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CN1959388B - Solid detector array architecture in use for radiation imaging system - Google Patents

Solid detector array architecture in use for radiation imaging system Download PDF

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Publication number
CN1959388B
CN1959388B CN 200510086765 CN200510086765A CN1959388B CN 1959388 B CN1959388 B CN 1959388B CN 200510086765 CN200510086765 CN 200510086765 CN 200510086765 A CN200510086765 A CN 200510086765A CN 1959388 B CN1959388 B CN 1959388B
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detector array
imaging system
radiation imaging
metal
solid
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CN1959388A (en
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李元景
张清军
赵书清
代主得
李树伟
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Tsinghua University
Nuctech Co Ltd
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Tsinghua University
Nuctech Co Ltd
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Abstract

A solid detector array structure in radiation-imaging system is prepared as forming single detector by bind-solidifying each flash crystal with photoelectric diode and coating reflection layer on them, isolating and solidifying isolation plate being used to arrange detectors in sequence, jacketing insulator at bottom of each said diode, embedding isolation plate and insulator on metal groove plate to form detector array, covering lead plate and foamed rubber layer on said array and using metal shell to fix them on metal groove plate.

Description

一种用于辐射成像系统中的固体探测器阵列结构 A Solid Detector Array Structure Used in Radiation Imaging System

技术领域technical field

本发明属于辐射检测技术领域,涉及用于X、γ辐射成像系统中的固体探测器装置,The invention belongs to the technical field of radiation detection, and relates to a solid-state detector device used in X and gamma radiation imaging systems.

背景技术Background technique

现有技术中,中国专利02286053.3公开了一种辐射成像固体探测器,用它所组成的探测器阵列,虽然具备了探测效率和灵敏度高,耐辐照、抗散射、电磁抗骚扰能力、环境适应性强、闪烁光窜扰为零等优点。但是,由于单个探测器的外壳材料是由密度较低的材料拉伸而成并且空间狭窄,其内不能设置太厚的重金属材料,否则会死区过大,因而射线窜扰和散射降得不够彻底。In the prior art, Chinese patent 02286053.3 discloses a solid-state detector for radiation imaging. The detector array composed of it has high detection efficiency and sensitivity, radiation resistance, anti-scattering, electromagnetic anti-disturbance capabilities, and environmental adaptability. It has the advantages of strong stability and zero flicker light interference. However, since the housing material of a single detector is stretched from a material with a lower density and the space is narrow, heavy metal materials cannot be placed in it too thick, otherwise the dead zone will be too large, so the ray interference and scattering will not be reduced thoroughly. .

发明内容Contents of the invention

为了解决上述现有技术中存在的问题,本发明的目的是提供一种用于辐射成像系统中的固体探测器阵列结构,它可以在保留解决避光、防潮、防振,电磁抗干扰能力强、安装维修方便的优点的同时,在不减小灵敏区和不增加死区的前提下,最大限度的提高射线抗散射、抗窜扰能力,提高成像的清晰度。In order to solve the problems existing in the above-mentioned prior art, the object of the present invention is to provide a solid detector array structure used in a radiation imaging system, which can solve the problem of avoiding light, moisture, vibration, and strong electromagnetic anti-interference ability. , The advantages of convenient installation and maintenance, at the same time, without reducing the sensitive area and without increasing the dead area, it can maximize the ability of anti-scattering and anti-interference of rays, and improve the definition of imaging.

为了达到上述的发明目的,本发明的技术方案以如下方式实现:In order to achieve the above-mentioned purpose of the invention, the technical solution of the present invention is realized in the following manner:

一种用于辐射成像系统中的固体探测器阵列结构,它包括多个由碘化铯或钨酸镉形成的闪烁晶体和与之耦合的光电二极管。其结构特点是,所述各闪烁晶体和光电二极管粘接固化并涂有反射层形成单个探测器。各探测器依次排列用隔板相互隔离并粘接固化,各光电二极管的底部套装绝缘子并使其管脚下延出。各隔板、绝缘子嵌接在金属槽板上形成由多个探测器组成的探测器阵列。探测器阵列上铺设有铅板,铅板上放置海绵橡胶层,由金属外罩将探测器阵列包容并固定在金属槽板上。A solid-state detector array structure used in a radiation imaging system, which includes a plurality of scintillation crystals formed by cesium iodide or cadmium tungstate and photodiodes coupled thereto. Its structural feature is that the scintillation crystals and photodiodes are bonded and solidified and coated with a reflective layer to form a single detector. The detectors are arranged sequentially and separated from each other by partitions and bonded and solidified. The bottom of each photodiode is fitted with an insulator and its pins are extended downward. The partitions and insulators are embedded in the metal slot plate to form a detector array composed of a plurality of detectors. A lead plate is laid on the detector array, a sponge rubber layer is placed on the lead plate, and the detector array is contained and fixed on the metal groove plate by the metal outer cover.

本发明由于采用了上述的结构,将由各闪烁晶体和光电二极管粘接而形成的单个探测器依次排列,并采用重金属如钨制成的隔片,将各探测器隔离,且在各隔片上边铺设一块铅板,这样大大提高了探测器的射线抗窜扰和抗散射能力。另外,使用防霉、避光、防潮胶涂在金属外罩与金属槽板、绝缘子等连接缝隙处,一方面完全避光,另一方面增加了探测器阵列的电磁抗干扰性能。探测器晶体前后与外罩之间、铅板和外罩之间装有海绵橡胶层,提高了防震性能。因此本发明具有抗散射、抗窜扰、避光、防潮、防震、死区小、可拆卸等特点。对于使用单个光电二极管和单个晶体形成的探测器,维修时,还可以对单个探测器予以更换,无须破坏一个基本测量单元。使检查故障十分便利,大大降低了维修成本。Because the present invention adopts the above-mentioned structure, the single detectors formed by bonding the scintillation crystals and photodiodes are arranged in sequence, and spacers made of heavy metals such as tungsten are used to isolate each detector, and on each spacer A lead plate is laid, which greatly improves the anti-interference and anti-scattering ability of the detector. In addition, anti-mildew, light-proof, and moisture-proof glue is applied to the connection gap between the metal cover and the metal slot plate, insulator, etc. On the one hand, it is completely protected from light, and on the other hand, the electromagnetic anti-interference performance of the detector array is increased. There are sponge rubber layers between the front and back of the detector crystal and the outer cover, between the lead plate and the outer cover, which improves the shockproof performance. Therefore, the present invention has the characteristics of anti-scattering, anti-jamming, light-proof, moisture-proof, shock-proof, small dead zone, detachable and the like. For a detector formed by using a single photodiode and a single crystal, during maintenance, the single detector can also be replaced without destroying a basic measurement unit. It is very convenient to check the fault and greatly reduce the maintenance cost.

附图说明Description of drawings

图1是本发明的结构剖面示意图;Fig. 1 is a schematic sectional view of the structure of the present invention;

图2是图1的A-A向结构剖面示意图;Fig. 2 is a schematic cross-sectional view of the structure A-A in Fig. 1;

图3是图1的B向示意图;Fig. 3 is a schematic view in direction B of Fig. 1;

图4是图1的C向视图;Fig. 4 is the C direction view of Fig. 1;

图5是本发明的使用状态图。Fig. 5 is a use state diagram of the present invention.

具体实施方式Detailed ways

下面结合附图及具体实施方式对本发明做进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

参看图1~图4,本发明固体探测器阵列结构包括多个由碘化铯或钨酸镉形成的闪烁晶体4和与之耦合的光电二极管3。各闪烁晶体4和光电二极管3用光学透明胶粘接固化并涂有反射层形成单个探测器。各探测器依次排列用重金属制成的隔板9相互隔离并粘接固化。各光电二极管3的底部套装绝缘子2并使其管脚延出。各隔板9、绝缘子2嵌接在金属槽板1上形成由多个探测器组成的探测器阵列。探测器阵列上铺设有铅板5,铅板5上放置海绵橡胶层6。用铜拉伸成型并镀镍的金属外罩7将探测器阵列包容并通过螺钉8将其固定在金属槽板1上。在金属外罩7与金属槽板1以及各绝缘子2接触缝隙上涂有防潮、防震、避光胶。Referring to FIGS. 1 to 4 , the solid-state detector array structure of the present invention includes a plurality of scintillation crystals 4 formed of cesium iodide or cadmium tungstate and photodiodes 3 coupled thereto. Each scintillation crystal 4 and photodiode 3 are bonded and cured with an optically transparent adhesive and coated with a reflective layer to form a single detector. The detectors are arranged sequentially and separated from each other by partitions 9 made of heavy metals and bonded and solidified. The bottom of each photodiode 3 is covered with an insulator 2 and its pins are extended. Each partition plate 9 and insulator 2 are embedded on the metal slot plate 1 to form a detector array composed of a plurality of detectors. A lead plate 5 is laid on the detector array, and a sponge rubber layer 6 is placed on the lead plate 5 . The metal housing 7 that is stretched and formed with copper and plated with nickel contains the detector array and is fixed on the metal slot plate 1 by screws 8 . Moisture-proof, shockproof and light-proof glue is coated on the contact gap between the metal cover 7 and the metal slot plate 1 and each insulator 2 .

参看图5,使用本发明时,将固体探测器阵列通过金属槽板1上另设的安装孔将其安装在一印刷电路板10上,印刷电路板上设有探测器的连接和偏压,当然也可不加偏压,使入射射线与固定探测器的夹角接近0度,这样可以减少串扰。Referring to Fig. 5, when using the present invention, the solid state detector array is installed on a printed circuit board 10 by the installation hole that establishes additionally on the metal slot plate 1, and the printed circuit board is provided with the connection and the bias of the detector, Of course, no bias voltage can be added, so that the angle between the incident ray and the fixed detector is close to 0 degrees, which can reduce crosstalk.

Claims (5)

1.一种用于辐射成像系统中的固体探测器阵列结构,它包括多个由碘化铯或钨酸镉形成的闪烁晶体(4)和与之耦合的光电二极管(3),其特征在于,所述各闪烁晶体(4)和光电二极管(3)粘接固化并涂有反射层形成单个探测器,各探测器依次排列用隔板(9)相互隔离并粘接固化,各光电二极管(3)的底部套装绝缘子(2)并使其管脚下延出,各隔板(9)、绝缘子(2)嵌接在金属槽板(1)上形成由多个探测器组成的探测器阵列,探测器阵列上铺设有铅板(5),铅板(5)上放置海绵橡胶层(6),由金属外罩(7)将探测器阵列包容并固定在金属槽板(1)上。1. A solid-state detector array structure used in a radiation imaging system, it includes a plurality of scintillation crystals (4) formed by cesium iodide or cadmium tungstate and photodiodes (3) coupled therewith, characterized in that , the scintillation crystals (4) and photodiodes (3) are bonded and cured and coated with a reflective layer to form a single detector, each detector is arranged in sequence and separated from each other by a partition (9) and bonded and cured, each photodiode ( 3) The bottom of the insulator (2) is set and the pins are extended downward, and each partition (9) and insulator (2) are embedded in the metal slot plate (1) to form a detector array composed of multiple detectors. A lead plate (5) is laid on the detector array, a sponge rubber layer (6) is placed on the lead plate (5), and the detector array is accommodated and fixed on the metal slot plate (1) by a metal outer cover (7). 2.按照权利要求1所述的用于辐射成像系统中的固体探测器阵列结构,其特征在于,所述金属外罩(7)是由铜拉伸成型并镀镍。2. The solid-state detector array structure used in a radiation imaging system according to claim 1, characterized in that, the metal housing (7) is formed by stretching copper and plated with nickel. 3.按照权利要求1所述的用于辐射成像系统中的固体探测器阵列结构,其特征在于,所述隔板(9)的材料采用钨合金。3. The solid-state detector array structure used in a radiation imaging system according to claim 1, characterized in that the material of the partition (9) is tungsten alloy. 4.按照权利要求1、2或3所述的用于辐射成像系统中的固体探测器阵列结构,其特征在于,所述金属外罩(7)与金属槽板(1)的连接采用螺钉(8)固定。4. The solid-state detector array structure used in the radiation imaging system according to claim 1, 2 or 3, characterized in that, the connection between the metal housing (7) and the metal slot plate (1) adopts screws (8 )fixed. 5.按照权利要求4所述的用于辐射成像系统中的固体探测器阵列结构,其特征在于,所述金属外罩(7)与金属槽板(1)以及各绝缘子(2)接触缝隙上涂有防潮、防震、避光的材料。5. The solid-state detector array structure used in a radiation imaging system according to claim 4, characterized in that, the contact gap between the metal cover (7) and the metal slot plate (1) and each insulator (2) is coated with There are moisture-proof, shock-proof and light-proof materials.
CN 200510086765 2005-11-03 2005-11-03 Solid detector array architecture in use for radiation imaging system Active CN1959388B (en)

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CN104792805B (en) * 2015-04-16 2017-09-12 中国原子能科学研究院 A kind of transmission detectors and interpolated data computational methods
CN109489752B (en) * 2018-12-29 2024-11-15 无锡洋湃科技有限公司 A multiphase flow quality metering device based on ray coincidence measurement
CN114210594A (en) * 2021-12-09 2022-03-22 合肥泰禾卓海智能科技有限公司 Intelligent dry separator X-ray detector mounting and accommodating device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6426991B1 (en) * 2000-11-16 2002-07-30 Koninklijke Philips Electronics N.V. Back-illuminated photodiodes for computed tomography detectors
CN2578841Y (en) * 2002-11-15 2003-10-08 清华大学 Radial imaging solid detector
CN2736764Y (en) * 2004-09-14 2005-10-26 清华大学 Radiation image formation array solid-state detector
CN2862022Y (en) * 2005-11-03 2007-01-24 清华大学 Solid-state detector array structure used in radiation imaging system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6426991B1 (en) * 2000-11-16 2002-07-30 Koninklijke Philips Electronics N.V. Back-illuminated photodiodes for computed tomography detectors
CN2578841Y (en) * 2002-11-15 2003-10-08 清华大学 Radial imaging solid detector
CN2736764Y (en) * 2004-09-14 2005-10-26 清华大学 Radiation image formation array solid-state detector
CN2862022Y (en) * 2005-11-03 2007-01-24 清华大学 Solid-state detector array structure used in radiation imaging system

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