CN1960622B - Correction method for head position of part installation device and nominal nozzle - Google Patents

Abstract

The present invention provides a correction method for head position of a part installation device and a nominal nozzle, wherein, the real offset between the camera for substrate identifying and the head position can be idenfified accurately and also an appropriate correction can be performed through simple steps. A nominal nozzle is installed on the head (14n), and the position of a VCS camera (the first camera) (20) at the substrate (10) side can be identified by an OCC camera (the second camera)(26) of a holding device (12) which is installed with a head (14n). Then, the head (14n) is moved to the identified position of the VCS camera (20) according to the offset (On) on design between the OCC camera (26) and the head (14n). The position sign (36) of the nominal nozzle (32) which has been moved is shot by the VCS camera (20), thus, the offset (OnR) of the moved head from the center of the VCS camera (20) is calculated as an offset correction value.

Description

The bearing calibration and the nominal nozzle of a position of apparatus for mounting component

Technical field

Illusory (dummy) nozzle that this timing uses is carried out in the bearing calibration and being suitable for that the present invention relates to a position of apparatus for mounting component.

Background technology

The apparatus for mounting component that is used for electronic units such as IC, LSI, flip-chip, resistor disc, chip capacitor are installed in the precalculated position of substrate is for example disclosed in patent documentation 1.This apparatus for mounting component has head, described head has the nozzle of these parts of vacuum suction, make up this head (specifically, for keeping this retainer) in moving of X-Y direction (horizontal drive) and Z-direction (vertical driving) and making up of this head self around Z axle rotation (θ driving), and the parts that will offer part feeder (partsfeeder) are installed on the substrate

In this apparatus for mounting component,, then no doubt can make the installation accuracy of parts on substrate impaired if the nozzle location of nozzle location on the X-Y plane that control device is discerned and reality departs from.The position of head (nozzle) can be judged according to the image pickup result of the camera (second camera among the present invention) that is installed in the substrate identification usefulness on the retainer (retainer) that is equipped with this together, and have preset distance (side-play amount offset) between the head of the camera of this substrate identification usefulness and reality, so if change from the set point of hypothesis in advance because of the thermal expansion of retainer self etc. causes this side-play amount, then as a result of, between position that control device is discerned and an actual position, produce and depart from.

Therefore, in the apparatus for mounting component of this patent documentation 1, as follows this side-play amount is proofreaied and correct.At first, can advance and retreat constitutes the mark of the base side that is formed at erecting device movably, with the center-aligned of chip identification with camera (first camera among the present invention).Then, the camera that makes substrate identification usefulness moves to be predicted as from the initial point of X-Y plane and enters substrate identification with predetermined value X1, Y1 in the design of the visual field of camera, take with camera with this substrate identification, obtain initial position MXO, the MYO of the reality of mark.Then, also with chip identification with this mark of camera observes, detect initial position MCXO, MCYO.Afterwards, mark is kept out of the way with the visual field of camera from chip identification, and the head that will proofread and correct moves predetermined value X2, Y2 in the design from initial point, is directed to the chip identification camera, obtain nozzle in chip identification with initial position NXO, NYO on the camera.

Carry out timing, carry out operation same as described above, with the resulting current location MX1 of camera, MY1 and the chip identification resulting current location NX1 of camera, NY1, obtain separately poor Δ X1=MX1-MXO, Δ X2=NX1-NXO, Δ Y1=MY1-MYO, Δ Y2=NY1-NYO according to substrate identification.Δ X=Δ X1+ Δ X2, Δ Y=Δ Y1+ Δ Y2 are the correcting value of being tried to achieve.

In addition, execution mode as other in this patent documentation 1 also discloses following structure: observe to be positioned at having departed from how many (MCXO → MCX1), this variation (being recited as " position deviation that the deviation of cylinder action causes ") is appended in the computing of the substrate identification viewed described shifted by delta X of camera, Δ Y when chip identification has originally been carried out the judgement of operation with being marked at of camera center.

No. the 3129134th, [patent documentation 1] Japan special permission

But, in the bearing calibration of a position of the apparatus for mounting component of above-mentioned patent documentation 1, the kind of the position relation of considering is very many, and, for any position relation, all to constitute and judge correcting value, so its result by the operation of observing this time fluctuation, both sides when operating preceding and judgement need 2 groups information of multiple class, the step complicated problems that existence is used to judge.

And when utilizing the nozzle of the camera observes head that chip identification uses, the way of in fact accurately discerning the center of nozzle is extremely difficult operation, just from this point, can not say to detect head accurately (axle center) position.

Summary of the invention

The present invention proposes in order to solve existing issue, problem of the present invention provides the side-play amount of the camera of directly and exactly discerning substrate identification usefulness with simple steps and an actual position, thereby can carry out the bearing calibration of a position of suitable correction and the nominal nozzle that uses in this bearing calibration.

The bearing calibration of a position of apparatus for mounting component of the present invention, described apparatus for mounting component utilization be assemblied in pedestal upper edge X-Y direction movably the head on nozzle come adsorption element, with this component configuration on substrate, described apparatus for mounting component have first camera that is configured on the described pedestal and with described first second camera of assembling movably on described pedestal, described bearing calibration comprises: first step (step 54), and the dummy of the described nozzle of assembling is the inspection that is labeled of self center of described X-Y direction with anchor clamps (nominal nozzle) on described head; Second step (step 56) utilizes described second camera to discern the center of described first camera; Third step (step 64), consider described second camera and the described head that will proofread and correct between design on side-play amount, this is moved to the center of first camera that identifies in described second step; And the 4th step (step 76), locational described inspection after utilizing described first camera to move described mark of anchor clamps, thereby the offset detection at the center of this after will moving and described first camera is the correcting value of the side-play amount in the design between described second camera and the described head, addresses the above problem thus.

In the present invention, the inspection that is marked with the center of self is at first prepared as nominal nozzle with anchor clamps.This be because, can grasp more exactly the head (nozzle) the center.Then, utilization confirms to be disposed at the center of first camera (chip identification camera described later: be equivalent to the VCS camera) of base side in this moment with first second camera that assembles movably (camera is used in substrate identification described later: be equivalent to the OCC camera) on described pedestal.Then, consider second camera and, this is moved to the center of first camera that identifies in the above-mentioned step as the side-play amount in (known) design between the head of calibration object.That is, just come the center of first camera in order to make as the head of calibration object, second camera movement is to the position of returning the side-play amount on designing of letting it pass according to the center of actual first camera of grasping of this second camera self institute.The camera lens that second camera utilizes self is the location of " actual measurement " first camera exactly.Therefore, when utilizing the first camera nominal nozzle, if the mark of this nominal nozzle is during from the shooting misalignment of first camera, this departs from and can be understood as real offset and produced with respect to the side-play amount in second camera and the design between this and depart from.Therefore, be correcting value by this being departed from detect, can be directly and discern second camera and the side-play amount of head exactly at current time.

Can directly and exactly discern the camera of substrate identification usefulness and the side-play amount of a position of reality with simple steps, can carry out suitable correction.

Description of drawings

Fig. 1 is the flow chart of control flow of bearing calibration of a position of erecting device that an example of embodiments of the present invention is shown.

Fig. 2 is the summary block diagram that the major part of the erecting device A that has been suitable for above-mentioned bearing calibration is shown.

Fig. 3 is the summary front view and the upward view of the nominal nozzle that uses when implementing above-mentioned bearing calibration.

Fig. 4 illustrates the flow chart of determining the control flow of triggering for the correction of carrying out above-mentioned bearing calibration.

Fig. 5 is the flow chart of major part control flow of Change Example that the part of Fig. 4 is shown.

Embodiment

Describe an example of embodiments of the present invention below with reference to the accompanying drawings in detail.

As shown in Figure 2, the erecting device A of the applied electronic unit of the present invention has the XY driving mechanism of so-called stand (gantry) type, and described XY driving mechanism has X-axis 2, Y-axis 4, and retainer in pedestal 10 (retainer) 12 can move in the X-Y direction.On retainer 12, be equipped with 14 (14-1 ... 14-4), utilize the nozzle 16 be installed on 14 (16-1 ... 16-4) adsorption element (not shown) can be with this component configuration in the precalculated position that is carried on the substrate 18 of pedestal more than 10.In this embodiment, 4 stature 14-1～14-4 are installed on a retainer 12.For convenience's sake, will as calibration object the head be expressed as 14n, nozzle is expressed as 16n.

First camera) 20, nozzle exchange unit 22 and calibration block 24 pedestal 10 of erecting device A is provided with the VCS camera (camera that chip identification is used: of the adsorbed state that is used for detection part.And, OCC camera (substrate identification camera: second camera) 26 also is being installed except described 14 on the retainer 12.Mark is useful on camera mark (VCS mark) 20a, the 20b that makes OCC camera 26 confirm the position of described VCS camera 20 on described VCS camera 20.

In the present embodiment, when erecting device starts, utilize OCC camera 26 to take to be arranged at the mark (instrumentation point) on the calibration block (omitting diagram), relatively should take the X-Y position and the preposition data of each detected mark, thereby obtain the intrinsic position deviation of this erecting device A, store in the not shown control device.For the location recognition of the mark that has utilized calibration block itself, utilize existing known method.

Mark by having used this calibration block, by the identifying operation that OCC camera 26 carries out, retainer 12 is proofreaied and correct with respect to the X-Y coordinate that is installed in the various unit (for example, VCS camera 20, nozzle exchange unit 22 etc.) on the pedestal 10.And, take mark 18a, the 18b that on the substrate 18 that should carry, describes with identical OCC camera 26, thereby proofread and correct retainer 12 with respect to the X-Y coordinate that coordinate is installed.The pivot of each stature 14 of seeing from OCC camera 26 (in the design) relative distance (each 14-1 ... 14-4 with respect to the side-play amount in the design of OCC camera 26 01 ... parameter when 04) being used as assembling obtains in advance, each 14n (any one among 14-1～14-4) is being positioned under the situation of coordinates of targets, with the X-Y coordinate figure addition of employed 14n with respect to the side-play amount On and the OCC camera benchmark of this OCC camera 26.Then, in suitable period described later,, carry out the correction of this side-play amount On by step shown in Figure 1.

Herein, the nominal nozzle that will use in this correction (check and use anchor clamps) 32 is shown in Fig. 3.

This nominal nozzle 32 constitute with a 14n between the portion of picking up (assemble mechanism) 34 identical with the shape of common nozzle (omitting diagram), can adopt with the identical mode of common nozzle to be assemblied on the 14n.But, in order to give full play to effect, substitute adsorption orifice as anchor clamps, describe distinct mark 36 in the position at the center (that is the axle center of a 14n) of the X-Y direction that is equivalent to self.And, for example near its Z-direction central authorities, have the eaves portion 38 that is coated with color one-tenth green, the visuognosis that further improves mark 36.Usually, nozzle is difficult to determine clearly its center on this function of adsorption element.A 14n of unassembled condition of nozzles more is difficult to determine its axle center.Therefore, in the present invention, specially will be assemblied on the 14n, utilize mark 36 can easily determine its center as the nominal nozzle 32 of the anchor clamps of special use.

Then, use Fig. 1 to describe the aligning step of side-play amount in detail.

At first, (be expressed as S52 among Fig. 1 in step 52, below identical), retainer 12 is moved to the position that stores nozzle exchange unit 22, the nozzle that herein will be assemblied in before this on (will proofread and correct) 14n unloads, and (step 54) changed, assembled to the 22 taking-ups nominal nozzle 32 as anchor clamps shown in Figure 3 from the nozzle exchange unit.This is changed and adopts the mode identical with common nozzle exchange, according to the indication from not shown control device, carries out automatically.

Assembled after the nominal nozzle 32, utilized the OCC camera 26 on the retainer 12 to discern the position (step 56) that is formed at camera mark (VCS mark) 20a, 20b on the VCS camera 20.In this erecting device A, 2 positions on the diagonal of VCS camera 20 are marked with VCS mark 20a, 20b respectively, so the position of OCC camera 26 identification these 2 VCS mark 20a, 20b utilizes this intermediate point to discern, determine the center 20c of VCS camera 20.Then, enter step 58, consider the side-play amount On in the design, a 14n that will proofread and correct moves to the center 20c (step 58) of the VCS camera 20 of identification in the step 56.

After moving, in step 60, a 14n is descended along Z axle (axle center of a 14n), set the height of the mark 36 that can take nominal nozzle 32 for.Descend after the end, the θ axle of driving head 14n makes its position (step 62) that rotates to 0 degree, utilizes VCS camera 20 to take the mark 36 (step 64) of nominal nozzles 32.Then, in step 66～76,, rotate/stop the θ axle of a 14n, utilize VCS camera 20 shot mark 36 in each position every 90 degree.Its result obtains 4 images altogether, therefore enters step 78, according to the track that mark 36 is obtained, and the pivot of a computing 14n (the real axis heart of a 14n).Its result even be assembled into respect to the real axis heart of 14n deflection a little at nominal nozzle 32, also can obtain the real axis heart (step 76) of a 14n reliably.

Herein, the position of the reality of VCS camera 20 discerned, determines by OCC camera 26 according to the camera data of self, to be used to keep the retainer 12 of OCC camera 26 to move to respect to this position deviation of determining the position that the side-play amount On between known, an OCC camera 26 and the 14n is gone up in design, thus we can say the real axis heart obtained and VCS camera 20 the center depart from directly reacted with this (known) design on the actual of side-play amount On depart from.Therefore, in step 90, this departs from the correcting value that Δ On is side-play amount On, On+ Δ On is obtained be real offset OnR.

But this correction is in order to keep high accuracy (correction accuracy), and assembling is as the nominal nozzle 32 of special fixture on a 14n.Therefore, the mensuration that is used to proofread and correct need be carried out with the least possible timing when production not being caused overslaugh.From this viewpoint, the erecting device A nozzle that assembling is scheduled on a 14n all the time except in substrate transferring so the substrate transferring that is determined at that is used for proofreading and correct carries out, preferably finishes to measure in substrate transferring as far as possible.But, nozzle exchange originally takes place in substrate transferring sometimes, to establish a capital be to finish to measure in substrate transferring so be difficult to one.So, not when each conveyance substrate, all to measure at every turn, but will set according to specific interval from benchmark the time the mensuration of elapsed time, last time the time production number (processing number), the mensuration of last time of substrate the time ad-hoc location or the variations in temperature of parts at least one as parameter, reach set point when above in these parameters, carry out the described program that is used to proofread and correct.For which parameter is begun this program as benchmark, can set in advance by the user.

Fig. 4 illustrates the mensuration control flow regularly that is used to determine to carry out this correction.In step 100, when confirming the production end of specific substrate, begin the conveyance (step 102) of next substrate.Meanwhile, control flow enters step 104,, judges whether the basic parameter that the user sets is " time " herein.During for time reference, enter step 106, whether the elapsed time when judging from benchmark has surpassed set point, being judged as the moment that has surpassed set point, enters step 108, obtains the real offset OnR of a 14n.

On the other hand, when the basic parameter that the user sets is " production number ", enter step 112, judge in step 114 whether produce number has reached set point from step 104.Before reaching set point, repeat flow process before this, the stage having reached set point, enter step 116, obtain the real offset OnR of a 14n.In addition, in step 118, remove the counting of producing number.

When the basic parameter that the user sets is certain location or parts " temperature ",, enter step 120, be judged as variations in temperature herein when having surpassed set point, obtain the real offset OnR of a 14n in step 122 by step 104,112.And, the temperature when step 124 preservation obtains real offset.In addition, when basic parameter is set at " temperature ", when descending, can when the uniform temp condition, utilize the side-play amount that under specific temperature, obtains in advance again because of certain reason temperature.

Fig. 5 illustrates the example that has been suitable for this other execution mode that utilizes again.

Fig. 5 further considers practicality, and the step 108,116 of Fig. 4,122 part (part of the frame A1 of Fig. 4) are changed over frame A2, and is most of identical with each step of Fig. 4 beyond frame A1 → frame A2.Therefore, give identical step number to identical with the step of Fig. 4 in fact step.

In the control flow of Fig. 5, when step 120 has judged that variations in temperature has surpassed set point (, be judged as the relevant condition of variations in temperature when setting up), do not enter the detection (real offset OnR obtains) that departs from immediately, and at first, in step 170, judge whether there is the detected value of having obtained under the same conditions for departing from.

When not having detected value, in step 122, obtain the real offset OnR of a 14n, and, the temperature that confirms this moment is in the applied temps scope (step 172), and the real offset OnR with obtained (detection) stores (step 174) as the detected value of the real offset OnR of this temperature then.

Its result in step 170, when being judged as the detected value that exists under the uniform temp condition, does not carry out the detection of real offset OnR once more, recycling this detected value (skips steps 122,172,174).

On the other hand, when the elapsed time when step 106 is judged as from benchmark has surpassed set point and step 114, be judged as when producing number and having reached set point, adopt the mode identical with previous execution mode, enter step 108,116 respectively, obtain the real offset OnR of a 14n.But, in this embodiment, the temperature that confirms this moment is (during renewal for the difference of acquired real offset OnR (detected value) under this real offset OnR that obtains and this temperature in normal range (NR)) (step 180,182) afterwards in the applied temps scope, obtained real offset OnR is newly stored as the detected value that departs under this temperature or upgrades (rewriting).

By carrying out this control flow, thinking at every turn when obtaining real offset OnR under the appropriate condition that data are as the storage of the detected value under this temperature or upgrade, can reduce the actual frequency that departs from detection gradually.Its result can reduce gradually to productive influence, and, data itself are replaced to successively the immediate data of good reliability.

In addition, in this embodiment, shown in step 172,180,182, with obtained real offset OnR as the storage of detected value, when preserving, with the temperature of this moment in the applied temps scope as condition.And, upgrade (rewriting) during detected value, the difference of real offset OnR that this is obtained and the real offset OnR that under this temperature, has obtained (detected value) in normal range (NR) as condition.This is because prevent the preservation " inappropriate detected value " that the influence because of temporary transient interference causes.But the step of this affirmation (S172, S180, S182) is not the step that must be provided with.Particularly begin stored number back, detected value more after a little while, can freely omit these steps, or relax the threshold value that is used to judge normal range (NR) in operation.

In addition, in the above-described embodiment, make nominal nozzle around the rotation of the axle center of head, obtain this center, thereby, also can obtain an axle center of 1 exactly even be tilted when assembling at this nominal nozzle, but in the present invention, this step is not certain necessary, can not make the nominal nozzle rotation yet, and directly read this mark.And, even under the situation of rotation, also need not per 90 degree and read, as long as when 120 degree following (more than 3 times), just can discharge the axis of rotation of a definite 14n of the influence of tilting to assemble.In addition, certainly needless to say, number of times of imaging is many more, can access information accurately more.

Further, in the above-described embodiment, for the mensuration of when which type of condition is complete, carrying out real offset, the structure that has adopted the user suitably to select, and for the triggering that how to be set at the mensuration of carrying out this correction usefulness, the present invention is not particularly limited.Also can trigger according to the parameter setting beyond the above-mentioned parameter, can also set in conjunction with above-mentioned parameter, for example being set at and handling number is the such triggering when having surpassed set point of the above and variations in temperature of predetermined value.

Can be applicable to and be the correction of second camera that the erecting device that various parts use is installed with the side-play amount of head.And nominal nozzle is not limited to this bearing calibration, measures exactly at needs under the situation at center of head (nozzle), all can utilize at any time.

Claims (9)

1. A method of correcting the position of a head of a component mounting device that absorbs a component using a nozzle mounted on a head movable in an X-Y direction on a base and arranges the component on a substrate, said The component mounting apparatus has a first camera arranged on the base and a second camera movably mounted on the base together with the head, and the method of correcting the position of the head of the component mounting apparatus is characterized in that , The correction method includes: The first step is to assemble the dummy object of the nozzle on the head, that is, the inspection jig whose center in the X-Y direction is marked; In a second step, using the second camera to identify the center position of the first camera; A third step of moving the head to the center position of the first camera identified in the second step, taking into account a designed offset between the second camera and the head to be corrected; and The fourth step is to use the first camera to photograph the mark of the inspection jig at the moved position, and detect the deviation of the moved head from the center of the first camera as the A correction for the offset by design between the second camera and the head. 2. The method of correcting the head position of the component mounting apparatus according to claim 1, wherein: In the fourth step, rotating the head around its axis and photographing the mark of the inspection jig at least three times in the circumferential direction, The deviation is detected from the axis center of the mark obtained from the three or more imaging results. 3. The method of correcting the head position of the component mounting apparatus according to claim 2, wherein: The imaging in the circumferential direction is performed a total of four times at intervals of 90 degrees in the circumferential direction. 4. The method of correcting the head position of the component mounting apparatus according to claim 1, wherein: At least one of the number of substrates produced, the elapsed time from the reference time, the specific position at the time of the previous measurement, or the temperature change of the component is used as a parameter, and the condition that these parameters reach a set value or more is established. , the deviation detection is performed. 5. The method of correcting the head position of a component mounting apparatus according to any one of claims 1 to 4, wherein: The deviation detection is performed when at least the condition that the temperature change of a specific position or component during the previous measurement is equal to or greater than a set value is satisfied, and, When the condition related to the temperature change is established and the deviation detection is performed, the detected deviation is stored as a detected value of the deviation at the temperature, When the subsequent temperature conditions are the same, the detected value is reused without performing deviation detection again. 6. The method of correcting the head position of the component mounting apparatus according to claim 5, wherein: A program is installed that also performs said deviation detection when a predetermined condition is satisfied, and when the predetermined condition is satisfied, regardless of the presence or absence of said detected value, the deviation detection is performed, wherein the predetermined condition is said specific The temperature change of the position or part reaches a condition other than the condition above the set value, and When the predetermined condition is satisfied and the deviation is detected, the detected deviation is newly stored as a detected value of the deviation at the temperature, or the stored detected value is updated with the detected deviation. 7. The method of correcting the head position of the component mounting apparatus according to claim 5, wherein: When at least one of the condition that the temperature is within the practical temperature range or the condition that the difference between the stored detected value and the detected value obtained this time is controlled within a predetermined value is established, the detected value is determined. storage. 8. The method of correcting the head position of the component mounting apparatus according to claim 6, wherein: When at least one of the condition that the temperature is within the practical temperature range or the condition that the difference between the stored detected value and the detected value obtained this time is controlled within a predetermined value is established, the detected value is determined. store or update. 9. A dummy nozzle, the dummy nozzle is used for the correction method of claim 1, and the dummy nozzle is characterized in that, The dummy nozzle may be mounted on a head of a component mounting device that absorbs a component using a nozzle mounted on the head movable in an X-Y direction on a base, arranges the component on a substrate, The dummy nozzle has a mark indicating its own center in the X-Y direction, and functions as an inspection jig for identifying the position of the head in the X-Y direction.

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