CN110034081A - Cooling module and method of making the same - Google Patents
Cooling module and method of making the same Download PDFInfo
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- CN110034081A CN110034081A CN201810031215.8A CN201810031215A CN110034081A CN 110034081 A CN110034081 A CN 110034081A CN 201810031215 A CN201810031215 A CN 201810031215A CN 110034081 A CN110034081 A CN 110034081A
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000001816 cooling Methods 0.000 title description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 136
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 135
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 112
- 229910052802 copper Inorganic materials 0.000 claims abstract description 112
- 239000010949 copper Substances 0.000 claims abstract description 112
- 239000011248 coating agent Substances 0.000 claims abstract 18
- 238000000576 coating method Methods 0.000 claims abstract 18
- 239000012224 working solution Substances 0.000 claims abstract 8
- 238000000034 method Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000006260 foam Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 238000010273 cold forging Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000011435 rock Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 75
- 239000010410 layer Substances 0.000 description 42
- 239000012530 fluid Substances 0.000 description 31
- 238000005245 sintering Methods 0.000 description 13
- 239000011247 coating layer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 239000006262 metallic foam Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000005242 forging Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种散热模块及其制作方法，特别是涉及一种通过毛细现象以进行散热的散热模块及其制作方法。The invention relates to a heat dissipation module and a manufacturing method thereof, in particular to a heat dissipation module and a manufacturing method for heat dissipation through capillary phenomenon.
背景技术Background technique
随着各种电子电机工业的高度发展，各式电子设备满足了人们日常生活的不同需求。各式电子设备在运作的过程中，随着能源的转换与利用，也会伴随着产生程度不等的热能，其中尤以中央处理器(Central Processing Unit，简称CPU)或图形处理器(graphicsprocessing unit，简称GPU)等需要进行高速运算的电子器件所产生的热能最为可观。热能的累积不仅会影响电子器件的工作效能，也会产生安全上的疑虑。With the high development of various electronic and motor industries, various electronic devices meet the different needs of people's daily life. During the operation of various electronic devices, along with the conversion and utilization of energy, they will also generate heat energy of varying degrees, especially the central processing unit (Central Processing Unit, CPU) or graphics processing unit (graphics processing unit). , referred to as GPU) and other electronic devices that require high-speed computing generate the most considerable thermal energy. The accumulation of thermal energy will not only affect the working performance of electronic devices, but also cause safety concerns.
为避免热能持续累积于电子设备中，通常会于前述电子器件上安装一散热装置。常见的散热装置包括直接连接于电子器件上的散热模块以及降温风扇，通过散热模块将电子器件所生产的热能导出，并由降温风扇引发的气流快速将逸散至空气中的热能带走，以达到降低电子器件温度的作用。In order to avoid the continuous accumulation of thermal energy in the electronic device, a heat dissipation device is usually installed on the aforementioned electronic device. Common heat dissipation devices include heat dissipation modules directly connected to electronic devices and cooling fans. The heat energy produced by the electronic devices is exported through the heat dissipation modules, and the air flow caused by the cooling fans quickly takes away the heat energy that escapes into the air. To achieve the effect of reducing the temperature of electronic devices.
现有应用于CPU或GPU的散热模块，有的采用均温板(vapor chamber)搭配散热鳍片组成，其均温板系采用两片上、下盖板对应盖合以形成一个内腔室，并于内装入工作液之后，将内腔气体抽出并真空密封。前述均温板的一侧贴靠至产生热源的电子器件，另一侧涂覆散热银膏后，供散热鳍片安装至其上。借此，电子器件产生的热能通过均温板、散热银膏而被传导至散热鳍片，并经由散热鳍片使热能被逸散至空气中，再由降温风扇引起的气流将高温的空气带走。Existing heat dissipation modules for CPU or GPU are composed of vapor chambers and heat dissipation fins. After the working fluid is filled into the inner chamber, the gas in the inner chamber is drawn out and vacuum sealed. One side of the aforesaid vapor chamber is attached to the electronic device that generates the heat source, and the other side is coated with heat-dissipating silver paste for mounting the heat-dissipating fins thereon. In this way, the heat energy generated by the electronic device is conducted to the heat dissipation fins through the vapor chamber and the heat dissipation silver paste, and the heat energy is dissipated into the air through the heat dissipation fins, and then the air flow caused by the cooling fan brings the high temperature air into the air. Walk.
然而，现有的均温板结构复杂，热能的传递路径上经过多次介质转换，效率不佳；再者，工作液冷凝后没办法有效地回到热源所在位置，循环效率不彰；此外，由于需要针对上、下盖板的结合以及均温板与散热鳍片的结合分别进行焊接工序，在第二次回炉进行二次高温焊接时，很容易破坏先前已焊接的结构，严重影响产品的生产良率。However, the existing uniform temperature plate has a complex structure, and the heat energy transfer path undergoes multiple medium conversions, so the efficiency is not good; in addition, the working fluid cannot effectively return to the location of the heat source after condensing, and the cycle efficiency is poor; in addition, Since it is necessary to carry out the welding process for the combination of the upper and lower cover plates and the combination of the vapor chamber and the heat dissipation fins, when the second high temperature welding is performed in the second return to the furnace, it is easy to destroy the previously welded structure and seriously affect the product. Production yield.
发明内容SUMMARY OF THE INVENTION
本发明所要解决的技术问题在于，针对现有技术的不足提供一种散热模块及其制作方法，其不仅有助于散热效率提升，且能够加强整体的结构强度。The technical problem to be solved by the present invention is to provide a heat dissipation module and a manufacturing method thereof in view of the deficiencies of the prior art, which not only help to improve the heat dissipation efficiency, but also can strengthen the overall structural strength.
为了解决上述的技术问题，本发明所采用的其中一技术方案是，提供一种散热模块，其包括一铜制板体以及一铝制板体，所述铜制板体凹设有一凹槽，所述铜制板体于所述凹槽的内侧面上覆盖有一第一毛细覆盖层。所述铝制板体的一第一侧面设置有多个散热鳍片，所述铝制板体的一第二侧面覆盖所述凹槽的开口，所述铝制板体与所述铜制板体之间形成用于容置一工作液的一容置空间，所述第二侧面凸设有至少一凸柱，且所述第二侧面上覆盖有一第二毛细覆盖层。其中，所述铝制板体与所述铜制板体结合成一体，所述凸柱抵靠于所述铜制板体的所述凹槽的内侧面，且所述工作液通过毛细现象以在所述第一毛细覆盖层与所述第二毛细覆盖层之间流动。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a heat dissipation module, which includes a copper plate body and an aluminum plate body, and the copper plate body is recessed with a groove, The copper plate body is covered with a first capillary covering layer on the inner surface of the groove. A first side of the aluminum plate body is provided with a plurality of heat dissipation fins, a second side of the aluminum plate body covers the opening of the groove, the aluminum plate body and the copper plate are An accommodating space for accommodating a working fluid is formed between the bodies, at least one convex column is protruded from the second side surface, and a second capillary cover layer is covered on the second side surface. Wherein, the aluminum plate body and the copper plate body are integrated into one body, the convex column abuts against the inner side of the groove of the copper plate body, and the working fluid passes through the capillary phenomenon to remove Flow between the first capillary cover and the second capillary cover.
较佳地，所述第一毛细覆盖层是烧结固定于所述铜制板体的一第一泡沫金属(porous foam metal)层，所述第二毛细覆盖层是烧结固定于所述铝制板体的一第二泡沫金属层。Preferably, the first capillary covering layer is a first porous foam metal layer sintered and fixed to the copper plate body, and the second capillary covering layer is sintered and fixed to the aluminum plate. A second foam metal layer of the body.
较佳地，所述的散热模块还进一步包括多个金属粉体，多个所述金属粉体被烧结固定于所述凸柱的表面，以在所述凸柱的表面形成一毛细结构。Preferably, the heat dissipation module further includes a plurality of metal powders, and the plurality of metal powders are sintered and fixed on the surface of the convex column to form a capillary structure on the surface of the convex column.
为了解决上述的技术问题，本发明所采用的另外一技术方案是，提供一种散热模块，其包括一铜制板体以及一铝制板体，所述铜制板体凹设有一凹槽，所述铜制板体于所述凹槽的内侧面覆盖有一第一毛细覆盖层，且所述凹槽的内侧面凸设有至少一凸柱。所述铝制板体的一第一侧面设置有多个散热鳍片，所述铝制板体的一第二侧面覆盖所述凹槽的开口，所述铝制板体与所述铜制板体间形成用于容置一工作液的一容置空间，且所述第二侧面覆盖有一第二毛细覆盖层。其中，所述铝制板体与所述铜制板体结合成一体，所述凸柱抵靠于所述铝制板体的所述第二侧面，且所述工作液通过毛细现象在所述第一毛细覆盖层与所述第二毛细覆盖层之间流动。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a heat dissipation module, which includes a copper plate body and an aluminum plate body, and the copper plate body is recessed with a groove, The copper plate body is covered with a first capillary covering layer on the inner side of the groove, and at least one protruding post is protruded from the inner side of the groove. A first side of the aluminum plate body is provided with a plurality of heat dissipation fins, a second side of the aluminum plate body covers the opening of the groove, the aluminum plate body and the copper plate are An accommodating space for accommodating a working fluid is formed between the bodies, and the second side surface is covered with a second capillary covering layer. Wherein, the aluminum plate body is integrated with the copper plate body, the protruding column abuts against the second side surface of the aluminum plate body, and the working fluid passes through the capillary phenomenon in the Flow between the first capillary cover layer and the second capillary cover layer.
为了解决上述的技术问题，本发明所采用的另外再一技术方案是，提供一种散热模块的制作方法，所述制作方法包括加工一铜片，以形成具有一凹槽的一铜制板体。通过烧结以形成一第一毛细覆盖层于所述凹槽的内侧面。加工一铝材，以形成一铝制板体，所述铝制板体的一第一侧面形成有多个散热鳍片，且所述铝制板体的一第二侧面形成有至少一凸柱。通过烧结以形成一第二毛细覆盖层于所述铝制板体的所述第二侧面。将所述铜制板体与所述铝制板体相结合，以使所述凸柱抵靠至所述铜制板体的所述凹槽的内侧面，且使所述铝制板体与所述铜制板体之间形成一容置空间。将一工作液注入所述容置空间内并抽出所述容置空间中的气体，将所述铜制板体与所述铝制板体密封焊接成一体。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a method for manufacturing a heat dissipation module, the manufacturing method includes processing a copper sheet to form a copper plate body with a groove . By sintering, a first capillary covering layer is formed on the inner side of the groove. Processing an aluminum material to form an aluminum plate body, a first side of the aluminum plate body is formed with a plurality of heat dissipation fins, and a second side of the aluminum plate body is formed with at least one convex column . A second capillary covering layer is formed on the second side surface of the aluminum plate body by sintering. The copper plate body is combined with the aluminum plate body, so that the protruding column abuts against the inner side surface of the groove of the copper plate body, and the aluminum plate body is connected to the inner side of the groove. An accommodating space is formed between the copper plate bodies. A working fluid is injected into the accommodating space and the gas in the accommodating space is extracted, and the copper plate body and the aluminum plate body are sealed and welded into one body.
较佳地，具有多个所述散热鳍片与所述凸柱的所述铝制板体是通过冷锻加工而形成。Preferably, the aluminum plate body having a plurality of the heat dissipation fins and the protruding columns is formed by cold forging.
较佳地，位于所述第一侧面的多个所述散热鳍片是通过铝挤型加工而形成，位于所述第二侧面的所述凸柱是通过铣削加工而形成。Preferably, the plurality of heat dissipation fins on the first side are formed by aluminum extrusion, and the protruding posts on the second side are formed by milling.
为了解决上述的技术问题，本发明所采用的另外又一技术方案是，提供一种散热模块的制作方法，所述制作方法包括加工一铜片，以形成一铜制板体，所述铜制板体具有一凹槽，且所述铜制板体于所述凹槽的内侧面形成有至少一凸柱。通过烧结以形成一第一毛细覆盖层于所述凹槽的内侧面。加工一铝材，以形成一铝制板体，所述铝制板体的一第一侧面形成有多个散热鳍片。通过烧结以形成一第二毛细覆盖层于所述铝制板体的所述第二侧面。将所述铜制板体与所述铝制板体相结合，以使所述凸柱抵靠至所述铝制板体的所述第二侧面，且使所述铝制板体与所述铜制板体之间形成一容置空间。将一工作液注入所述容置空间内并抽出所述容置空间中的气体，将所述铜制板体与所述铝制板体密封焊接成一体。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a heat dissipation module, the manufacturing method includes processing a copper sheet to form a copper plate body, the copper The plate body has a groove, and the copper plate body is formed with at least one protruding column on the inner side of the groove. By sintering, a first capillary covering layer is formed on the inner side of the groove. An aluminum material is processed to form an aluminum plate body, and a first side surface of the aluminum plate body is formed with a plurality of heat dissipation fins. A second capillary covering layer is formed on the second side surface of the aluminum plate body by sintering. The copper plate body is combined with the aluminum plate body, so that the protruding column abuts against the second side surface of the aluminum plate body, and the aluminum plate body is connected to the aluminum plate body. An accommodating space is formed between the copper plate bodies. A working fluid is injected into the accommodating space and the gas in the accommodating space is extracted, and the copper plate body and the aluminum plate body are sealed and welded into one body.
本发明的其中一有益效果在于，本发明所提供的散热模块及其制作方法，其能通过“铜制板体以及铝制板体间通过凸柱相互抵靠”以及“工作液通过毛细现象在第一毛细覆盖层与第二毛细覆盖层之间流动”的技术方案，不仅有助于散热效率提升，且能够加强整体的结构强度。One of the beneficial effects of the present invention is that in the heat dissipation module and the manufacturing method thereof provided by the present invention, the "copper plate body and the aluminum plate body are abutted against each other through the convex column" and "the working fluid passes through the capillary phenomenon in the The technical solution of "flow between the first capillary cover layer and the second capillary cover layer" not only helps to improve the heat dissipation efficiency, but also enhances the overall structural strength.
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所提供的附图仅用于提供参考与说明，并非用来对本发明加以限制。For further understanding of the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only for reference and description, not for limiting the present invention.
附图说明Description of drawings
图1为本发明第一实施例的散热模块的制作方法的流程图。FIG. 1 is a flowchart of a manufacturing method of a heat dissipation module according to a first embodiment of the present invention.
图2为本发明第一实施例的散热模块的立体组合示意图。FIG. 2 is a three-dimensional combined schematic diagram of the heat dissipation module according to the first embodiment of the present invention.
图3为本发明第一实施例的散热模块的一立体分解示意图。FIG. 3 is a schematic exploded perspective view of the heat dissipation module according to the first embodiment of the present invention.
图4为本发明第一实施例的散热模块的另一立体分解示意图。FIG. 4 is another perspective exploded schematic view of the heat dissipation module according to the first embodiment of the present invention.
图5为图2的V-V剖面线的剖面示意图。FIG. 5 is a schematic cross-sectional view of the V-V section line in FIG. 2 .
图6为图5的VI标记处的局部放大示意图。FIG. 6 is a partial enlarged schematic view of the VI mark in FIG. 5 .
图7为本发明第二实施例的剖面示意图。7 is a schematic cross-sectional view of a second embodiment of the present invention.
图8为本发明第三实施例的散热模块的制作方法的流程图。FIG. 8 is a flowchart of a manufacturing method of a heat dissipation module according to a third embodiment of the present invention.
图9为本发明第三实施例的剖面示意图。9 is a schematic cross-sectional view of a third embodiment of the present invention.
图10为本发明第四实施例的立体组合示意图。FIG. 10 is a three-dimensional combined schematic diagram of the fourth embodiment of the present invention.
图11为本发明第四实施例的一立体分解示意图。FIG. 11 is a schematic exploded perspective view of the fourth embodiment of the present invention.
图12为本发明第四实施例的另一立体分解示意图。FIG. 12 is another perspective exploded schematic view of the fourth embodiment of the present invention.
具体实施方式Detailed ways
以下是通过特定的具体实例来说明本发明所公开有关“散热模块及其制作方法”的实施方式，本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其他不同的具体实施例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本发明的构思下进行各种修改与变更。另外，本发明的附图仅为简单示意说明，并非依实际尺寸的描绘，事先声明。以下的实施方式将进一步详细说明本发明的相关技术内容，但所公开的内容并非用以限制本发明的保护范围。The following are specific specific examples to illustrate the embodiments of the "heat dissipation module and its manufacturing method" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.
应理解，虽然本文中可能使用术语第一、第二、第三等来描述各种组件或者信号，但这些组件或者信号不应受这些术语的限制。这些术语主要是用以区分一组件与另一组件，或者一信号与另一信号。另外，本文中所使用的术语“或”，应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。It will be understood that, although the terms first, second, third, etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component, or one signal from another. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.
第一实施例first embodiment
请参阅图1所示之流程图，并搭配参阅图2至图6所示之组件符号。图1为本发明第一实施例的散热模块T的制作方法的流程图。图2为本发明第一实施例的散热模块T的立体组合示意图。图3为本发明第一实施例的散热模块T的一立体分解示意图。图4为本发明第一实施例的散热模块T的另一立体分解示意图。图5为图2的V-V剖面线的剖面示意图。图6为图5的VI标记处的局部放大示意图。Please refer to the flowchart shown in FIG. 1 , and refer to the component symbols shown in FIG. 2 to FIG. 6 . FIG. 1 is a flowchart of a manufacturing method of a heat dissipation module T according to a first embodiment of the present invention. FIG. 2 is a three-dimensional combined schematic diagram of the heat dissipation module T according to the first embodiment of the present invention. FIG. 3 is a schematic exploded perspective view of the heat dissipation module T according to the first embodiment of the present invention. FIG. 4 is another perspective exploded schematic view of the heat dissipation module T according to the first embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the V-V section line in FIG. 2 . FIG. 6 is a partial enlarged schematic view of the VI mark in FIG. 5 .
首先，说明本发明第一实施例的铜制板体1以及铝制板体2主要结构，请配合参阅图1至图4所示。本发明第一实施例所提供的散热模块T包括铜制板体1以及铝制板体2。铜制板体1由一铜片加工而成。具体来说，可以通过冲压成型或其他金属加工成型的工艺，将铜片加工成具有凹槽11的铜制板体1。在本实施例中，铜制板体1的凹槽11为双阶凹槽，其包括一上凹槽111以及一下凹槽112，但本发明并不以此为限。此外，在本实施例中，铜制板体1的周缘还形成有一工作液注入通道12，但在本发明中，工作液注入通道12的设置方式以及位置并不以图面所示为限。First, the main structures of the copper plate body 1 and the aluminum plate body 2 according to the first embodiment of the present invention will be described. Please refer to FIG. 1 to FIG. 4 . The heat dissipation module T provided by the first embodiment of the present invention includes a copper plate body 1 and an aluminum plate body 2 . The copper plate body 1 is processed from a copper sheet. Specifically, the copper sheet can be processed into the copper plate body 1 having the grooves 11 through stamping forming or other metal forming processes. In this embodiment, the groove 11 of the copper plate body 1 is a double-stage groove, which includes an upper groove 111 and a lower groove 112 , but the invention is not limited to this. In addition, in this embodiment, a working fluid injection channel 12 is formed on the periphery of the copper plate body 1 , but in the present invention, the arrangement and position of the working fluid injection channel 12 are not limited to those shown in the drawings.
另一方面，铝制板体2是由加工铝材所形成，此处所称的铝材包括铝、铝合金以及铝镁合金等材料。铝制板体2的第一侧面21形成有多个散热鳍片211，且铝制板体2的第二侧面22形成有至少一凸柱221。On the other hand, the aluminum plate body 2 is formed of processed aluminum materials, and the aluminum materials referred to here include materials such as aluminum, aluminum alloys, and aluminum-magnesium alloys. A plurality of heat dissipation fins 211 are formed on the first side surface 21 of the aluminum plate body 2 , and at least one protruding column 221 is formed on the second side surface 22 of the aluminum plate body 2 .
在本发明的较佳实施例中，是采用冷锻加工的方式在铝制板体2的第一侧面21形成散热鳍片211并于第二侧面22形成凸柱221。锻造散热鳍片211的制程主要是经过精密的风道设计，以求得适当的散热鳍片211排列设计，并于建立对应的模具后，将铝材加热并以高压使铝材充满模穴而形成柱狀散热鳍片211。通过锻造生产散热鳍片211具有材料致密高、能够制作出高细长比的鳍片、可变化形状等优点。此外，采用冷锻的方式制成散热鳍片211除了具有较精密的优点外，散热鳍片211的强度也较热锻来得更好。In a preferred embodiment of the present invention, the cooling fins 211 are formed on the first side surface 21 of the aluminum plate body 2 and the protrusions 221 are formed on the second side surface 22 by cold forging. The process of forging the heat dissipation fins 211 is mainly through precise air duct design to obtain an appropriate arrangement design of the heat dissipation fins 211. After the corresponding mold is established, the aluminum material is heated and the aluminum material is filled with high pressure to fill the mold cavity. Columnar heat dissipation fins 211 are formed. The heat dissipation fins 211 produced by forging have the advantages of high material density, high slenderness ratio fins, and variable shapes. In addition, the cooling fins 211 made by cold forging have the advantages of being more precise, and the strength of the cooling fins 211 is also better than that of hot forging.
在本发明的其他较佳实施例中，也可以通过铝挤型加工而形成位于第一侧面21的多个散热鳍片211，并且通过铣削加工而形成位于第二侧面22的凸柱221。此一实施方式相较于前述实施例，具有生产成本较低的优点。In other preferred embodiments of the present invention, the plurality of cooling fins 211 on the first side surface 21 can also be formed by aluminum extrusion, and the protruding columns 221 on the second side surface 22 can be formed by milling. Compared with the foregoing embodiment, this embodiment has the advantage of lower production cost.
接下来，说明本发明第一实施例的铜制板体1与铝制板体2相互结合的方式，以及两者相互结合后所形成的架构，请配合参阅图1以及图5所示。将本发明第一实施例的铜制板体1与铝制板体2相结合时，铝制板体2的第二侧面22覆盖凹槽11的开口，铝制板体2与铜制板体1之间形成用于容置工作液W的容置空间S。在本实施例中，铝制板体2的凸柱221会抵靠至铜制板体1的凹槽11的内侧面。在本实施例中，由于凹槽11为双阶凹槽，且其包括一上凹槽111以及一下凹槽112，因此，凸柱221会依据所抵靠的位置不同而进行不同的高低设计。Next, the method of combining the copper plate body 1 and the aluminum plate body 2 according to the first embodiment of the present invention, and the structure formed by the combination of the two will be described. Please refer to FIG. 1 and FIG. 5 together. When the copper plate body 1 and the aluminum plate body 2 according to the first embodiment of the present invention are combined, the second side 22 of the aluminum plate body 2 covers the opening of the groove 11 , and the aluminum plate body 2 and the copper plate body A accommodating space S for accommodating the working fluid W is formed between 1 . In this embodiment, the protruding post 221 of the aluminum plate body 2 abuts against the inner side of the groove 11 of the copper plate body 1 . In this embodiment, since the groove 11 is a double-stage groove and includes an upper groove 111 and a lower groove 112 , the protruding posts 221 are designed with different heights according to different positions against which they rest.
在将铜制板体1与铝制板体2结合成一体，且将工作液W从工作液注入通道12(如图3所示)注入容置空间S内，并由工作液注入通道12抽出容置空间S中的气体后，密封工作液注入通道12，以使容置空间S形成完全密封的状态。由于水具有低成本、环保、比热容大、表面张力大、导热系数高以及具备合适的沸点等特性，在本实施例中，采用水作为工作液W，但本发明并不以此为限，也可以采用其他液体作为工作液W。由于在本发明中，铜制板体1以及铝制板体2之间通过凸柱221相互抵靠，因此在将气体从容置空间S中抽出后，铜制板体1不至于因为内外压力差的影响而向内凹陷，具有良好的结构强度。After the copper plate body 1 and the aluminum plate body 2 are integrated into one, and the working fluid W is injected into the accommodating space S from the working fluid injection channel 12 (as shown in FIG. 3 ), and is drawn out from the working fluid injection channel 12 After accommodating the gas in the accommodating space S, the working fluid injection channel 12 is sealed so that the accommodating space S is completely sealed. Since water has the characteristics of low cost, environmental protection, large specific heat capacity, large surface tension, high thermal conductivity and suitable boiling point, in this embodiment, water is used as the working fluid W, but the present invention is not limited to this, and also Other liquids can be used as the working fluid W. In the present invention, the copper plate body 1 and the aluminum plate body 2 abut against each other through the protruding column 221, so after the gas is drawn out from the accommodating space S, the copper plate body 1 will not be affected by the pressure difference between the inside and outside. The influence of the inward depression, has good structural strength.
再接下来，说明本发明第一实施例的细部结构，以及本发明的散热模块T的主要工作方式，请配合参阅图1以及图6所示。在将铜制板体1与铝制板体2结合成一体之前，通过烧结以形成第一毛细覆盖层3于凹槽11的内侧面，此外，通过烧结以形成第二毛细覆盖层4于铝制板体2的第二侧面22。在本实施例中，第一毛细覆盖层3是烧结固定于铜制板体1的第一泡沫金属(porous foam metal)层，第二毛细覆盖层4是烧结固定于铝制板体2的第二泡沫金属层，且在第一泡沫金属层以及第二泡沫金属层中都有添加金属粉体，但本发明并不以此为限。Next, the detailed structure of the first embodiment of the present invention and the main working mode of the heat dissipation module T of the present invention will be described. Please refer to FIG. 1 and FIG. 6 together. Before the copper plate body 1 and the aluminum plate body 2 are integrated into one body, the first capillary coating layer 3 is formed on the inner side of the groove 11 by sintering, and the second capillary coating layer 4 is formed on the aluminum plate by sintering. The second side surface 22 of the plate body 2 . In this embodiment, the first capillary covering layer 3 is a first porous foam metal layer sintered and fixed to the copper plate body 1 , and the second capillary covering layer 4 is a second capillary covering layer 4 that is sintered and fixed to the aluminum plate body 2 . Two metal foam layers, and metal powders are added to the first metal foam layer and the second metal foam layer, but the present invention is not limited to this.
第一泡沫金属层以及第二泡沫金属层可以是泡沫铝、泡沫铜或泡沫镍层。具体应用上，可以采用粉末冶金法或电化学沉积法进行制备。举例来说，可以在铝粉中加入发泡剂(如NH4Cl等)，并将其与铜制板体1及/或铝制板体2进行烧结，在烧结的过程中发泡剂挥发留下孔隙，而造成泡沫结构。或者，通过电化学沉积法在聚氨酯泡沫塑料骨架上复制成泡沫金属，并将所形成的泡沫金属烧结于铜制板体1及/或铝制板体2上。本发明可以采用电化学沉积法制备泡沫金属，并在将所制备的泡沫金属层烧结于铜制板体1及/或铝制板体2的过程中，另外添加金属粉体，以使得前述额外添加的金属粉体在烧结的过程中，能够吸附并固定于凸柱221的表面，进而在凸柱221的表面形成毛细结构，然而，本发明在实际施作上并不以此为限。举例而言，倘若通过前述粉末冶金法直接在铝制板体2上制备第二泡沫金属层，则第二泡沫金属层也会吸附固定于凸柱221的表面，进而使第二泡沫金属层所形成的第二毛细覆盖层4一并覆盖于凸柱221的表面，因此，在此种施作方式之下也可以不必额外添加其他金属粉体。然而，本发明不以上述所举的例子为限。The first metal foam layer and the second metal foam layer may be foamed aluminum, copper or nickel foam layers. In specific applications, powder metallurgy or electrochemical deposition can be used for preparation. For example, a foaming agent (such as NH 4 Cl, etc.) can be added to the aluminum powder, and it is sintered with the copper plate body 1 and/or the aluminum plate body 2, and the foaming agent is volatilized during the sintering process Pores are left behind, creating a foam structure. Alternatively, metal foam is replicated on the skeleton of the polyurethane foam by an electrochemical deposition method, and the formed metal foam is sintered on the copper plate body 1 and/or the aluminum plate body 2 . In the present invention, an electrochemical deposition method can be used to prepare foam metal, and in the process of sintering the prepared metal foam layer on the copper plate body 1 and/or the aluminum plate body 2, metal powder is additionally added, so that the aforementioned additional During the sintering process, the added metal powder can be adsorbed and fixed on the surface of the convex pillars 221 , thereby forming a capillary structure on the surface of the convex pillars 221 . However, the present invention is not limited to this in practice. For example, if the second metal foam layer is directly prepared on the aluminum plate body 2 by the aforementioned powder metallurgy method, the second metal foam layer will also be adsorbed and fixed on the surface of the convex pillars 221, so that the second metal foam layer is The formed second capillary cover layer 4 covers the surfaces of the convex pillars 221 together. Therefore, it is not necessary to add other metal powders in this manner. However, the present invention is not limited to the above-mentioned examples.
在本实施例中，由于铜制板体1于凹槽11的内侧面上覆盖有第一毛细覆盖层3、铝制板体2的第二侧面22上覆盖有第二毛细覆盖层4，且凸柱221的表面具有毛细结构，因此，工作液W可以通过毛细现象以在第一毛细覆盖层3与第二毛细覆盖层4之间流动。In this embodiment, since the copper plate body 1 is covered with the first capillary coating layer 3 on the inner surface of the groove 11 , the second capillary coating layer 4 is covered on the second side surface 22 of the aluminum plate body 2 , and The surface of the convex column 221 has a capillary structure, so the working fluid W can flow between the first capillary coating layer 3 and the second capillary coating layer 4 through capillary phenomenon.
更具体的说，本发明的散热模块T是应用于会产热的电子器件，尤其是中央处理器(Central Processing Unit，简称CPU)、图形处理器(graphics processing unit，简称GPU)或北桥芯片(North Bridge)等电子器件，但不以此为限。实际应用上，散热模块T被设置于前述电子器件上，且以铜制板体1的外表面直接接触前述电子器件的发热部位(热源)。在此一实施例中，铜制板体1上对应于下凹槽112的外表面会直接贴靠在热源上，此时，位在下凹槽112内的工作液W会被热源加热，且由于容置空间S内的气体已经被抽出，相较于在常压下，低压状态下的工作液W可以在更低的温度下汽化并带走大量的热能。举例来说，请参考图6箭号所示的方向，水在常压下的沸点约为摄氏100度左右，但在本发明的容置空间S中，能够在摄氏80度以下的温度条件下汽化为水蒸气，并且迅速充满整个容置空间S。当水蒸气接触到相对较低温的铝制板体2或其上的第二毛细覆盖层4时，水蒸气的热量迅速被铝制板体2带走，此时大量的水蒸气凝结成液态的水，并沿着第二毛细覆盖层4、凸柱221表面以及第一毛细覆盖层3回到下凹槽112内，或至少回到凹槽11内侧表面的第一毛细覆盖层3中。需要特别说明的是，图6所示的第一毛细覆盖层3、第二毛细覆盖层4以及工作液W都只是为了便于说明而示意性的绘制，其尺寸并未根据实际施作所需的比例进行绘制。然而，本发明不以上述所举的例子为限。More specifically, the heat dissipation module T of the present invention is applied to an electronic device that generates heat, especially a central processing unit (Central Processing Unit, referred to as CPU), a graphics processing unit (graphics processing unit, referred to as GPU) or a north bridge chip ( North Bridge) and other electronic devices, but not limited thereto. In practical application, the heat dissipation module T is disposed on the aforementioned electronic device, and the outer surface of the copper plate body 1 directly contacts the heat generating part (heat source) of the aforementioned electronic device. In this embodiment, the outer surface of the copper plate body 1 corresponding to the lower groove 112 will directly abut on the heat source. At this time, the working fluid W located in the lower groove 112 will be heated by the heat source, and due to The gas in the accommodating space S has been extracted, and the working fluid W under the low pressure state can be vaporized at a lower temperature and take away a large amount of heat energy compared with that under normal pressure. For example, please refer to the direction indicated by the arrow in FIG. 6 , the boiling point of water under normal pressure is about 100 degrees Celsius, but in the accommodating space S of the present invention, the temperature can be below 80 degrees Celsius. It is vaporized into water vapor and quickly fills the entire accommodation space S. When the water vapor contacts the relatively low temperature aluminum plate body 2 or the second capillary covering layer 4 on it, the heat of the water vapor is quickly taken away by the aluminum plate body 2, and a large amount of water vapor condenses into a liquid water, and along the second capillary cover layer 4 , the surface of the convex pillars 221 and the first capillary cover layer 3 back into the lower groove 112 , or at least back into the first capillary cover layer 3 on the inner surface of the groove 11 . It should be noted that, the first capillary cover layer 3, the second capillary cover layer 4 and the working fluid W shown in FIG. 6 are only drawn schematically for the convenience of description, and their dimensions are not required for actual operation. Scale to draw. However, the present invention is not limited to the above-mentioned examples.
综合以上，简要整理本发明第一实施例的散热模块T的制作流程：Based on the above, the manufacturing process of the heat dissipation module T according to the first embodiment of the present invention is briefly summarized:
S100：加工铜片以形成具有凹槽11的铜制板体1。S100: The copper sheet is processed to form the copper plate body 1 having the grooves 11.
S102：烧结形成第一毛细覆盖层3于凹槽11的内侧面。S102 : Sintering to form the first capillary cover layer 3 on the inner side of the groove 11 .
S104：加工铝材以形成一侧具有多个散热鳍片211且另一侧具有至少一凸柱221的铝制板体2。S104: Process the aluminum material to form the aluminum plate body 2 having a plurality of heat dissipation fins 211 on one side and at least one protruding post 221 on the other side.
S106：烧结形成第二毛细覆盖层4于铝制板体2的另一侧。S106 : Sintering to form the second capillary coating layer 4 on the other side of the aluminum plate body 2 .
S108：结合铜制板体1与铝制板体2以使凸柱221抵靠至铜制板体1，且使铝制板体2与铜制板体1之间形成容置空间S。S108 : Combine the copper plate body 1 and the aluminum plate body 2 so that the protruding posts 221 abut against the copper plate body 1 , and form an accommodation space S between the aluminum plate body 2 and the copper plate body 1 .
S110：将工作液W注入容置空间S内，并抽出容置空间S中的气体。S110: Inject the working fluid W into the accommodating space S, and extract the gas in the accommodating space S.
S112：将铜制板体1与铝制板体2密封焊接成一体。S112: The copper plate body 1 and the aluminum plate body 2 are sealed and welded into one body.
第二实施例Second Embodiment
如同先前所述，虽然在第一实施例中，凹槽11为双阶凹槽，且其包括一上凹槽111以及一下凹槽112，但本发明并不以此为限。请参阅图7所示，在本发明的第二实施例中，散热模块T’包括铜制板体1’以及铝制板体2’，铜制板体1’凹设有凹槽11’，铝制板体2’的第一侧面21’设置有多个散热鳍片211’，铝制板体2’的第二侧面22’则覆盖凹槽11’的开口。在本实施例中，凹槽11’为单阶凹槽，也因此，位在铝制板体2’的第二侧面22’且抵靠至铜制板体1’的凸柱221’，其高度被设计成一致的高度，以均匀地支撑于铝制板体2’与铜制板体1’之间，并且维持铝制板体2’与铜制板体1’之间的容置空间S’。在本实施例中，工作液W’位在凹槽11’内。As mentioned above, although in the first embodiment, the groove 11 is a double-stage groove and includes an upper groove 111 and a lower groove 112 , the invention is not limited thereto. Referring to FIG. 7, in the second embodiment of the present invention, the heat dissipation module T' includes a copper plate body 1' and an aluminum plate body 2', and the copper plate body 1' is recessed with a groove 11', The first side surface 21' of the aluminum plate body 2' is provided with a plurality of heat dissipation fins 211', and the second side surface 22' of the aluminum plate body 2' covers the opening of the groove 11'. In this embodiment, the groove 11 ′ is a single-stage groove, and therefore, it is located on the second side 22 ′ of the aluminum plate body 2 ′ and abuts against the protruding post 221 ′ of the copper plate body 1 ′. The height is designed to be a uniform height, so as to be evenly supported between the aluminum plate body 2' and the copper plate body 1', and to maintain the accommodating space between the aluminum plate body 2' and the copper plate body 1' S'. In this embodiment, the working fluid W' is located in the groove 11'.
第三实施例Third Embodiment
以下请参阅图8所示之流程图，并搭配参阅图9所示之结构以及组件符号，说明本发明第三实施例的散热模块T”。在本发明的第三实施例中，散热模块T”包括铜制板体1”以及铝制板体2”。铜制板体1”凹设有凹槽11”，铜制板体1”于凹槽11”的内侧面覆盖有第一毛细覆盖层(此图未标示)，且凹槽11”的内侧面凸设有至少一凸柱113”。本实施例中的凹槽11”也是由一上凹槽111”以及一下凹槽112”所形成的双阶凹槽结构，但如同先前所述，本发明并不以此为限。Please refer to the flow chart shown in FIG. 8 , together with the structure and component symbols shown in FIG. 9 , to describe the heat dissipation module T" according to the third embodiment of the present invention. In the third embodiment of the present invention, the heat dissipation module T "includes copper plate body 1" and aluminum plate body 2". The copper plate body 1" is recessed with a groove 11", the inner side of the copper plate body 1" is covered with a first capillary coating layer (not marked in this figure), and the inner side of the groove 11" is covered At least one protruding post 113" is protruded. The groove 11" in this embodiment is also a double-stage groove structure formed by an upper groove 111" and a lower groove 112", but as described above, the present invention is not limited to this.
铝制板体2”的第一侧面21”设置有多个散热鳍片211”，铝制板体2”的第二侧面22”则覆盖凹槽11”的开口。铝制板体2”与铜制板体1”间形成用于容置工作液W”的容置空间S”，且第二侧面22覆盖有第二毛细覆盖层(此图未标示)。其中，铝制板体2”与铜制板体1”结合成一体，凸柱113”抵靠于铝制板体2”的第二侧面22”，且工作液W”通过毛细现象在第一毛细覆盖层与第二毛细覆盖层之间流动。The first side surface 21" of the aluminum plate body 2" is provided with a plurality of heat dissipation fins 211", and the second side surface 22" of the aluminum plate body 2" covers the opening of the groove 11". A accommodating space S" for accommodating the working fluid W" is formed between the aluminum plate body 2" and the copper plate body 1", and the second side surface 22 is covered with a second capillary coating layer (not shown in this figure). The aluminum plate body 2" is integrated with the copper plate body 1", the convex column 113" abuts against the second side surface 22" of the aluminum plate body 2", and the working fluid W" passes through the capillary phenomenon in the first Flow between the capillary cover and the second capillary cover.
相较于第一或第二实施例，第三实施例的主要差异处，在于凸柱113”是形成于铜制板体1”的凹槽11”的内侧面，且抵靠至铝制板体2”。但无论第一、第二或第三实施例都是使铜制板体1”以及铝制板体2”之间通过凸柱113”相互抵靠，此外，也都能够使工作液W”通过毛细现象在第一毛细覆盖层与第二毛细覆盖层之间流动。Compared with the first or second embodiment, the main difference of the third embodiment is that the protruding post 113" is formed on the inner side of the groove 11" of the copper plate body 1" and abuts against the aluminum plate Body 2". However, regardless of the first, second or third embodiments, the copper plate body 1" and the aluminum plate body 2" are abutted against each other through the protruding column 113", and in addition, the working fluid W" can also pass through. Capillarity flows between the first capillary cover and the second capillary cover.
综合以上，简要整理本发明第三实施例的散热模块T”的制作流程：Based on the above, the manufacturing process of the heat dissipation module T" according to the third embodiment of the present invention is briefly summarized:
S200：加工铜片以形成具有凹槽11”且凹槽11”的内侧面具有至少一凸柱113”的铜制板体1”。S200: Process the copper sheet to form a copper plate body 1" having a groove 11" and at least one protruding post 113" on the inner side of the groove 11".
S202：烧结形成第一毛细覆盖层于凹槽11”的内侧面。S202: Sintering to form a first capillary covering layer on the inner side of the groove 11".
S204：加工铝材以形成一侧具有多个散热鳍片211”的铝制板体2”。S204: Process the aluminum material to form an aluminum plate body 2" with a plurality of heat dissipation fins 211" on one side.
S206：烧结形成第二毛细覆盖层于铝制板体2”的另一侧。S206: Sintering to form a second capillary coating layer on the other side of the aluminum plate body 2".
S208：结合铜制板体1”与铝制板体2”以使凸柱113”抵靠至铝制板体2”，且使铝制板体2”与铜制板体1”之间形成容置空间S”。S208: Combine the copper plate body 1" and the aluminum plate body 2" so that the protruding column 113" abuts against the aluminum plate body 2", and forms a space between the aluminum plate body 2" and the copper plate body 1" accommodating space S".
S210：将工作液W”注入容置空间S”内，并抽出容置空间S”中的气体。S210: Inject the working fluid W" into the accommodating space S", and extract the gas in the accommodating space S".
S212：将铜制板体1”与铝制板体2”密封焊接成一体。S212: The copper plate body 1" and the aluminum plate body 2" are sealed and welded into one body.
第四实施例Fourth Embodiment
以下通过本发明第四实施例的散热模块T”’，进一步说明本发明的其他实施方式。请参阅图10至图12所示，图10为本发明第四实施例的立体组合示意图。图11为本发明第四实施例的一立体分解示意图。图12为本发明第四实施例的另一立体分解示意图。，散热模块T”’包括铜制板体1”’以及铝制板体2”’。铜制板体1”’凹设有凹槽11”’，本实施例中的凹槽11”’也是由一上凹槽111”’以及一下凹槽112”’所形成的双阶凹槽结构，但如同先前所述，本发明并不以此为限。Hereinafter, other embodiments of the present invention will be further described through the heat dissipation module T''' according to the fourth embodiment of the present invention. Please refer to Fig. 10 to Fig. 12 , and Fig. 10 is a three-dimensional combined schematic diagram of the fourth embodiment of the present invention. Fig. 11 It is a perspective exploded schematic view of the fourth embodiment of the present invention. Figure 12 is another perspective exploded schematic view of the fourth embodiment of the present invention. The heat dissipation module T"' includes a copper plate body 1"' and an aluminum plate body 2". '. The copper plate body 1"' is recessed with a groove 11"', and the groove 11"' in this embodiment is also a double-stage groove structure formed by an upper groove 111"' and a lower groove 112"' , but as mentioned above, the present invention is not limited thereto.
请参阅图10及图11所示，在本发明第四实施例中，散热模块T”’还包括散热风扇5，且铝制板体2”’在对应于散热鳍片211”’的位置形成有安装部212，散热风扇5能被组装至安装部212，并且提供气流以带走积聚在散热鳍片211”’的热量。在本实施例中，铝制板体2”’的散热鳍片211”’是由冷锻加工的方式形成的，由图11可以看出，由于散热鳍片211”’是由冷锻加工的方式形成，因此散热鳍片211”’的构造可以有较多变化，在散热风扇5运转的过程中，不规则排列的散热鳍片211”’可以对通过其间的气流，造成扰流的效果，借此增进散热效率。10 and FIG. 11, in the fourth embodiment of the present invention, the heat dissipation module T"' further includes a heat dissipation fan 5, and the aluminum plate body 2"' is formed at a position corresponding to the heat dissipation fins 211"' There is a mounting portion 212 to which the cooling fan 5 can be assembled, and an airflow is provided to take away the heat accumulated on the cooling fins 211 ″′. In this embodiment, the heat dissipation fins 211"' of the aluminum plate body 2"' are formed by cold forging. It can be seen from FIG. 11 that the heat dissipation fins 211"' are formed by cold forging. Therefore, the structure of the heat dissipation fins 211"' can be changed more. During the operation of the heat dissipation fan 5, the irregularly arranged heat dissipation fins 211"' can cause disturbance to the airflow passing through them. Thereby, the heat dissipation efficiency is improved.
另请参阅图12所示，在本发明第四实施例中，铝制板体2”’在形成散热鳍片211”’的另一侧形成有凸柱221”’，在本实施例中，凸柱221”’的形状为圆柱状，而非如同其他实施例为长条柱状。此外，如同先前所说，由于本实施例的凹槽11”’也为双阶凹槽，且其包括上凹槽111”’以及下凹槽112”’，因此，本实施例的凸柱221”’也会依据所抵靠的位置不同而进行不同的高低设计。总的来说，本发明并不具体限定凸柱221”’的形状或高低，只要铜制板体1”’以及铝制板体2”’之间能通过凸柱221”’相互抵靠，即符合本发明设置凸柱221”’之精神，而应当被涵盖在发明所欲主张保护的范围之内。Please also refer to FIG. 12, in the fourth embodiment of the present invention, the aluminum plate body 2"' is formed with a convex column 221"' on the other side where the heat dissipation fins 211"' are formed. In this embodiment, The shape of the protruding post 221 ″' is a cylindrical shape, rather than an elongated column shape as in other embodiments. In addition, as mentioned above, since the groove 11 ″' in this embodiment is also a double-stage groove, and it includes an upper groove 111 ″′ and a lower groove 112 ″′, the protruding post 221 in this embodiment "'It will also be designed with different heights depending on the position it is against. In general, the present invention does not specifically limit the shape or height of the protruding post 221"', as long as the copper plate body 1"' and the aluminum plate body 2"' can abut each other through the protruding post 221"', That is, it is in accordance with the spirit of the present invention to provide the protruding post 221 ″', and should be covered within the scope of the claimed protection of the present invention.
实施例的有益效果Beneficial Effects of Embodiments
复请参阅图2至图6所示，本发明所提供的散热模块T及其制作方法，其能通过“铜制板体1以及铝制板体2间通过凸柱221相互抵靠”以及“工作液W通过毛细现象在第一毛细覆盖层3与第二毛细覆盖层4之间流动”的技术方案，不仅有助于散热效率提升，且能够加强整体的结构强度。Please refer to FIG. 2 to FIG. 6 again, the heat dissipation module T provided by the present invention and the manufacturing method thereof can pass “the copper plate body 1 and the aluminum plate body 2 abut each other through the protruding pillars 221” and “ The technical solution that the working fluid W flows between the first capillary cover layer 3 and the second capillary cover layer 4 through capillary phenomenon” not only helps to improve the heat dissipation efficiency, but also enhances the overall structural strength.
更进一步来说，由于本发明的凸柱221抵靠于铜制板体1与铝制板体2之间，有助凝结于第一毛细覆盖层3的工作液W通过凸柱221表面的毛细结构回流至第二毛细覆盖层4，因此能够增进内部工作液W的循环效率；此外，凸柱221抵靠于铜制板体1的凹槽11的内侧面(或如图9的第三实施例，凸柱113”抵靠于铝制板体2”的第二侧面22”)，由于都是内部支撑结构，而无须通过穿设在板体上的开口相互嵌卡，因此能避免气密性不佳的问题。再者，本发明充分运用铜制板体1导热性佳的优点以及铝制板体质轻、坚硬以及散热效率高等优势，全面性地提高散热模块T的工作效率。另一方面，有别于传统使用均温板的产品在铜制均温板与散热鳍片之间还要涂覆散热银膏等材质，经过多次介质转换而导致热传递效率不佳，本发明的铜制板体1与铝制板体2直接相互接触，也可以简化热传递的路径而达成更好的散热效果。Furthermore, since the protruding post 221 of the present invention abuts between the copper plate body 1 and the aluminum plate body 2 , it helps the working fluid W condensed on the first capillary coating layer 3 to pass through the capillary on the surface of the protruding post 221 . The structure is returned to the second capillary cover layer 4, so the circulation efficiency of the internal working fluid W can be improved; in addition, the convex post 221 abuts against the inner side of the groove 11 of the copper plate body 1 (or the third embodiment as shown in FIG. 9 ). For example, the protruding posts 113" abut against the second side surface 22") of the aluminum plate body 2". Since they are all internal support structures, they do not need to be inserted into each other through the openings on the plate body, so they can avoid air tightness. In addition, the present invention makes full use of the advantages of good thermal conductivity of the copper plate body 1 and the advantages of light weight, rigidity and high heat dissipation efficiency of the aluminum plate body to comprehensively improve the working efficiency of the heat dissipation module T. Another On the one hand, different from the traditional products using vapor chambers, a material such as heat dissipation silver paste is also applied between the copper vapor chamber and the heat dissipation fins, which leads to poor heat transfer efficiency after multiple medium conversions. The copper plate body 1 and the aluminum plate body 2 are in direct contact with each other, which can also simplify the heat transfer path and achieve better heat dissipation effect.
以上所公开的内容仅为本发明的优选可行实施例，并非因此局限本发明的权利要求书的保护范围，所以凡是运用本发明说明书及附图内容所做的等效技术变化，均包含于本发明的权利要求书的保护范围内。The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the protection scope of the claims of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and the accompanying drawings of the present invention are included in the present invention. within the scope of protection of the claims of the invention.
Claims (10)
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