a schematic diagram of the package of the integrated cooling device;

Figure 4 The assembly drawing of the integrated cooling device and the heating element;

In the figure, 1: heating module substrate; 2: heating module; 3: substrate; 4: inlet; 5: fin; 6: channel; 7: outlet; 8: cooling module; 9: gasket; 10: cover plate; 11: connecting bolt; 12: threaded hole.

Detailed ways

Figure 1 shows the distribution of multi-heat source heating modules. As shown in Figure 2, the heat dissipation device of the present invention is an integrated structure. In Figure 2, each heat dissipation module 8 is directly processed on a substrate 3, and the heat dissipation modules 8 are connected by channels 6 etched on the substrate 3. The base plate 3 has an inlet 4 and an outlet 7 for liquid working fluid. The distribution position of each heat dissipation module 8 is the heat dissipation surface of the substrate 3 corresponding to the position of the corresponding heat dissipation module 2, and the entire integrated heat dissipation device can be directly installed on the heat generation module 2 with multiple heat sources shown in FIG. 1 . When the heating modules 2 are different in height, it can be solved by processing corresponding grooves on the contact surface of the substrate 3 and the heating module 2. This contact surface is the heat-absorbing surface of the substrate. The working conditions of the heat dissipation module are as follows: since the heating module 2 is in contact with the substrate 3, corresponding to the heat dissipation module 8, when it generates heat, the heat is transferred from the heating module 2 to the heat dissipation substrate 3 and the module 8; 4 enters the heat dissipation module 8, flows through the pre-designed and processed channel 6, enters each heat dissipation module 8, and exchanges heat with the fins 5 processed in the heat dissipation module 8 inside the heat dissipation module 8, and the heat is taken away by the working fluid. Finally, it flows out through exit 7. During the design process, the design of the fins 5 in the heat dissipation module 8 and the passages 6 between the heat dissipation modules 8 can be designed in consideration of the heat generation conditions of each heat generation module.

As shown in Figures 3-4, the heat sink is the part of the heat dissipation system that directly exchanges heat with the heating body, and is the core of the entire heat dissipation system. With some additional equipment, these additional equipment include the power system of liquid working medium circulation and secondary heat exchange equipment. The entire integrated heat dissipation module must first design the shape of the fins 5 in the heat dissipation module 8 and the channels 6 between each heat dissipation module 8 according to the specific heating conditions of the heat dissipation object, and then perform etching processing according to the design situation, thus completing the heat dissipation module. 8 processing. Then cover the base plate 3 of the heat sink with a thin metal plate as the cover plate 10 , and the cover plate 10 and the base plate 3 are directly water-sealed, as shown in FIG. 3 . After the cooling device is packaged, it can be covered on the heating module 2, and the heating module 2 and the substrate 3 are tightly combined; if the heights of the heating modules 2 are different, grooves can be processed on the substrate of the cooling device to make the entire heat dissipation The device is combined with the heating module 2 tightly and flatly. The supply of coolant for the heat sink is circulated by the peripheral equipment through the inlet and outlet processed on the substrate 3 of the heat sink.

In the heat dissipation module designed by the utility model, each heat dissipation module is self-contained and connected as a whole. We can process the fin shape and different fins that meet the heat dissipation requirements on the corresponding heat dissipation module according to the heat generation of a certain heating element. The combination of fins. After testing, when the liquid working medium flows through each heat dissipation module, the required cycle power can be reduced by 30% to achieve the same heat dissipation effect as similar heat dissipation devices, and this structure can provide better temperature uniformity and heat dissipation Structural stability and reliability. Therefore, the advantages of the heat dissipation module in the utility model are obvious.

Claims (7)

1, the integrated heat radiating device under the many thermals source condition of a kind of little space, it comprises the water jacket that has import and outlet, it is characterized in that described water jacket is by the substrate and the cover plate of water-stop are formed each other, the one side that described substrate matches with cover plate is a radiating surface, corresponding another side is a heat-absorbent surface, the radiating surface of described substrate is provided with a plurality of separate radiating modules and the pipeline that each radiating module is connected together, and described radiating module is communicated with import and outlet.

2, the integrated heat radiating device under the many thermals source condition of little space according to claim 1 is characterized in that the pipeline that is communicated with between described each radiating module is the direct passage of processing on the substrate radiating surface.

3, the integrated heat radiating device under the many thermals source condition of little space according to claim 2 is characterized in that described passage is the groove that is etched on the substrate radiating surface.

4,, it is characterized in that described radiating module is one group of fin directly processing on the substrate radiating surface according to the integrated heat radiating device under claim 1 or the 2 or 3 described little space many thermals source conditions.

5, the integrated heat radiating device under the many thermals source condition of little space according to claim 4 is characterized in that described substrate adopts red copper or aluminium alloy.

6, according to the integrated heat radiating device under claim 1 or the 2 or 3 described little space many thermals source conditions, it is characterized in that described import and outlet are arranged at substrate edges.

7, according to the integrated heat radiating device under claim 1 or the 2 or 3 described little space many thermals source conditions, it is characterized in that being provided with and the heat generating components corresponding groove at the heat-absorbent surface of described substrate.

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