CN1933713A - Cooling module and its heat pipe - Google Patents
Cooling module and its heat pipe Download PDFInfo
- Publication number
- CN1933713A CN1933713A CN 200510103214 CN200510103214A CN1933713A CN 1933713 A CN1933713 A CN 1933713A CN 200510103214 CN200510103214 CN 200510103214 CN 200510103214 A CN200510103214 A CN 200510103214A CN 1933713 A CN1933713 A CN 1933713A
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- Prior art keywords
- heat pipe
- capillary structure
- housing
- heat
- thickness
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- 238000001816 cooling Methods 0.000 title 1
- 239000012530 fluid Substances 0.000 claims abstract description 30
- 230000005855 radiation Effects 0.000 claims abstract description 30
- 230000004308 accommodation Effects 0.000 claims description 22
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 description 14
- 230000008020 evaporation Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 239000007788 liquid Substances 0.000 description 7
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 239000011469 building brick Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat radiation module, which comprises a heat pipe and at least one heat radiation fin. The heat dissipation fins are arranged outside the heat pipe and connected with the heat pipe. The heat pipe includes a housing, a capillary structure and a working fluid. The shell is provided with an accommodating space and a bottom, wherein the bottom is provided with a non-flat surface, and the surface faces the accommodating space. The capillary structure is arranged on the surface of the bottom, and the working fluid is filled in the shell.
Description
Technical field
The present invention relates to a kind of heat radiation module, especially refer to have the heat radiation module of high-effect heat pipe.
Background technology
Along with industrial technology constantly progresses greatly, various electronic products direction little, in light weight towards volume invariably and low power consumption develops.Because the energy service efficiency of electronic building brick is not absolutely, therefore have many power and be wasted and convert heat energy to, these heat energy can make intrasystem temperature rise.When the temperature of system surpassed the operating temperature that electronic building brick allows, the physical property of electronic building brick will raise and change along with ambient temperature, makes the malfunction of system, and it is wrong or function is stopped to produce running.And, when more rising, intrasystem temperature heals when high, and the failure rate of system also can improve thereupon.
If want to allow system that higher reliability is arranged, will make system can maintain suitable operating temperature range.Be to strengthen the radiating effect of electronic building brick, existing way mostly is greatly to be sentenced radiator at thermal source thermal conductance is gone out, and dissipates heat in the environment with nature or forced convertion mode via the fin (fin) of radiator.
Because heat pipe (heat pipe) can be under very little sectional area and temperature difference, a large amount of heat is transmitted one section considerable distance, and do not need the additional power source supply to operate, under the consideration that need not power provides with the space utilization economy, heat pipe has been one of heat-transferring assembly of widely using in the electronic radiation product.
Please refer to Fig. 1, it is the generalized section of the heat pipe of prior art.Heat pipe 10 is airtight hollow cavities, is provided with capillary structure 12 on tube wall 11, and has working fluid in the heat pipe 10.One of heat pipe 10 end is evaporation ends A, and the other end then is condensation end B.Wherein, evaporation ends A contacts with thermal source (not illustrating), and the working fluid at evaporation ends A place flashes to gaseous state because of heat absorption, and spontaneous current is condensed into liquid state then to condensation end B after latent heat (latent heat) is disengaged at condensation end B place under the influence of pressure reduction.Condensed working fluid again by the capillary force of capillary structure 12 to flow back to evaporation ends A.So, a recirculation is to reach the effect of heat radiation.
Please also refer to Fig. 1 and Fig. 2, Fig. 2 is the dotted line schematic diagram of C partly in the heat pipe of Fig. 1.Because the capillary structure 12 of the heat pipe 10 of prior art has the thickness of uniformity, capillary structure 12 is thicker, though can increase the liquid content of evaporation ends A place capillary structure, but vapour bubble G blocks in capillary structure 12 when causing phase change easily, and then influence the mechanism that working fluid covers, cause the performance of heat pipe 10 to reduce.If capillary structure 12 is thinner, though be difficult for causing vapour bubble G to block, reduce the liquid content of evaporation ends A place capillary structure, cause heat pipe 10 treatable heats to reduce, or produce dry (dry out) phenomenon.
From the above, how to solve the problem of the vapour bubble obstruction that is brought owing to capillary structure thickness, and then the heat exchange area that increases heat pipe effectively is an important topic to promote integral heat sink usefulness in fact.
Summary of the invention
Therefore, for addressing the above problem, the present invention proposes a kind of heat radiation module and heat pipe thereof, and the problem of blocking with the vapour bubble that solves prior art also can increase the heat exchange area of heat pipe effectively and promote integral heat sink usefulness.
For reaching above-mentioned purpose, the present invention proposes a kind of heat pipe, comprises a housing, a capillary structure and a working fluid.Wherein, housing has an accommodation space and a bottom, and the bottom has the surface of a non-flat forms, and this surface is towards accommodation space.Capillary structure is arranged on the surface of bottom, and the working fluid filling is in housing.
According to another object of the present invention, a kind of heat radiation module is proposed, comprise a heat pipe and at least one radiating fin.Wherein, heat pipe comprises a housing, a capillary structure and a working fluid, and housing has an accommodation space and a bottom, and the bottom is the surface with a non-flat forms, and this surface is towards accommodation space.Capillary structure is arranged on the surface, and the working fluid filling is in housing.Radiating fin is arranged at outside the heat pipe and with heat pipe and links.
From the above, heat radiation module of the present invention and heat pipe thereof, its housing has the bottom of a non-planar surface, makes that the contact area between housing and the capillary structure increases, and helps to promote the heat dispersion of heat pipe.In addition, form the capillary structure on a plane for being layed in surperficial going up, it has different thickness, in the less part of thickness, can make working fluid more easily from capillary structure evaporation and break away from capillary structure, and then avoid the obstructing problem of boiling and vapour bubble generation between bottom and capillary structure; In the bigger part of thickness, the working fluid of enough liquid state then can be provided, being supplemented to the part of thinner thickness, and avoid the generation of dry-out.In addition,, can increase the contact area of accommodation space and capillary structure, promptly increase disengagement area, also help the improved efficiency of heat pipe for along the profile on the surface of housing bottom surface and the capillary structure that is provided with.
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Fig. 1 is the generalized section of the heat pipe of prior art.
Fig. 2 is the dotted line schematic diagram of C partly in the heat pipe of Fig. 1.
Fig. 3 A is the heat pipe schematic diagram of preferred embodiment of the present invention.
Fig. 3 B is the schematic diagram of the dotted line part D of Fig. 3 A.
Fig. 4 and Fig. 5 are two kinds of schematic diagrames in addition of the capillary structure of Fig. 3 B.
Fig. 6 to Fig. 8 is the schematic diagram of the various cross sectional shapes of housing of heat pipe.
Fig. 9 is the schematic diagram of the column type heat pipe of preferred embodiment of the present invention.
Figure 10 is the schematic diagram of the heat radiation module of preferred embodiment of the present invention.
Figure 11 and Figure 12 are the schematic diagram of two kinds of heat radiation modules in addition of preferred embodiment of the present invention.
The primary clustering symbol description
10,20,30,50,50 ': heat pipe
11: tube wall
12,22,22 ', 32,52: capillary structure
21,31,51: housing
211,311: accommodation space
212,212 ', 312,512: the bottom
213,213 ', 313: the surface
214,214 ': projection
314: cover plate
315: sidewall
40: the heat radiation module
60,60 ': radiating fin
A: evaporation ends
B: condensation end
G: vapour bubble
H1: first thickness
H2: second thickness
S: pedestal
W: working fluid
Embodiment
Hereinafter with reference to correlative type, the embodiment according to heat radiation module of the present invention and heat pipe thereof is described.
Please be simultaneously with reference to Fig. 3 A and Fig. 3 B, Fig. 3 A is the heat pipe schematic diagram of preferred embodiment of the present invention, and Fig. 3 B is the schematic diagram of the dotted line part D of Fig. 3 A.Heat pipe 20 of the present invention is an example with a tabular heat pipe, comprises a housing 21, a capillary structure 22 and a working fluid W.Housing 21 has an accommodation space 211 and a bottom 212.In the present embodiment, be example with the housing 21 that is the hollow slab shape.Wherein, the material of housing 21 is a high heat conducting material, for example is copper, silver, aluminium or its alloy, so when the bottom 212 of housing 21 and thermal source (not illustrating) when contacting, can be fast the heat of thermal source be conducted to the elsewhere.Accommodation space 211 is a confined space, and bottom 212 has a surface 213, and surface 213 is towards accommodation space 211.
212 surfaces that had 213, bottom are surfaces of a non-flat forms, that is to say that bottom 212 has different-thickness.Surface 213 is formed with at least one projection 214, and a plurality of projection 214 constitutes a checkerboard pattern, a ranks pattern (pattern in a row), a symmetrical expression pattern or an asymmetric pattern on surface 213.In Fig. 3 B, surface 213 is constituted a checkerboard pattern by a projection 214 by a plurality of one-tenth flat columns, and the cross sectional shape on surface 213 is square or rectangle.
Working fluid W filling is in housing 21, and working fluid W for example is one of inorganic compound, pure water, alcohols, ketone, liquid metal, refrigerant, organic compound or its mixture.When heat pipe 20 is arranged on the thermal source, working fluid in the close capillary structure 22 of thermal source one end (being evaporation ends A) absorbs the working fluid that is become gaseous state by the heat that thermal source produced, and change liquid working fluid after in the capillary structure 22 of stow away from heat one end (being condensation end B), disengaging latent heat into, again by capillary force that capillary structure 22 provided and flow back into evaporation ends A, so circulation endlessly continues band from thermal source, to reach the effect of heat radiation with heat.
Because the bottom 212 of housing 21 has uneven surperficial 213, make contact area increase between housing 21 and the capillary structure 22, help to promote the heat dispersion of heat pipe 20.Moreover, because capillary structure 22 has different thickness, in the less H2 part (being projection 214 tops) of thickness, can make working fluid more easily from capillary structure 22 evaporation and break away from capillary structure 22, and then avoid the boiling of 22 of bottom 212 and capillary structures and the obstructing problem that vapour bubble is produced.On the other hand,, then can provide the working fluid of enough liquid state, with the H1 that is supplemented to thinner thickness partly, and avoid the generation of dry (dry out) phenomenon the bigger H1 of thickness partly (being non-projection 214 parts that have).
Yet, the present invention is not limited thereto, capillary structure 22 removes on the surface 213 that is layed in bottom 212, and capillary structure 22 is formed outside the plane towards accommodation space 211, capillary structure 22 also can be surfacewise 213 profile and being provided with, make capillary structure 22 also form one rough, that is capillary structure 22 have equal single thickness on surface 213.For example, as Fig. 4 and shown in Figure 5, the capillary structure 22 ' that is positioned on the projection 214 ' has thickness H1 ', and for the capillary structure 22 ' that is positioned on the non-bottom 212 ' with projection 214 ', then has thickness H2 '.Thickness H1 ' can equate with thickness H2 ' or not wait, and it is required to look closely the user.
Owing to capillary structure 22 ' surfacewise 213 ' profile be provided with, thus, can increase the contact area (promptly having increased disengagement area) of accommodation space and capillary structure 22 ', help the improved efficiency of heat pipe integral body.In addition, similarly, the surface 213 ' of bottom 212 ' is the surface of a non-flat forms, can make that the contact area between housing and the capillary structure increases, so can promote the heat dispersion of heat pipe.
Moreover, the cross sectional shape of housing bottom 212 ' is unrestricted, except being the square or rectangle shown in Fig. 3 B and Fig. 4, can also be triangle (as shown in Figure 5), hemisphere (as shown in Figure 6), arc (as shown in Figure 7) or trapezoidal (as shown in Figure 8), and cross sectional shape also can be a discontinuous pattern or a curved surface.
In addition, the heat pipe 20 among Fig. 3 A is an example with the housing 21 of a hollow slab shape, and right housing can also be other shape, and the shape of the thermal source that can use according to desire is done design.So the bottom of housing can be circle, square or other geometry.Please refer to Fig. 9, it is the schematic diagram of the column type heat pipe of preferred embodiment of the present invention.Heat pipe 30 comprises a housing 31, a capillary structure 32 and a working fluid.Wherein, capillary structure 32 and working fluid have identical technical characterictic and effect with capillary structure 22 and working fluid among first embodiment, do not repeat them here.
Housing 31 is an open column shape and has an accommodation space 311 and a bottom 312, and bottom 312 has the surface 313 of a non-flat forms, and surface 313 is towards accommodation space 311.Wherein, housing 31 has more a cover plate 314 and a sidewall 315, and sidewall 315 is located on bottom 312, and cover plate 314 is bottom 312 and establishing relatively.In the housing 31 of open column shape, the evaporation ends of heat pipe 30 is positioned at bottom 312 parts, and condensation end then is positioned at sidewall 315 parts.Because the bottom 312 of housing 31 is the surfaces 313 with a non-flat forms, can increase the contact area of bottom 312 and capillary structure 32, and then the usefulness of lifting heat pipe 30, in addition, when if capillary structure 32 is arranged on 312 the surface 313, bottom in the on-plane surface mode, can increase the contact area of capillary structure 32 and accommodation space 311, and then promote the usefulness of heat pipe 30.
Then, please refer to Figure 10, it is the schematic diagram of the heat radiation module of preferred embodiment of the present invention.Heat radiation module 40 comprises a heat pipe 50 and at least one radiating fin 60.Heat pipe 50 comprises a housing 51, a capillary structure 52 and a working fluid W.Wherein, heat pipe 50 can have identical technical characterictic with the heat pipe 20 of Fig. 3 A and the heat pipe 30 of Fig. 9, does not repeat them here.
In Figure 10, be example with a tabular type heat pipe 50, that is housing 51 is the hollow slab shape.Certainly, housing 51 also can be as Figure 11 or the column type that forms shown in Figure 12.Radiating fin 60 is with aluminium extruded moulding manufacturing, and it is outer and link to each other with heat pipe 50 to be arranged at heat pipe 50.The connected mode of radiating fin 60 and heat pipe 50 be selected from welding, chimeric, fix, stick together the group that formed one of them.Radiating fin 60 can directly contact with heat pipe 50, or more can be coated with a tin cream (soldering paste), a heat-conducting cream (grease) between radiating fin 60 and heat pipe 50, or a material that can serve as thermally-conductive interface.
Radiating fin 60 is arranged at the top of tabular heat pipe 50, and perhaps, as Figure 11 or shown in Figure 12, heat pipe 50 ' is sheathed on radiating fin 60 ' or 60 " between, and radiating fin and heat pipe with heat edge mode carry out chimeric with and/or fix.Radiating fin 60,60 ', 60 " arrangement mode for example be that the horizontal interval distributes, perpendicular separation distributes, oblique distribution spaced apart, radial, or other distribution mode.
Referring again to Figure 10, heat radiation module 40 can be applicable on the thermal source (not illustrating), and heat pipe 50 directly contacts with thermal source or contacts with thermal source by the pedestal S of an outside.As shown in figure 10, pedestal S is a solid metal block, one of pedestal S side contacts with the bottom 512 of the housing 51 of heat pipe 50, the opposite side of pedestal S then contacts with a thermal source, high conduction characteristic by pedestal S, and the heat of being dispersed by thermal source can be conducted to fast the housing 51 of heat pipe 50, conduct to radiating fin 60 again.Thermal source is the electronic building brick of a heating, for example is central processing unit, transistor, server, high-order drafting card, hard disk, power supply unit, running control system, electronic multimedia mechanism, radio communication base station or high-order game machine etc.In addition, heat radiation module 40 more can with a fan winding, in order to the heat loss more rapidly that promotes to be derived by heat radiation module 40.
From the above, heat radiation module of the present invention and heat pipe thereof, its housing is the bottom with a non-planar surface, makes that the contact area between housing and the capillary structure increases, and helps to promote the heat dispersion of heat pipe.In addition, form the capillary structure on a plane for being layed in surperficial going up, it has different thickness, in the less part of thickness, can make working fluid more easily from capillary structure evaporation and break away from capillary structure, and then avoid the obstructing problem of boiling and vapour bubble generation between bottom and capillary structure; In the bigger part of thickness, the working fluid of enough liquid state then can be provided, being supplemented to the part of thinner thickness, and avoid the generation of dry-out.In addition,, can increase the contact area of accommodation space and capillary structure, promptly increase disengagement area, also help the improved efficiency of heat pipe for along the profile on the surface of housing bottom surface and the capillary structure that is provided with.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be included in the accompanying claim its equivalent modifications of carrying out or change.
Claims (19)
1, a kind of heat pipe comprises:
One housing has an accommodation space and a bottom, and this bottom has the surface of a non-flat forms, and should the surface towards this accommodation space;
One capillary structure is arranged on this surface; And
One working fluid, filling is in this housing.
2, heat pipe as claimed in claim 1, wherein the material of this housing is copper, silver, aluminium or its alloy, or a high heat conducting material.
3, heat pipe as claimed in claim 1, wherein this housing is a hollow slab shape or is an open column shape.
4, heat pipe as claimed in claim 1, wherein this housing has more a cover plate and a sidewall, and this side wall ring is located at this bottom, and this cover plate is this bottom and establishing relatively.
5, heat pipe as claimed in claim 1, wherein the cross sectional shape of this housing bottom is hemisphere, arc, triangle, rectangle, square or trapezoidal, and this bottom can be circle, square or other geometry.
6, heat pipe as claimed in claim 1, wherein this surface is formed with at least one projection, and those projections constitute a checkerboard pattern, a ranks pattern, a symmetrical expression pattern or an asymmetric pattern on this surface.
7, heat pipe as claimed in claim 1, wherein this capillary structure is layed in this surface, makes this capillary structure form a plane towards this accommodation space.
8, heat pipe as claimed in claim 7, wherein this capillary structure have one first thickness and one second thickness, and this first thickness is greater than this second thickness perpendicular to this bottom direction.
9, heat pipe as claimed in claim 1, wherein this capillary structure is provided with along this surperficial profile, and this capillary structure has equal thickness or non-equal thickness.
10, a kind of heat radiation module comprises:
One heat pipe comprises a housing, a capillary structure and a working fluid, and this housing has an accommodation space and a bottom, this bottom has the surface of a non-flat forms, and should the surface towards this accommodation space, this capillary structure is arranged on this surface, and this working fluid filling is in this housing; And
At least one radiating fin is arranged at this heat pipe and is connected outward and with this heat pipe.
11, heat radiation module as claimed in claim 10, wherein the material of this housing is copper, silver, aluminium or its alloy, or a high heat conducting material.
12, heat pipe as claimed in claim 10, wherein this housing is a hollow slab shape or is an open column shape.
13, heat radiation module as claimed in claim 10, wherein this housing has more a cover plate and a sidewall, and this side wall ring is located at this bottom, and this cover plate is this bottom and establishing relatively.
14, heat radiation module as claimed in claim 10, wherein the cross sectional shape of this housing bottom is hemisphere, arc, triangle, rectangle, square or trapezoidal, and this bottom can be circle, square or other geometry.
15, heat radiation module as claimed in claim 10, wherein this surface is formed with at least one projection, and those projections constitute a checkerboard pattern, a ranks pattern, a symmetrical expression pattern or an asymmetric pattern on this surface.
16, heat radiation module as claimed in claim 10, wherein this capillary structure is layed in this surface, makes this capillary structure form a plane towards this accommodation space.
17, heat radiation module as claimed in claim 16, wherein this capillary structure have one first thickness and one second thickness, and this first thickness is greater than this second thickness perpendicular to this bottom direction.
18, heat radiation module as claimed in claim 10, wherein this capillary structure is provided with along this surperficial profile, and this capillary structure has equal thickness or non-equal thickness.
19, heat radiation module as claimed in claim 10, wherein this heat pipe can see through a pedestal or directly contact with a thermal source, is directly conducted to those radiating fins in order to the heat that this thermal source is dispersed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510103214A CN100584167C (en) | 2005-09-16 | 2005-09-16 | Heat radiation module and heat pipe thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510103214A CN100584167C (en) | 2005-09-16 | 2005-09-16 | Heat radiation module and heat pipe thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1933713A true CN1933713A (en) | 2007-03-21 |
| CN100584167C CN100584167C (en) | 2010-01-20 |
Family
ID=37879266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510103214A Expired - Fee Related CN100584167C (en) | 2005-09-16 | 2005-09-16 | Heat radiation module and heat pipe thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100584167C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101681896B (en) * | 2007-05-29 | 2012-05-23 | 联合材料公司 | Heat spreader for semiconductor device and method for manufacturing the heat spreader |
| CN103885559A (en) * | 2012-12-20 | 2014-06-25 | 加弘科技咨询(上海)有限公司 | Heat dissipation fin, heat dissipation fin assembly and electronic device |
| CN108738284A (en) * | 2018-06-28 | 2018-11-02 | 深圳中讯源科技有限公司 | A kind of graphene composite radiating laminated construction and its manufacturing method |
| CN110034081A (en) * | 2018-01-12 | 2019-07-19 | 智光股份有限公司 | Cooling module and method of making the same |
| CN110573819A (en) * | 2017-09-29 | 2019-12-13 | 株式会社村田制作所 | Vapor chamber |
| CN111447793A (en) * | 2020-04-08 | 2020-07-24 | Oppo广东移动通信有限公司 | Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6474074B2 (en) * | 2000-11-30 | 2002-11-05 | International Business Machines Corporation | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
| CN2874398Y (en) * | 2005-05-10 | 2007-02-28 | 苏子欣 | Integrated heat conductive pipe radiation structure |
-
2005
- 2005-09-16 CN CN200510103214A patent/CN100584167C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101681896B (en) * | 2007-05-29 | 2012-05-23 | 联合材料公司 | Heat spreader for semiconductor device and method for manufacturing the heat spreader |
| CN103885559A (en) * | 2012-12-20 | 2014-06-25 | 加弘科技咨询(上海)有限公司 | Heat dissipation fin, heat dissipation fin assembly and electronic device |
| CN110573819A (en) * | 2017-09-29 | 2019-12-13 | 株式会社村田制作所 | Vapor chamber |
| CN110034081A (en) * | 2018-01-12 | 2019-07-19 | 智光股份有限公司 | Cooling module and method of making the same |
| CN108738284A (en) * | 2018-06-28 | 2018-11-02 | 深圳中讯源科技有限公司 | A kind of graphene composite radiating laminated construction and its manufacturing method |
| CN108738284B (en) * | 2018-06-28 | 2024-06-07 | 深圳中讯源科技有限公司 | A graphene composite heat dissipation laminate structure and manufacturing method thereof |
| CN111447793A (en) * | 2020-04-08 | 2020-07-24 | Oppo广东移动通信有限公司 | Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment |
| CN111447793B (en) * | 2020-04-08 | 2022-05-13 | Oppo广东移动通信有限公司 | Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100584167C (en) | 2010-01-20 |
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