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CN1897795A - Method for manufacturing multilayer circuit board with embedded passive components - Google Patents

Method for manufacturing multilayer circuit board with embedded passive components Download PDF

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Publication number
CN1897795A
CN1897795A CN 200510084347 CN200510084347A CN1897795A CN 1897795 A CN1897795 A CN 1897795A CN 200510084347 CN200510084347 CN 200510084347 CN 200510084347 A CN200510084347 A CN 200510084347A CN 1897795 A CN1897795 A CN 1897795A
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conductive foil
circuit board
multilayer circuit
passive components
manufacturing
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Inventor
洪清富
王永辉
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Advanced Semiconductor Engineering Inc
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Advanced Semiconductor Engineering Inc
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Priority to CN 200510084347 priority Critical patent/CN1897795A/en
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Abstract

本发明公开了一种内嵌无源组件的多层电路板的制造方法,其方法包含:提供一导电箔,该导电箔具有至少一对金属凸点;将一无源组件接合于对应的金属凸点;叠合一有机绝缘层于一核心板上;将该导电箔叠合于该有机绝缘层上;以及在该导电箔形成与无源组件连接的电路图案。采用本发明,不需顾虑电阻或电容工艺能力,以及其形成后与原先设计值有差异的问题,而提供使用者应用于不同工艺能力的多层电路板的制造方法,能有效简化其工艺与其制造成本。

Figure 200510084347

The present invention discloses a method for manufacturing a multilayer circuit board with embedded passive components, the method comprising: providing a conductive foil having at least one pair of metal bumps; bonding a passive component to the corresponding metal bumps; laminating an organic insulating layer on a core board; laminating the conductive foil on the organic insulating layer; and forming a circuit pattern connected to the passive component on the conductive foil. By adopting the present invention, there is no need to worry about the process capability of resistors or capacitors, and the problem that the resistors or capacitors are different from the original design values after they are formed, and the method for manufacturing multilayer circuit boards for users with different process capabilities can effectively simplify the process and manufacturing cost.

Figure 200510084347

Description

The manufacture method of the multilayer circuit board of built-in passive assembly
Technical field
The present invention relates to a kind of manufacture method of multilayer circuit board, relate in particular to the manufacture method of a kind of built-in passive assembly in multilayer circuit board.
Background technology
For can be further in limited substrate area, create the bigger space and the multifunctionality of hoisting module, normal utilization is dwindled or built-in passive assembly comes the mode of framework driving component to realize to create more spaces, so just develop the multilayer circuit board that to be embedded with passive block (passive device), above-mentioned passive block for example is resistance, electric capacity, inductance and voltage-controlled crystal oscillator etc.
There are many methods all to make multiple membranaceous passive block in a multilayer circuit board in order to integration, but with the multilayer circuit board technical process, its key aspect is the technological ability of embedded this type of thick film of circuit board or film passive block, after its key aspect refers to that also the film passive block is in being integrated in multilayer circuit board, how to keep its excellent electrical property accuracy, and how will and original design load between difference drop to minimum, for example, TaiWan, China patent " making is embedded with the method for the multilayer circuit board of passive block " bulletin on January 21st, 2003, notification number 518616) mentioned in, referring to figs. 1A to Figure 1B, a multilayer circuit board that is embedded with passive block comprises: a surface has the circuit board 1 of patterned circuit layer 2; One conductive foil 3; One resistive film 5 is deposited on the little rough region that good adhesion is provided than tabular surface of conductive foil 3, and can imposes the sclerosis that suitable heating makes, and wherein little rough region can utilize methods such as photoresistance lithography or polishing to define; One protective layer 7 covers this resistive film 5; And a preimpregnation material 9, in order to place between conductive foil 3 and the circuit board 1.Wherein circuit board 1, conductive foil 3 is superimposed with preimpregnation material 9 by heat-press step.
Right aforesaid way must be considered the technological ability of resistance or electric capacity, for example need the area of careful controlling resistance material printing size, with difference to some extent between the resistance of avoiding printing formation and the original design load, problems such as the electrical accuracy difference that is caused, therefore whole technology can be complicated.
Therefore, developing in the gradually ripe field at this, how to take into account under the situation of electrical accuracy, streamline any further technology so that present technological ability more can cooperate the demand of next-generation, is problem anxious to be solved now.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of manufacture method of multilayer circuit board of built-in passive assembly, provides a kind of especially and can simplify technology, improves the manufacture method of multilayer circuit board of the built-in passive assembly of electrical accuracy.
Another object of the present invention is the manufacture method of multilayer circuit board that a kind of built-in passive assembly is provided, need not worry resistance or electric capacity technological ability, with and form back and original discrepant problem of design load.
Another object of the present invention is the manufacture method of multilayer circuit board that a kind of built-in passive assembly is provided, and this passive block for example is resistor, capacitor or inductor etc.
Therefore, for achieving the above object, the manufacture method of the multilayer circuit board of a kind of built-in passive assembly disclosed in this invention comprises: a conductive foil is provided, and this conductive foil has a first surface and a second surface, and has at least one pair of metal salient point; One passive block is engaged in corresponding metal salient point; A superimposed organic insulator is on a core board; This conductive foil is superimposed on this organic insulator; And this conductive foil of patterning is to form circuit pattern on this conductive foil.
Wherein organic insulator is between conductive foil and core board.
In addition, also can be by in core board, being formed with at least one through hole, to be electrically conducted the conducting wire of core board upper surface conductive foil and lower surface conductive foil mutually.
In addition, the core board with surface circuit also can be electrically connected to the conducting wire on core board surface to form a multilayer circuit board with the circuit patterns with conductive foil by the blind hole that is formed at insulating barrier.
In addition, this multilayer circuit board can have the structure of blind hole and through hole and/or buried via hole simultaneously.
The manufacture method of the multilayer circuit board of a kind of built-in passive assembly of the present invention, need not worry resistance or electric capacity technological ability, with and form back and original discrepant problem of design load, and the manufacture method that provides the user to be applied to the multilayer circuit board of different process ability can effectively be simplified its technology and its manufacturing cost.
Description of drawings
Figure 1A to Figure 1B is an existing manufacturing process profile that is embedded with the multilayer circuit board of passive block;
Fig. 2 A to Fig. 2 D is the manufacturing process profile of a preferred embodiment of the multilayer circuit board of built-in passive assembly of the present invention;
Fig. 3 A and Fig. 3 B show a preferred embodiment of the multilayer circuit board circuit forming surface pattern behind the lamination;
Fig. 4 A to Fig. 4 B shows another preferred embodiment of the multilayer circuit board circuit forming surface pattern behind the lamination; And
Fig. 5 shows a preferred embodiment again of the multilayer circuit board circuit forming surface pattern behind the lamination.
Wherein, Reference numeral:
1: circuit board 2: patterned circuit layer
3: conductive foil 5: resistive film
7: protective layer 9: the preimpregnation material
11: conductive foil 11a: first conductive foil
11b: second conductive foil 13: passive block
15: metal salient point 17a: surface
19: core board 20a: core board upper surface circuit
20b: core board lower surface circuit 21a: first organic insulator
21b: second organic insulator 23: multilayer circuit board
25: through hole 27: metal level
27a: the first conductive foil metal level 27b: the second conductive foil metal level
29a: the first conductive foil circuit pattern 29b: the second conductive foil circuit pattern
31a: upper surface blind hole 31b: lower surface blind hole
Embodiment
Relevant characteristics and implementation of the present invention cooperate graphicly to be described in detail as follows as most preferred embodiment now.
Consult Fig. 2 A to Fig. 2 D, be the manufacturing process profile of a preferred embodiment of the multilayer circuit board of built-in passive assembly of the present invention.
Shown in Fig. 2 A, conductive foil 11 at first is provided, have at least one pair of metal salient point 15 in a surperficial 17a (first surface), in order to engage with a passive block.
Above-mentioned conductive foil 11 with at least one pair of metal salient point 15 can be bought from manufacturer, or utilize for example be the Patternized technique of lithography technology with a conductive foil patterning to form this metal salient point 15 on a surface of conductive foil.
Conductive foil 11 materials are copper, silver, aluminium, palladium or silver-colored palladium, are good with Copper Foil.
Shown in Fig. 2 B, a passive block 13 to be gone up corresponding metal salient point 15 with conductive foil 11 1 surperficial 17a (first surface) engage, its juncture for example utilizes hot pressing.In the process of hot pressing, the accuracy of aligning must good control.
Above-mentioned passive block 13 can be capacitor, resistor or inductor.
Shown in Fig. 2 C, core board 19, first organic insulator and the second organic insulator 21a, 21b are arranged, comprise the first conductive foil 11a of passive block 13, and the second conductive foil 11b that comprises passive block or do not comprise passive block is arranged.
The first organic insulator 21a and the second organic insulator 21b are pressed on the both sides of core board simultaneously, again one first conductive foil 11a and one second conductive foil 11b are pressed on the first organic insulator 21a and the second organic insulator 21b simultaneously.Perhaps, with the first organic insulator 21a, the first conductive foil 11a, second organic insulator reaches the both sides that the second conductive foil 11b places core board 18 respectively, carries out pressing more simultaneously.Certainly, also can a pressing first organic insulator 21a, the first conductive foil 11a is in a side of core board, and other lamina of not pressing of opposite side and conductive foil.
The one side that wherein comprises passive block 13 on conductive foil 11a, the 11b contacts with organic insulator.
Organic insulator 21a, 21b can be preimpregnation material (prepreg) or are coated on the aqueous resin on core board 19 surfaces.
Core board 19 can be had a metallic circuit of double-side patternization or for simple patternless core board, can be double-layer circuit board or multilayer circuit board.Can be made up of insulation organic material or ceramic material, for example by epoxy resin, poly-ethanamide, two maleic acid vinegar imines/three nitrogen trap resins, or its glass is formed from the composite material of fiber.For example can be existing FR-4 substrate.This type FR-4 substrate for example is made up of epoxy resin, glass fabric and electro copper foil.Certainly, core board 19 is not limited to only be made up of single organic material, also can be made up of the different insulative material layer.
And above-mentioned superimposed process is to realize by heat-press step, and in superimposed process, the accuracy of aligning must good control.
Therefore, shown in Fig. 2 D, the multilayer circuit board 23 of demonstration behind superimposed program lamination from top to bottom comprises the first conductive foil 11a, the first organic insulator 21a, core board 19, the second organic insulator 21b, second conductive foil 11b with passive block 13 or the second conductive foil 11b with passive block 13 in regular turn.
Shown in Fig. 3 A and Fig. 3 B, an embodiment of the multilayer circuit board circuit forming surface pattern behind the demonstration lamination.
As shown in Figure 3A, run through the first conductive foil 11a and the second conductive foil 11b, form and at least always to bore a hole 25,, be able to by these through holes 25 to be electrically conducted each other to provide follow-up when on the first conductive foil 11a, the second conductive foil 11b, forming circuit.
Then, form metal level 27 so that the hole conducting, another surface (second surface) of the first conductive foil 11a and second another surface of conductive foil 11b (second surface) forms metal level 27a, 27b respectively so that follow-up formation circuit pattern in hole wall.
Metal level 27 can comprise copper.
Form metal level 27, for example form the method for copper metal layer, can utilize physical vapor deposition (PVD), chemical vapor deposition (CVD), electro-coppering, electroless copper, sputter (sputtering), evaporation (evaporation), electric arc steam deposition (arc vapor deposition), ion beam sputter (ion beamsputtering), the molten deposition (laser ablation deposition) of loosing of laser, electricity slurry to promote methods such as chemical vapour deposition (CVD) (PECVD) or organometallic chemical vapour deposition (CVD) to form.
It is preferable for utilizing the electroless plating mode earlier, utilizes plating mode to form metal level again.
Shown in Fig. 3 B, metal level 27a, the 27b of patterning upper and lower surface and conductive foil 11a, 11b are to form circuit pattern 29a, 29b respectively.
Above-mentioned patterning upper and lower surface metal level 27 can utilize existing technology of electroplating through hole with the method that forms 29a, 29b respectively, for example comprises subraction (subtractive), and subraction for example utilizes the panel method.
Though in Fig. 3 B, be presented at up and down and all form circuit pattern on the conductive foil, in fact still can only on a conductive foil wherein, form circuit pattern.
In addition, if the core board 19 in the multilayer circuit board behind the lamination has the circuit pattern of upper and lower surface, or it wherein a surface has circuit pattern up and down, also can form the external circuit pattern that electrically connects with the core board circuit pattern in superficies in another way, shown in Fig. 4 A to Fig. 4 B, another embodiment of the multilayer circuit board circuit forming surface pattern behind the demonstration lamination.
Shown in Fig. 4 A, the first conductive foil 11a, the first organic insulator 21a, the second conductive foil 11b and the second organic insulator 21b that run through upper and lower surface respectively, form at least one blind hole 31a, 31b to expose the circuit 20 that is covered in the core board 19 under organic insulator 21a, the 21b, and provide follow-up when on conductive foil, forming circuit, be able to by these blind holes 31a, 31b to be electrically conducted the circuit 20 of the core board 19 under organic insulator 21a, the 21b.
Then, form the first metal layer 27a, the second metal level 27b respectively in the upper and lower surface of multilayer circuit board 23, wherein the first metal layer 27a cover this first conductive foil 11a and blind hole 31a inwall in case with core board 19 upper surface circuit 20a hole conductings, the second metal level 27b cover this second conductive foil 11b and lower surface blind hole 31b inwall in case with the lower surface circuit 20b hole conducting of core board 19.
The first metal layer or second metal level can comprise copper.
Form metal level, the method that for example forms copper metal layer can utilize physical vapor deposition (PVD), chemical vapor deposition (CVD), electro-coppering, electroless copper, sputter (sputtering), evaporation (evaporation), electric arc steam deposition (arc vapor deposition), ion beam sputter (ion beam sputtering), the molten deposition (laser ablation deposition) of loosing of laser, electricity slurry to promote methods such as chemical vapour deposition (CVD) (PECVD) or organometallic chemical vapour deposition (CVD) to form.
It is preferable for utilizing the electroless plating mode earlier, utilizes plating mode to form copper metal layer again.
Shown in Fig. 4 B, the patterning the first metal layer 27a and the second metal level 27b and conductive foil 11a, 11b are to form circuit pattern 29a, the 29b that electrically connects with core board 19 upper and lower surface circuit 20a, 20b respectively.
Multilayer circuit board behind above-mentioned this lamination also can comprise the buried via hole 39 (figure does not show its access path) that electrically connects with blind hole.
Though displaing core plate upper and lower surface all has circuit pattern in Fig. 4 B, but in fact core board can only have circuit pattern in a surface wherein, certainly, though in Fig. 4 B, show up and down all to form circuit pattern on the conductive foil, in fact still can be only wherein form circuit pattern on the conductive foil in corresponding core board circuit pattern.
In addition, if the core board 19 in the multilayer circuit board among Fig. 4 A and Fig. 4 B behind the lamination has the circuit pattern of upper and lower surface, or it wherein a surface has circuit pattern up and down, also can outside the technology of above-mentioned through hole, cooperate the technology of Fig. 3 A to Fig. 3 B to form blind hole again, to see through the external circuit pattern that this blind hole and core board circuit pattern electrically connect in the follow-up formation of superficies, as shown in Figure 5, another embodiment of the multilayer circuit board circuit forming surface pattern behind the demonstration lamination.
Comprehensive the above, the manufacture method of the multilayer circuit board of a kind of built-in passive assembly of the present invention, because of having metal salient point on the conductive foil, passive block can directly utilize hot press on metal salient point, so need not consider the printing size issue of passive block, reduced and formed the process complexity of passive block, and then reached simplification technology, and improved the purpose of electrical accuracy.
Therefore, the manufacture method of the multilayer circuit board of a kind of built-in passive assembly of the present invention, need not worry resistance or electric capacity technological ability, with and form back and original discrepant problem of design load, and the manufacture method that provides the user to be applied to the multilayer circuit board of different process ability can effectively be simplified its technology and its manufacturing cost.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.

Claims (10)

1、一种内嵌无源组件的多层电路板的制造方法,其特征在于:包含:1. A method for manufacturing a multilayer circuit board with embedded passive components, characterized in that: comprising: 提供一导电箔,该导电箔具有一第一表面与一第二表面,并具有至少一对金属凸点设于该第一表面;providing a conductive foil, the conductive foil has a first surface and a second surface, and has at least one pair of metal bumps disposed on the first surface; 将一无源组件接合于对应的该金属凸点;bonding a passive component to the corresponding metal bump; 叠合一有机绝缘层于一核心板上;laminating an organic insulating layer on a core board; 将该导电箔叠合于该有机绝缘层上;及laminating the conductive foil on the organic insulating layer; and 图案化该导电箔。The conductive foil is patterned. 2、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:该导电箔为铜箔。2. The method of manufacturing a multilayer circuit board with embedded passive components according to claim 1, wherein the conductive foil is copper foil. 3、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:该无源组件选自由电容器、电感器与电阻器所构成的群组的其中之一。3. The method of manufacturing a multilayer circuit board with embedded passive components according to claim 1, wherein the passive components are selected from the group consisting of capacitors, inductors and resistors. 4、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:该有机绝缘层为一预浸材。4. The method of manufacturing a multilayer circuit board with embedded passive components according to claim 1, wherein the organic insulating layer is a prepreg material. 5、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:该有机绝缘层由环氧树脂组成。5. The method for manufacturing a multilayer circuit board with embedded passive components according to claim 1, wherein the organic insulating layer is made of epoxy resin. 6、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:将该无源组件接合于对应的该金属凸点的步骤利用热压。6. The method of manufacturing a multilayer circuit board with embedded passive components according to claim 1, wherein the step of bonding the passive components to the corresponding metal bumps uses hot pressing. 7、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:将该有机绝缘层叠合于该核心板上的步骤与将该导电箔叠合于该有机绝缘层上的步骤利用热压实现。7. The method of manufacturing a multilayer circuit board with embedded passive components according to claim 1, characterized in that: the step of laminating the organic insulating layer on the core board is the same as laminating the conductive foil on the organic The step on the insulating layer is carried out using hot pressing. 8、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:形成电路图案于该导电箔的该第二表面的步骤中,包含:8. The method for manufacturing a multilayer circuit board with embedded passive components according to claim 1, wherein the step of forming a circuit pattern on the second surface of the conductive foil includes: 贯穿该核心板、该有机绝缘层及该导电箔以形成一贯穿孔;penetrating through the core board, the organic insulating layer and the conductive foil to form a through hole; 形成一金属层于该导电箔的该第二表面与该贯穿孔的内璧;及forming a metal layer on the second surface of the conductive foil and the inner wall of the through hole; and 图案化该金属层。The metal layer is patterned. 9、根据权利要求1所述的内嵌无源组件的多层电路板的制造方法,其特征在于:形成电路图案于该导电箔的该第二表面的步骤中,包含:9. The method for manufacturing a multilayer circuit board with embedded passive components according to claim 1, wherein the step of forming a circuit pattern on the second surface of the conductive foil includes: 贯穿该机绝缘层及该导电箔以形成一盲孔;形成一金属层于该导电箔的该第二表面与该盲孔的内璧;及forming a blind hole through the insulating layer and the conductive foil; forming a metal layer on the second surface of the conductive foil and the inner wall of the blind hole; and 图案化该金属层。The metal layer is patterned. 10、根据权利要求9所述的内嵌无源组件的多层电路板的制造方法,其特征在于:该核心板还包含一埋孔,与该盲孔电性连接。10. The method of manufacturing a multilayer circuit board with embedded passive components according to claim 9, wherein the core board further comprises a buried hole electrically connected to the blind hole.
CN 200510084347 2005-07-15 2005-07-15 Method for manufacturing multilayer circuit board with embedded passive components Pending CN1897795A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104319448A (en) * 2014-10-24 2015-01-28 中国电子科技集团公司第四十一研究所 Multi-layer power distribution network of high-frequency printed boards based on accessory resistive films
CN108811323A (en) * 2014-08-11 2018-11-13 三星电机株式会社 Printed circuit board and manufacturing methods
CN111465187A (en) * 2020-05-19 2020-07-28 青岛零频新材料科技有限公司 Copper-clad plate containing resistance layer, printed circuit board and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108811323A (en) * 2014-08-11 2018-11-13 三星电机株式会社 Printed circuit board and manufacturing methods
US11096286B2 (en) 2014-08-11 2021-08-17 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and manufacturing method thereof
CN108811323B (en) * 2014-08-11 2021-09-21 三星电机株式会社 Printed circuit board and method for manufacturing the same
CN104319448A (en) * 2014-10-24 2015-01-28 中国电子科技集团公司第四十一研究所 Multi-layer power distribution network of high-frequency printed boards based on accessory resistive films
CN111465187A (en) * 2020-05-19 2020-07-28 青岛零频新材料科技有限公司 Copper-clad plate containing resistance layer, printed circuit board and manufacturing method thereof

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