CN100445734C - A Radiation Imaging Array Solid Detector - Google Patents

Abstract

A radiation imaging array solid detector belongs to the technical field of radiation detection. The invention includes a scintillation crystal formed by cesium iodide or cadmium tungstate and a photodiode coupled therewith, and the scintillation crystal and the photodiode are contained by a casing. The shell is composed of a metal cover plate, a metal bottom plate, a front end cover, a rear end cover and two side plates. The metal cover plate is provided with a plurality of slots, and the partitions made of heavy metal materials are placed in the slots to separate the scintillation crystals to form a plurality of solid detectors. A base rubber pad is placed between the metal base plate and the photodiode, and the insulators of the solid detectors pass through the metal base plate and the base rubber pad to lead out the two poles of the photodiode. Side rubber pads are arranged between the front end cover, the rear end cover and the end faces of the scintillation crystal and the photodiode. Compared with the prior art, the present invention is not only small in size, light-proof, moisture-proof, vibration-proof, easy to install and maintain, and high in detection efficiency, but also enables simple processing and overcomes the problem of large dead zones between detectors.

Description

A Radiation Imaging Array Solid Detector

technical field

The invention relates to an X and gamma radiation imaging array solid detection device, which belongs to the technical field of radiation detection.

Background technique

In the prior art, Chinese patent 95219469.4 discloses a pen-type radiation imaging gas detection device. Although this patented technology has the advantages of better detection efficiency, better sensitivity, radiation resistance, and long self-collimation working life, its disadvantages But the size is large, the detector installation requires a large space, and the detection efficiency is still not ideal. In order to reduce the volume of the detector and improve the detection effect. Chinese patent 01259228.5 discloses a cobalt 60 gamma ray source-cesium iodide or cadmium tungstate detector container inspection system, wherein the detector used is a solid detector coupled with a crystal and a photodiode. In the way of solidifying the crystal and the photodiode, reflective white glue is used for isolation, but this isolation method has the disadvantages that the detector cannot completely avoid light, moisture and crosstalk, and the anti-vibration effect is poor. However, the solid-state detector arrays produced by Heyman Corporation of Germany and DT Corporation of Finland use a basic measurement unit composed of multiple scintillation crystals. The entire detector array is replaced along the way. For this reason, the applicant has applied for a Chinese patent, the application number is 02286053.3, and the name is "radiation imaging solid-state detector". Although the solid-state detector array composed of this patented technology has the advantages of small size, light-proof, moisture-proof, vibration-proof, convenient installation and maintenance, and high detection efficiency, its disadvantage is that the array detector composed of this method has the advantages of small size. The lower process is difficult to process, and the dead zone between the detectors is relatively large.

Contents of the invention

In order to solve the above-mentioned problems in the prior art, the applicant provides a radiation imaging array solid-state detector for the deficiencies in the No. 02286053.3 patent technology. It is not only small in size, light-proof, moisture-proof, vibration-proof, easy to install and maintain, and high in detection efficiency, but also makes the process simple and easy, and overcomes the problem of large dead zones between detectors.

In order to realize the above-mentioned purpose of the invention, the technical solution of the present invention is realized in the following manner:

A radiation imaging array solid-state detector, which includes a scintillation crystal formed by cesium iodide or cadmium tungstate and a photodiode coupled therewith, and the scintillation crystal and the photodiode are contained by a housing. Its structural feature is that the housing is composed of a metal cover plate, a metal bottom plate, a front end cover, a rear end cover and two side plates. The metal cover plate is provided with a plurality of slots, and the partitions made of heavy metal materials are placed in the slots to separate the scintillation crystals to form a plurality of solid detectors. A bottom rubber pad is placed between the metal bottom plate and the photodiode, and the insulators of the solid detectors pass through the metal bottom plate and the bottom rubber pad to lead out the two poles of the photodiode. Side rubber pads are arranged between the front end cover, the rear end cover and the end faces of the scintillation crystal and the photodiode.

According to the above technical solution, the photodiode is integrally coupled with each scintillation crystal or the photodiode is a single body coupled with each scintillation crystal respectively.

According to the above technical solution, screws are used to fix the front end cover, the rear end cover, the metal cover plate and the metal bottom plate. A light-shielding layer of metal sheet with conductive adhesive is placed between the two side plates, the metal cover plate and the metal bottom plate, and is fixed by sealing and bonding.

Due to the adoption of the above-mentioned structure, the present invention consists of a metal cover plate, a metal bottom plate, a front end cover, a rear end cover and two side plates to form a housing, and contains a plurality of scintillation crystals and photodiodes coupled therewith to form a solid detector array , which simplifies the manufacturing process and overcomes the dead zone between the detectors. Since the partitions made of heavy metal in the housing separate the scintillation crystals and make the partitions protrude from the appropriate length of the scintillation crystals, the interference and random scattering of incident rays are greatly reduced. Since the metal cover plate, metal base plate and rear end cover can be made of thicker metal plates during production, on the one hand, the solid-state detector array can be fixed, and on the other hand, the scattering around the scintillation crystal is reduced. Since the two ends of the housing are sealed and bonded with a light-shielding layer of metal sheet with conductive glue, on the one hand, the solid-state detector array is completely protected from light, and on the other hand, the electromagnetic anti-interference performance of the solid-state detector array is increased. In addition, since the bottom rubber pad and side rubber pads are placed in the casing, the vibration-proof performance of the solid-state detector array is improved. Compared with the prior art, the present invention not only has simple processing technology and no dead zone between detectors, but also has improved performance in anti-scattering, anti-interference, light-proof, moisture-proof and vibration-proof. For a detector formed by coupling a single photodiode and a single scintillation crystal, a single detector can be replaced during maintenance without destroying a basic measurement unit, which makes checking for faults very convenient and greatly reduces maintenance costs.

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

Description of drawings

Fig. 1 is a schematic sectional view of the structure of the present invention;

Fig. 2 is a sectional view of A direction of Fig. 1;

Fig. 3 is the right view of Fig. 1;

Fig. 4 is the left view of Fig. 1;

Fig. 5 is the bottom view of Fig. 1;

Fig. 6 is the usage state diagram of the present invention.

Detailed ways

Referring to FIG. 1 to FIG. 5 , the present invention includes a scintillation crystal 11 made of cesium iodide or cadmium tungstate contained in a casing and a photodiode 7 coupled thereto. The housing is composed of a metal cover plate 1, a metal base plate 9, a front end cover 4, a rear end cover 10 and two side plates 12. The metal cover 1 is provided with a plurality of slots 2, and the slots 2 are provided with partitions 13 made of heavy metal materials, which separate the scintillation crystals 11 to form a plurality of solid detectors. A bottom rubber pad 6 is placed between the metal bottom plate 9 and the photodiode 7, and the insulators 8 of each solid detector pass through the metal bottom plate 9 and the bottom rubber pad 6 to lead out the two poles of the photodiode 7. Side rubber pads 5 are placed between the front end cover 4 , the rear end cover 10 , the scintillation crystal 11 , and the end faces of the photodiode 7 . The photodiode 7 is integrally coupled to each scintillation crystal 11 or the photodiode 7 is a single body coupled to each scintillation crystal 11 respectively. The front end cover 4, the rear end cover 10, the metal cover plate 1, and the metal bottom plate 9 are fixed by screws 3, and a light-shielding layer of metal sheet with conductive adhesive is placed between the two side plates 12, the metal cover plate 1, and the metal bottom plate 9 And fixed by sealing adhesive.

When a single photodiode 7 is used, a reflective layer is coated on the surface of the scintillation crystal 11 formed by cesium iodide or cadmium tungstate, and the single photodiode 7 is coupled with each scintillation crystal 11 to form a single solid detector. The separators 13 made of heavy metal materials are inserted into the multiple slots 2 set in the metal cover plate 1 and bonded with super glue. Inserted between the above-mentioned separators 13 . After the bottom rubber pad 6 and the insulators 8 of each solid detector are installed on the metal bottom plate 9, the whole is aligned with the combination of the metal cover plate 1 and the solid detector and plugged in, passing through the metal bottom plate 9 and the bottom rubber pad 6 The two poles of the photodiode 7 are drawn out. Install the side rubber pads 5 on the end faces of the scintillation crystal 11 and the photodiode 7, and fix the front cover 4, the rear end cover 10, the metal cover plate 1, and the metal bottom plate 9 with screws 3, and the two side plates 12 and the metal cover plate 1 1. A light-shielding layer of metal sheets with conductive adhesive is placed between the metal base plates 9 and is fixed by sealing and bonding. Finally, be coated with mildew-proof, lucifuge, moisture-proof paint on the gap where moisture or light easily come in around the housing made up of metal cover plate 1, metal base plate 9, front end cover 4, rear end cover 10 and both side plates 12.

When the integrated photodiode 7 is used, the remaining five surfaces of the scintillation crystal 11 formed of cesium iodide or cadmium tungstate except the coupling surface with the photodiode 7 are coated with reflective layers. Separators 13 made of heavy metal materials are inserted into the plurality of slots 2 provided in the metal cover 1 and bonded with super glue. The integral photodiode 7 is coupled between the spacers 13 . After the bottom rubber pad 6 and the insulators 8 of each solid detector are installed on the metal bottom plate 9, the whole is aligned with the combination of the metal cover plate 1 and the solid detector and plugged in, passing through the metal bottom plate 9 and the bottom rubber pad 6 The two poles of the photodiode 7 are drawn out. Install the side rubber pads 5 on the end faces of the scintillation crystal 11 and the photodiode 7, and fix the front cover 4, the rear end cover 10, the metal cover plate 1, and the metal bottom plate 9 with screws 3, and the two side plates 12 and the metal cover plate 1 1. A light-shielding layer of metal sheets with conductive adhesive is placed between the metal base plates 9 and is fixed by sealing and bonding. Also use anti-mildew, lucifuge, moisture-proof coating to be coated on by metal cover plate 1, metal base plate 9, front end cover 4, rear end cover 10 and the gap place that light easily comes in around the shell that moisture or light come in.

Referring to Fig. 6, when the present invention is in use, the array solid-state detector is installed on a printed circuit board PCB, and the connection and bias voltage of the detector are arranged on the PCB board. The included angle of the device is close to 0 degrees, which can reduce crosstalk.

Claims (3)

1, a kind of radiant image array solid probe, it comprises scintillation crystal (11) that is formed by cesium iodide or cadmium tungstate and the photodiode (7) that is coupled with it, described scintillation crystal (11) and photodiode (7) are contained by housing, it is characterized in that described housing is made up of metal cover board (1), metal base plate (9), front end end cover (4), rear end cap (10) and biside plate (12); Be provided with a plurality of flutings (2) in the described metal cover board (1), be equipped with the dividing plate of making by heavy metal material (13) in the fluting (2), each scintillation crystal (11) is separated a plurality of solid probes of formation, be equipped with primer pad (6) between described metal base plate (9) and the photodiode (7), pass metal base plate (9) and primer pad (6) is drawn the two poles of the earth of photodiode (7) by the insulator (8) of set each solid probe, be equipped with side rubber cushion (5) between the end face of described front end end cover (4), rear end cap (10) and scintillation crystal (11), photodiode (7).

2, radiant image array solid probe according to claim 1 is characterized in that, described photodiode (7) is that one and each scintillation crystal (11) are coupled or photodiode (7) is coupled with each scintillation crystal (11) respectively for monomer.

3, radiant image array solid probe according to claim 1 and 2, it is characterized in that, adopt screw (3) fixing between described front end end cover (4), rear end cap (10) and metal cover board (1), the metal base plate (9), be equipped with the sheet metal lucifuge layer of band conducting resinl between biside plate (12) and metal cover board (1), the metal base plate (9) and adopt sealing to be adhesively fixed.

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