CN1886448A - Production process tape for film-shaped wiring board - Google Patents
Production process tape for film-shaped wiring board Download PDFInfo
- Publication number
- CN1886448A CN1886448A CNA2004800346269A CN200480034626A CN1886448A CN 1886448 A CN1886448 A CN 1886448A CN A2004800346269 A CNA2004800346269 A CN A2004800346269A CN 200480034626 A CN200480034626 A CN 200480034626A CN 1886448 A CN1886448 A CN 1886448A
- Authority
- CN
- China
- Prior art keywords
- resin
- film
- fillers
- thin slice
- production process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
A production process tape for film-shaped wiring board that exhibits high heat resistance, mechanical properties, moldability and dimensional stability and that excels in productivity and workability, realizing low cost. There is provided a production process tape for film-shaped wiring board, which consists of a sheet comprising at least one thermoplastic resin, the thermoplastic resin selected from among a polysulfone resin, a thermoplastic polyimide resin and a polyether aromatic ketone resin, and a plate filler, which sheet exhibits an antiflexing strength (JIS P8155: tension 250 g, flexing rate 175 times/min, and flexing surface 0.38R) of 10 times or more and a linear expansion coefficient of 50 ppm/ DEG C or below.
Description
Technical field
The present invention relates to the production process band that a kind of requirement has the film like circuit board of excellent thermotolerance and physical strength.
Background technology
All the time, the polyethers aromatic resin is as the engineering plastics with excellent thermotolerance, mechanical characteristics etc., and quilt is cognitive widely.In order further to enlarge the purposes of these resins, attempt in the super engineering plastics of polyethers aromatic ketone resinoid and thermoplastically polyimide resin and so on, adding filler, improve their every physicals.For example, also the someone proposes to add various inorganic fibrous fillers and is attempting improving their physical strength and thermotolerance (the clear 63-22854 communique of TOHKEMY).
Example as the required film like circuit board of electronic component (below, abbreviate substrate as) has the substrate that is called FPC (flexible PCB), TAB (coil type engages automatically) and COF (membrane of flip chip) etc.In the production of these film like substrates and operation such as dispatch from the factory, use traction belt (LEAD TAPE) and interval-zone production processes such as (SPACE TAPE) with band.With being with employed material, consider heat resisting temperature, mechanical characteristics and cost etc. in this operation as these production processes, can adopt various metals or resin.
Production with the TAB of one of film like substrate is example, and when becoming the rolling mode of production to carry out processing, the traction belt as the regulation operation can use the finished product of TAB itself or the work in-process of TAB.At this moment, will produce the bad of high price TAB product, and reduce productivity.
In addition, in the TAB production process, also use the Thermocurable polyimide resin thin slice of high price sometimes.When using Thermocurable polyimide resin thin slice, in order to satisfy physical strength, will use thicker thin slice, like this will be unsatisfactory aspect cost.Because be by solvent casting method heat production in next life solidified nature polyimide resin thin slice, so it is low to produce the productivity of thicker thin slice, the production cost height.
Other operations of using in the production process as the film like substrate have the interval-zone that prevents that product from pasting each other mutually with band.Can enumerate metal or thicker Thermocurable polyimide resin thin slices such as SUS as the stable on heating interval-zone of needs.But the equal price height of these thin slices is so production cost strengthens.In addition, because the Heavy Weight of metal interval-zone, productivity reduces.When not being the very strict thermotolerance of special requirement, also can use polyethylene terephthalate thin slice etc.
The operation of using in the production process of film like substrate like this is with being with, need possess thermotolerance and physical strength, but when using its product self as traction belt, will reduce yield rate, perhaps use the thicker Thermocurable polyimide resin thin slice of high price, can cause the problems such as increase of product cost again.
JP Patent Document 1: the spy opens clear 63-22854 communique
Summary of the invention
The present invention is used to address the above problem, and is to provide a kind of productivity with excellent thermotolerance, mechanical characteristics, thin slice and processibility height and film or thin slice resin combination cheaply.In addition, the present invention also provides enough this films of a kind of energy or the production process of the film like substrate of thin slice making with being with.Below, said in this specification sheets " thin slice " comprises film.
The invention provides production process band by laminar film like circuit board, aforementioned thin slice contains plate-like fillers and is selected from least a thermoplastic resin in polysulfone resin, thermoplastically polyimide resin and the polyethers aromatic ketone resinoid, the folding strength of aforementioned thin slice (JIS P 8155: tension force 250g, bending speed: per minute 175 times, folding surface 0.38R) is more than 10 times, and linear expansivity is below 50ppm/ ℃.
In addition, the median size of preferred plate-like fillers is 0.1-20 μ m, and preferred aspect ratio is more than 5.The thermoplastic resin of relative 100 weight parts, the addition of preferred plate-like fillers is the 5-60 weight part.Preferred plate-like fillers is for being selected from silicon, aluminium, at least a in the metal oxide of magnesium etc.
Operation of the present invention with band can by production efficiency high dissolve extrusion process manufacturing.And, when can improve the yield rate problem of the film like pdm substrate that in the past existed, also can avoid because of using the rising of the cost that high price Thermocurable polyimide resin thin slice causes, be proper as industrial film shape substrate production operation with being with.
Embodiment
Do not have special the qualification for employed polysulfone resin among the present invention, but preferably contain the polysulfone resin of the repeating unit shown in any in formula (1)～(8).
[Chemical formula 1]
[Chemical formula 2]
Do not limit for employed thermoplastically polyimide resin among the present invention is special, preferably contain the thermoplastically polyimide resin of the repeating unit shown in formula (9)～(11).The ULTEM materials such as (trade(brand)names) that the production of U.S. GE company is arranged as the material that contains these structures.In addition, give flexibility by the silica gel modification in addition and improved the SILTEM materials such as (trade(brand)names) of the GE company production of folding strength.
[chemical formula 3]
Do not limit for employed thermoplastically polyethers aromatic ketone resinoid among the present invention is special, preferably contain the thermoplastically polyethers aromatic ketone resinoid of the repeating unit shown in formula (12)～(13).Trade mark registration) as the material that contains these structures the PEEK that VICTREX company produces (trade(brand)name: material such as is arranged.
[chemical formula 4]
The thermoplastic resin of relative 100 weight parts of the addition of plate-like fillers of the present invention is the 5-60 weight part, and preferred addition is the 10-40 weight part.If addition is less than above-mentioned scope, then the thermotolerance of resin combination, dimensional stability are just insufficient.In addition, if addition will reduce the shaping processability of resin combination during more than above-mentioned scope.
The preferred median size that is used for plate-like fillers of the present invention is 0.1-20 μ m.Further preferred median size is 0.5-10 μ m, and most preferred median size is 2-8 μ m.
If the median size of plate-like fillers is less than above-mentioned scope, then operation is with the thermotolerance of band, and performances such as dimensional stability are just insufficient.In addition, the flowability in the time of also can worsening resin treatment causes processing difficulties, so not preferred.The median size of plate-like fillers is during greater than above-mentioned scope, and the appearance poor of molding is difficult to obtain surface smoothing, and in addition, the flowability in the time of also can worsening resin treatment causes processing difficulties, so not preferred.
Operation of the present invention has improved the physical strength and the dimensional stability of resin combination by leaps and bounds by plate-like fillers with band.This plate-like fillers particularly the time can suppress the polar expansion of resin inherent, reduce because of the softening dimensional change that causes of resin, so improved physical strength and dimensional stability with band in the operation that is used in the high temperature field.
Be used for plate-like fillers of the present invention substrate resin is had outstanding dispersiveness, can be dispersed in the resin equably, so can give resin combination all impartial good dimensional stabilitys.Resin combination preferred resin of the present invention and plate-like fillers homogeneous blended resin combination.
The aspect ratio that is used for plate-like fillers of the present invention is preferably more than 5.Here, the aspect ratio of plate-like fillers is to represent with the mean thickness of median size/plate-like fillers.If the shape of particle approaches the particle of spheric aspect ratio less than 5, then can not reduce polar expansion fully, so not preferred.In addition, if aspect ratio is more than 100 and shape approaches fibrous particle, then the flowability that dissolves of resin reduces, and produces Zener phenomena on the resin flow direction, strengthen the anisotropy of resin combination, thus the thin slice that can not get having the homogeneous mechanical characteristic.
In addition, do not limit, can use with the metal oxide of silicon, aluminium, magnesium etc. etc. to be the material of main moiety for the material of employed plate-like fillers among the present invention is special.These materials both can be used alone, but also also mix together.
For the resin flake of operation of the present invention with band, only otherwise worsen its effect, then also can be as required and with fiber reinforced materials (glass fibre, carbon fiber, potassium titanate fiber, ceramic fiber, aromatic polyamide fibre, boron fibre etc.), granular or unsetting strengthening material (lime carbonate, clay, talcum, mica, carbon element of graphite, molybdenumdisulphide etc.), improve conductive material (carbon, zinc oxide, titanium oxide etc.), improve thermally-conductive materials (powdery metal oxide compound etc.), prevent oxygenant, thermo-stabilizer, prevent charged dose, UV light absorber, sliding material, parting agent, dyestuff, pigment, other thermoplastic resin is (polyamide-based, polycarbonate-based, polyacetal system, PET system, PBT system, polyphenylene sulfide system, polyarylester system, the fluorine prime system, polyethers nitrile system, polymerizable mesogenic system etc.), heat-curing resin (phenol system, epoxy system, silicon system, polymeric amide-polyimide system etc.).And, also can carry out surface treatment to each compaction material.
(the production process manufacturing of band)
In the present invention, resinous principle is mixed the method for mixing with the interpolation of plate-like fillers does not have specific restriction, can use the various mixing method of mixing.For example, add filler in thermoplastic resin the time, add to respectively dissolve mix in the extrusion machine just passable.In addition, have only the powdered raw material will be in advance to carry out drying in advance with the mixing machine of homogenizer, spherical stirrer, mixer, cylinder (tumbler) etc. after, again with dissolve mixing machine dissolve mix just passable.
The forming method of thin slice can take to be applicable to the manufacturing process as the resin of base material.For example, can use injection molding, dissolve various manufacturing process such as extrusion molding, the shaping of notes type, compression molding, thermal sintering, powder body coating.When using band, can carry out forming slit, concavo-convex to the regulation fabric width by the metal pattern forming process with the thin slice manufacturing process that obtains; The secondary processing of coated surface conductive layer, anti-electrostatic interfere with layer etc.
Operation of the present invention preferably dissolves the extrusion molding material resin with the manufacturing of band, forms thin slice.To its extrusion method, method for drawing out does not have special qualification.Thin slice can be an individual layer, can be multilayered structure also, and there is no particular limitation.
For example, when making the thin slice of the multilayered structure of forming by thermoplastic resin layer and Thermocurable polyimide resin layer, can make after the thermoplastic resin layer the stacked again Thermocurable polyimide resin layer of usefulness solvent application mode with dissolving extrusion molding.In addition, also can with laminating Thermocurable polyimide resin thin slice laminating layer be laminated on the thermoplastic resin layer dissolving when extruding the thermoplastic resin layer.There is no particular limitation to the stacked number of this moment and laminating, can implement by thermosol the laminating etc. of lamination and joint compound.And, in the present invention, also can make up the thermoplastic resin layer and form multilayered structure.
Production process of the present invention must have thermotolerance with band.Particularly in the heating process of drying process and roasting procedure etc., for example, when using as spacing piece, the difference of the hot dimensional change of film like substrate and interval-zone is as far as possible for a short time to be preferred.If the value of linear expansivity separately differs too big, then in heating process, the film like substrate will contact with interval-zone with the film like substrate production, does not just have the effect of spacing piece.General film like substrate is made of thermofixation polyimide and Copper Foil, and the linear expansivity of thermofixation polyimide and Copper Foil is 20-30ppm/ ℃.Therefore, wish that operation of the present invention is below 50ppm/ ℃ with the linear expansivity of band.Preferred linear expansivity is below 45ppm/ ℃, and further preferred again linear expansivity is below 40ppm/ ℃, and most preferably linear expansivity is below 35ppm/ ℃.But suitable rerum natura scope is relevant with the relative value between the film like substrate that uses with band with production process, and generally linear expansivity is below 50ppm/ ℃ the time, and the actual use of most of occasions is all no problem.On the other hand, the linear expansivity of thin slice of the present invention is during greater than 50ppm/ ℃, in heating process, owing to differ too big with the dimensional change of film like substrate, can the generation problem in operation.
Operation of the present invention is more than 10 times with the preferred folding strength of band.The film like substrate carries out web-like and adds man-hour, and operation also will be web-like processing with traction belt and interval-zone.In the situation of folding strength less than 10 times, in order to be processed as web-like, in the streamline carrying that becomes rolling processing, just fracture easily, the problem that also has during use takes place.The value of folding strength (inferior) is the bigger the better.Preferred folding strength is more than 10 times, and preferred especially folding strength is more than 15 times, and being more preferably folding strength is more than 20 times.
Embodiment
By the following examples, comparative example further describes the present invention, but the present invention has more than and is limited to these for example.Embodiment, the employed starting material of comparative example are as follows.
* 1. polysulfone resins
Solvay Advanced Polymers makes UDEL P-1700NT (trade(brand)name)
* 2. thermoplastically polyimide resins
GE system ULTEM CRS5001-1000
* 3. polyethers aromatic ketone resins
VICTREX makes PEEK450G (trade(brand)name)
* 4. glass fibre (fibrous)
Asahi Glass system RES-TP29 aspect ratio: more than 100
* 5. aluminium oxide particles (particle shape)
Admatechs system AO-502 aspect ratio: 1
* 6. tabular talcums (tabular)
Japan talcum system MS-1 aspect ratio: 17, median size: 13 μ m
* 7. tabular talcums (tabular)
Japan talcum system L-1 aspect ratio: 25, median size: 5 μ m
In the ratio of allotment shown in table 1 and the table 2, various materials are supplied to the twin shaft forcing machine that mixes, dissolve mix after, make particle.The numerical value of each embodiment in the table and the combined amount of comparative example is weight part.With single shaft forcing machine and T pattern etc. produced particle is dissolved and to extrude processing, obtain laminar sample.In addition, comparative example 5 obtains laminar sample by hot pressing processing.
Estimate as follows.
(1) folding strength: carry out folding strength with the thick laminar sample of 0.2mm and measure (being foundation with JISP8155)
(2) linear expansivity: with the linear expansivity (is foundation with JISK7196) of thermo-mechanical analysis determination test machine working sample
(3) thermotolerance: judge softening dimensional change: heat at 200 ℃, to the variation of sample shape before and after heating, do not change be labeled as zero, distortion is less is labeled as △, be out of shape be labeled as *.
(4) plasticity: carry out stranded processing (strand) and wafer processes shaping with twin shaft muller and single shaft muller, to resulting sample, its outward appearance of visual valuation.Outward appearance is good is labeled as zero, do not obtain being labeled as of stable molding *.
(5) under TAB production process condition, problem not taking place, uses good to be labeled as zero, owing to the bending of dimensional change, thin slice, wrinkling take place being labeled as of problem *.Being labeled as of in application, fractureing owing to the thin slice fragility * *.
[table 1]
[table 2]
Utilize possibility on the industry
According to the present invention, can obtain having excellent heat resistance, mechanical property, forming, dimensionally stable The property, operability and cheaply the film-form substrate production process with the band.
Claims (4)
1. the production process of a film like circuit board is with being with, this band is made of thin slice, this thin slice contains plate-like fillers and is selected from least a thermoplastic resin in polysulfone resin, thermoplastically polyimide resin and the polyethers aromatic ketone resin, the folding strength of this thin slice (JIS P 8155: tension force 250g, bending speed: per minute 175 times, folding surface 0.38R) is more than 10 times, and linear expansivity is below 50ppm/ ℃.
2. band as claimed in claim 1, the median size of plate-like fillers are 0.1～20 μ m.
3. band as claimed in claim 1, the aspect ratio of plate-like fillers are more than 5.
4. band as claimed in claim 1, with respect to the thermoplastic resin of 100 weight parts, the addition of plate-like fillers is the 5-60 weight part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP407330/2003 | 2003-12-05 | ||
| JP2003407330 | 2003-12-05 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102134486A Division CN101358035A (en) | 2003-12-05 | 2004-11-17 | Production process tape for film-shaped wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1886448A true CN1886448A (en) | 2006-12-27 |
Family
ID=34650306
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004800346269A Pending CN1886448A (en) | 2003-12-05 | 2004-11-17 | Production process tape for film-shaped wiring board |
| CNA2008102134486A Pending CN101358035A (en) | 2003-12-05 | 2004-11-17 | Production process tape for film-shaped wiring board |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102134486A Pending CN101358035A (en) | 2003-12-05 | 2004-11-17 | Production process tape for film-shaped wiring board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2005054345A1 (en) |
| KR (1) | KR101146967B1 (en) |
| CN (2) | CN1886448A (en) |
| TW (1) | TW200518932A (en) |
| WO (1) | WO2005054345A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102149542B (en) * | 2008-09-08 | 2014-07-23 | 新日铁住金化学株式会社 | Highly heat conductive polyimide film, highly heat conductive metal-clad laminate and method for producing same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009144058A (en) * | 2007-12-14 | 2009-07-02 | Toyobo Co Ltd | Automobile outer panel member |
| JP6413613B2 (en) * | 2014-10-21 | 2018-10-31 | 三菱ケミカル株式会社 | the film |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0734446B2 (en) * | 1986-08-19 | 1995-04-12 | 住友ベ−クライト株式会社 | Film carrier tape |
| JPS6454792A (en) * | 1987-08-26 | 1989-03-02 | Sumitomo Bakelite Co | Film carrier tape |
| JP2839704B2 (en) * | 1990-11-27 | 1998-12-16 | 住友ベークライト株式会社 | Space tape for TAB |
| US20030181560A1 (en) * | 2000-08-29 | 2003-09-25 | Akiyoshi Kawaguchi | Resin composition, molded object thereof, and use thereof |
| JP3955188B2 (en) * | 2001-05-21 | 2007-08-08 | 三菱樹脂株式会社 | Heat-resistant film for substrate and printed wiring board using the same |
| JP2003128931A (en) * | 2001-10-23 | 2003-05-08 | Otsuka Chem Co Ltd | Resin composition and molded material |
| JP4220794B2 (en) * | 2002-02-01 | 2009-02-04 | 積水化学工業株式会社 | Insulating substrate material, printed circuit board, laminate, copper foil with resin, copper clad laminate, polyimide film, TAB film and prepreg |
| DE60336980D1 (en) * | 2002-02-06 | 2011-06-16 | Sekisui Chemical Co Ltd | Resin composition |
| JP2003282648A (en) * | 2002-03-26 | 2003-10-03 | Sumitomo Bakelite Co Ltd | Structure body sheet and space tape for tab |
| JP4599793B2 (en) * | 2002-11-22 | 2010-12-15 | 住友ベークライト株式会社 | Space tape for TAB production process |
| JP4849762B2 (en) * | 2002-12-02 | 2012-01-11 | 住友ベークライト株式会社 | Aromatic resin composition, heat-resistant sheet, and flexible circuit board reinforcing sheet |
| JP4271962B2 (en) * | 2003-02-21 | 2009-06-03 | 三菱樹脂株式会社 | Chip carrier spacer base film |
| JP2004349366A (en) * | 2003-05-21 | 2004-12-09 | Mitsubishi Plastics Ind Ltd | Multilayer wiring board and its manufacturing method |
-
2004
- 2004-11-17 CN CNA2004800346269A patent/CN1886448A/en active Pending
- 2004-11-17 KR KR1020067013497A patent/KR101146967B1/en not_active IP Right Cessation
- 2004-11-17 JP JP2005515897A patent/JPWO2005054345A1/en active Pending
- 2004-11-17 WO PCT/JP2004/017046 patent/WO2005054345A1/en not_active Application Discontinuation
- 2004-11-17 CN CNA2008102134486A patent/CN101358035A/en active Pending
- 2004-11-23 TW TW093136044A patent/TW200518932A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102149542B (en) * | 2008-09-08 | 2014-07-23 | 新日铁住金化学株式会社 | Highly heat conductive polyimide film, highly heat conductive metal-clad laminate and method for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101358035A (en) | 2009-02-04 |
| TW200518932A (en) | 2005-06-16 |
| KR20060126683A (en) | 2006-12-08 |
| WO2005054345A1 (en) | 2005-06-16 |
| JPWO2005054345A1 (en) | 2007-06-28 |
| KR101146967B1 (en) | 2012-05-22 |
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