CN1975948B - Chip Capacitor - Google Patents

Abstract

The invention relates to a sheet capacitor and its IC socket, method thereof. A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, the capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.

Description

Chip Capacitor

This application is a divisional application of the application dated October 30, 2003, the application number 200310104724.2, and the title of the invention is "Chip Capacitor, IC Socket Using It, and Manufacturing Method of Chip Capacitor".

technical field

The present invention relates to chip capacitors used for noise absorption or filters of high-speed ICs and processors, IC sockets using the chip capacitors, and methods for manufacturing chip capacitors.

Background technique

In recent years, the speedup of personal computers and communication equipment is progressing, and miniaturization and high-frequency response of electronic components used for them are required. Along with this, it is also necessary to realize large capacitance and low impedance as a capacitor as an electronic component. In particular, power supply circuits for driving computer CPUs are required to absorb noise and pulsating current as a high-frequency response in terms of circuit design. Therefore, there is a strong demand for electrolytic capacitors with low ESR (equivalent series resistance), low ESL (equivalent series impedance), and large capacitance that can withstand high pulsating currents. In order to meet such demands, many small chip-type capacitors are currently arranged around the CPU at positions close to the CPU.

Fig. 53 shows the periphery of the CPU according to the above conventional configuration. A connection plug (hereinafter, referred to as a plug) 402 is provided under an IC 401 represented by a CPU. An IC socket (hereinafter referred to as socket) 403 is soldered to a printed wiring board (hereinafter referred to as substrate) 404 . A chip capacitor (hereinafter referred to as capacitor) 405 is mounted close to IC 401 configured in this way. A structure similar to the above mounting state in which a resistor is used instead of a capacitor is disclosed, for example, in Japanese Patent Publication No. 60-130150 published in 1960.

The IC 401 has 478 plugs 402 , and a wiring pattern (not shown) for leading out from the IC 401 is provided on the substrate 404 of the socket 403 . Therefore, in this mounted state, as the number of mounted components increases, the capacitor 405 around the IC 401 and other electronic components not shown in the figure are mounted away from the IC 401 and the mounting area is insufficient.

On the other hand, the operating frequency of the CPU is increasing. In order to absorb noise and supply current, it is necessary to make a large-capacity low-ESR and low-ESL chip-type capacitor as close as possible to the CPU. This frequency response is thus being lost in the prior art described above.

Specifically, because the height of the socket 403 is about 3 mm, and the distance from the socket 403 to the capacitor 405 is about tens of mm, the ESL increases for the CPU, and the higher the frequency, the higher the impedance. Therefore, the capacitive performance of low ESL cannot be fully exhibited in a high frequency region.

Contents of the invention

The chip capacitor in the present invention is provided with: an anode sheet having an anode electrode part on one side, a cathode sheet having a cathode electrode part on one side, arranged between the above-mentioned anode electrode part and the above-mentioned cathode electrode part, And the separator containing the electrolytic solution is arranged between the above-mentioned anode sheet and the above-mentioned cathode sheet, and an opening part is provided to be embedded in the above-mentioned separator, and the above-mentioned anode sheet and the above-mentioned cathode sheet are joined together to form a sealing sheet for sealing the above-mentioned separator .

Description of drawings

Fig. 1 is an exploded perspective view showing a chip capacitor and its usage state according to Embodiment 1 of the present invention.

2 is a cross-sectional view showing a state in which an IC is connected to the chip capacitor of FIG. 1 .

3A to 3D are plan views showing the configuration of the contact portion in FIG. 1 .

Fig. 4 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 2 of the present invention.

FIG. 5 is a cross-sectional view of the capacitive element using the chip capacitor shown in FIG. 4 .

FIG. 6 is an exploded perspective view showing a state of use of the chip capacitor of FIG. 4 .

7 is a cross-sectional view showing a state where an IC is connected to the chip capacitor of FIG. 4 .

Fig. 8 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 3 of the present invention.

FIG. 9 is a cross-sectional view of the chip capacitor shown in FIG. 8 .

Fig. 10 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 4 of the present invention.

FIG. 11 is a cross-sectional view of the chip capacitor shown in FIG. 10 .

Fig. 12 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 5 of the present invention.

FIG. 13 is a cross-sectional view of the chip capacitor shown in FIG. 12 .

Fig. 14 is a cross-sectional view showing a chip capacitor according to Embodiment 6 of the present invention and its state of use.

Fig. 15 is an exploded perspective view showing a chip capacitor and its usage state according to Embodiment 7 of the present invention.

FIG. 16 is a cross-sectional view of the chip capacitor of FIG. 15 and its surroundings.

FIG. 17 is an exploded perspective view showing the configuration of the chip capacitor of FIG. 15 .

Fig. 18 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 8 of the present invention.

Fig. 19 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 9 of the present invention.

FIG. 20 is an exploded perspective view of the chip capacitor of FIG. 19 .

21A and 21B are plan views showing the configuration of a contact portion of a chip capacitor according to Embodiment 10 of the present invention.

22A and 22B are plan views showing other examples of contact portions of the chip capacitor according to Embodiment 10 of the present invention. Fig. 22C and Fig. 22D are cross-sectional views of Fig. 22A and Fig. 22B respectively.

Fig. 23 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 11 of the present invention.

FIG. 24 is a cross-sectional view showing a state in which an IC is connected to the chip capacitor of FIG. 23 .

FIG. 25 is a plan view showing the chip capacitor in FIG. 23 , a pin for connecting to an IC, and a non-contact through-hole.

Fig. 26 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 12 of the present invention.

Fig. 27 is a cross-sectional view showing the chip capacitor of Fig. 26 .

FIG. 28 is a cross-sectional view showing a state in which an IC is connected to the chip capacitor of FIG. 26 .

FIG. 29 is a plan view showing the configuration of a contact portion of the chip capacitor of FIG. 26 .

FIG. 30 is an exploded perspective view showing the structure when the electrode foil of the chip capacitor of FIG. 26 is laminated in multiple layers.

Fig. 31 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 13 of the present invention.

Fig. 32 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 14 of the present invention.

Fig. 33 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 15 of the present invention.

Fig. 34 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 16 of the present invention.

Fig. 35 is a cross-sectional view showing the chip capacitor of Fig. 34 .

36 is a cross-sectional view showing a state where an IC is connected to the chip capacitor of FIG. 34 .

FIG. 37 is a plan view showing the configuration of a contact portion of the chip capacitor of FIG. 34 .

FIG. 38 is an exploded perspective view showing the structure when the electrode foil of the chip capacitor of FIG. 34 is laminated in multiple layers.

Fig. 39 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 17 of the present invention.

Fig. 40 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 18 of the present invention.

Fig. 41 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 19 of the present invention.

Fig. 42 is an exploded perspective view showing an IC socket using a chip capacitor according to Embodiment 20 of the present invention and its usage state.

FIG. 43 is an exploded perspective view of a sliding portion constituting the IC socket in FIG. 42. FIG.

Fig. 44 is a front sectional view showing the IC socket shown in Fig. 42 .

45A and 45B are plan views showing the configuration of a contact portion of an IC socket using a chip capacitor according to Embodiment 21 of the present invention.

46A and 46B are plan views showing other examples of contact portions of the IC socket according to Embodiment 21 of the present invention. 46C and 46D are cross-sectional views of FIG. 46A and FIG. 46B, respectively.

47A is a diagram showing the manufacturing process of the anode chip from the raw material to the pressing process in the manufacturing method of the chip capacitor according to Embodiment 22 of the present invention. Fig. 47B is a manufacturing process diagram of the insulating sheet of the chip capacitor according to Embodiment 22 of the present invention. Fig. 47C is a manufacturing process diagram of the insulating sheet of the chip capacitor according to Embodiment 22 of the present invention.

Fig. 48A is a plan view showing the manufacturing process from lamination of the finished cathode sheet, insulating sheet and anode sheet to forming the recess in the manufacturing method of the chip capacitor according to Embodiment 22 of the present invention. Fig. 48B is a front view showing the manufacturing process of Fig. 48A. Fig. 48C is a diagram showing the manufacturing process of Fig. 48A in the lower view.

49A is a manufacturing process diagram showing, in plan view, the steps of forming a contact portion on a finished wiring laminate sheet and mounting a capacitor element in a method of manufacturing a chip capacitor according to Embodiment 22 of the present invention. Fig. 49B is a front view showing the manufacturing process of Fig. 49A. Fig. 49C is a diagram showing the manufacturing process of Fig. 49A with a lower view.

Fig. 50 is a plan view showing a contact portion of a chip capacitor according to Embodiment 22 of the present invention.

Fig. 51 is a cross-sectional view showing the configuration of a capacitive element of a chip capacitor according to Embodiment 22 of the present invention.

Fig. 52A is a plan view showing the process of attaching the cover sheet for protecting the capacitive element mounted on the completed wiring laminate sheet to cutting into final individual sheets in the method of manufacturing a chip capacitor according to Embodiment 22 of the present invention; Manufacturing process diagram of the process. Fig. 52B is a front view showing the manufacturing process of Fig. 52A.

Fig. 53 is an exploded perspective view showing the state of the periphery of the CPU according to a conventional configuration.

Detailed ways

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in each embodiment of the present invention, the same reference numerals are attached to the parts having the same configuration, and their detailed descriptions are omitted.

(Embodiment 1)

1 is an exploded perspective view showing a chip capacitor according to Embodiment 1 of the present invention and its usage state, and FIG. 2 is a cross-sectional view showing a state in which an IC is connected to the chip capacitor of FIG. 1 . Connecting plugs (hereinafter referred to as plugs) 2 are provided under IC1 represented by a CPU. IC sockets (hereinafter referred to as sockets) 3 are soldered to printed wiring boards (hereinafter referred to as substrates) 4 . In this embodiment, an example of an IC package using 478 pins is shown.

The chip capacitor (hereinafter referred to as capacitor) 5 is provided with a through hole (hereinafter referred to as hole) 6 through which the pin 2 of IC1 penetrates. Further, only the contact portion (the blackened portion in the figure) that conducts with the plug 2 is formed in the hole 6 through which the plug 2 needs to be connected to the IC1. The capacitor 5 is formed by bonding a general-purpose printed circuit board (hereinafter referred to as a substrate) 8 on which a capacitive element 9 is mounted to a fixed substrate (hereinafter referred to as a substrate) 10 .

3A to 3D show the configuration of the contact portion 7 . 3A shows the hole 6 when it is not in contact with the plug 2. The size of the hole 6 at this time is preferably more than twice the outer diameter of the plug 2, because the larger the hole 6, the higher the non-contact reliability.

FIG. 3B shows the through-hole 6A when contact with the plug 2 is required for conduction. The hole 6A has a substantially star shape, the largest diameter is larger than the outer diameter of the plug 2 , and the smallest diameter is smaller than the outer diameter of the plug 2 . Therefore, since the protruding portion (smallest diameter portion) in contact with the plug 2 relaxes the stress generated by the up and down movement of the plug 2 during insertion and extraction, the plug 2 can be inserted and removed smoothly.

FIG. 3C shows the through hole 6B when it is necessary to contact the same plug 2 for conduction. The hole 6B has a substantially elliptical shape, and the outer diameter of the circular plug 2 is larger in the major axis direction and smaller in the minor axis direction than the diameter of the plug 2 . Since there is no edge in this shape, the stress on the contact portion 7 at the time of insertion is small, cracks are less likely to occur, and reliable connection can be obtained.

FIG. 3D shows the periphery of the through-hole 6B when contact with the same plug 2 is required for conduction. In addition to the hole 6B shown in FIG. 3C , slits 6C for absorbing stress when the hole 6B is enlarged by the plug 2 are adjacently provided in parallel to both ends of the hole 6B in the minor axis direction. Since the slit 6C can relax the stress applied to the hole 6B, the plug 2 can be inserted and pulled out smoothly.

Any of the types of contact portions shown above in FIGS. 3A to 3D may be used, but only polygonal contact portions may be used.

According to the capacitor 5 of this embodiment, the plug 2 of IC1 passes through the hole 6 of the capacitor 5 and is mounted on the socket 3. According to this structure, the IC1 and the capacitor 5 are conducted through the contact portion 7. With such a simple configuration, a thin chip capacitor 5 can be obtained. Since the capacitor 5 is sandwiched between the IC1 and the socket 3, it is possible to secure an area for mounting capacitor elements in the chip capacitor 5 with high density. Also, since the distance between the capacitor 5 and IC1 is short, ESL can be reduced.

(Embodiment 2)

4 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 2 of the present invention, and FIG. 5 is a cross-sectional view showing the structure of a capacitor element used in the chip capacitor. 6 is an exploded perspective view showing a state of use of the chip capacitor of FIG. 4 , and FIG. 7 is a cross-sectional view showing a state of connecting an IC to the chip capacitor of FIG. 4 .

In FIG. 4 , a through-hole (hereinafter referred to as a hole) 12 through which a plug (hereinafter referred to as plug) 2 of IC1 penetrates is provided in a conductive cathode sheet (hereinafter referred to as sheet) 11 . Only in the hole 12 through which the plug 2 needs to be connected to the IC1 is formed a contact portion 13 (a blackened portion in the figure) that conducts with the plug 2 . Furthermore, the peripheral portion 14 has a structure bent into a substantially L-shape for reinforcement. With this configuration, the bending strength of the chip capacitor can be improved without using a reinforcing material. An insulating sheet (hereinafter referred to as a sheet) 15 is arranged on the outer (lower surface in the figure) side of the sheet 11 . An insulating sheet (hereinafter referred to as a sheet) 16 made of a polymer material is disposed on the inner (upper side in the drawing) side of the sheet 11 , and an opening 20A is provided in the center of the sheet 16 .

A through-hole (hereinafter, referred to as a hole) 18 through which the plug 2 of the IC 1 penetrates is provided in the conductive anode sheet (hereinafter, referred to as sheet) 17 . Furthermore, only in the hole 18 through which the plug 2 needs to be connected to the IC1 is formed a contact portion 19 (the blackened portion in the figure) that conducts with the plug 2 . Also, an opening portion 20B is provided in the central portion. The chip capacitor element 21 has an anode extraction part 22 and a cathode extraction part 23 . The sheet 16 forms an insulating layer that insulates between the sheets 11 , 17 . An insulating sheet (hereinafter referred to as a sheet) 24 is arranged on the upper surface of the sheet 17 . The sheet 24 is provided with a through-hole (hereinafter, referred to as a hole) 25 through which the plug 2 of the IC 1 penetrates. In addition, similarly to the sheet 11, the peripheral portion 14 of the sheet 17 may be bent into a substantially L-shape for reinforcement.

In the chip capacitor according to the present embodiment thus constituted, the sheet 16 and the conductive sheet 17 are bonded in layers on the inside of the conductive sheet 11 where the sheet 15 is bonded to the outside. Furthermore, capacitive element 21 is disposed in openings 20A, 20B provided in overlapping central portions of sheet 16 and sheet 17 . Since the capacitive element 21 is arranged in the openings 20A and 20B in this way, a thin chip capacitor can be obtained. Moreover, the anode extraction part 22 of the capacitive element 21 is electrically connected to the sheet 17, the cathode extraction part 23 is electrically connected to the sheet 11, and the sheet 24 is further sealed to cover the sheet 17. In the above description, the opening portion 20B is provided in the sheet 17 , but may also be provided in the sheet 11 .

In addition, the openings 26 and 27 are respectively provided with pieces 15 and 24 so that the test plugs can directly contact the conductive pieces 11 and 17 , respectively. With such a configuration, it is possible to supply power in the burn-in process of the circuit chip of the mounted component and the capacitive element 21 without passing through the contact portion 19 . In turn, the contact portion 19 connected to the plug 2 can be protected during the production process. By forming the openings 26 and 27 enlarged, it is possible to smoothly and reliably supply electric power in the burn-in process required for producing the capacitive element 21 .

In addition, the sheets 15, 16, and 24 can also be made of insulating glue such as epoxy resin and melamine, polyethylene-to-titanate (PET), polypropylene (PP), polycarbonate (PC), etc. Insulating materials and heat-resistant insulating sheets such as polyimide (PI) and polyamide imide (PAI) are formed. In addition, a structure bonded with an adhesive may also be used. Also, the outer package may be formed by covering by resin molding, or the surface may be covered with an insulating sheet, coated with a coating material, or printed with insulating glue.

Also, the conductive sheets 11, 17 having the contact portions 13, 19 are made of elastic materials such as phosphor bronze for springs and stainless steel (SUS) plated with gold, which is satisfactory from the point of view of connection stability. . However, the sheets 11 and 17 may also be composed of copper-iron-aluminum sheets or sheets obtained by laminating elastic films and metal foils.

FIG. 5 is a cross-sectional view showing in detail the configuration of the chip-shaped capacitive element 21 . A dielectric oxide surface film 28 is formed on the surface of the electrode body on which the anode extraction portion 22 is provided. Further, a solid electrolyte layer 29 made of functional polymers is formed by lamination on the surface, and a cathode layer made of carbon and silver paste is formed on the surface to form the cathode extraction part 23 . The thickness of the cathode layer is not less than 0.1mm and not more than 0.2mm, and the upper surface and the lower surface of the cathode extraction portion 23 are connected through the cut-out portion 30 provided on the side.

As shown in FIG. 6, chip capacitor (hereinafter referred to as capacitor) 31 configured in this way is mounted in IC socket 3 so that plug 2 provided on the lower surface of IC 1 penetrates through hole 32 formed in capacitor 31 . The through hole 32 integrates the through holes 12 , 18 , and 25 . Furthermore, IC1 conducts with the capacitor 31 through a contact portion 33 (a blackened portion in the figure). The contact portion 33 integrates the contact portions 13 , 19 . With such a simple configuration, a thin chip capacitor 31 can be obtained. According to this configuration, since the capacitive element 21 is connected from the root of the plug 2, ESL caused by wiring between the capacitive element 21 and IC1 can be greatly reduced.

In addition, as shown in FIG. 7, in the state where IC1 is mounted in the capacitor 31, since the holes 12, 18 formed on the conductive sheets 11, 17 are large for the plug 2, the holes 12, 18 are not electrically connected to the plug 2. . On the other hand, the contact portion 13 formed on the sheet 11 is brought into contact with the plug 2A for electrical connection. On the other hand, the hole 18 of the upper piece 17 is formed larger. Therefore, the hole 18 is not in contact with the connection plug 2A, and only the tab 11 is electrically connected to the plug 2A. Also, a contact portion 19 formed on the sheet 17 is brought into contact with the plug 2B for electrical connection. On the other hand, the through hole 11A of the lower sheet 11 is formed larger. Therefore, the hole 11A is not in contact with the plug 2B, and only the tab 17 is electrically connected with the plug 2B.

Also, the cathode plug 2A for connecting IC1 is connected to the cathode extraction portion 23 of the capacitive element 21 through the contact portion 13 and the chip 11 . On the other hand, the anode plug 2B for connecting IC1 is connected to the anode extraction part 22 of the capacitive element 21 through the contact part 19 and the tab 17 . Generally, since the sheet 17 and the anode extraction portion 22 are made of metal, they can be connected by electric or laser welding, riveting, ultrasonic welding, or the like. Since the sheet 11 and the cathode extraction part 23 are composed of metal and conductive material, they can be connected by conductive paste and adhesive or crimping.

(Embodiment 3)

8 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 3 of the present invention, and FIG. 9 is a cross-sectional view of FIG. 8 . In this embodiment, the capacitive elements of the chip capacitor in Embodiment 2 are mounted in two stacked states, and the characteristics of the respective capacitive elements are different. Except for this structure, it is the same as Embodiment 2.

As in Embodiment 2, an insulating sheet (hereinafter referred to as sheet) 16 and a conductive anode sheet (hereinafter referred to as sheet) 17 are bonded to the inside of a conductive cathode sheet (hereinafter referred to as sheet) 11 in a laminated manner. Capacitance element 21 is disposed in opening 20 provided at the overlapping center portions of sheets 16 and 17 . The anode extraction part 22 of the capacitive element 21 is electrically connected to the sheet 17 , and the cathode extraction part 23 is electrically connected to the sheet 11 . In this way, a layered body is formed. An insulating sheet (hereinafter, referred to as a sheet) 24 is sealed to cover the sheet 17 . In this way, the first chip capacitor is formed.

Further, on the lower surface of the sheet 11, an insulating sheet 34 (hereinafter referred to as a sheet) and a conductive second anode sheet (hereinafter referred to as a sheet) 35 are laminated and bonded. The capacitive element 37 is disposed in the opening 36 provided at the overlapping center portions of the sheets 34 and 35 . An anode extraction part 38 of the capacitive element 37 is electrically connected to the chip 35 , and a cathode extraction part 39 is electrically connected to the chip 11 . In this way, a layered body is formed. The insulating sheet 40 is sealed to cover the sheet 17 . In this way, the second chip capacitor is formed.

Furthermore, the contact portion 13 of the sheet 11 , the contact portion 19 of the sheet 17 , and the contact portion 41 of the sheet 35 are in contact with the plug 2 in FIG. 9 .

In this way, in the chip capacitor according to this embodiment, a plurality of capacitive elements having different types or characteristics are integrally formed in one chip capacitor. Generally, about 1/4 to 1/3 of ICs are constituted by power lines of the same system. Therefore, according to such a configuration, a plurality of capacitive elements 21 and 37 can be collectively connected. Furthermore, it is possible to connect the capacitive elements 21 and 37 with respective withstand voltages to the plugs 2 of different voltages of one IC1. Therefore, the overall size and thickness can be further reduced.

(Embodiment 4)

10 is an exploded perspective view showing the configuration of a chip capacitor according to Embodiment 4 of the present invention, and FIG. 11 is a cross-sectional view of FIG. 10 . In this embodiment, the capacitive elements of the chip capacitor in Embodiment 2 are mounted in two stacked states, and the characteristics of the respective capacitive elements are different. Except for this structure, it is the same as Embodiment 2.

On the conductive cathode sheet (hereinafter referred to as sheet) 11, conductive anode sheets (hereinafter referred to as sheet) 42, 43 are laminated with insulating sheets (hereinafter referred to as sheet) 44, 45 respectively between them. . Furthermore, the anode extraction portion 38 of the capacitive element 37 is connected to the chip 42 , and the cathode extraction portion 39 is electrically connected to the chip 11 . Furthermore, the anode extraction part 22 of the capacitive element 21 different in withstand voltage or characteristic from the capacitive element 37 is connected to the sheet 43 , and the cathode extraction part 23 is connected to the sheet 11 . Also, an insulating sheet 46 is sealed to cover the sheet 43 . In this way, a chip capacitor is formed.

11, contact portion 47 of chip 11, contact portion 48 of chip 42 serving as the anode of capacitive element 37, and contact portion 49 of chip 43 serving as the anode of capacitive element 21 are in contact with plug 2 of IC1.

Thus, according to the chip capacitor of the present embodiment, as in the third embodiment, a plurality of capacitive elements having different types or characteristics are integrally formed in one chip capacitor. Therefore, similarly to the third embodiment, it is possible to collectively connect the capacitive elements 21 and 37 of each withstanding voltage to the plugs 2 of different voltages to one IC1. Therefore, the overall size and thickness can be further reduced.

(Embodiment 5)

12 is an exploded perspective view showing the configuration of a chip capacitor according to Embodiment 5 of the present invention, and FIG. 13 is a cross-sectional view of FIG. 12 . In this embodiment, a plurality of capacitive elements of the chip capacitor in the second embodiment are mounted. Except for this structure, it is the same as Embodiment 2.

On the upper surface of the conductive cathode sheet (hereinafter referred to as sheet) 11 , a conductive anode sheet (hereinafter referred to as sheet) 17 is laminated via an insulating sheet (hereinafter referred to as sheet) 16 . In addition, the anode extraction parts 51 of the plurality of capacitive elements 50 are respectively connected to the chip 17 , and the respective cathode extraction parts 52 are connected to the chip 11 . And the insulating sheets 24, 15 seal it. In this way, a chip capacitor is formed.

In addition, in FIG. 13 , the contact portion 53 of the sheet 11 serving as the cathode of the capacitive element 50 and the contact portion 54 of the sheet 17 serving as the anode of the capacitive element 50 are in contact with the connection plug 2 of the IC1.

In this way, the chip capacitor according to this embodiment has a structure in which the capacitor element is divided into a plurality of parts. Therefore, the stress applied to the capacitive element 50 due to the flip-flop capacitor can be buffered. That is, it is possible to suppress stress added when a chip capacitor is inserted into IC1 and scattering of LC due to thermal expansion.

(Embodiment 6)

Fig. 14 is a cross-sectional view showing a chip capacitor according to Embodiment 6 of the present invention and its state of use. The connection plug 2 provided on the IC1 is inserted into the IC socket 3 provided on the printed wiring board 4 . A large recess 56 is formed in the center of the chip capacitor 55 to fit into the hollow portion of the IC socket 3 , and the capacitive element 57 is mounted in the recess 56 .

In this way, in the chip capacitor according to this embodiment, it is possible to mount the high-height capacitive element 57 in the chip capacitor 55 . Also, when the chip capacitor 55 is assembled upside down, it is impossible to insert the connection plug 2 into the IC socket 3 or to contact other electronic components 58 . Therefore, reverse insertion of the chip capacitor 55 can be prevented.

(Embodiment 7)

Fig. 15 is an exploded perspective view showing a chip capacitor according to Embodiment 7 of the present invention and its usage state, and Fig. 16 is a cross-sectional view of Fig. 15 . FIG. 17 is an exploded perspective view showing the configuration of the chip capacitor of FIG. 15 .

A bonding surface for connection (hereinafter referred to as bonding surface) 59 is provided on the lower surface of IC1. The printed wiring board (hereinafter, referred to as a substrate) 4 has a connection bonding surface (hereinafter, referred to as a bonding surface) 60 . A connection joint surface (hereinafter referred to as a joint surface) 62 is provided on an upper surface of a chip capacitor (hereinafter referred to as a capacitor) 61 to be connected to the joint surface 59 . A connection joint surface 72 connected to the joint surface 60 is likewise arranged on the underside. The joint surfaces 62 and 72 are integrally connected by the through hole 71 . The blackened portion in FIG. 15 is the bonding surface 63 for power supply provided on the chip capacitor 61 (hereinafter referred to as the bonding surface). Like the joint surface 62, the joint surface 63 is integrally connected in the vertical direction by through holes, and is also electrically connected to the built-in capacitive elements 67 and 68 .

Chip capacitor 61 configured in this way is sandwiched between IC1 and substrate 4 . According to such a configuration, it is possible to secure an area for mounting the capacitive element in the chip capacitor 61 . The chip capacitor 61 is mechanically fixed and electrically connected at the same time by means of connection methods such as solder holes through joint surfaces 62 provided correspondingly to the joint surfaces 59 and 60 . According to such a structure, each connection of IC1, board|substrate 4, and chip capacitor 61 can be performed by the same method as conventional.

In FIG. 17, the first insulating plate (hereinafter referred to as the substrate) 64 is formed in substantially the same shape as IC1. The anode connection part 65 and the cathode connection part 66 are respectively connected to the anode extraction part and the cathode connection part provided on the capacitive element described later. The cathode extraction part is connected. The respective types and characteristics of the capacitive elements 67, 68 are different. The second insulating plate (hereinafter referred to as the substrate) 69 forms approximately the same shape as IC1, and has a thickness ratio of the capacitive elements 67, 68. A high-height configuration. The square cutout portion 70 is provided at the center of the substrate 69. The bonding surface 62 and the bonding surface 63 are provided on the substrates 64 and 69, respectively.

By dividing the insulating substrate in this way and arranging the capacitive elements 67 and 68 in one cutout portion, the chip capacitor 61 can be made thinner. In addition, the capacitive elements 67 and 68 can be connected from the bonding surface 59 of the IC1. Therefore, it is possible to significantly reduce the value of ESL due to the wiring between the capacitive elements 67 and 68 and IC1. In addition, the insulating substrates 64, 69 have substantially the same shape as the IC1, and have a configuration in which the intervals between the connection joint surfaces provided on the insulating substrates 64, 69 correspond to the intervals between the connection joint surfaces 59 provided on the IC1. . Therefore, it is possible to collectively connect one common electronic component element (large-capacitance capacitor and power supply module) to the connection joint surface 59 of IC1 having the same shape as IC1. Therefore, the entire circuit including IC1 can be reduced in size and thickness.

Also as shown in FIG. 16 , in capacitor 61 , vertical through-holes 71 conducting vertically are formed corresponding to the intervals between bonding surfaces 59 in a state where substrate 64 and substrate 69 are bonded together. Through the through hole 71, the bonding surface 62 connected to the IC 1 is arranged on the upper surface, and the bonding surface 72 connected to the substrate 4 is arranged on the lower surface.

Further, capacitive elements 67 and 68 are mounted on the substrate 64 and inside a cutout portion 70 provided on the substrate 69 . Capacitance elements 67 and 68 are covered with insulating portion 73 made of rubber-based resin and heat-resistant resin such as polyimide, polyamideimide, or phenol.

In addition, the capacitive element 67 is constituted by forming a functional polymer layer on the outer surface of the anode electrode foil 74 formed with a dielectric oxide surface film layer, and further forming the cathode extraction portion 75 on the outer surface. The anode electrode foil 74 is joined to the anode connection part 65, and the cathode extraction part 75 is joined to the cathode connection part 66 by means of welding, conductive glue made of silver and carbon, etc., and are electrically connected to each other. Similarly, the capacitive element 68 is formed by forming a functional polymer layer on the outer surface of the anode electrode foil 76 formed with a dielectric oxide surface film layer, and further forming the cathode extraction portion 77 on the outer surface. The anode electrode foil 76 is joined to the anode connection part 65, and the cathode extraction part 77 is joined to the cathode connection part 66 by means of connection methods such as welding and silver-carbon conductive glue, and are electrically connected to each other. The cathode extraction parts 75, 77 are made of silver paste and carbon.

In addition, in FIG. 16 , the insulating layer 78 insulates the wiring portion formed on the capacitor 61 . The solder hole 79 is connected to the bonding surface 59 of the IC 1 , and the solder hole 80 is connected to the bonding surface 60 of the substrate 4 . By providing the solder holes 79 and 80 in this way, the capacitor 61 is sandwiched between the IC1 and the substrate 4 and inverted, and the substrate 4, the capacitor 61, and the IC1 can be laminated and connected integrally.

According to such a configuration, a plurality of capacitive elements 67 and 68 having different types and characteristics can be connected in accordance with the voltage and capacity used by IC1. In addition, capacitance can be added without changing the shape of the bonding surface 60 formed on the substrate 4 . Therefore, it is possible to add circuits, strengthen noise countermeasures, and the like without changing the pattern on the substrate 4 . Therefore, the product development period can be greatly shortened.

Also, in this embodiment, IC1 has been described by taking the leadless type as an example, but it is not limited thereto. It is also possible to connect a flat package type IC to the chip capacitor of the present embodiment by forming the bonding surface to be connected to the IC in a flat package type so as to match the pitch of the leads.

Furthermore, printed wiring boards with a multilayer structure may be used for the substrate 64 and the substrate 69 .

(Embodiment 8)

Fig. 18 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 8 of the present invention. The IC 81 has lead wires 82 for connection. A through hole 84 is provided to vertically penetrate an insulating substrate (hereinafter referred to as substrate) 83 . On the upper surface of the substrate 83 , a connection bonding surface (hereinafter referred to as bonding surface) 85 to be connected to the lead wire 82 of the IC 81 is provided. The bonding surface 86 is connected to the connection bonding surface 60 of the printed wiring board (hereinafter referred to as substrate) 4 provided on the lower surface of the substrate 83 . The wiring portion 88 connects the bonding surfaces 85 and 60 and the chip capacitor 87 . Solder holes 89 are used to connect the joint surface 86 and the joint surface 60 . The chip capacitor 87 is disposed on the outer periphery of the IC 81 . In this way, chip capacitor (hereinafter referred to as capacitor) 90 can be formed.

In this configuration, conduction is achieved by connecting the bonding surface 85 provided on the upper surface of the capacitor 90 to the lead 82 of the IC 81 and connecting the bonding surface 86 provided on the lower surface of the capacitor 90 to the bonding surface 60 of the substrate 4 . Therefore, the chip capacitor 90 can be sandwiched between the IC 81 and the substrate 4 . Accordingly, it is possible to secure an area for mounting the capacitive element in the chip capacitor 90 . Furthermore, since the insulating substrate can be formed in one piece, the cost can also be reduced.

(Embodiment 9)

Fig. 19 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 9 of the present invention, and Fig. 20 is an exploded perspective view of Fig. 19 . The capacitive element 92 is mounted in the body portion 91 of the chip capacitor. The capacitive element 92 is formed by laminating a conductive polymer layer 94 and a cathode layer 95 made of carbon, silver paste, etc. on an anode electrode foil 93 with a dielectric oxide surface film formed on the surface.

Also, the anode electrode foil 93 is connected to the conductive anode sheet (hereinafter referred to as sheet) 96 and connected to the IC1 connection plug 2 via the contact portion 97 . Further, the cathode layer 95 is connected to a cathode tab (hereinafter referred to as tab) 98 and connected to another IC connection plug (hereinafter referred to as plug) 2 via a contact portion 99 . The sheets 96 and 98 also serve as wiring for taking out the anode and wiring for taking out the cathode, respectively, and are made of SUS, phosphor bronze for springs, or the like. The capacitive element 92 constructed in this way is sealed with the cover sheet 100 of an insulator, so that the body part 91 of the chip capacitor according to this embodiment is constituted.

The slide plate 101 is formed into a box shape with an open top. The guides 102 are arranged at the upper end of the slide plate 101 to face each other. The guide 102 is placed on the upper end of the body portion 91 , and the slider 101 is installed in the body portion 91 . Therefore, the slide plate 101 can be freely slidably held in the left-right direction in FIG. 19 with respect to the body portion 91 .

In this state, the spring 104 is compressed and inserted into the spring receiving portion 103 formed between the body portion 91 and the slide plate 101 . Accordingly, the slider 101 moves in the right direction in the drawing, and the body portion 91 moves in the left direction. Due to this force, the through hole 105 provided in the slide plate 101 and the contact portions 97 , 99 clamp the plug 2 . In this configuration, the through-hole 105 formed larger than the through-hole 2 moves to the left side in a state where the spring 104 is compressed. Therefore, it is extremely easy to insert and extract the body portion 91 for replacement.

Furthermore, the reinforcement portion 106 supports the spring 104 . A through hole 107 is provided to vertically penetrate the cathode layer 95 of the capacitive element 92 . The spring 104 is an urging portion that urges the main body portion 91 and/or the slide plate 101, and may be formed of an elastic body such as rubber other than a spring.

The main body portion 91 configured in this way is arranged to be sandwiched between the IC 1 and the substrate 4 . Furthermore, by passing the plug 2 of IC1 through the through hole 108 of the main body part 91 and installing it in the IC socket 3, the IC1 and the main body part 91 are connected through the contact part 109. With such a simple configuration, a thin chip capacitor can be obtained. According to this configuration, in a state where the through-hole 105 of the slider 101 and the through-hole 108 of the main body portion 91 are aligned, the plug 2 can be easily inserted and pulled out of the through-hole. Also, in the state of use, since the elasticity acts in the direction of clamping the plug 2 into the hole 105 of the slider 101 and the contact portion 109, the plug 2 can be locked and the contact portion 109 and the plug 2 can be electrically connected surely. Also because the contact portion 109 has elasticity, even when there is a spacing deviation in the plug 2, the elasticity of the contact portion 109 can absorb the spacing deviation.

(Embodiment 10)

21A and B are diagrams showing the configuration of a contact portion of a chip capacitor according to Embodiment 10 of the present invention. Other configurations are the same as those of the ninth embodiment.

A through-hole 108 into which the IC 1 is inserted into a connection plug (hereinafter referred to as a plug) 2 is formed larger than the plug 2 . A through hole (hereinafter, referred to as a hole) 105 is provided in the slide plate 101 . A semicircular through-hole 110 having a linear portion is formed in the elastic conductive sheets 96 and 98 . A slit 111 is formed adjacent to the through hole 110 . An elastic contact portion 112 is formed between the through hole 110 and the slit 111 .

The contact portion 112, as shown in FIG. 21B, the hole 105 also moves in the same direction when the slider 101 moves in the direction of the arrow in the figure when the plug 2 of the IC1 is inserted. Therefore, the contact portion 112 having elasticity for clamping the plug 2 is bent and deformed toward the slide plate 111 side. Due to this deformation, even when there is an interval deviation in the plug 2 , the plug 2 can be surely brought into contact with the contact portion 112 by the contact portion 112 having elasticity. Also in the state of FIG. 21A, since the hole 105 of the slide plate 101 is not in contact with the plug 2, the plug 2 can be inserted and pulled out easily.

22A and 22B are plan views showing other examples of contact portions, and FIGS. 22C and 22D are cross-sectional views of FIGS. 22A and 22B, respectively. A through-hole (hereinafter, referred to as a hole) 113 is formed in an elastic conductive sheet (hereinafter, referred to as a sheet) 114 and has a protrusion inside. By inserting the plug 2 into the hole 113 and bending the protrusion, the elastic contact portion 115 is formed. In the conductive sheet 116 on the counter electrode side, a large opening 117 is formed so as not to conduct with the plug 2 . The insulating sheet 118 maintains insulation between the pair of conductive sheets 114 , 116 . Cover sheet 119 covers sheet 114 .

With the contact portion 115 thus constituted, as shown in FIGS. 22B and 22D, when the plug 2 is inserted and the slider 101 moves in the direction of the arrow in the figure, the hole 105 also moves in the same direction. Therefore, the contact portion 115 having elasticity for clamping the plug 2 is curvedly deformed to the outside. Due to this deformation, even when there is an interval deviation in the plug 2, the plug 2 can be surely brought into contact with the contact portion 115 because the contact portion 115 has elasticity. Moreover, in the state of FIG. 22A, 22C, since the hole 105 of the slide plate 101 is not in contact with the plug 2, the plug 2 can be inserted and pulled out easily.

(Embodiment 11)

Fig. 23 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 11 of the present invention. FIG. 24 is a cross-sectional view showing a state in which an IC is connected to the chip capacitor of FIG. 23 . 25A and 25B are plan views showing the contact portion of FIG. 23 .

A through-hole (hereinafter, referred to as a hole) 121 through which a connection pin (hereinafter, referred to as a pin) 2 of the IC 1 penetrates is provided in a conductive anode sheet (hereinafter, referred to as a sheet) 120 . In the hole 121, only in the hole 121 through which the plug 2 to be connected to the IC1 penetrates, is formed a contact portion 122 (the blackened portion in the figure) that conducts with the plug 2 . An opening portion 123 is also provided at the central portion.

A through-hole (hereinafter, referred to as a hole) 125 through which the plug 2 penetrates is provided in the first cathode sheet (hereinafter, referred to as sheet) 124 . In the hole 125, only in the hole 125 through which the plug 2 to be connected to the IC1 passes, is formed a contact portion 126 (the blackened portion in the figure) that conducts with the plug 2 . Further, a bent portion 127 bent into a substantially L-shape is provided on the periphery (end face) for reinforcement.

A through-hole (hereinafter, referred to as a hole) 129 through which the plug 2 penetrates is provided in the second cathode sheet (hereinafter, referred to as sheet) 128 . In the hole 129, only in the hole 129 through which the plug 2 to be connected to the IC1 passes, is formed a contact portion 130 (the blackened portion in the drawing) that conducts with the plug 2 . Further, a bent portion 131 bent into a substantially L-shape is provided on the periphery (end surface) for reinforcement.

Insulating sheets (hereinafter, referred to as sheets) 132 and 133 are respectively provided with through-holes 134 through which the plug 2 penetrates, and openings 135A and 135B are respectively provided at the central parts. Insulating sheets (hereinafter referred to as sheets) 136 and 137 are respectively provided with through-holes 138 through which the plug 2 passes. The chip-shaped capacitive element 139 has an anode extraction portion 140 and a cathode extraction portion 141 .

In the chip capacitor according to the present embodiment thus constituted, the chips 132 and 133 are disposed on the front and rear surfaces of the chip 120, and the chips 124 and 128 are sandwiched therebetween. Furthermore, capacitive elements 139 are disposed in openings 123 , 135A, 135B provided in overlapped central portions of sheet 120 and sheets 132 , 133 . Further, the anode extraction part 140 of the capacitive element 139 is electrically connected to the sheet 120 and the cathode extraction part 141 is electrically connected to the sheets 124 and 128 through the conductor 142 . Also, the sheet 136 covers the sheet 124 , and the sheet 137 covers the sheet 128 .

In FIG. 24 , the contact portion 143 is connected with the plug 2 and the blade 120 . The contact portion 144 is connected to the plug 2 and the blades 124 , 128 . The through hole 145 is not connected to the plug 2 . The welded portion 146 is electrically connected to the bent portion 127 of the sheet 124 and the bent portion 131 of the sheet 128, and the sheet 120 is shielded by this configuration. In this way, the chip capacitor according to this embodiment can be configured.

In addition, the sheets 120, 124, 128 are preferably made of conductive and elastic materials such as phosphor bronze for springs, SUS, nickel silver alloy, and beryllium copper. If its thickness is 0.05 to 0.25 mm, the insertion and extraction properties are good. In addition, for the sheets 132, 133, 136, and 137, PET, polyamide (PA), PC, heat-resistant polyphenylene vulcanization (PPS), PI, polyetheretherketone (PEEK ). Alternatively, hard substrates such as ceramics and glass, acrylic, silicon, and melamine-based insulating paints may be used to maintain the sheet shape. In addition, the thickness of the substrate is 0.03-0.2 mm, which is easy to handle, and the thinner the insulating sheet between electrodes, the lower the ESL. Also, when insulating paint is used, the thickness is preferably 5 to 20 µm, and the separate use of sheets or insulating paint is determined arbitrarily depending on the manufacturing method and cost.

In the chip capacitor according to the present embodiment configured in this way, the current flowing through the capacitive element 139 is divided into two into the first current loop 147 and the second current loop 148 as shown by the solid line in FIG. 24 and flows. In the first current loop 147 that becomes the lower side in the figure, the current flows from the anode extraction part 140 → the contact part 122 of the sheet 120 → the plug 2 → IC1 → the plug 2 → the contact part 126 of the sheet 124 → the cathode extraction part 141 sequential flow. In the second current loop 148 that becomes the upper side in the figure, the current flows from the anode extraction part 140 → the contact part 122 of the sheet 120 → the plug 2 → IC1 → the plug 2 → the contact part 130 of the sheet 128 → the cathode extraction part 141 sequential flow.

Therefore, through the current loops 147 and 148 that flow through the upper side and the lower side in this way, the current is divided into the upper side and the lower side and returned to the capacitive element 139 . Furthermore, the directions of the current loops are opposite in the upper side and the lower side, canceling the generated magnetic fields. Therefore, the ESL component is made small, and the ESL to the plug 2 is made extremely small.

In addition, in the above configuration, the upper current loop 147 and the lower current loop 148 have the same area, so that the generation of a magnetic field can be suppressed and the ESL can be reduced. Further, the sheet 124 and the sheet 128 are electrically connected to each other through the welded portion 146 to cover the sheet 120 . Thus making ESR and ESL extremely small.

Alternatively, a contact portion may be provided on only one of the sheet 124 and the sheet 128 , and the sheet 124 and the sheet 128 may be electrically connected on the end surface by the welded portion 146 . In this configuration, since the contact portion formed on the cathode sheet is only one side, it is easy to insert and remove the plug 2 .

In addition, in this embodiment, the portions excluding the holes 125, 129 and the contact portions 126, 130 of the sheets 124, 128 are covered with an insulating layer made of the sheets 132, 133 or insulating coating. According to this configuration, since the cathode bonding surface cannot be directly touched by hand, it is possible to prevent troubles such as destruction of IC1 due to static electricity during mounting.

25A and 25B show a through-hole not in contact with the plug 2 and a contact portion in contact with the plug 2, respectively. In FIG. 25A , the non-contact through-holes forming the pieces 120 , 124 , and 128 are larger than the outer diameter of the plug 2 . In addition, the through hole 150 of the insulating sheet is formed smaller than the through hole 149 in order to maintain the insulation between the plug 2 and the sheets 120 , 124 , and 128 .

Also in FIG. 25B , the contact portions 151 provided on the pieces 120 , 124 , and 128 in contact with the plug 2 form an ellipse whose minor axis is smaller than the outer diameter of the plug 2 and whose major axis is larger than the outer diameter of the plug 2 . In this way, the plug 2 can be brought into contact with the pieces 120, 124, 128 arbitrarily through the combination of Figs. 25A and 25B.

(Embodiment 12)

26 is an exploded perspective view showing the structure of a chip capacitor according to Embodiment 12 of the present invention, FIG. 27 is a cross-sectional view of FIG. 26, and FIG. 28 is a cross-sectional view showing a state where an IC is connected to the chip capacitor of FIG.

The cathode sheet (hereinafter, referred to as sheet) 152 is composed of a conductive body in which phosphor bronze for springs is plated with gold. Formed in the sheet 152 are through-holes 153 corresponding to the intervals between IC1 connection plugs (hereinafter referred to as plugs) 2 and contact portions 154B connected to IC1 connection cathode plugs (hereinafter referred to as plugs) 2B. Cathode electrode foil (hereinafter, referred to as electrode foil) 155 is electrically and mechanically connected to a substantially central portion of sheet 152 through connection portion 156A formed by ultrasonic welding, cold stamping, or the like.

The anode piece (hereinafter, referred to as a piece) 157 is composed of a conductor made of phosphor bronze for springs plated with gold. On the sheet 157 are formed through-holes 153 corresponding to the intervals of the plugs 2 of IC1 and contact portions 154A connected to anode plugs (hereinafter referred to as plugs) 2A for connection of IC1. Anode electrode foil (hereinafter referred to as electrode foil) 158 is electrically connected and mechanically joined to a substantially central portion of sheet 157 through connection portion 156B formed by ultrasonic welding, cold pressing, or the like. The electrode foils 115 and 158 function as a cathode electrode part and an anode electrode part, respectively.

Separator 159 is impregnated in a gel electrolyte solution not shown in the figure, and is disposed between sheet 152 and sheet 157 . That is, electrode foil 115 and electrode foil 158 are provided facing each other with separator 159 interposed therebetween. In addition, when the electrode constituent part is sealed by using a gel-like electrolytic solution, since the electrolytic solution does not flow out, occurrence of improper sealing can be prevented.

The sealing sheet 160 provided with an opening portion in the central portion is made of insulating material such as polyethylene, PET, epoxy resin, melamine, silicone resin or the like. The sealing sheet 160 is disposed between the sheets 152 and 157 to join them into one body by bonding or heat welding, and seals the electrode foils 155 , 158 sandwiching the separator 159 . Through-holes 153 consistent with the intervals of the plugs 2 are provided in the insulating sheets 161 and 162 , and are respectively attached to the outer surfaces of the sheets 152 and 157 . In addition, instead of the sheets 161, 162, an insulating coating may be applied to the outer surfaces of the sheets 152, 157.

In this manner, the chip capacitor (hereinafter, referred to as capacitor) 163 of this embodiment can be configured. According to such a configuration, electric power is directly supplied from the sheets 152 and 157 to the electrode foils 155 and 158 , respectively. Therefore, ESR can be reduced. Also, since the electrical conduction path constituted by the sheet 157 and the sheet 152 is sealed, ESL can also be reduced. Furthermore, structurally, the overall thickness of the capacitor 163 is reduced.

In addition, it is preferable to depressurize and seal the electrode constituent part composed of the electrode foil 158, the separator 159, and the electrode foil 155 below atmospheric pressure. If this is done, since the electrodes are bonded through the separator 159, the electrode interval is stabilized, and the variation in characteristics becomes small.

In the capacitor 163 of the present embodiment configured in this way, the through-hole 153 through which the pin 2 of the IC 1 penetrates is provided. In addition, contact portions 154A and 154B (blackened portions in the figure) that conduct with the plug 2 are formed only in the through hole 153 through which the plug 2 to be connected to the IC1 passes. By inserting the plug 2 of IC1 through the through hole 153 of the capacitor 163 and attaching it to the IC socket 3, the IC1 and the capacitor 163 are electrically connected through the contact portions 154A and 154B. According to such a configuration, the capacitor 163 can be interposed between the IC1 and the IC socket 3 . Therefore, no space is required for mounting the capacitor 163 on the printed circuit board. In addition, when IC1 is a CPU, generally about 1/4 to 1/3 are constituted by the power supply line of the same system. According to this configuration, it is possible to collectively connect a plurality of power supply plugs.

In addition, in FIG. 28, the plug 2 is not connected to the through-hole 153A. The plug 2A is connected to the through hole 153B through the contact portion 154A. The plug 2B is connected to the through hole 153C through the contact portion 154B.

Also, the sheets 152 and 157 are made of elastic conductive metal plated with gold. Therefore, corrosion of the sheets 152, 157 due to the electrolytic solution can be prevented. Furthermore, an elastic spring material can be used for the contact portions 154A, 154B, and the reliability at the time of insertion and removal of the IC can be greatly improved. Instead of gold plating, insulating coating may be applied to the parts of the sheets 152 and 157 other than the electrode foils 155 and 158 that are in contact with the electrolytic solution. Furthermore, by insulating coating or covering the outer surfaces of the sheets 152, 157 with insulating sheets, it is possible to prevent electric leakage due to contact with other electronic parts mounted on the same printed circuit wiring board.

Fig. 29 shows the structure of the contact portion 154A, the left side of the figure shows the state before the plug 2A is inserted, and the right side of the figure shows the state after the plug 2A is inserted. An elliptical through hole 164 is formed in the contact portion 154A connected to the plug 2A of the IC 1 . The through hole 164 has a size larger than the diameter of the plug 2A in the long axis direction and smaller than the diameter of the plug 2A in the short axis direction. Since there is no edge portion in this shape, the stress to the contact portion 154A can be relieved, and it is difficult to introduce cracks in the contact portion 154A. The through hole 165 is provided in the sealing sheet 160 and has a smaller diameter than the through hole 166 of the sheet 152 . Therefore, insulation can be ensured. The through-hole 167 is provided in the insulating sheet 162, and is formed slightly larger in order to have little influence even if sticking misalignment occurs.

FIG. 30 shows a structure in which electrode foils of the chip capacitor according to this embodiment are laminated in multiple layers. In this configuration, cathode electrode foils (hereinafter, referred to as electrode foils) 168, separators 169, and anode electrode foils (hereinafter, referred to as electrode foils) 170 are alternately laminated so that each electrode foil 168 and each electrode foil 170 are electrically connected to each other. connect. The electrode foil 168 is connected to the sheet 152 by ultrasonic welding or the like. A portion of the electrode located at the outermost end of the electrode foil 170 is lengthened to connect the tab 157 to the joint portion 171 formed. The bonding portion 171 may be formed at the outermost end of the electrode foil 168 and connected to the sheet 152 . According to this configuration, the capacitance of the capacitor can be easily increased.

Further, according to this configuration, the joint portion 171 provided in the electrode foil 170 is electrically connected to the sheet 157 and the electrode foil 170 by means of ultrasonic welding or the like in a state where the sheet 157 is opened. Also, the sheet 157 and the sheet 152 can be closed by bending the engaging portion 171 .

(Embodiment 13)

Fig. 31 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 13 of the present invention. In this embodiment, the anode/cathode electrode portions are respectively formed on a part of the anode/cathode chips of the chip capacitor according to the twelfth embodiment. Also, the cathode sheet and the anode sheet are made of aluminum.

The cathode electrode part (hereinafter referred to as electrode part) 173 is formed by etching a part of one side of cathode sheet (hereinafter referred to as sheet) 172 to enlarge the surface area. The anode electrode portion (hereinafter, referred to as an electrode portion) 175 is formed by etching a part of one side of the anode sheet (hereinafter, referred to as a sheet) 174 to enlarge the surface area and performing a forming process. Separator 176 is impregnated in the driving electrolyte and disposed between electrode portion 173 and electrode portion 175 . The electrode portion 173 and the electrode portion 175 are provided facing each other with the separator 176 interposed therebetween. On the surfaces of the sheets 172 and 174 where the electrode portion 173 and the electrode portion 175 are provided, a sealing sheet 177 made of a polymer material is laminated on a portion excluding the electrode portion 173 and the electrode portion 175 . Insulating sheets 178, 179 insulate the outer package.

The chip capacitor of the present embodiment having such a configuration is fabricated as follows. First, a sealing sheet 177 made of a polymer material is laminated on one surface of each of the sheets 172 and 174 made of aluminum by opening portions where the electrode part 173 and the electrode part 175 are formed. Insulating sheets 178 and 179 are respectively laminated on the other surface. Furthermore, the sheet 172 and the sheet 174 are etched by dipping in an etching tank not shown in the figure. In this way, the electrode portions 173, 175 are formed. Further, the electrode portion 175 formed on the sheet 174 is dipped in a formation groove not shown in the figure to form the electrode portion 175 . Thereafter, through-holes and contact portions are formed by press working, and the sheet 172 and the sheet 174 are produced.

Next, the sheet 172 and the sheet 174 are disposed so that the electrode portion 173 and the electrode portion 175 face each other, and the separator 176 is interposed therebetween. Thereafter, by heating the periphery of the separator 176 by means of a heat press or the like, the sealing sheet 177 is thermally welded and sealed. In this way, chip capacitors can be produced.

According to this configuration, the electrode portions 173 , 175 are integrally formed on a part of the sheets 172 , 174 made of aluminum. Therefore, individual connections of the sheets 172, 174 and the electrode portions 173, 175 are not required and connection resistance is eliminated. As a result, a chip capacitor with low ESR and a small number of components can be obtained.

(Embodiment 14)

Fig. 32 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 14 of the present invention. A cathode electrode foil (hereinafter referred to as electrode foil) 181 is bonded to one side of a cathode sheet (hereinafter referred to as sheet) 180 made of a conductor. An anode electrode foil (hereinafter referred to as electrode foil) 183 is bonded to one side of an anode sheet (hereinafter referred to as sheet) 182 made of a conductor. The electrode foils 181 and 183 function as a cathode electrode part and an anode electrode part, respectively. The electrode foil 181 and the electrode foil 183 are disposed so as to face each other, and a substantially spherical spacer 185 mixed with the driving electrolytic solution 184 is placed between them. The diameter of the spacer 185 is, for example, 5 to 20 μm.

By using the electrolytic solution 184 mixed in the spacer 185 in this way, the amount of the electrolytic solution per unit area between the electrode foils can be increased while maintaining the insulation between the electrode foils. This is because the density of this structure is lower than that of a sheet-like separator. Also, depending on the diameter of the spacer 185 , the electrode interval can be kept at an arbitrary thin interval from several μm to several tens of μm. Furthermore, the distance between the electrode foils of several μm, which is difficult to handle with a separator, can be arbitrarily set according to the diameter of the spacer 185 . Therefore, the layer of the electrolytic solution 184 can be thinned. Thereby reducing ESR.

Sealing sheet 186 seals electrode foil 181 , electrode foil 183 , and driving electrolyte 184 mixed with gasket 185 . The cathode connector (hereinafter referred to as connector) 187 and the anode connector (hereinafter referred to as connector) 189 are formed of elastic conductors. The connection cathode pin 2B of IC1 provided in the connector 187 is connected to the contact portion 188 . The connection anode pin 2A of IC1 provided in the connector 189 is connected to the contact portion 190 . The connecting portion 191 electrically connects the tab 180 and the connector 187, and the anode tab 182 and the connector 189, respectively.

According to such a configuration, since the contact parts 187 and 189 do not normally come into contact with the electrolytic solution, an elastic spring material can be used for the contact parts 187 and 189 . Therefore, the reliability at the time of insertion and extraction of IC1 can be greatly improved. In addition, in order to prevent corrosion caused by the electrolyte, it is preferable to apply gold plating or insulating coating to the parts in contact with the electrolyte and the connectors 187, 188 other than the electrode foils 181, 183 of the sheets 180, 183 .

(Embodiment 15)

Fig. 33 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 15 of the present invention. A recess 193 is provided in a cathode sheet (hereinafter referred to as sheet) 192 made of a conductor. A cathode electrode foil (hereinafter referred to as electrode foil) 194 is bonded to the sheet 192 inside the recess 193 . A recess 196 is provided in an anode sheet (hereinafter referred to as sheet) 195 made of a conductor. The anode electrode foil 197 is bonded to the anode tab 195 in the concave portion 196 . The electrode foil 194 and the electrode foil 197 are disposed so as to face each other, and a separator 198 immersed in a driving electrolytic solution is interposed between them. The sealing sheet 199 seals the electrode foil 194 and the electrode foil 197 and the separator 198 together. Other configurations are the same as those of the twelfth embodiment.

According to such a configuration, even when the electrode foils 194 , 197 and the separator 198 are thickened by laminating them, they can be accommodated without difficulty. In addition, it is possible to prevent the electrolytic solution for driving from flowing out in the sealing process of the electrode foils 194 and 197 and the separator 198 . And when used horizontally, there is no need to worry about the leakage of liquid. Further, it is possible to prevent chip capacitors from being inserted in the opposite direction.

(Embodiment 16)

34 is an exploded perspective view showing the configuration of a chip capacitor according to Embodiment 16 of the present invention, FIG. 35 is a cross-sectional view of FIG. 34, and FIG. 36 is a cross-sectional view showing a state where an IC is connected to the chip capacitor of FIG.

In the cathode electrode foil (hereinafter, referred to as electrode foil) 200, through-holes 201 corresponding to the intervals of IC1 connection plugs (hereinafter, referred to as plugs) 2, and IC1 connection cathode plugs (hereinafter, referred to as plugs) 2 are formed. The contact portion 202B to which the plug) 2B is connected. Through-holes 201 corresponding to the intervals of the plugs 2 are provided in the insulating sheet 203 . A cathode sheet is formed by laminating an insulating sheet 203 on one surface of the electrode foil 200 .

Anode electrode foil (hereinafter referred to as electrode foil) 204 has through-holes 201 at the same interval as plugs 2 and contact portion 202A connected to anode plug (hereinafter referred to as plug) 2A for IC1 connection. Through-holes 201 corresponding to the intervals of the plugs 2 are provided in the insulating sheet 205 . An anode sheet is formed by laminating an insulating sheet 205 on one surface of an electrode foil 204 . The electrode foils 200 and 204 function as a cathode electrode part and an anode electrode part, respectively.

Separator 206 is impregnated in an unillustrated drive electrolyte and disposed between electrode foil 200 and electrode foil 204 . In this way, the electrode foil 200 and the electrode foil 204 are arranged facing each other with the separator 206 interposed therebetween. The sealing sheet 207 having an opening in which the spacer 206 is inserted is formed in the central portion, and is made of an insulating material such as polyethylene, PET, epoxy resin, melamine, or silicone resin. Through-holes 201 corresponding to the intervals of the plugs 2 are also provided in the sealing sheet 207 . The sealing sheet 207 is arranged between the electrode foil 200 and the electrode foil 204 to bond them together and seal the separator 206 . In this way, the chip capacitor (hereinafter referred to as capacitor) 208 of this embodiment can be formed.

According to such a structure, contact part 202A, 202B of plug 2A, 2B which connects IC1 is integrally formed with electrode foil 204, 200, respectively. Furthermore, since the electrode foils 204, 200 and the contact portions 202A, 202B are formed of flat surfaces, the ESR is reduced. Furthermore, since the electrode foils 200 and 204 are arranged close to each other, the ESL is also reduced. Also, since the capacitor 208 can be connected at the root of the plug 2, there is no influence of ESR and ESL due to the wiring pattern, and further, the number of parts can be reduced, and assembly can be simplified.

In addition, it is preferable to depressurize the separator 206 interposed between the electrode foil 200 and the electrode foil 204 below the atmospheric pressure and seal it. By doing so, since the electrode foils 200 and 200 are bonded via the separator 206, the electrode interval can be stabilized, and variations in characteristics can be reduced.

A through-hole 201 through which the plug 2 penetrates is provided in the capacitor 208 configured in this way. In the through hole 201, contact portions 202A and 202B (blackened portions in the figure) that conduct with the plug 2 are formed only in the through hole 201 that needs to be connected to the IC1 through the plug 2 . By attaching the plug 2 of IC1 to the IC socket 3 so as to pass through the through hole 201 of the capacitor 208, the IC1 and the capacitor 208 are electrically connected through the contact portions 202A and 202B.

In addition, in FIG. 36 , the plug 2 is not connected to the through hole 201A. The plug 2A is connected to the through-hole 201B through the contact portion 202A. The plug 2B is connected to the through-hole 201C through the contact portion 202B.

Fig. 37 shows the structure of the contact portion of the anode piece, the left side of the figure shows the state before the plug 2A is inserted, and the right side of the figure shows the state after the plug 2A is inserted. A substantially cross-shaped slit 208 is formed in the contact portion 202A conducting with the plug 2A provided in the electrode foil 204 . The slot 208 can also be substantially Y-shaped. The slit 208 has a configuration in which the slit is covered with an elastic insulating sheet 205 provided with an opening 209 slightly larger than the diameter of the plug 2A.

According to such a configuration, the plug 2A is inserted to press and expand the slit 208 formed in the contact portion 202A. At this time, in order not to expand the contact portion 202A, a force compressing from the periphery of the contact portion 202A toward the center of the opening portion 209 is applied from the elastic insulating sheet 205 . Therefore, even if the electrode foil 204 is made of an inelastic material, an appropriate contact pressure can be applied to the plug 2A, and the contact stability between the plug 2A and the contact portion 202A is improved. In addition, the contact portion 202B can also be configured similarly.

FIG. 38 shows a structure in which electrode foils of the chip capacitor according to this embodiment are laminated in multiple layers. The first cathode electrode foil (hereinafter referred to as electrode foil) 210 and the first anode electrode foil (hereinafter referred to as electrode foil) 211 are formed to have approximately the same size. Second cathode electrode foil (hereinafter referred to as electrode foil) 212 , second anode electrode foil (hereinafter referred to as electrode foil) 213 , and separator 214 have approximately the same size and are formed smaller than electrode foils 210 and 211 .

Between the electrode foils 210 and 211 thus formed, the electrode foils 213 and 212 are alternately laminated with a separator 214 interposed between the respective electrode foils 213 and 212 . The electrode foils 210, 212, and the electrode foils 213, 211 are electrically connected, respectively, by means of crimping or the like. Thereafter, the periphery of the separator 214 is sealed with a sealing sheet not shown in the figure. In this way, chip capacitors can be assembled. According to this configuration, the capacitance can be easily increased.

(Embodiment 17)

Fig. 39 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 17 of the present invention. An insulating sheet 216 is laminated on one surface of a cathode electrode foil (hereinafter referred to as electrode foil) 215 . The insulating sheet 216 is formed in a size smaller than that of the electrode foil 215, or exposes at least a part of the periphery of the electrode foil 215 by providing a cutout portion on a part of the periphery. The exposed portion of the electrode foil 215 constitutes a cathode connection terminal portion (hereinafter referred to as a terminal portion) 217 . This forms the cathode sheet. An insulating sheet 219 is laminated on one surface of an anode electrode foil (hereinafter referred to as electrode foil) 218 . An insulating sheet 219 is formed in the same manner as the above-mentioned cathode sheet, and an exposed portion of the electrode foil 218 constitutes an anode connection terminal portion (hereinafter referred to as a terminal portion) 220 . In this way, an anode sheet is formed. The electrode foils 215 and 218 function as a cathode electrode part and an anode electrode part, respectively.

The electrode foil 215 and the electrode foil 218 are arranged to face each other with the separator 221 interposed therebetween. The separator 221 is soaked in an unillustrated driving electrolyte. In the sealing sheet 222 sandwiched between the cathode electrode foil 215 and the anode electrode foil 218, a gap is provided between the opening part into which the separator 221 is fitted and the IC1 connection plug (hereinafter referred to as plug) 2 shown in FIG. 36 . Consistent through holes 201 . The sealing sheet 222 seals the separator 221 and joins the electrode foil 215 and the electrode foil 218 , thus forming an electrode portion.

A cathode connector (hereinafter, referred to as a connector) 223 is provided with a contact portion 225 that connects the through hole 224 at the same interval as the plug 2 and the cathode plug 2B for connection of IC1. The connector 223 is connected to the terminal portion 217 provided in the above-mentioned cathode piece by fusing or fusing or the like. An anode connector (hereinafter, referred to as a connector) 226 is provided with a contact portion 228 that connects the through hole 227 at the same interval as the plug 2 and the anode plug 2A for connection of IC1. The connector 226 is connected to the terminal portion 220 provided in the above-mentioned anode piece by fusing or fusing or the like. Therefore, it is possible to configure the chip capacitor according to the present embodiment in which the electrode portion and the contact portion are separated.

According to such a configuration, the respective contact portions 225, 228 connected to the plugs 2B, 2A can be formed of an elastic spring material. Therefore, the reliability of insertion and removal to IC1 can be greatly improved. Moreover, since the sheet-shaped electrode foils 215 and 218 themselves serve as the terminal portions 217 and 220, ESR can be reduced. Furthermore, since the electrode foils 215 and 218 are closely adjacent to each other, ESL can also be reduced. Furthermore, structurally, the overall thickness of the chip capacitor can be reduced.

(Embodiment 18)

Fig. 40 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 18 of the present invention. The cathode cover (hereinafter referred to as cover) 230 and the anode cover (hereinafter referred to as cover) 235 are made of conductive elastic metal. Cover 230 is provided with through-holes 231 at the same intervals as IC1 connection pins (hereinafter referred to as pins) 2 shown in FIG. The central part of one side of the lid 230 is electrically connected to the cathode electrode foil (hereinafter referred to as electrode foil) 229 through the connection part 230 by methods such as fusing, welding, and crimping. In the cover 235 , through-holes 236 corresponding to the intervals of the plugs 2 and contact portions 237 connected to the anode plug 2A for connecting IC1 are provided. The central part of one side of the cover 235 is electrically connected to the anode electrode foil (hereinafter referred to as electrode foil) 234 through the connection part 238 by methods such as fusing, welding, and crimping. The electrode foils 229 and 234 function as a cathode electrode portion and an anode electrode portion, respectively.

The separator 239 is formed smaller than the electrode foil 229 and the electrode foil 234, and the separator 239 is immersed in an unillustrated driving electrolyte. The electrode foil 229 and the electrode foil 234 are arranged to face each other, and the separator 239 is disposed between them. In the seal sheet 240 , an opening portion into which the spacer 239 is fitted and a through-hole 201 corresponding to the interval between the plugs 2 are provided. The sealing sheet 240 is arranged between the electrode foil 229 and the electrode foil 234, and between the lid 230 and the lid 235 to seal the separator 239, and join the electrode foils 229, 234, and the lids 230, 235 into one body. In this manner, the chip electrolytic capacitor of this embodiment can be configured.

According to such a configuration, the separator 239 immersed in the driving electrolytic solution is sealed with the electrode foils 229 and 234 and the sealing sheet 240 . According to this configuration, the covers 230 and 235 are not affected by the chemical reaction caused by the electrolytic solution for driving. Therefore, as for the material constituting the cover 230, 235, a material having elasticity suitable for the contact portion 232, 237 and having a physical property of leading the electrode portion can be preferably selected. For example, SUS, phosphor bronze for springs, nickel-silver alloy foil for springs, etc. can be used. Therefore, reliability related to insertion and removal of the plug 2 and strength outside the chip electrodes can be improved. In addition, contact between the contact portions 232 and 237 and the plug 2 can be reliably achieved, and ESR can be reduced. Furthermore, since the electrode foils 229 and 234 are closely adjacent to each other, ESL can also be reduced.

In addition, a sheet-shaped polymer material is suitably used as a material of the sealing sheet 240 constituting it. In particular, hot-melt PET and polyethylene (PE), hardened and adhesive sheets (including additional core materials) made of silicon, epoxy and melamine-based resins are desired.

(Embodiment 19)

Fig. 41 is a cross-sectional view showing the structure of a chip capacitor according to Embodiment 19 of the present invention. In the cathode electrode foil (hereinafter, referred to as electrode foil) 200, through-holes 201 corresponding to the intervals of IC1 connection pins (hereinafter, referred to as pins) 2 and contact portions 202B connected to IC1's connection cathode pins 2B are provided. . The through-holes 201 corresponding to the intervals of the plugs 2 are provided in the insulating sheet 203 and laminated on one surface of the electrode foil 200 . In this way, the cathode sheet is formed. Anode electrode foil (hereinafter referred to as electrode foil) 204 is provided with through-holes 201 at the same interval as plugs 2 and contact portion 202A connected to anode plug 2A for IC1 connection. In the chip capacitor according to the present embodiment, the cathode electrode foils 200 of the two above-mentioned cathode sheets are arranged facing each other with the anode electrode foil 204 sandwiched between them. The electrode foils 200 and 204 function as an anode electrode part and a cathode electrode part, respectively.

The substantially spherical insulating spacer 241 has a diameter of 5 to 20 μm, and the insulating spacer (hereinafter, referred to as a spacer) 241 is mixed in the electrolytic solution 242 for driving. The electrolytic solution 242 is respectively injected between the cathode electrode foil 200 and the anode electrode foil 204 which are provided facing each other. In the sealing sheet 207 , an opening portion into which the electrolyte solution 242 mixed with the gasket 241 is inserted and a through-hole 201 at the same interval as the plug 2 are provided. The sealing sheet 207 seals the electrolytic solution 242 and joins the electrode foil 200 and the electrode foil 204 into one body. In this way, the chip capacitor according to this embodiment can be configured.

According to such a configuration, the capacitance of the capacitor can be easily increased by a multiple of the number of layers by only stacking electrode foil 200 , electrode foil 204 , and sealing sheet 207 of the same shape. Therefore, the capacitance of the capacitor can be easily customized. Moreover, since the ESR becomes 1 corresponding to the number of layers by lamination, it is also easy to design the ESR.

In addition, by using the electrolytic solution 242 mixed in the spacer 241, the amount of the electrolytic solution per unit area between the electrode foils can be increased while maintaining the insulation between the electrode foils. This is because the density of this structure is lower than that of a sheet-like separator. In addition, the distance between the electrode foils of several μm, which is difficult to handle with a separator, can also be set arbitrarily according to the diameter of the spacer 241 . Therefore, the layer of the electrolytic solution 242 can be thinned. Thereby, ESR can be reduced.

(Embodiment 20)

Fig. 42 is an exploded perspective view showing an IC socket using a chip capacitor according to Embodiment 20 of the present invention and its usage state. Connecting plugs (hereinafter referred to as plugs) 2 are provided under IC1 represented by a CPU. In this embodiment, an example of an IC package using 478 pins is shown.

IC socket (hereinafter referred to as socket) 3 has sliding portion 243 having chip capacitor (hereinafter referred to as capacitor) 253 and cover portion 244 soldered to printed wiring board (hereinafter referred to as substrate) 4 . A plurality of through holes 245 through which the plug 2 penetrates is provided in the sliding portion 243 corresponding to the plug 2 . In the through hole 245, only in the through hole 245 through which the plug 2 that needs to be connected to the IC1 passes through, is formed a contact portion 246 (blackened portion in the figure) that conducts with the plug 2 .

A through-hole 247 corresponding to the through-hole 245 provided in the sliding portion 243 is similarly provided in the cover portion 244 . Further, in the covering portion 244, guides 248 are provided so that the front side and the rear side (not shown) in the figure form a pair to face each other. The guide 248 engages and holds the slide plate 243 so as to be able to slide freely in the left-right direction in the figure. Also, the cover portion 244 serves as a drive mechanism for the slide portion 243 and has a shaft hole 249 , a cam 250 that rotates around the shaft hole 249 , and a lever 251 that rotates the cam 250 . Also as shown in FIG. 44 , in the through hole 247 , only in the through hole 247 that needs to be connected with the plug 2 connected to the IC1 to pass through, a fixed contact 265 conducting with the plug 2 is formed. The fixed contact 265 is provided on the side where the plug moves by the operation of a drive mechanism 266 described later.

FIG. 43 is an exploded perspective view of the sliding portion 243 constituting the socket 3. As shown in FIG. Capacitive element 252 is installed in capacitor 253 . The capacitive element 252 has an anode electrode foil (hereinafter referred to as electrode foil) 254 on which a dielectric oxide surface film is formed. A conductive polymer layer (not shown) is formed on the electrode foil 254, and a cathode layer 255 made of carbon, silver paste, or the like is laminated thereon.

The electrode foil 254 is connected to a conductive anode sheet (hereinafter referred to as sheet) 256 such as SUS and phosphor bronze for a spring that also serves as an anode extraction wiring by welding or conductive adhesive such as silver and carbon glue. The electrode foil 254 is thus connected to the pin 2 of the IC1 via the anode-side contact portion 257 . In addition, the cathode layer 255 is connected to a conductive cathode sheet (hereinafter referred to as sheet) 258 such as SUS and phosphor bronze for springs which also serves as a wiring for taking out the cathode through a conductive adhesive such as silver or carbon glue. The cathode layer 255 is thus connected to the plug 2 via the cathode-side contact 259 . The sheets 256, 258 are further insulated by an insulating sheet 260 disposed therebetween. The insulating sheet 260 is made of polymer materials such as PET, PC, PVC (polyethylene), PA, PI, and PAI. In this way, the capacitor 253 can be formed.

The capacitor 253 is covered by a slide cover 262 and an insulating sheet 263 which are fastened and held on the cover portion 244 freely and slidably. In this way, the sliding portion 243 can be formed.

We illustrate with Fig. 44 the work that comprises the socket 3 that electric capacity 253 forms like this. First, the plug 2 of IC1 is inserted into the through-hole 245 provided in the socket 3 . In this state, the cam 250 is rotated in the direction of the arrow in the figure by operating the lever 251 constituting the driving mechanism 266 . Therefore, the cam 250 presses the protrusion 264 provided on the sliding part 243 in the left direction in the figure, so that the sliding part 243 moves in the same direction until it reaches the position shown by the dotted line in the figure. As a result, the fixed contact portion 265 and the contact portions 257, 259 are sandwiched and locked into the plug 2, respectively, and the plug 2 and the contact portions 257, 259 are respectively connected to be electrically conducted.

Also, by performing the operation opposite to the above operation, the locked state in which the plug 2 is sandwiched by the fixed contact portion 265 and the contact portions 257, 259 are respectively released is returned to the original state. In the unlocked state, the plug 2 can be easily removed from the socket 3 . In this way, the plug 2 can be easily inserted into and pulled out from the through hole in a state where the through hole 245 of the slide portion 243 is aligned with the through hole 245 of the chip capacitor 253 .

In addition, in FIG. 44 , other electronic components 268 are mounted on the substrate 4 , and recesses 267 provided in the capacitor 253 are arranged to avoid protrusions of the IC1 .

The socket 3 configured in this way can connect electronic components such as the capacitive element 252 from the base of the plug 2 of the IC1. Therefore, by shortening the connection distance between electronic components such as the capacitive element 252 and IC1, the lead inductance (ESL) and lead resistance (ESR) can be suppressed to low values.

(Embodiment 21)

45A and 45B show the configuration of the contact portion of the IC socket using the chip capacitor according to Embodiment 21 of the present invention.

A through-hole (hereinafter, referred to as a hole) 245 of a connection plug (hereinafter, referred to as a plug) 2 into which the IC 1 is inserted is formed larger than the plug 2 . A through hole (hereinafter, referred to as a hole) 247 is provided in the covering portion 244 of the socket 3 . A semicircular through-hole (hereinafter, referred to as a hole) 269 having a straight portion is formed in the elastic conductive sheet. A slit 270 is formed adjacent to the through hole 269 . An elastic contact portion 271 is formed between the through hole 269 and the slit 270 .

Contact portion 271, as shown in FIG. 45B, holes 245, 269 also move in the same direction when plug 2 inserted into IC1 moves slide portion 243 shown in FIG. 44 in the direction of the arrow in the figure. Therefore, both ends of the elastic contact portion 271 clamping the plug 2 are deformed so as to expand toward the hole 269 side. Due to this deformation, even when there is an interval deviation in the plug 2 , the plug 2 can be surely brought into contact with the contact portion 271 by the contact portion 271 having elasticity. Also in the state of FIG. 21A, since the hole 247 of the covering portion 244 does not come into contact with the plug 2, the plug 2 can be easily inserted and pulled out.

46A and 46B are plan views showing other examples of contact portions, and FIGS. 46C and 46D are cross-sectional views of FIGS. 46A and 46B, respectively. A through-hole (hereinafter, referred to as a hole) 272 is formed in an elastic conductive anode sheet (hereinafter, referred to as a sheet) 256 and has a protrusion inside. By inserting the plug 2 into the hole 272 and bending the protrusion, the elastic contact portion 273 is formed. In the cathode conductive sheet (hereinafter referred to as sheet) 258 on the counter electrode side, a large opening 274 is formed so as not to conduct with the plug 2 . An insulating sheet 260 maintains insulation between the sheets 256 , 258 . Cover sheet 262 overlies sheet 256 . The fixed contact portion 265 is disposed in the hole 247 .

With the contact portion 273 thus constituted, as shown in FIGS. 46B and 46D, when the plug 2 is inserted and the sliding portion 243 moves in the direction of the arrow in the figure, the holes 245, 272 also move in the same direction. Therefore, the elastic contact portion 273 sandwiching the plug 2 between the fixed contact portion 265 deforms outwardly in a curved manner. Due to this deformation, even when there is an interval deviation in the plug 2 , the plug 2 can be surely brought into contact with the contact portion 273 due to the elastic contact portion 273 . Also, in the state of FIGS. 22A and 22C, since the hole 247 of the cover portion 244 and the fixed contact portion 265 are not in contact with the plug 2, the plug 2 can be easily inserted and pulled out.

(Embodiment 22)

47A to 47C are diagrams showing the manufacturing steps of an anode sheet, an insulating sheet, and a cathode sheet from raw materials to a pressing process in a method of manufacturing a chip capacitor according to Embodiment 22 of the present invention. The cathode sheet (hereinafter referred to as sheet) sheet 275 is made of a spring material such as phosphor bronze for spring and SUS, or a conductive sheet obtained by laminating an elastic film and metal foil, copper, iron, or aluminum. The thickness of the sheet 275 is 0.05 to 0.3 mm. First, in the sheet 275, the escape through-hole 276 which does not come into contact with the connection pin (hereinafter referred to as pin) 2 of the IC1 is formed at a predetermined position by press working as shown in the embodiment already described.

The insulating sheet (hereinafter, referred to as sheet) 277 is composed of insulating materials such as PET, PP, and PC sheets with a thickness of 0.01 to 0.3 mm, and polymer materials such as heat-resistant insulating sheets such as PI, PAI, and PEEK. On the sheet 277, an escape through hole 278 through which all the plugs 2 of the IC 1 pass through without contact is formed at a predetermined position by press processing, and an opening 279 is formed in the center.

The anode sheet (hereinafter referred to as sheet) 280 is formed of the same material as sheet 275 and has the same thickness. In the sheet 280, an escape through-hole 281 that does not come into contact with the connection pin 2 of the IC 1 is formed at a predetermined position by press working, and an opening 282 is formed in the center.

FIGS. 48A to 48C are manufacturing process diagrams showing the process from adhesion to concave portion formation of the finished sheet 275, 277, 280 shown in FIG. 47 in plan view, front view and bottom view. The process proceeds from left to right in the figure. First, the finished sheet 275 and sheet 280 are heated by the heater 283 to a temperature at which the sheet 277 melts. Then, a sheet 277 serving as an insulating layer is sandwiched between them, and the sheets are laminated by pressing with a roller 284 . Next, a concave portion 286 is formed in the center portion by molding press (hereinafter referred to as press) 285 in order to avoid protrusion of the IC1. In this way, a wiring laminated sheet (hereinafter referred to as a sheet) 287 having a cathode/anode wiring pattern can be produced.

In addition, it is preferable to press 285 while heating the sheet 277 to a softening temperature to form it. Therefore, the shape of the recessed portion 286 can be maintained well. Also, the sheet 277 may be sandwiched between the sheet 275 and the sheet 280, and bonded by ultrasonic welding. Also, instead of the sheet 277, an insulating layer may be formed by printing a thermosetting or UV-curing insulating paint.

49A to 49C are manufacturing process diagrams showing the steps of forming a contact portion on the processed sheet 287 shown in FIG. 48 and mounting a capacitive element in plan view, front view and bottom view. The process proceeds from left to right in the figure. First, a contact portion 288 (a blackened portion in the figure) to be connected to the pin 2 of IC1 is formed on the sheet 287 by a punch 289 . In this way, by punching the sheet 275 and the sheet 280 at the same time to form the contact portion 288 at the same time, the spacing deviation of the holes that are in contact with the pins 2 of the IC 1 is greatly reduced.

Also, in this embodiment, before the contact portion 288 is formed on the sheets 275 , 280 , the concave portion 286 is formed in a portion excluding the portion where the escape through-holes 276 , 278 , 281 and the contact portion 288 are formed. In this way, stable recesses 286 can be formed even when there is adhesive deviation on sheet 275 and sheet 280 . Also, by simultaneously integrally forming the contact portion 288 after forming the concave portion 286 , it is possible to form the contact portion 288 without a gap.

Next, conductive paste (hereinafter, referred to as paste) 290 of silver, carbon, copper, etc. is picked up by cotton ball 291 and transferred to the bottom surface (cathode) of recess 286 formed on sheet 287, and paste 290 is applied. Next, the cathode electrode part (hereinafter, referred to as electrode part) 293 of capacitive element 292 is brought into close contact with glue 290 coated on the bottom surface of concave part 286 . At this time, the capacitive element 292 is arranged such that the anode electrode portion (hereinafter referred to as electrode portion) 294 of the capacitive element 292 is in contact with the contact portion 295 of the sheet 280 . Thereafter, the glue 290 is allowed to dry.

Next, the electrode portion 294 of the capacitive element 292 and the connecting portion of the sheet 280 may be connected by a welding method such as electrofusion 296 and laser welding. In this way, the sheet 287 and the capacitive element 292 are electrically connected. In addition, the capacitive element 292 is disposed on a portion where the opening 279 provided at the center of the sheet 277 and the opening 282 provided at the center of the sheet 280 are integrated. In this way, compact chip capacitors with reduced size and thickness can be obtained. In addition, instead of the sheet 280 , an opening may be provided in the center of the sheet 275 .

In addition, FIG. 50 is a plan view showing the shape of the hole constituting the contact portion 288 . In the uppermost piece 280 , an escape through-hole 281 having a diameter larger than the outer diameter of the plug 2 is formed. An escape through-hole 278 smaller than the escape through-hole 281 is formed in the lower sheet 275 disposed thereon. Further, an elliptical through hole 276 partially smaller than the outer diameter of the plug 2 is formed in the piece 265 disposed below it. In this way, the contact portion 288A on the cathode side is formed. A through hole opposite to the contact portion 288A on the cathode side is formed in the contact portion 288B on the anode side. That is, an elliptical through hole partially smaller than the outer diameter of the plug 2 is formed in the sheet 280 . Therefore, even when there is a deviation in the sheet 275 , the sheet 280 , and the sheet 277 , insulation can be increased by covering the non-contact escape through-hole with the sheet 277 . Furthermore, the connection stability can be increased due to the portion of the piece 277 exposed from the escape through hole. In addition, the elliptical escape through-holes provided in the pieces 275 and 280 may be rectangular or star-shaped having a portion partially smaller than the outer diameter of the plug 2 as in the first embodiment.

FIG. 51 is a cross-sectional view showing the configuration of the capacitive element 292 . A solid electrolyte layer 299 made of a functional polymer such as thiophene is formed on the outer surface of an electrode portion 294 made of an aluminum foil on which a dielectric oxide surface film is formed. Further, an electrode portion 293 composed of carbon and silver paste or the like is formed on its surface. In this manner, the chip-type capacitive element 292 can be configured. In addition, if the capacitive element 292 is a tantalum capacitive element, a ceramic capacitive element, a wet electrolytic capacitive element, an electric two-layer capacitive element, a chip battery element, etc., and can be formed into a sheet-shaped element, the capacitive element 292 is not particularly limited.

52A, 52B are plan views and front views showing the manufacturing process from the attaching process of the cover sheet for protecting the capacitive element 292 mounted on the processed sheet 287 shown in FIG. 49 to the process of cutting into final individual sheets. . The process proceeds from left to right in the figure. First, the cover sheet 301 made of an insulating polymer material provided with the escape through-hole 300 through which the plug 2 of the IC1 penetrates is superimposed on the sheet 287 . And it is carried into the vacuum tank 302 which is divided into upper and lower parts and sealed up, and the inside of the vacuum tank 302 is evacuated with a vacuum pump 303 . Furthermore, the lid sheet 301 is laminated on the sheet 287 by hot stamping 304 while the inside of the vacuum chamber 302 is in a vacuum state. In this way, welding is performed to seal the capacitive element 292 , and finally cut into individual pieces by the cutting punch 305 . In this way, the chip capacitor 306 can be fabricated. The cover sheet 301 forms an insulating layer. In addition, instead of using the vacuum chamber 302 to form the vacuum-sealed capacitive element 292 between the cover sheet 301 and the sheet 287, the sealing may be performed in an inert gas. By these methods, oxidation of the capacitor element 292 can be prevented, and the reliability of the chip capacitor can be improved.

In addition, in this embodiment, we have described the configuration in which the sheet 277 is disposed only on the upper surface of the sheet 275, but the insulating sheet 277 may be welded or attached to the lower surface if necessary.

Also, the insulating layer made of sheets 277, 301 can also be made of insulating coatings such as epoxy resin, melamine, silicon and polyurethane, insulating materials such as PET, PP, PC sheets, and PI, PAI, PEEK, etc. The heat-resistant insulating sheet is formed. Moreover, the connection of each sheet|seat may be the structure adhere|attached with an adhesive. Also, the outer package may be formed by covering with resin molding, covering the surface with an insulating sheet, coating with a coating material, or printing an insulating paint.

In addition, if the sheet 277 is formed by printing a heat-curable or UV-curable insulating paint, there is no problem such as sticking deviation of the sheet 277 caused by expansion and contraction of the film in roll production. Also, the sheet 277 may be formed of a thermally reversible insulating sheet, and the sheet 277 may be thermally bonded to the sheet 275 by heating the sheet 275 and the sheet 280 . According to this method, the sheets 275 and 280 can be thermally bonded with the heat-induced deformation kept to a minimum by keeping the sheet 277 at normal temperature before thermal bonding. Therefore, a highly reliable chip capacitor can be obtained. Also, the same effect can be obtained by using ultrasonic thermal bonding sheets 275, 277, and 280 instead of thermal bonding by heating.

In addition, an insulating sheet and an anode sheet may be added and laminated inside the sheet 275 to connect capacitive elements having different characteristics. In this way, it is possible to easily construct a chip capacitor that collectively mounts capacitive elements with different voltages, capacitive elements made of ceramics, functional polymers, films, etc., and battery elements with different characteristics.

As mentioned above, the first chip capacitor according to the present invention has a contact portion formed in the through hole that needs to be electrically connected to the above-mentioned IC connection plug in the through hole into which the IC connection plug is inserted, and a contact portion connected to the contact portion. the capacitive element. Furthermore, the second chip capacitor according to the present invention has joint surfaces for connecting to an IC on the upper surface and joint surfaces for connecting to a printed wiring board on the lower surface. And the capacitive element is electrically connected to each connecting surface. According to any of these configurations, it is possible to increase the mounting area of the peripheral circuits of the IC by directly connecting a capacitive element with a large capacitance and low ESL near the IC. Also according to the 3rd sheet capacitor of the present invention, there is an anode sheet with an anode electrode part on one side, a cathode sheet with a cathode electrode part on one side, an electrolyte solution arranged between them, and a sealed electrolyte solution. seal sheet. The sealing sheet is arranged between the anode sheet and the cathode sheet, and is integrated with the anode sheet and the cathode sheet. According to this configuration, power can be directly supplied to the anode electrode portion and the cathode electrode portion from the anode tab and the cathode tab, respectively. Also, the electrical conduction paths with the cathode sheet and the anode sheet are sealed. Therefore, a capacitance with reduced ESL and ESR can be obtained. Furthermore, in terms of structure, since the thickness of the capacitor is reduced, it is possible to mount the peripheral circuits of the IC with high density.

Furthermore, the IC socket according to the present invention includes a sliding portion having the above-mentioned first chip capacitor, and a covering portion that is coupled so that the sliding portion can slide freely. The covering portion is bonded to the printed circuit wiring board. The cover part is provided with a through-hole into which the IC connection plug is fitted. In this through hole, a fixed contact portion is formed in the through hole that needs to be electrically connected to the above-mentioned IC connection plug. Further, the covering portion has a cam and a lever for sliding the sliding portion. According to this configuration, the IC connection plug can be easily inserted into or pulled out from the through hole in a state where the through hole of the sliding portion is aligned with the through hole of the chip electronic component. Also, in the state of use, since the contact portion of each through hole of the sliding portion and the fixed contact make the elasticity act in the direction of the connection plug sandwiching the IC, the connection plug can be locked and the contact portion can be reliably electrically connected. and connection plugs.

In the method for manufacturing a chip capacitor of the present invention, first, an insulating sheet is sandwiched between a conductive cathode sheet and a conductive anode sheet. In addition, an escape through-hole is provided in the insulating sheet in a portion where all the connection pins of the IC are fitted in advance in a non-contact manner. On the cathode sheet and the anode sheet, escape through holes having a diameter larger than the outer diameter of the connection plug are respectively provided in advance in portions not in contact with the connection plug. Next, lamination is performed in a state corresponding to the escape through-holes respectively provided on the cathode sheet, insulating sheet, and anode sheet. Furthermore, the contact portion to be connected to the connection plug is integrally formed with the cathode tab and the anode tab at the same time. A contact portion is formed in the through-hole to be electrically connected to the connection plug in the through-hole into which the connection plug of the IC is fitted. According to this method, it is possible to stably provide a chip capacitor with little variation in the pitch of the connecting pins to the IC.

In addition, the features of the embodiments of the present invention described above can be combined and implemented within a possible range, and such combinations are within the scope of the present invention.

Claims (17)

1. sheet capacitor is characterized in that:

It has:

On single face, have anode electrode part anode strip,

On single face, have cathode electrode part cathode sheets,

Be provided between above-mentioned anode electrode part and the above-mentioned cathode electrode part, and contain electrolyte separator and

Be provided between above-mentioned anode strip and the above-mentioned cathode sheets, be provided with the opening portion that embeds above-mentioned separator, be bonded into one, seal the diaphragm seal of above-mentioned separator with above-mentioned anode strip and above-mentioned cathode sheets.

2. the described sheet capacitor of claim 1 is characterized in that:

Above-mentioned anode electrode part by the anode electrode paper tinsel constitute,

Above-mentioned cathode electrode part is made of cathode electrode foil,

At the opening portion of above-mentioned diaphragm seal, also embed above-mentioned anode electrode part and above-mentioned cathode electrode part.

3. the described sheet capacitor of claim 2 is characterized in that:

Have a plurality of above-mentioned anode electrode paper tinsels, above-mentioned cathode electrode foil and above-mentioned separator, they are replaced lamination make each separator be sandwiched between the different electrode foil of polarity.

4. the described sheet capacitor of claim 1 is characterized in that:

Above-mentioned anode strip is made of aluminium foil and above-mentioned anode electrode partly is to implement to form to handle and form by the part of the single face of above-mentioned anode strip being carried out etching,

Above-mentioned cathode sheets is made of aluminium foil and above-mentioned cathode electrode partly is to form by the part of the single face of above-mentioned cathode sheets is carried out etching,

The opening portion that above-mentioned anode electrode part, above-mentioned separator and above-mentioned cathode electrode are partially submerged into is set in above-mentioned diaphragm seal.

5. the described sheet capacitor of claim 1, it is characterized in that: above-mentioned anode electrode part is made of the anode electrode paper tinsel, above-mentioned cathode electrode part is made of cathode electrode foil, further have the spherical pad of sneaking in the above-mentioned electrolyte, the opening portion that above-mentioned anode electrode part, above-mentioned electrolyte and above-mentioned cathode electrode are partially submerged into is set in above-mentioned diaphragm seal.

6. the described sheet capacitor of claim 1 is characterized in that:

The through hole that embeds with plug being connected of IC is set in above-mentioned anode strip and above-mentioned cathode sheets respectively and in above-mentioned through hole, is being connected in the through hole that is electrically connected with plug, be provided with and the above-mentioned contact portion that contacts with plug that is connected with above-mentioned.

7. the described sheet capacitor of claim 1 is characterized in that:

Also possess a plurality of connectors, each connector is respectively arranged with: be electrically connected respectively with above-mentioned anode strip and above-mentioned cathode sheets, and make the through hole of the connection of IC with the plug embedding; And, in above-mentioned through hole, be connected in the through hole that is electrically connected with plug with above-mentioned, with the above-mentioned contact portion that is connected with the plug contact.

8. the described sheet capacitor of claim 7 is characterized in that:

Above-mentioned anode strip, above-mentioned cathode sheets and above-mentioned connector are by beyond above-mentioned cathode electrode part and above-mentioned anode electrode part, at least with part that above-mentioned electrolyte contacts on, implemented that the metal of rubber-like conductivity any in gold-plated, the insulation coating constitutes.

9. the described sheet capacitor of claim 1, it is characterized in that: above-mentioned anode strip and above-mentioned cathode sheets are by beyond above-mentioned cathode electrode part and above-mentioned anode electrode part, at least with part that above-mentioned electrolyte contacts on, implemented that the metal of rubber-like conductivity any in gold-plated, the insulation coating constitutes.

10. the described sheet capacitor of claim 1 is characterized in that:

Above-mentioned electrolyte is gelatinous.

11. the described sheet capacitor of claim 1 is characterized in that:

Core in above-mentioned anode strip and above-mentioned cathode sheets forms recess, sets above-mentioned anode electrode part, above-mentioned cathode electrode part and above-mentioned electrolyte in above-mentioned recess.

12. the described sheet capacitor of claim 1 is characterized in that:

It further has the insulating barrier that covers outer surface.

13. the described sheet capacitor of claim 1 is characterized in that:

Above-mentioned cathode sheets has the cathode electrode foil of the contact portion that is provided with above-mentioned cathode sheets, and above-mentioned anode strip has the anode electrode paper tinsel of the contact portion that is provided with above-mentioned anode strip,

Above-mentioned contact portion is used for contacting with being connected with plug of IC,

Above-mentioned cathode electrode foil, above-mentioned anode electrode paper tinsel and above-mentioned separator constitute capacity cell,

Above-mentioned diaphragm seal is provided between above-mentioned anode electrode paper tinsel and the above-mentioned cathode electrode foil part, seals above-mentioned separator, and makes above-mentioned anode electrode paper tinsel and above-mentioned cathode electrode foil be bonded into one.

14. the described sheet capacitor of claim 1 is characterized in that:

Above-mentioned anode strip has: form above-mentioned anode electrode part the anode electrode paper tinsel,

On the single face of above-mentioned anode electrode paper tinsel, expose above-mentioned anode electrode paper tinsel at least the periphery a part carry out stacked insulating trip and

The anode splicing ear that exposes above-mentioned anode electrode paper tinsel,

Above-mentioned cathode sheets has: form above-mentioned cathode electrode part cathode electrode foil,

On the single face of above-mentioned cathode electrode foil, expose above-mentioned cathode electrode foil at least the periphery a part carry out stacked insulating trip and

Cathode connection terminal that exposes above-mentioned cathode electrode foil,

Have: be provided between above-mentioned anode electrode paper tinsel and the above-mentioned cathode electrode foil, and soak the separator that is contained in the above-mentioned electrolyte,

The opening portion that above-mentioned separator embeds is set in above-mentioned diaphragm seal.

15. the described sheet capacitor of claim 14 is characterized in that:

It further has: the anode connector, and have in the through hole that the connection that is arranged on IC embeds with plug and connect the contact portion of above-mentioned connection with plug, constitute by the rubber-like electric conductor, partly be electrically connected with above-mentioned anode splicing ear; With

Cathode connector has in the through hole that the connection that is arranged on IC embeds with plug and connects the contact portion of above-mentioned connection with plug, is made of the rubber-like electric conductor, is electrically connected with above-mentioned cathode connection terminal subdivision.

16. any one described sheet capacitor in the claim 13～15 is characterized in that:

Have a plurality of above-mentioned anode electrode paper tinsels, above-mentioned cathode electrode foil and above-mentioned separator, they are replaced lamination make each separator be sandwiched between the different electrode foil of polarity.

17. any one described sheet capacitor in the claim 13～15 is characterized in that:

In any slit that crosswise, Y word shape are set on any one at least of above-mentioned anode electrode paper tinsel and above-mentioned cathode electrode foil,

Make and on the part corresponding, form diameter than the rubber-like insulating trip of above-mentioned connection with the big opening portion of the diameter of plug with above-mentioned slit, cover at least on any one of the above-mentioned anode electrode paper tinsel that is provided with above-mentioned slit and above-mentioned cathode electrode foil, form above-mentioned contact portion.

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