CN1936933A - micro memory card - Google Patents

Abstract

The present invention discloses a micro memory card, comprising a partially hollowed-out first substrate and a second substrate stacked on each other. The second substrate is provided with interface contacts on its outer surface relative to the first substrate, and a controller, a memory chip, etc. are provided on its inner surface at the hollowed-out portion relative to the first substrate. The above-mentioned design develops more component assembly space under the existing structural form, effectively reducing the size of the memory card to the width of a thumb or even a fingernail.

Description

micro memory card

technical field

The invention relates to a miniature memory card, especially a memory card that can be reduced in size to the width of a thumb, or even the width of a fingernail.

Background technique

At present, memory cards on the market generally include SD, MMC, SM, CF, MS, and xD. Compared with traditional storage media, these memory cards have breakthrough developments in size and capacity. They are small and thin memory card with a capacity of several gigabytes. The size and capacity of these memory cards have repeatedly made remarkable achievements. One of the reasons behind it is the increasing popularity of consumer digital products, such as digital cameras, digital cameras, multi-function mobile phones, digital players, etc., all of which require considerable capacity. But compact storage media. Therefore, even though the size of memory cards on the market is small, the industry is still scrambling to develop smaller memory cards. For example, there is MINI SD under SD, and RS-MMC under MMC.

It can be seen from the above that increasing the capacity and reducing the size are the constant development direction of the memory card, but to further improve, it is necessary to break through the limitations of the existing component size and structure in order to achieve a revolutionary breakthrough in the capacity and volume of the memory card. develop.

Contents of the invention

The purpose of the present invention is to provide a miniature memory card that can break through the size limitation of existing components and reduce the size to the width of a thumb, or even the width of a fingernail.

In order to achieve the foregoing object, the present invention proposes a micro memory card, which includes:

A first substrate, which has an appropriate thickness, and forms an indented hollow part on a surface;

A second substrate is matched with the first substrate and overlapped with each other, and its inner surface is provided with electronic components related to the memory card at a position opposite to the hollow part on the first substrate;

A plurality of interface contacts are arranged on the outer surface of the aforementioned first or second substrate, and are connected with the electronic components on the second substrate;

After the above-mentioned first/second substrates are stacked, at least the size of the end with the interface contact conforms to the standard specification of a specific communication protocol, so as to be plugged into the corresponding interface connection port.

Furthermore, installing electronic components on any substrate will protrude to a certain height, which is one of the reasons why the memory card cannot be broken through in reducing the size, and the present invention forms a hollow space at the interlayer of overlapping substrates to make the relevant electronic components Installed at the corresponding position, in this way, the problem that the components protrude from the surface of the substrate and occupy space and cannot be further reduced in size can be solved. With the aforementioned design, the memory card can conform to the interface protocol except for its thickness, and its length and width can be reduced to the width of a thumb, or even the width of a fingernail.

Preferably, the interface contacts are arranged on the outer side of the second substrate.

Preferably, the interface contacts are arranged on the outer side of the first substrate.

Preferably, a plurality of welding pad contacts are further formed on the outer surface of the first substrate for mounting a memory element, and each welding pad contact is connected to an interface contact on the second substrate through an interlayer conduction means.

Preferably, a plurality of welding pad contacts are further formed on the outer surface of the second substrate for mounting a memory element, and each welding pad contact is connected to an interface contact on the first substrate through an interlayer conduction means.

Preferably, the electronic components mounted on the second substrate include a controller chip.

Preferably, a controller chip and a memory chip are mounted on the second substrate.

Preferably, the interface contact conforms to the USB interface protocol.

Preferably, the surface of the memory element on the outer surface of the first substrate is further covered with a protection layer.

Preferably, the surface of the memory element on the outer surface of the second substrate is further covered with a protective layer.

Therefore, the present invention develops more component assembly space under the existing structure type, and effectively reduces the size of the memory card to the width of a thumb, or even the width of a fingernail.

Description of drawings

Fig. 1 is an external view of the first preferred embodiment of the present invention.

Fig. 2 is an exploded view of the first preferred embodiment of the present invention.

Fig. 3 is a sectional view of the first preferred embodiment of the present invention.

Fig. 4 is an exploded view of the second preferred embodiment of the present invention viewed from above.

Fig. 5 is an exploded view of a second preferred embodiment of the present invention viewed from a top view.

Fig. 6 is a cross-sectional view of the second preferred embodiment of the present invention.

Fig. 7 is an exploded view of the third preferred embodiment of the present invention viewed from above.

FIG. 8 is an exploded view of a fourth preferred embodiment of the present invention viewed from a top view.

Fig. 9 is a cross-sectional view of a fifth preferred embodiment of the present invention.

Explanation of reference signs:

10, 30, 50 the first base plate 11, 31, 51 hollow part

13, 61 Memory element 14 Protective layer 15 Grooving

20, 40, 60 second substrate 21, 41, 52 interface contacts

22, 42, 63 controller 43 memory chip 44 slotting

Detailed ways

Regarding a preferred embodiment of the present invention, please refer to Fig. 1, shown in 2, it is to make after a first substrate 10 and a second substrate 20 are superimposed on each other and constitute; Wherein:

The first substrate 10 has an appropriate thickness/width (0.8mm and 12.4mm respectively in this embodiment, and its length can vary depending on requirements, such as 32mm, 24mm and 16mm, etc., and its length is 24mm in this embodiment) , and form a hollow part 11 through the inner and outer surfaces at an appropriate position; and the first substrate 10 is further formed with a plurality of welding pad contacts (not shown in the figure) on its outer surface, for installing a memory element 13, in this implementation In an example, the memory element 13 is a TSOP package element, and the thickness of the package is less than 1.27mm. The memory element 13 is covered with a protection layer 14 to form a protection, and the protection layer 14 is about 0.1 mm. Furthermore, one end of the first substrate 10 is formed with a long and narrow slot 15 parallel to the short side of the end, for the user to use fingernail hooks to apply force to extract the memory card.

The size of the second substrate 20 roughly matches the first substrate 10. In this embodiment, the length of the second substrate 20 is slightly shorter than the first substrate 10, so that the through groove 15 at one end of the first substrate 10 can be exposed; The second substrate 20 is provided with a plurality of interface contacts 21 on the outer surface relative to the first substrate 10. In this embodiment, the interface contacts 21 conform to the USB interface standard, and the inner surface of the second substrate 20 is opposite to the first The hollow part 11 on the substrate 10 is provided with a controller 22 (please refer to FIG. 3 ), or further provided with passive components such as inductance/resistance/capacitance, the controller 22 is arranged on the inner surface of the second substrate 20, And correspondingly located in the hollow part 11 of the first substrate 10, it makes full use of the available space of the existing structure, so that the installation of these components will not increase the thickness of the memory card due to protruding from the surface of the substrate; and the second substrate 20 There is a circuit (not shown in the figure) on it, which is used to connect the interface contact 21 on the outer surface of the aforementioned controller 22, and the circuit on the second substrate 20 passes through an interlayer conduction means (such as a via hole, through-hole plating, etc. ) are connected to the solder pads on the first substrate 10 .

The aforementioned controller 22 and passive components can be fabricated on the second substrate 20 in one process. The so-called one process uses chip-type passive components in terms of passive components. Therefore, the passive components can be mounted on the controller. 22 chips are installed in the same process, such as "chip mounting", "wire bonding" and "packaging" and other steps.

Yet another feasible primary process is as follows:

I/O pads on one surface of the controller chip and the chip passive component have the same electrical connection characteristics;

Make the I/O welding pads of the controller chip and the chip-type passive components face up and fix on the second substrate 20;

Make metal lines to connect the chip and the I/O pads of the chip-type passive components. The specific method can be achieved by coating. The coating technology can be achieved by evaporation or electroplating; it can be first on the second substrate and the controller on it. A photoresist is covered on the surface of the chip and chip-type passive components, and the circuit pattern is transferred to the photoresist, followed by etching to expose the I/O pads on the chip and chip-type passive components, followed by coating, on the photoresist The etched area is plated with a metal film by evaporation or electroplating to form lines, and these lines are used to connect the chip to the corresponding I/O pad on the chip passive component;

After the aforementioned steps are completed, an insulating layer is formed on the surface of the second substrate, the controller chip, the passive components and the circuits thereon, and then the packaging is completed.

Utilize the memory card that aforesaid technique is formed, after the first/second substrate 10/20 are superimposed, at least the size of one end with the interface contact 21 conforms to the standard specification of the USB interface protocol, so that it can be plugged into the corresponding interface connection port; in the traditional technology, installing electronic components on any substrate will protrude to a considerable height, causing the memory card to be unable to further reduce the size, and the present invention is formed at the superimposed first/second substrate 10/20 interlayer Hollowing out the space allows the relevant electronic components to be installed in the corresponding positions, which can solve the problem that the components protrude from the surface of the substrate and occupy space and cannot be further reduced in size, thereby helping to reduce the size of the memory card. In this embodiment, the length/width/thickness of the aforementioned memory card are 24mm/12.4mm/2.4mm, which are roughly the width of a thumb.

Please also refer to Figures 4-6, which is another preferred embodiment of the present invention, which can further reduce the size of the memory card to the width of a fingernail, mainly by stacking a first substrate 30 and a second substrate 40 constituted afterwards; of which:

The first substrate 30 has an appropriate thickness/width (1.8mm and 12.4mm in this embodiment, respectively, and its length is 16mm, and a recessed hollow portion 31 is formed on the inner surface (please refer to FIG. 5 for details). ).

The size of the second base plate 40 is matched with the first base plate 30, and one end thereof is formed with a narrow and long slot 44) parallel to the short side of the end, for the user to buckle with a fingernail, as the usefulness of extracting the memory card for force; The second substrate 40 is provided with a plurality of interface contacts 41 (see FIG. 5 ) on the outer surface relative to the first substrate 30. In this embodiment, the interface contacts 41 conform to the USB interface standard. The second substrate The inner surface of 40 is at least provided with a controller 42 and a memory chip 43 (see FIG. 6 ) at a position opposite to the hollow part 31 on the first substrate 30, or is further provided with passive components such as inductance/resistance/capacitance, the control The device 42 and the memory chip 43 are arranged on the inner surface of the second substrate 40, and are correspondingly located in the hollow portion 31 of the first substrate 30; moreover, there are circuits (not shown) on the second substrate 40 for connecting the aforementioned Interface contacts 41 on the outer surface of the controller 42 . In addition, the controller 42 , the memory chip 43 and even the chip-type passive components can be fabricated on the second substrate 40 in one process, and the available process technology has been described in the above-mentioned embodiments, so further description is omitted. The memory card formed by these technologies is only about the size of a fingernail.

As shown in Figures 7 to 9, it is another preferred embodiment of the present invention, which still consists of a first substrate 50 and a second substrate 60 stacked together; wherein:

The first substrate 50 is formed with an inset hollow portion 51 on the inner surface opposite to the second substrate 60, and a plurality of interface contacts 52 are provided on the outer surface thereof;

On the outer surface of the second substrate 60 opposite to the first substrate 50, lines and a plurality of pad contacts (not shown) are further formed for mounting a memory element 61, and the memory element 61 is covered with a protective layer 62 , to constitute protection. The inner surface of the second substrate 60 is provided with a controller 63 (please refer to FIG. 9 ) at the position opposite to the hollow portion 51 on the first substrate 50, or is further provided with passive components such as inductance/resistance/capacitance, and is connected to these components. The circuit is electrically connected to the memory element 61 on the outer surface and the interface contact 52 on the outer surface of the first substrate 51 through interlayer conduction technology. And the controller 63 is arranged on the inner surface of the second substrate 60, and is correspondingly located in the hollow part 51 of the first substrate 50, which makes full use of the available space of the existing structure, so that the installation of these components will not protrude due to The surface of the substrate increases the thickness of the memory card.

To sum up, the present invention utilizes the laminated circuit board to form a hollowed-out part at the interlayer to create an available space for installing electronic components, so that after the electronic components are installed, their thickness will not be increased due to protruding from the surface of the substrate, so it can effectively Reduce the size of the memory card to meet market demand.

Claims (10)

1. a minisize memory card is characterized in that, includes:

One first substrate possesses suitable thickness, on it and be formed with a hollow-out parts;

One second substrate is with first substrate coupling and be superimposed with each other, and the position of its medial surface hollow-out parts on relative first substrate is provided with the memory card associated electronic components;

A plurality of interface contacts, be located at aforementioned first or the outside surface of second substrate on, and be connected with electronic component on second substrate;

Aforementioned the first/the second substrate is after superimposed, at least in the standard specification of the size conforms specific communications agreement of the end with interface contact, so that be plugged to corresponding interface Port.

2. minisize memory card as claimed in claim 1 is characterized in that, this interface contact is located on the lateral surface of this second substrate.

3. minisize memory card as claimed in claim 1 is characterized in that, this interface contact is located on the lateral surface of this first substrate.

4. minisize memory card as claimed in claim 2 is characterized in that, further is formed with a plurality of weld pad contacts on the outside surface of this first substrate, and for a memory component is installed, each weld pad contact sees through the interlayer conduction means and is connected with interface contact on second substrate.

5. minisize memory card as claimed in claim 3 is characterized in that, further is formed with a plurality of weld pad contacts on the outside surface of this second substrate, and for a memory component is installed, each weld pad contact sees through the interlayer conduction means and is connected with interface contact on first substrate.

6. minisize memory card as claimed in claim 4 is characterized in that, electronic components mounted includes controller chip on this second substrate.

7. minisize memory card as claimed in claim 2 is characterized in that, on this second substrate controller chip and memory chip is installed.

8. as claim 1,2 or 3 described minisize memory cards, it is characterized in that this interface contact meets the USB interface agreement.

9. minisize memory card as claimed in claim 4 is characterized in that, the memory component surface on this first outer surface of substrate further is covered with a protective seam.

10. minisize memory card as claimed in claim 5 is characterized in that, the memory component surface on this second outer surface of substrate further is covered with a protective seam.

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