CN104777887B - Micro-channel formula water cooling chip radiator - Google Patents

Abstract

The invention discloses a micro-channel type water-cooled chip radiator. The radiator is composed of an upper cover and a bottom bracket. The upper surface of the bottom bracket is provided with a raised rectangular micro-channel. The left and right sides of the rectangular micro-channel are All have storage tanks. Sealing grooves are arranged on the inside and outside of the area surrounded by the rectangular microchannel and the water storage pool, and a sealing ring is arranged in the sealing groove. The four sides of the loam cake are bent downwards, and the loam cake is buckled on the sealing ring of the bottom bracket. The lower left corner and the upper right corner of the upper cover are respectively provided with a water inlet and a water outlet, and the positions of the water inlet and the water outlet can be interchanged, and a slope is arranged on the edge of the water inlet and outlet of the rectangular microchannel. The design of the micro-channel and the water flow channel on the upper cover has a strong heat exchange effect, which can significantly improve the heat exchange efficiency compared with the traditional water-cooled radiator. This type of heat sink is thinner, but has a relatively large heat exchange area, so it is very suitable for the narrow space of the computer server, and makes the temperature uniformity effect of the CPU chip better.

Description

Micro-channel water-cooled chip radiator

technical field

The invention belongs to the field of thermal energy engineering, in particular to a radiator device for cooling a computer CPU chip.

Background technique

The CPU chip of a computer can be used as a typical representative of high heat flux heating devices. A large server usually has dozens or even hundreds of multi-core CPU chips. Behind the strong performance, it is accompanied by higher heat generation and heat flux. It can be said that the efficient cooling of CPU chips has become a shackle for the further development of computer performance. At present, the heat dissipation technology applied to the cooling of high heat flux devices is mainly based on air cooling, that is, a radiator is installed on the surface of the cooled device, and the heat is taken away by the forced flow of cold air through the fins on the radiator. As we all know, the water cooling method has a high heat transfer efficiency, but the water-cooled heat dissipation has two major difficulties, one is the leakage of the cooling liquid; the other is that the heat dissipation efficiency is reduced due to the excessive flow resistance of the fluid in the heat dissipation chamber. The former belongs to the processing precision and installation issues, while the latter will involve the theory and technology of heat transfer and flow. Most of the liquid-cooled radiators commonly used at present are processed (drawn) into a needle column matrix in the cooling cavity. The main function of the needle column is to increase the heat exchange area in the cooling water cavity to improve the cooling effect. However, the disadvantage of this type of heat sink is that the structure of each needle column is not independent, and the needle column is short and the bottom of the cooling cavity is relatively thick, so a low-resistance flow field cannot be formed in the needle column matrix. The defect that leads to the structural design of this type of radiator is the lack of heat transfer and flow theory. Therefore, how to improve the efficiency and performance of liquid-cooled radiators has become a difficult point in the research of high heat flux device cooling at home and abroad.

Contents of the invention

The object of the present invention is to propose a micro-channel type radiator device for cooling computer CPU chips, which can effectively improve the heat dissipation performance of the CPU chips on the basis of reducing the flow resistance of the cooling fluid.

The technical solution adopted to realize the purpose of this invention is: the radiator is composed of an upper cover and a bottom bracket, the upper surface of the bottom bracket is provided with a raised rectangular micro-channel, and the left and right sides of the rectangular micro-channel are provided with Cistern. A sealing groove is arranged on the inside and outside of the area surrounded by the rectangular microchannel and the water storage pool, and a sealing ring is arranged in the sealing groove. The four sides of the loam cake are bent downwards, and the loam cake is buckled on the sealing ring of the bottom bracket. The lower left corner and the upper right corner of the upper cover are respectively provided with a water inlet and a water outlet, and the positions of the water inlet and the water outlet can be interchanged, and a slope is provided on the edge of the water inlet and outlet of the rectangular microchannel.

In addition to the structure of the radiator, the cooling water flow mode is compared with the existing technology: the cooling water turns at a right angle from the water inlet on the top surface of the upper cover and enters the drainage channel, and then spreads out through the water storage pool to cool the fins on the bottom support , and then collect the outflow in the reservoir on the other side. Because the channel is oriented in the same direction as the fluid flows, there is very little resistance. The fins are immersed in the water flow, and the fluid can form a very uniform flow field, which can fully cool the CPU chip (in contact with the bottom surface of the radiator), and strengthen the heat transfer of the radiator.

Adjust the temperature and flow of the coolant according to the heat load (heat flux density) of the CPU, and achieve a good parameter matching through calculation. Experiments have proved that the pressure drop caused by this structure is very small. According to the principle of heat transfer, the temperature gradient of the fins (roots) is higher at the bottom and lower at the top, and the cooling water flows out laterally, so this structure can have a relatively high temperature. Good cooling effect. The main function of the fins is not to dissipate heat directly, but to dissipate the heat of the bottom bracket in a high heat conduction way, and finally dissipate the heat through cooling water.

The characteristics and beneficial effects of the present invention are that the design of the rectangular micro-grooves and the water flow channels of the upper cover can enhance the heat transfer of the radiator, especially the micro-grooves are processed into fins similar to pieces. The fins and the cooling fluid exchange heat horizontally, so they have a strong heat exchange effect, which can significantly improve the heat exchange efficiency compared with traditional water-cooled radiators. This type of radiator is thinner, but has a relatively large heat exchange area, so it is very suitable for the narrow space of the computer server, and makes the temperature uniformity effect of the CPU chip better, and can reduce the working temperature more effectively.

Description of drawings

Fig. 1 is a three-dimensional structural view of the bottom bracket and the micro-channel arrangement of the present invention.

Fig. 2 is a three-dimensional structure diagram of the upper cover in the present invention.

Detailed ways

The principle and structure of the present invention will be further described below in conjunction with the accompanying drawings and through specific embodiments. It should be noted that this embodiment is descriptive rather than restrictive, and the protection scope of the present invention is not limited by this embodiment.

The micro-channel type water-cooled chip radiator is composed of an upper cover and a bottom support, which specifically includes: the upper surface of the bottom support 1 is provided with a raised rectangular micro-channel 1-1, and the left and right sides of the rectangular micro-channel are both There are cisterns 1-2. Sealing grooves 1-3 are arranged on the inside and outside of the area surrounded by the rectangular micro-groove and the water storage tank, and sealing rings are arranged in the sealing grooves. The four sides of the loam cake 2 are bent downward, and the loam cake is seized on the sealing ring of the bottom bracket. A water inlet 2-1 and a water outlet 2-2 are respectively arranged at the lower left corner and the upper right corner of the loam cake, the positions of the water inlet and the water outlet can be interchanged, and a slope is provided on the edge of the water inlet and outlet of the rectangular microchannel. The positions of the water inlet and the water outlet of the upper cover correspond to the positions of the water storage tanks on the left and right sides of the rectangular microchannel of the bottom support.

The four corners of the loam cake are all provided with shoulders 2-3, and the shoulders are provided with screw holes, which are fastened and sealed with the bottom support by screws. Both the water inlet and the water outlet of the upper cover are provided with sockets to connect with pipelines. The bottom bracket is made of copper material.

As an example, the height of the rectangular channel is 3mm; the length is 75mm; the width of the channel is 0.3mm; the total height of the bottom bracket is 6mm; the thickness of the upper cover is 6mm.

When in use, the heat dissipation bottom bracket is in close contact with the heat-dissipated device, and a thermal bonding layer material with high thermal conductivity is arranged between the bottom bracket and the heat-dissipated device. As an example, a transparent plastic upper cover is used for experimental detection and observation, and it can be clearly seen that the fluid flows with low resistance.

Claims (5)

1. micro-channel formula water cooling chip radiator, radiator are made of upper cover and collet, it is characterized in that：The upper surface of collet (1) Equipped with raised rectangle micro-channel (1-1), the arranged on left and right sides of rectangle micro-channel is equipped with storage cistern (1-2), in rectangle Outside is equipped with seal groove (1-3) in micro-channel and storage cistern area defined, and sealing ring, upper cover (2) are equipped with seal groove Four side downward bendings, upper cover detained on the sealing ring of collet, and water inlet is respectively equipped with the lower left corner of upper cover and the upper right corner (2-1) and water outlet (2-2), intaking can exchange with the position of water outlet, be set at the edge of rectangle micro-channel disengaging water end (W.E.) There is slope.

2. micro-channel formula water cooling chip radiator described in accordance with the claim 1, it is characterized in that：The upper cover water inlet and water outlet The position of mouth is corresponding with the position of the collet rectangle micro-channel arranged on left and right sides storage cistern.

3. micro-channel formula water cooling chip radiator described in accordance with the claim 1, it is characterized in that：The corner of the upper cover is equipped with Shoulder (2-3), shoulder are equipped with screw hole, pass through screw and collet fit sealing.

4. according to the micro-channel formula water cooling chip radiator described in claim 1 or 2, it is characterized in that：The water inlet of the upper cover Joint chair is equipped with water outlet to be connected with pipeline.

5. micro-channel formula water cooling chip radiator described in accordance with the claim 1, it is characterized in that：The height of the rectangle conduit For 3-4mm；Length is 75mm；Groove width is 0.3-0.4mm；Collet is made of red copper material.