CN1921126A - Light sensor package structure - Google Patents

Abstract

The invention discloses a light sensor packaging structure, which comprises a substrate, wherein metal wiring is arranged on the upper surface and the lower surface of the substrate, and a plurality of conductors penetrate through the substrate to electrically connect the metal wiring on the upper surface and the lower surface; at least one optical sensing component and a frame around the optical sensing component are arranged on the substrate, and the conductor can be positioned in the frame area or the area between the optical sensing component and the frame; a transparent cover plate is covered on the frame to form the packaging structure. In addition, the substrate and the frame can be directly replaced by an accommodating substrate with an accommodating space. The invention can effectively improve the reliability of the component and the production qualification rate and quality by the packaging structure.

Description

Light sensor package structure

technical field

The invention relates to a packaging structure of a semiconductor component, in particular to a packaging structure of a light sensor that can improve component reliability and production yield.

Background technique

Please refer to FIG. 1 for the packaging structure of a common CMOS photosensor (CMOS Image sensor). This packaging structure includes a substrate 10 on which metal wiring 12 is formed, which can extend from the side to the lower surface as an external connection point. , a frame (Frame) 16 is adhered to the surface of the substrate 10 by using a first colloidal layer 14, and a photosensitive chip 18 is mounted on the substrate 10 using bonding colloid 28, and the photosensitive chip 18 has a photosensitive Measuring area 20, and then use metal wire 22 to connect the photo-sensing chip 18 and the substrate 10, so that the photo-sensing chip 18 can electrically communicate with the metal wiring 12 of the substrate 10 through the metal wire 22, and finally use a second colloid layer 24 bonding light-transmitting glass 26 on the frame 16 to cover the light-sensing chip 18 . This packaging method is to isolate foreign pollutants, so that the CMOS light-sensing component can truly sense the external environment.

However, the above packaging structure still has many disadvantages. One of the main disadvantages is that the adhesion force between the frame 16 and the substrate 10 is limited due to the existence of the metal wiring 12 during the reliability test, so that external moisture will penetrate from the first colloidal layer 14 into the light sensor. Test component 18, causing quality problems. Secondly, due to the cleaning step in the packaging process, the first colloid layer 14 will have residual glue (Residue Glue) running to the surface of the light sensing chip 18 at this time, resulting in impurities that are not easy to clean, which affects the production yield. . Furthermore, in the known packaging method, the metal wiring 12 on the upper and lower surfaces conducts electricity through the half hole on the edge as the electroplated metal layer. 14 flows down along the half hole, causing colloidal pollution on the packaging structure that is not easy to remove.

In view of this, the present invention aims at the above problems and proposes a light sensor packaging structure to solve the shortcomings of the prior art.

Contents of the invention

The main purpose of the present invention is to provide a light sensor packaging structure, which can avoid impurities such as residual glue that is not easy to clean during the manufacturing process, thereby affecting the product pass rate and quality, so as to effectively improve the process pass rate.

Another object of the present invention is to provide a photosensor packaging structure, which can improve the reliability of the packaging structure (Reliability), so as to avoid water vapor from penetrating into the photosensor from the first colloidal layer during the reliability test. Quality problems caused by testing components.

According to the above-mentioned purpose, the present invention proposes a light sensor packaging structure, which includes a substrate, the upper and lower surfaces of which are provided with metal wiring, and a digital conductor is used to pass through the substrate to electrically connect the metal wiring on the upper and lower surfaces; At least one light-sensing component is installed on the substrate, and is electrically connected with the metal wiring; another frame is formed on the substrate and arranged around the light-sensing component, so that the conductors can be located in the frame area or in the frame and a light-sensing component; and a light-transmitting cover plate covers the frame to seal the light-sensing component.

In addition, the aforesaid substrate and frame can also be an integrally formed accommodating substrate, the metal wirings on the upper and lower surfaces of which are electrically connected by digital conductors, and at least one light sensor is installed in the accommodating space of the accommodating substrate. The test component is electrically connected with the metal wiring, and then a light-transmitting cover plate is sealed on the accommodating substrate.

In the following, a detailed description will be made with specific embodiments in conjunction with the accompanying drawings, so that it will be easier to understand the purpose, technical content, features and effects of the present invention.

Description of drawings

1 is a cross-sectional view of a known photosensor packaging structure;

2 is a cross-sectional view of the optical sensor packaging structure of the present invention;

3 is a cross-sectional view of another embodiment of the photosensor packaging structure of the present invention;

FIG. 4 is a cross-sectional view of yet another embodiment of the photosensor packaging structure of the present invention.

Detailed ways

The present invention proposes a photosensor packaging structure with high reliability to effectively prevent the colloid from polluting the surface of the photosensor component during the manufacturing process, resulting in impurities that are not easy to clean, thereby improving the production pass rate.

The packaging structure of the present invention is shown in Figure 2. This light sensor packaging structure includes a substrate 30, which can be a printed circuit board or a molded substrate. Upper and lower metal wiring (Metallization Trace) are respectively provided on the upper and lower surfaces of the substrate 30. 32, 34, and use a number of conductors 36, usually plated through holes (Plated Through Via), through the substrate 30 to electrically connect the upper metal wiring 32 and the lower metal wiring 34, and a light sensing component 38 using a first colloid Layer 40 is bonded on the substrate 30. The first colloidal layer 40 can be silver glue or adhesive tape. The photosensitive element 38 has a photosensitive region 42. The electrical communication between the photosensitive element 38 and the substrate 30 is made of metal. Line 44 is connected; a frame 46, which can be a molding frame (Molding Frame), is formed on the substrate 30 and is arranged around the light sensing component 38, and finally uses the second colloid layer 48 to seal the light-transmitting cover plate 50 The cover is on the frame 46 to seal the photo-sensing component 38 .

Since the upper and lower metal wirings 32, 34 on the upper and lower surfaces of the package structure substrate 30 are connected by the plated through hole 36, and the plated through hole 36 is in the substrate 30 below the frame 46 area, so that the frame 46 and the substrate 30 can be directly connected. closely together without being affected by the metal wiring 32 .

Wherein, in order to increase the bonding force between the substrate 30 and the frame 46, at least one convex portion (not shown in the figure) can be provided on the substrate 30, and at least one concave portion (not shown in the figure) can be provided on the relative position of the frame 46. , so that the substrate 30 and the frame 46 can be tightly bonded together by the engagement of the convex portion and the concave portion; or at least one concave portion is provided on the substrate 30, and at least one convex portion is provided on the relative position of the frame 46, In this way, the substrate 30 and the frame 46 can also be closely bonded. In addition, a metal layer (not shown) may be further provided between the substrate 30 and the light sensing element 38 to facilitate bonding and increase heat dissipation. Furthermore, the design of the light-transmitting cover plate 50 can be used to filter specific light wavelengths, such as infrared filtering.

In other words, the position of the conductor 36 can also be set at other positions besides the area of the frame 46 . 3, the upper and lower metal wirings 32, 34 are located on the upper and lower surfaces of the substrate 30, respectively, and the upper and lower metal wirings 32, 34 are connected by a conductor 36 plated through holes, and the conductor 36 is located in the area between the frame 46 and the light sensing assembly 38 . After the electrical connection is completed by wire bonding, a protective colloid layer 52 will be coated between the frame 46 and the light sensing component 38, and hardened to seal the pores generated by the conductor 36, so as to isolate moisture from the substrate. The bottom of 30 penetrates into the package through the through hole; the protective colloid layer 52 can be soldermask, UV glue or thermosetting glue. The rest of the structure is the same as that shown in FIG. 2 , so it will not be repeated here.

In the foregoing embodiments, the frame 46 is bonded to the substrate 30 . Of course, the present invention can also use an integrally formed substrate and frame. Please refer to FIG. 4, the photosensor packaging structure includes an integrally formed housing substrate 54, which already includes a frame to form a housing space. This housing substrate 54 is a molded substrate that can be integrally formed. The upper and lower surfaces of the accommodating substrate 54 are provided with upper and lower layer metal wirings 32, 34, and the upper and lower layer metal wirings 32, 34 are electrically connected through the accommodating substrate 54 by a number conductor 36; A photo-sensing component 38 is installed on the accommodation substrate 54 in the accommodation space, and is electrically connected with the metal wiring 32; finally, a light-transmitting cover plate 50 is sealed on the accommodation substrate by the second colloid layer 48 54 on the frame. Of course, the lower layer metal wiring 34 can further extend to the outside of the receiving substrate 54 .

By virtue of the above packaging structure design, impurities such as residual glue that are not easy to clean can be avoided in the manufacturing process, which will affect the product pass rate and quality, so as to effectively improve the process pass rate and quality; the present invention can also improve the reliability of the package structure, In order to avoid quality problems caused by water vapor penetrating from the first colloidal layer into the light-sensing component during the reliability test.

The above-described embodiments are only for illustrating the technical ideas and characteristics of the present invention, and its purpose is to enable those who are familiar with this art to understand the content of the present invention and implement it accordingly. When the patent scope of the present invention cannot be limited with this, That is, all equivalent changes or modifications made according to the spirit disclosed in the present invention should still be covered within the patent scope of the present invention.

Claims (19)

1. A light sensor packaging structure, characterized in that, comprising: A substrate, the upper and lower surfaces of which are provided with metal wiring, and several conductors are used to pass through the substrate to electrically connect the metal wiring on the upper and lower surfaces; at least one light sensing component, the front face of which has a light sensing area, the light sensing component is mounted on the substrate and electrically connected with the metal wiring; a frame formed on the substrate and ringed around the light-sensing element such that the conductors are located in the substrate below the frame or between the frame and the light-sensing element; and A light-transmitting cover is used to cover the frame. 2. The light sensor package structure according to claim 1, wherein the substrate is a printed circuit board or a molded substrate. 3. The light sensor package structure according to claim 2, wherein the frame and the molding substrate are integrally formed. 4. The photosensor package structure according to claim 1, wherein at least one protrusion is provided on the substrate, and at least one recess is provided at a position opposite to the frame, so that the substrate and the frame Tight joint. 5. The light sensor package structure according to claim 1, wherein at least one concave portion is provided on the substrate, and at least one convex portion is provided at a position opposite to the frame, so that the substrate and the frame Tight joint. 6. The light sensor package structure as claimed in claim 1, wherein the conductor is a plated through hole. 7 . The light sensor packaging structure according to claim 1 , further comprising a colloidal layer for bonding the light sensing element on the substrate, and the colloidal layer can be silver glue or adhesive tape. 8. The light sensor package structure as claimed in claim 1, wherein a metal layer is further provided between the substrate and the light sensing element. 9. The optical sensor packaging structure according to claim 1, further comprising a protective colloid layer covering the upper surface or the lower surface of the substrate to seal the pores generated by the conductor, and the protection The colloidal layer can be green paint, UV glue or thermosetting glue. 10 . The light sensor package structure according to claim 1 , wherein the light-transmitting cover plate is further used to filter specific light wavelengths, such as infrared filtering. 11 . 11. An optical sensor packaging structure, characterized in that it comprises: A housing substrate, which includes a frame to form a housing space, metal wiring is arranged on the upper and lower surfaces of the housing substrate, and the upper and lower surfaces are electrically connected by digital conductors passing through the housing substrate metal wiring; At least one photo-sensing component, with a photo-sensing area on its front, the photo-sensing component is installed on the containing substrate in the containing space, and is electrically connected with the metal wiring; and A light-transmitting cover plate is sealed on the frame for accommodating the substrate. 12. The light sensor package structure according to claim 11, wherein the conductor is a plated through hole. 13. The light sensor package structure according to claim 11, wherein the metal wiring can further extend to the outside of the receiving substrate. 14. The light sensor packaging structure according to claim 11, further comprising a colloidal layer, which is used to bond the light sensing component to the receiving substrate, and the colloidal layer can be silver glue or adhesive tape . 15. The light sensor package structure as claimed in claim 11, wherein a metal layer is further provided between the substrate and the light sensing element. 16. The photosensor packaging structure according to claim 11, further comprising a protective colloid layer covering the upper surface or the lower surface of the substrate to seal the pores generated by the conductor, and the protection The colloidal layer can be green paint, UV glue or thermosetting glue. 17. The light sensor package structure as claimed in claim 11, wherein the light-transmitting cover plate is further used to filter specific light wavelengths, such as infrared filtering. 18. A light sensor packaging structure, characterized in that it comprises: A substrate, the upper and lower surfaces of which are provided with metal wiring, and several conductors are used to pass through the substrate to electrically connect the metal wiring on the upper and lower surfaces; at least one light sensing component, the front face of which has a light sensing area, the light sensing component is mounted on the substrate and electrically connected with the metal wiring; A frame is formed on the substrate and is arranged around the light sensing element; a light-transmitting cover plate, which is arranged on the frame; and At least one protective colloid layer is arranged on the surface of the substrate to seal the pores formed by the conductors. 19. The light sensor package structure according to claim 18, wherein the protective colloid layer can be green paint, UV glue or thermosetting glue.

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