CN1983516A - Substrate processing method and substrate processing apparatus - Google Patents
Substrate processing method and substrate processing apparatus Download PDFInfo
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- CN1983516A CN1983516A CNA2006101642909A CN200610164290A CN1983516A CN 1983516 A CN1983516 A CN 1983516A CN A2006101642909 A CNA2006101642909 A CN A2006101642909A CN 200610164290 A CN200610164290 A CN 200610164290A CN 1983516 A CN1983516 A CN 1983516A
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- 239000000758 substrate Substances 0.000 title claims abstract description 179
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims abstract description 223
- 239000007788 liquid Substances 0.000 claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 239000012530 fluid Substances 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 17
- 210000004209 hair Anatomy 0.000 abstract description 6
- 238000010926 purge Methods 0.000 description 14
- 239000003344 environmental pollutant Substances 0.000 description 7
- 231100000719 pollutant Toxicity 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 206010013786 Dry skin Diseases 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical class ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present invention provides a substrate processing method and substrate processing apparatus, which can lighten the damage for the surface of the substrate during cleaning, and can insure sufficient cleaning function. The device comprises: a long shape cleaning brush (221) having a hair bundle composed of many hairs; a removing roller for removing the substrate (B) relative to cleaning brush (221) in the direction crossing with the extending direction of the cleaning brush (221); a support mechanism for supporting the cleaning brush (221) by making the front end (50H) of the cleaning brush hair bundle (50) of the cleaning brush (221) toward the downstream of the moving direction of the substrate (B) of the moving roller and making the flank part (50F) of the cleaning brush hair bundle (50) of the cleaning brush (221) contact with the top surface of the substrate; a processing liquid supply nozzle (231) for supplying processing liquid to the cleaning brush hair bundle (50) of the cleaning brush (221) supported by the support mechanism.
Description
Technical field
The present invention relates in the manufacturing process of liquid crystal display (LCD), plasma display panel device (PDP), semiconductor equipment etc., LCD or PDP are carried out various processing, for example carry out the substrate processing method using same and the substrate board treatment of clean with glass substrate, semiconductor substrate, printed base plate etc.
Background technology
In recent years, make on the streamline with the substrate of glass substrate etc. at LCD or PDP, for example after use soups such as etch processes carry out the specific processing unit of processing substrate, set the substrate wiper mechanism, and clean foreign matters such as removing the film that remains on the substrate surface, particle.For example, shown in patent documentation 1, as substrate board treatment such device is proposed: to supplying with treatment fluid such as pure water by the substrate of conveying mechanisms such as roller path institute conveyance when, make roller type brush contact cylindraceous at this substrate surface with such substrate wiper mechanism.
In addition, shown in patent documentation 2, also propose to have such cleaning device: upper surface side and lower face side at the substrate of institute's conveyance set a plurality of bar-shaped brushes with predetermined distance, and make its reciprocating motion on the vertical direction of substrate transferring direction relatively, thereby remove dust on the substrate etc.
Patent documentation 1:JP spy opens flat 9-326377 communique.
Patent documentation 2:JP spy opens flat 10-34090 communique.
But, substrate board treatment shown in the above-mentioned patent documentation 1 makes roller type brush rotate cleaning base plate, therefore, and when cleaning (for example is formed with soft metal film etc., during the metal film of Al (aluminium) or Mo (molybdenum)+Al etc. etc.) substrate surface, bring damage might for this metal film.
In addition, even if the cleaning device shown in the above-mentioned patent documentation 2, since also make cleaning brush with substrate surface state of contact, reciprocating motion on perpendicular to the direction of substrate transferring direction, therefore, when cleaning is formed with the substrate surface of soft metal film etc., bring damage might for this metal film.
And then having more than is reduce to give the damage that substrate surface brought, and also must guarantee the cleaning function to substrate surface, and therefore, expectation is satisfied simultaneously to reduce and given the damage that substrate surface brought and improve requirement to the cleaning function of substrate surface.
Summary of the invention
The present invention proposes in order to address the above problem, and its purpose is to provide a kind of substrate processing method using same and substrate board treatment, when alleviating the damage that brings to substrate surface when cleaning, guarantees sufficient cleaning function.
The present invention is a kind of for the substrate board treatment that carries out the substrate enforcement predetermined process in the conveyance process along the conveyance path, and it has: be the cleaning brush of long shape on the Width of aforesaid substrate, it has the pieces that is made of a lot of bristles; Bracing or strutting arrangement, its make above-mentioned cleaning brush relative with above-mentioned conveyance path to and support above-mentioned cleaning brush, make the leading section of pieces of above-mentioned cleaning brush towards the downstream in above-mentioned conveyance path, and the side surface part of the pieces of above-mentioned cleaning brush is contacted with the interarea of the substrate in the above-mentioned conveyance process; Fluid Supplying apparatus, it is to supplying with the liquid of handling usefulness by the pieces of the above-mentioned cleaning brush that above-mentioned bracing or strutting arrangement supported.
In addition, the present invention is a kind of substrate processing method using same, it makes the downstream of the leading section of the pieces that is made of a lot of bristles that constitute cleaning brush towards the substrate transferring path, and the side surface part that makes the pieces of above-mentioned cleaning brush is contacted with the interarea of the substrate in the above-mentioned conveyance process, aforesaid substrate is relatively moved with respect to above-mentioned cleaning brush, simultaneously, the pieces of above-mentioned cleaning brush is supplied with the liquid of handling usefulness, thereby aforesaid substrate is handled.
If according to foregoing invention, then make the side surface part of the pieces of cleaning brush be in the state of the interarea that is contacted with this substrate by bracing or strutting arrangement, thereby, with compare in the mode in the past of bristle front end rubbed substrate interarea, can make cleaning brush flexibly be contacted with the substrate interarea, thereby be difficult for bringing damage to the substrate interarea.In addition, by for the pieces of the cleaning brush that under this state, is contacted with the substrate interarea and from the fluid Supplying apparatus feed fluid, and can apply uniform pressure to cleaning brush, its result, pollutant is floated from substrate equably, thereby can access uniform cleaning performance.
In addition, the aforesaid liquid feedway also can be only carries out the supply of aforesaid liquid to the side surface part of the pieces of above-mentioned cleaning brush.In view of the above, the interarea of substrate part do not carried out the supply of the liquid that undertaken by fluid Supplying apparatus, and by only the side surface part of the pieces of cleaning brush being carried out the supply of the liquid that undertaken by fluid Supplying apparatus, be easy on the substrate interarea, form mobile liquid layer by liquid thereby become.
In addition, the aforesaid liquid feedway also can have the liquid feed pressure change mechanism that can change the liquid feed pressure of above-mentioned cleaning brush.According to this structure, by the variable liquid feed pressure of liquid feed pressure change mechanism to cleaning brush, thus can be simply and promptly change the pressing force of cleaning brush to the substrate interarea.
In addition, above-mentioned cleaning brush also can turn back in the central authorities of length direction.According to such structure, do not need directly to implant the operation of a lot of bristles.
In addition, the end face that the pieces of above-mentioned cleaning brush has a leading section be in the plane parallel with above-mentioned conveyance path shape also can, or the end face with leading section is in more the shape in a plane long more, that tilt, the downstream in conveyance path and also can.The former makes consistent size easily, and the latter makes the front end of the pieces under the user mode neat easily.
In addition, above-mentioned bracing or strutting arrangement preferably to support above-mentioned cleaning brush in 45 °～75 ° at inclination angle, especially preferably supports above-mentioned cleaning brush for 60 ° with the inclination angle towards the downstream in above-mentioned conveyance path.By adopting such angular range, cleaning brush becomes suitable for the pressing force of substrate interarea.
In addition, the length of the pieces of above-mentioned cleaning brush is preferably 10mm～60mm, and in addition, the diameter of above-mentioned bristle is preferably 0.05mm～0.2mm.By these, the contact condition of the side surface part of pieces and substrate interarea becomes good.
In addition, above-mentioned cleaning brush is equipped with along above-mentioned conveyance path and a plurality ofly also can.In view of the above, can access higher cleaning performance.
In addition, above-mentioned cleaning brush relative with above-mentioned conveyance path to and be provided in the two sides side and also can.In view of the above, can obtain excellent cleaning effect to the two sides side of substrate.
According to the present invention, because the side surface part of the pieces of cleaning brush is contacted with the interarea of this substrate, and cleaning brush flexibly contacts the substrate interarea, therefore can reduce the damage that cleaning brush brings for the substrate interarea.Thus, in the later careful operation of the second layer (second layer), also can adopt the present invention.
In addition, do not need as in the past rotating brush or shake the brush carrying out tight gap adjustment between cleaning brush front end and the substrate interarea.
In addition, by from the pieces feed fluid of fluid Supplying apparatus, thereby can apply uniform pressure to cleaning brush for the cleaning brush that under this state, is contacted with the substrate interarea.Its result can make pollutant float equably from substrate, and can access uniform cleaning performance.Thereby, can satisfy damage that brings to substrate surface when alleviating cleaning and the requirement of guaranteeing sufficient cleaning function simultaneously.
And then, can as in the past, not need the rotating mechanism or the head motion of cleaning brush, can guarantee good cleaning function, therefore can realize the reduction of corresponding cost.
In addition, on the substrate interarea, form the mobile liquid layer that forms by liquid easily, can improve the ability of cleaning base plate interarea.
In addition, change liquid feed pressure to cleaning brush by liquid feed pressure change mechanism, thus can be simply and promptly change the pressing force of cleaning brush to the substrate interarea.
In addition, if the central authorities of above-mentioned cleaning brush at length direction are formed with turning back, then do not need directly to implant the operation of a lot of bristles.
In addition, if making the pieces of above-mentioned cleaning brush is the structure that end face with leading section is in the shape in the plane parallel with above-mentioned conveyance path, perhaps be in the structure of the shape in a plane long more, that tilt, the downstream in above-mentioned conveyance path more for end face with leading section, then make consistent size easily, and make the front end of the pieces under the user mode neat easily the latter at the former.
In addition, if, above-mentioned cleaning brush is supported for 45 °～75 °, in addition with the inclination angle towards the downstream in above-mentioned conveyance path by above-mentioned bracing or strutting arrangement, especially support for 60 ° with the inclination angle, can make cleaning brush become more suitable for the pressing force of substrate interarea.
In addition, if the length of the pieces of above-mentioned cleaning brush is done to become 10mm～60mm, in addition, the diameter of above-mentioned bristle is done to become 0.05mm～0.2mm, then the contact condition of the side surface part of pieces and substrate interarea can become better.
In addition, a plurality of as if above-mentioned cleaning brush is equipped with along above-mentioned conveyance path, then can access better cleaning performance.
In addition, if with above-mentioned cleaning brush relative with above-mentioned conveyance path to and be provided in the two sides side, then can obtain excellent cleaning effect to the two sides side of substrate.
Description of drawings
Fig. 1 is the figure of summary of the base plate cleaning device that substrate board treatment possessed of expression one embodiment of the present invention.
Fig. 2 is the figure that observes the cleaning brush that is possessed in the brush purge chamber of base plate cleaning device from the conveyance direction upstream side of substrate.
Fig. 3 is the longitudinal sectional view of cleaning brush.
Fig. 4 is the end view of the configuration of expression cleaning brush of relative substrate and treatment fluid supply nozzle.
Fig. 5 is an end view of representing to be equipped with respectively the state of a plurality of cleaning brush and treatment fluid supply nozzle.
Fig. 6 is the longitudinal sectional view of other execution modes of expression cleaning brush.
Fig. 7 is the end view of the configuration of expression cleaning brush portion shown in Figure 6 and treatment fluid supply nozzle.
Embodiment
Below, substrate board treatment and substrate processing method using same for an embodiment of the invention describe with reference to accompanying drawing.Fig. 1 is the figure of summary of the base plate cleaning device that substrate board treatment possessed of expression an embodiment of the invention.Substrate board treatment 1 has base plate cleaning device 10.Base plate cleaning device 10 has: brush purge chamber 2, and it carries out soup to the substrate B that becomes process object and handles; Rinsing chamber 3, it carries out rinsing to the substrate B that has passed through brush purge chamber 2; Air knife chamber 4.In addition, in base plate cleaning device 10, preferably make substrate B with the posture that tilts from the horizontal direction vertical with the conveyance direction of substrate B by conveyance.By with this posture conveyance substrate B, in brush purge chamber 2 and rinsing chamber 3, make the various liquid that substrate B is supplied be easy to fall downwards, thereby realize the lip-deep good fluidity of removing from substrate B.
Fig. 2 is the figure that observes the cleaning brush 221 that the brush purge chamber 2 of base plate cleaning device 10 possessed from the conveyance direction upstream side of substrate B.In addition, cleaning brush 222 adopts the structure same with this cleaning brush 221.Cleaning brush 221 has cleaning brush pieces 50 that the surface clean of substrate B uses, vertical the cleaning brush base portion 51 that (implantation) has this cleaning brush pieces 50 is set.The cleaning brush 221 that constitutes by these cleaning brush pieces 50 and cleaning brush base portion 51, employing is in the direction of intersecting with the conveyance direction of substrate B (for example, vertical direction or with approach vertical direction etc.) and be parallel to the shape that is long shape that the direction of the upper surface of substrate B is extended.In addition, cleaning brush 221 adopts and makes front end 50H (Fig. 3) side of cleaning brush pieces 50 towards the conveyance direction downstream of substrate B, from only the tilt posture of angle of regulation of the posture with the Surface Vertical of substrate B.Thus, cleaning brush 221 is in the state of the interarea of the crooked and substrate B of contact in the conveyance process of the side surface part 50F (mid portion of cleaning brush pieces 50) of cleaning brush pieces 50.Its detailed content aftermentioned.
Upper surface part 111 sides at cleaning brush base portion 51 are provided with supporting mechanism (bracing or strutting arrangement) 6.Supporting mechanism 6 has supporting member 60 and cleaning brush mounting base 61.Cleaning brush 221 is sling fixing and supported by supporting member 60, and is installed on the cleaning brush mounting base 61 that is made of upright and outspoken member via this supporting member 60.Cleaning brush mounting base 61 for example is fixedly installed on the sidewall of cleaning brush purge chamber 2 etc.
In addition, diameter or the material (hardness) that consider to constitute each bristle of cleaning brush pieces 50 waits, cleaning brush pieces 50 with the contact condition on substrate B surface under angle (gradient) and as the diameter of the particle of removing object of cleaning etc., make the viewpoint on the upper surface of the substrate B that the side surface part 50F contact of cleaning brush pieces 50 should clean from contact area, decide the height and position of cleaning brush base portion 51 with the pressure of what degree, what degree.
In addition, supporting member 60 is set up with the relative cleaning brush mounting base 61 of variable mode apart from G shown in Figure 2 with can move freely.The operation to the height and position inching of cleaning brush base portion 51 relative substrate B upper surfaces can be carried out in the position of the supporting member 60 by adjusting relative cleaning brush mounting base 61.For example, when cleaning brush base portion 51 was the long shape corresponding with large-scale substrate, the substantial middle portion of the length direction of cleaning brush base portion 51 was crooked downwards easily.In this case, the position of the supporting member 60 relative cleaning brush mounting bases 61 by the part adjusted near this bending, can be with bending part up the direction raising is to a certain degree.Thus, the position of the relative substrate B of the side surface part 50F upper surface of cleaning brush pieces 50 is closed on the length direction tie up to cleaning brush 222 and become even.
Then, the structure to cleaning brush 221 describes.Fig. 3 is the longitudinal sectional view of cleaning brush 221.In addition, cleaning brush 222 also adopts same structure.Many bristles of the formation cleaning brush pieces 50 of cleaning brush 221 are in the substantial middle portion of its length direction, be wound on axle 52 around half-turn and turning back, and be embedded in the cleaning brush base portion 51 and constitute with axle 52.The section shape of cleaning brush base portion 51 sees roughly from side-looking and is " コ " word shape, and sees from side-looking and to be towards lower opening portion and the shape that front end attenuates.By the cleaning brush base portion 51 of this shape, cleaning brush pieces 50 parts of clamping axle 52 can be housed in the inside of cleaning brush base portion 51, and, be in the brush base portion 51 powerful fixing states that are cleaned.
Each bristle that constitutes cleaning brush pieces 50 for example is made of the material of nylon class, special teflon (registered trade mark) class, polyvinyl chloride (PVC:Poly Vinyl Chloride) class, and diameter for example is 0.05～0.2mm.The length L of the part that cleaning brush pieces 50 exposes from cleaning brush base portion 51 for example is 10mm≤L≤60mm.
In addition, cleaning brush base portion 51 is preferably as far as possible little size under the prerequisite that (implantation) cleaning brush pieces 50 can vertically be set at the width dimensions W on the substrate transferring direction, more particularly, be preferably below the 10mm.The size of the length direction of cleaning brush base portion 51 is suitably to set according to the size on the direction vertical with the conveyance direction of the substrate that becomes process object.
Fig. 4 is the end view of the configuration of the expression cleaning brush 221,222 of relative substrate B and treatment fluid supply nozzle 231,232.Cleaning brush 221,222 be provided in respectively substrate B above or below.
Cleaning brush 221,222 with cleaning brush base portion 51 relative substrate B surfaces only to the substrate transferring direction prior tilt angle theta that is determined that tilts
1Posture and be set up.And, because each side surface part 50F bending of cleaning brush 221,222, so this each side surface part 50F is set at the height and position of the state that is in its upper surface that is contacted with the substrate B in the conveyance process or lower surface.The tilt angle theta of cleaning brush 221,222
1Be 45 °～75 ° (best angle is 60 °).Because each cleaning brush base portion 51 of cleaning brush 221,222 is so that the upper surface of such relative substrate B or the posture that lower surface tilts are configured as mentioned above, therefore, the gap adjustment between each surface of the cleaning brush pieces 50 of cleaning brush 221,222 and substrate B does not need any precision.In addition, even without the tilt angle theta of carrying out with very high precision to cleaning brush 221,222
1Setting, produce the gap between each surface of the side surface part 50F of cleaning brush pieces 50 and substrate B or side surface part 50F take place that unnecessarily to push the bad possibility on each surface of substrate B also few.And then, to compare with front end 50H friction with cleaning brush pieces 50, the upper surface of substrate B or lower surface become and flexibly contact with the side surface part 50F of cleaning brush pieces 50, therefore are difficult for bringing damage to upper surface or the lower surface of substrate B.
Treatment fluid supply nozzle 231,232 for example is: (1) mainly spues pure water with high pressure high pressure nozzle; (2) utilize pressure that drop is supplied on the substrate with spray form, thus the two-fluid spray nozzle of the two-fluid of atomizing of liquids fluid and gaseous fluid; (3) the spue ultrasonic nozzle etc. of the pure water that is applied with ultrasonic vibration.In this embodiment, treatment fluid supply nozzle 231,232 be provided in compare cleaning brush 221,222 and be in substrate transferring direction downstream substrate B above or below.
Treatment fluid supply nozzle 231,232 sprays (supply) with the treatment fluid that sprayed and sets equipping position and set angle in the mode of the side surface part 50F of cleaning brush pieces 50.Thus, side surface part 50F for the cleaning brush pieces 50 of upper surface that under this state, is contacted with substrate B or lower surface, directly spray treatment fluid from treatment fluid supply nozzle 231,232, thereby can apply the contact pressure with substrate B equably the side surface part 50F of cleaning brush pieces 50.Its result can make pollutant float from substrate B equably, thereby can access uniform cleaning performance.
In addition, treatment fluid flows to upper surface or the lower surface of substrate B along the cleaning brush pieces 50 of cleaning brush 221,222, forms the liquid layer that flows uniformly along cleaning brush 221,222 on the upper surface of substrate B or lower surface.By this mobile liquid layer, can remove the upper surface that is present in substrate B or the pollutant on the lower surface equably.And then, by supplying with treatment fluid to the side surface part 50F of cleaning brush pieces 50, can make cleaning brush front end 50H produce fine motion, thereby pollutant is floated from substrate B equably from treatment fluid supply nozzle 231,232, therefore can obtain uniform cleaning performance.
In addition, also can be in the following way from the injection of the treatment fluid of treatment fluid supply nozzle 231,232: spray the side surface part 50F of cleaning brush pieces 50 and the upper surface of substrate B or the both sides of lower surface (1); (2) in addition, only the side surface part 50F to cleaning brush pieces 50 sprays, and upper surface or the bottom surface section of substrate B are not sprayed.If adopt the latter, then on each surface of substrate B, be easy to form the mobile liquid layer of treatment fluid, thereby on each surface of substrate B, can access higher cleaning performance.
In addition, treatment fluid supply nozzle 231,232 is connected and stores the treatment fluid supply source 7 that is used for to the treatment fluid of cleaning brush 221,222 supplies.And, be provided with supply pump (treatment fluid supply pressure change mechanism) 8 between treatment fluid supply nozzle 231,232 and the treatment fluid supply source 7, this supply pump 8 can change from the supply pressure of the liquid of 231,232 pairs of cleaning brush of treatment fluid supply nozzle, 221,222 supplies.By utilizing this supply pump 8 to change, thereby can freely control the pressing force of the side surface part 50F of cleaning brush 221,222 to substrate B from treatment fluid supply nozzle 231,232 supply pressures to cleaning brush 221,222 treatment fluids of being supplied with.
Fig. 5 is an end view of representing to be equipped with respectively the state of a plurality of cleaning brush 221,222 and treatment fluid supply nozzle 231,232.In this embodiment, cleaning brush 221,222 and treatment fluid supply nozzle 231,232 are respectively arranged with a plurality of in brush purge chamber 2, and, cleaning brush 221 is alternately set on the conveyance direction of substrate B with treatment fluid supply nozzle 231, similarly, cleaning brush 222 and treatment fluid supply nozzle 232 also on the conveyance direction of substrate B by alternate configurations.If constitute like this, the cleaning brush and the treatment fluid that then pass through separately spray, the difference that can have no time relatively ground utilizes cleaning brush 221,222 to scrape from each surface of substrate B continuously and gets pollutant, removes pollutant with utilization from treatment fluid supply nozzle 231,232 treatment fluids of being supplied with, and therefore can improve each the surperficial cleaning force to substrate B.
Then, describe for other execution mode of the present invention.For example, in the above-described embodiment, as shown in Figure 3, the structure of cleaning brush portion 222 is shapes that the end face employing level of the front end 50H of cleaning brush pieces 50 is in same plane, but as shown in Figure 6, this end face also can adopt relative horizontal plane to have tiltangle
2Shape, and make the downstream of its past more substrate transferring direction then long more.And the end face of front end 150H that makes this cleaning brush pieces 150 is along upper surface or the lower surface of substrate B.At this moment, the part that cleaning brush pieces 150 exposes from cleaning brush base portion 151, the length L of the part that its length is the longest are 10mm≤L≤60mm.
Fig. 7 is the end view of the configuration of expression cleaning brush portion 1221,1222 shown in Figure 6 and treatment fluid supply nozzle 231,232.Under the situation that sets cleaning brush portion shown in Figure 6 1221,1222, clean front end 150H side that brush portion 1221,1222 also takes to make cleaning brush pieces 150 towards the conveyance direction downstream of substrate B and from the posture vertical angle θ of defined in advance that only tilted with the upper surface of substrate B or lower surface
1Posture.If will be by having tiltangle at front end 150H
2The cleaning brush portion 1221,1222 that constitutes of cleaning brush pieces 150, with each surface tilt of so relative substrate B the posture configuration, the cleaning brush pieces 150 that then has this gradient diffuses into fan-shaped when being contacted with each surface of substrate B, and the thickness attenuation of front end 150H (hair seems that (degree) becomes thin), therefore treatment fluid is easy to be penetrated between each surface of cleaning brush pieces 150 and substrate B, thereby improves the treatment effeciency of treatment fluid.
In addition, the present invention not only is defined in the structure of above-mentioned execution mode, and can carry out various distortion.For example, in the respective embodiments described above, cleaning brush 221,222,1221,1222 be set at relative with the two sides of the upper surface of substrate B and lower surface to the position, but also can be arranged on the face side of any one party.
In addition, in the above-described embodiment, enumerated cleaning brush 221,222,1221,1222 and be applicable to that the situation in the brush purge chamber 2 is illustrated for example, but, being suitable for of this cleaning brush 221,222,1221,1222 not only is defined in brush purge chamber 2, also goes for utilizing in the process chamber that carries out other processing such as lift-off processing or development treatment the situation of the processing of brush.
In addition, in the above-described embodiment, with brush purge chamber 2 as the structure that is connected with process chamber that preceding operation is used and be illustrated, still, the brush purge chamber 2 that cleaning brush 221,222,1221,1222 is suitable for not only is defined in this, and can carry out being suitable for widely.For example, be configured, be applicable to that substrate wiper mechanism that the substrate of handling in monomer device (Etaching device etc.) in other preceding operation is cleaned etc. also can as the cleaning device monomer.
Claims (14)
1. a substrate board treatment is implemented predetermined process to the substrate that carries out along the conveyance path in the conveyance process, it is characterized in that having:
The cleaning brush that on the Width of aforesaid substrate, is long shape, it has the pieces that is made of a lot of bristles;
Bracing or strutting arrangement, its make above-mentioned cleaning brush relative with above-mentioned conveyance path to and support above-mentioned cleaning brush, make the leading section of pieces of above-mentioned cleaning brush towards the downstream in above-mentioned conveyance path, and make the side surface part of the pieces of above-mentioned cleaning brush be contacted with the interarea of the substrate in the above-mentioned conveyance process;
Fluid Supplying apparatus, it is to supplying with the liquid of handling usefulness by the pieces of the above-mentioned cleaning brush that above-mentioned bracing or strutting arrangement supported.
2. substrate board treatment according to claim 1 is characterized in that, the aforesaid liquid feedway only carries out the supply of aforesaid liquid to the side surface part of the pieces of above-mentioned cleaning brush.
3. substrate board treatment according to claim 1 is characterized in that, the aforesaid liquid feedway has the liquid feed pressure change mechanism that can change the liquid feed pressure of above-mentioned cleaning brush.
4. substrate board treatment according to claim 1 is characterized in that, above-mentioned cleaning brush turns back and forms in the central authorities of length direction.
5. substrate board treatment according to claim 1 is characterized in that, the end face that the pieces of above-mentioned cleaning brush has a leading section is in the shape in the plane parallel with above-mentioned conveyance path.
6. substrate board treatment according to claim 1 is characterized in that, the end face that the pieces of above-mentioned cleaning brush has leading section is in the shape in a plane long more, that tilt, the downstream in above-mentioned conveyance path more.
7. substrate board treatment according to claim 1 is characterized in that, above-mentioned bracing or strutting arrangement supports above-mentioned cleaning brush towards the downstream in above-mentioned conveyance path for 45 °～75 ° with the inclination angle.
8. substrate board treatment according to claim 1 is characterized in that, above-mentioned bracing or strutting arrangement supports above-mentioned cleaning brush towards the downstream in above-mentioned conveyance path for 60 ° with the inclination angle.
9. substrate board treatment according to claim 1 is characterized in that, the length of the pieces of above-mentioned cleaning brush is 10mm～60mm.
10. substrate board treatment according to claim 1 is characterized in that, the diameter of above-mentioned bristle is 0.05mm～0.2mm.
11. substrate board treatment according to claim 1 is characterized in that, above-mentioned cleaning brush is equipped with a plurality of along above-mentioned conveyance path.
12. substrate board treatment according to claim 1 is characterized in that, above-mentioned cleaning brush relative with above-mentioned conveyance path to and be provided in the two sides side.
13. substrate processing method using same, it is characterized in that, make the downstream of the leading section of the pieces that constitutes by a lot of bristles that constitute cleaning brush towards the substrate transferring path, and the side surface part that makes the pieces of above-mentioned cleaning brush is contacted with the interarea of the substrate in the conveyance process, under this state, aforesaid substrate is relatively moved, simultaneously with respect to above-mentioned cleaning brush, pieces to above-mentioned cleaning brush is supplied with the liquid of handling usefulness, thereby aforesaid substrate is handled.
14. substrate processing method using same according to claim 13 is characterized in that, only the side surface part of the pieces of above-mentioned cleaning brush is carried out the supply of aforesaid liquid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005359345 | 2005-12-13 | ||
| JP2005359345A JP2007165554A (en) | 2005-12-13 | 2005-12-13 | Substrate processor and substrate processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1983516A true CN1983516A (en) | 2007-06-20 |
| CN100446177C CN100446177C (en) | 2008-12-24 |
Family
ID=38165944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101642909A Expired - Fee Related CN100446177C (en) | 2005-12-13 | 2006-12-08 | Substrate processing method and substrate processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007165554A (en) |
| KR (1) | KR100841501B1 (en) |
| CN (1) | CN100446177C (en) |
| TW (1) | TW200727358A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101856646A (en) * | 2009-04-03 | 2010-10-13 | 大日本网屏制造株式会社 | Substrate board treatment |
| CN110090824A (en) * | 2018-01-30 | 2019-08-06 | 凯斯科技股份有限公司 | Brushing device |
| CN111921934A (en) * | 2020-08-11 | 2020-11-13 | 深圳市汤诚科技有限公司 | Based on chip is with processing production facility |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010137135A (en) * | 2008-12-10 | 2010-06-24 | Rasuko:Kk | Cleaning method and cleaning apparatus under low environmental load |
| CN103240244A (en) * | 2012-02-02 | 2013-08-14 | 林进诚 | Surface cleaning device and surface cleaning method |
| JP6090227B2 (en) * | 2014-04-22 | 2017-03-08 | Ｊｆｅスチール株式会社 | Waste removal apparatus and waste removal method |
| CN105185726B (en) * | 2014-05-13 | 2018-09-21 | 芝浦机械电子株式会社 | Substrate board treatment, substrate processing method using same, apparatus for manufacturing substrate and manufacture of substrates |
| JP6287672B2 (en) * | 2014-08-06 | 2018-03-07 | 旭硝子株式会社 | Substrate cleaning apparatus, cleaning method, and substrate manufacturing method using the cleaning method. |
| WO2018125821A1 (en) * | 2016-12-30 | 2018-07-05 | Applied Materials, Inc. | Spray bar design for uniform liquid flow distribution on a substrate |
| TWI753183B (en) | 2017-07-12 | 2022-01-21 | 美商康寧公司 | Apparatus and methods for manufacturing a glass substrate |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5536944A (en) | 1978-09-05 | 1980-03-14 | Citizen Watch Co Ltd | Method and device for washing rectangular substrate |
| JP2628168B2 (en) * | 1987-07-14 | 1997-07-09 | 住友シチックス株式会社 | Surface treatment equipment for semiconductor wafers |
| JPH09326377A (en) * | 1996-06-04 | 1997-12-16 | Dainippon Screen Mfg Co Ltd | Substrate treating system |
| US6230753B1 (en) * | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
| JPH1034090A (en) * | 1996-07-24 | 1998-02-10 | Sharp Corp | Washing device |
| JP3037620B2 (en) | 1996-08-27 | 2000-04-24 | 株式会社タイガーカワシマ | Rotating brush for seedling box washer |
| JP2000299302A (en) * | 1999-04-13 | 2000-10-24 | Seiko Epson Corp | Cleaning equipment |
| JP4602567B2 (en) * | 2000-12-15 | 2010-12-22 | 芝浦メカトロニクス株式会社 | Substrate cleaning device |
| JP2003145060A (en) * | 2001-11-15 | 2003-05-20 | Shibaura Mechatronics Corp | Cleaning brush, cleaning equipment |
| JP2005279451A (en) * | 2004-03-30 | 2005-10-13 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
-
2005
- 2005-12-13 JP JP2005359345A patent/JP2007165554A/en not_active Abandoned
-
2006
- 2006-11-06 TW TW095140963A patent/TW200727358A/en unknown
- 2006-12-07 KR KR1020060123632A patent/KR100841501B1/en not_active Expired - Fee Related
- 2006-12-08 CN CNB2006101642909A patent/CN100446177C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101856646A (en) * | 2009-04-03 | 2010-10-13 | 大日本网屏制造株式会社 | Substrate board treatment |
| CN101856646B (en) * | 2009-04-03 | 2013-08-07 | 大日本网屏制造株式会社 | Substrate processing apparatus |
| CN110090824A (en) * | 2018-01-30 | 2019-08-06 | 凯斯科技股份有限公司 | Brushing device |
| CN111921934A (en) * | 2020-08-11 | 2020-11-13 | 深圳市汤诚科技有限公司 | Based on chip is with processing production facility |
| CN111921934B (en) * | 2020-08-11 | 2022-06-10 | 深圳市汤诚科技有限公司 | Based on chip is with processing production facility |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070062915A (en) | 2007-06-18 |
| JP2007165554A (en) | 2007-06-28 |
| TW200727358A (en) | 2007-07-16 |
| KR100841501B1 (en) | 2008-06-25 |
| CN100446177C (en) | 2008-12-24 |
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