CN1885164A - Photoresist coating method and photoresist coating equipment - Google Patents

Abstract

The invention discloses a photoresist coating device, comprising a photoresist coating device, a cleaning device and a platform. A substrate is placed on the platform. When coating the photoresist, the cleaning device first removes particles on the surface of the substrate, and then the photoresist coating device evenly sprays the photoresist on the surface of the substrate.

Description

Photoresist coating method and photoresist coating equipment

technical field

The invention relates to a photoresist coating device and method, in particular to a photoresist coating device and method capable of controlling the number of particles.

Background technique

At present, the photoresist coating equipment generally used in the production process of large-size liquid crystal panels, as shown in FIG. Spray coating on the surface of the substrate 1 . Referring to FIG. 1 b , the photoresist coating device 10 includes a spray head 11 with a slit 12 in the center of the spray head 11 , and the photoresist (agent) 2 is sprayed out from between the slits 12 . This type of design has been seen in photoresist coating equipment provided by companies such as Tokyo Ohka Kogyo (TOK).

During the photoresist coating process, the particles carried by the substrate and the transmission equipment, as well as the particles produced by the photoresist coating equipment itself, will gradually accumulate in the photoresist coating equipment over time, and may contaminate the substrate. Reduce the quality of the product.

Contents of the invention

In order to solve the above-mentioned problems in the prior art, the present invention provides a photoresist coating device, which includes a photoresist coating device, a cleaning device and a platform. The substrate is placed on the platform. When coating the photoresist, the cleaning device first removes particles on the surface of the substrate, and then, the photoresist coating device uniformly sprays the photoresist on the surface of the substrate.

The invention can pre-clean the substrate before coating the photoresist, thereby reducing particles on the surface of the substrate and improving product quality. In addition, the present invention simultaneously cleans the platform for placing the substrate to further remove particles in the photoresist coating equipment, so the number of particles in the photoresist coating equipment can be effectively controlled.

Description of drawings

Figure 1a is a schematic diagram showing a prior art photoresist coating equipment;

Figure 1b is a schematic diagram showing the detailed structure of a photoresist coating device;

2 is a schematic diagram showing a photoresist coating device of the present invention;

Fig. 3 a is the A-A direction sectional view showing the cleaning device in Fig. 2;

Figure 3b is a bottom view showing the cleaning device;

Figure 3c is a schematic diagram showing the cleaning situation of the cleaning device;

Figure 3d is a schematic diagram showing a modified example of the cleaning device of the present invention;

Figure 3e is a schematic diagram showing the cleaning situation of the cleaning device in Figure 3d; and

4a, 4b, 4c and 4d are schematic diagrams showing the cleaning steps of the present invention.

Symbol Description

1～substrate 2～photoresist

3～Particles 10～Photoresist coating device

11～nozzle head 12～slit

20～cleaning device 21, 21’～suction unit

22, 22'～blowing unit 23～suction port

24～Blowing port 30～Platform

40～Machining process cavity 100～Photoresist coating equipment

Detailed ways

Referring to FIG. 2 , it shows a photoresist coating device 100 of the present invention, including a photoresist coating device 10 , a cleaning device 20 , a platform 30 and a process chamber 40 . The photoresist coating device 10 , the cleaning device 20 and the platform 30 are all disposed in the manufacturing process chamber 40 . The substrate 1 is placed on the platform 30 . When coating the photoresist 2 , the cleaning device 20 first removes the particles on the surface of the substrate 1 , and then the photoresist coating device 10 sprays the photoresist 2 evenly on the surface of the substrate 1 .

Referring to FIG. 3a, it shows a cross-sectional view of the cleaning device 20 in FIG. 2 along the direction A-A. The cleaning device 20 includes an air suction unit (suction chamber) 21 and two blowing units (air blowing chambers) 22 , and the air blowing units 22 are located on both sides of the air suction unit 21 . The air suction unit 21 has an air suction port 23 , and the air blow unit 22 has an air blow port 24 . Referring to FIG. 3 b , which shows a bottom view of the cleaning device 20 , the air suction port 23 and the air blow port 24 are elongated slits with a width of about 1-2 mm. Referring to Fig. 3c, the blowing unit 22 is connected with a blowing pipeline (not shown), when cleaning, the blowing unit 22 blows a gas (air) toward the substrate 1 from both sides of the suction unit 21, so that the substrate 1 The particles 3 on the surface are detached from the substrate 1 , and at the same time, the suction unit 21 sucks the particles 3 into the suction unit 21 by vacuum suction. The suction unit 21 is connected to a vacuum pipeline (not shown). After the particles 3 enter the suction unit 21 , they can be discharged from the photoresist coating device 100 through the vacuum pipeline. The blowing pressure of the blowing unit 22 is about 12-14 kPa. The suction pressure of the suction unit 21 is about -12 to -14 kPa. When the cleaning device 20 works, the suction pressure of the suction unit 21 may be slightly greater than the blowing pressure of the blowing unit 22 .

Referring to Fig. 3d, it shows a modified example of the cleaning device of the present invention, which is characterized in that the air suction unit 21' is located on both sides of the air blowing unit 22'. Referring to Fig. 3 e, the blowing unit 22' is connected with a blowing pipeline (not shown), and when cleaning, the blowing unit 22' blows a gas (air) towards the substrate 1, so that the particles 3 on the surface of the substrate 1 are separated from the substrate 1. The substrate 1 and at the same time, the suction unit 21 ′ is located on both sides of the blowing unit 22 ′, and the particles 3 are sucked into the suction unit 21 ′ by vacuum suction. The suction unit 21' is connected to a vacuum pipeline (not shown), and the particles 3 can be discharged from the photoresist coating device 100 through the vacuum pipeline after entering the suction unit 21'.

Although in the embodiment of the present invention, both the air suction unit and the air blowing unit are cavity structures, the air suction port and the air blow port are both elongated slits. However, it does not limit the embodiment of the present invention, the air suction unit and the air blowing unit may also be in a pipeline structure, and the air suction port and the air blowing port may also be in a hole structure. Or simply use the air suction unit to remove the particles, and omit the air blowing unit.

The operation of the photoresist coating equipment 100 of the present invention will be described below. Referring to FIG. 4a, firstly, in the manufacturing process chamber 40, the photoresist coating device 10 is at a first position, and the cleaning device 20 is at a second position. Next, as shown in FIG. 4 b , the cleaning device 20 moves from the second position to the first position along a second direction −x, and removes particles on the platform 30 at the same time. Referring to FIG. 4 c , after the cleaning device 20 has cleaned the platform 30 and is located at the first position, the substrate 1 is transported and placed on the platform 30 . Then, as shown in FIG. 4d, the photoresist coating device 10 and the cleaning device 20 move toward the first direction x simultaneously from the first position to the second position. At this time, the cleaning device 20 is located at the In front of the photoresist coating device 10 , the cleaning device 20 removes particles on the substrate 1 in advance, and the photoresist coating device 10 then sprays the photoresist 2 on the substrate 1 . After the photoresist coating is completed, the substrate is removed, the cleaning device 20 stays at the second position, and the photoresist coating device 10 returns to the first position from the second position along the second direction-x , and restore the state of Figure 4a.

The invention can pre-clean the substrate before coating the photoresist, thereby reducing particles on the surface of the substrate and improving product quality. In addition, the present invention simultaneously cleans the platform for placing the substrate to further remove particles in the photoresist coating equipment, so the number of particles in the photoresist coating equipment can be effectively controlled.

Although the present invention has been disclosed above with specific preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can still make many changes and modifications without departing from the spirit and scope of the present invention. Therefore The scope of protection of the present invention shall be determined by the appended claims.

Claims (17)

1. A photoresist coating device for coating a photoresist on a substrate, comprising: a platform for placing the substrate; a cleaning device that moves over the platform to remove the plurality of particles with vacuum suction; and The photoresist coating device sprays the photoresist on the substrate. 2. The photoresist coating apparatus according to claim 1, wherein the cleaning device cleans the plurality of particles on the surface of the substrate in a scanning manner. 3. The photoresist coating apparatus according to claim 1, wherein the photoresist coating device uniformly sprays the photoresist on the substrate in a scanning manner. 4. The photoresist coating apparatus according to claim 1, wherein the cleaning device comprises an air blowing unit and an air suction unit, and the air blowing unit blows a gas toward the substrate to detach the plurality of particles For the substrate, the suction unit removes the plurality of particles on the surface of the substrate by vacuum suction. 5. The photoresist coating device according to claim 4, wherein the air blowing unit comprises an air blowing port, and the air blowing port is a slit. 6. The photoresist coating device according to claim 5, wherein the air blowing port has a width of about 1-2 mm. 7. The photoresist coating apparatus according to claim 4, wherein the suction unit comprises a suction port, and the suction port is a slit. 8. The photoresist coating device as claimed in claim 7, wherein the suction port has a width of about 1-2 mm. 9. The photoresist coating apparatus according to claim 4, wherein the air blowing pressure of the air blowing unit is about 12-14 kPa. 10. The photoresist coating apparatus according to claim 4, wherein the suction pressure of the suction unit is about -12˜-14 kPa. 11. The photoresist coating equipment according to claim 1, wherein the cleaning device comprises two air blowing units and an air suction unit, the air blowing units are located on both sides of the air suction unit, and the air blowing units The unit blows a gas toward the substrate to make the plurality of particles detach from the substrate, and the suction unit removes the particles on the surface of the substrate by vacuum suction. 12. The photoresist coating equipment according to claim 1, wherein the cleaning device comprises an air blowing unit and two air suction units, the air suction units are located on both sides of the air blowing unit, and the air blowing unit faces A gas is blown out from the substrate to make the plurality of particles detach from the substrate, and the suction unit removes the plurality of particles from the surface of the substrate by vacuum suction. 13. The photoresist coating apparatus according to claim 1, further comprising a process chamber, wherein the platform, the cleaning device and the photoresist coating device are all disposed in the process chamber. 14. A photoresist coating method, comprising: (a) providing the photoresist coating equipment as claimed in claim 1; (b) placing the substrate on the platform; and (c) simultaneously move the cleaning device and the photoresist coating device from a first position to a second position in a first direction, at this time, the cleaning device is located in front of the photoresist coating device, the cleaning device The particles on the substrate are removed in advance, and the photoresist coating device then sprays the photoresist on the substrate. 15. The photoresist coating method according to claim 14, wherein, between step (a) and step (b), further comprising the step (d) of removing the plurality of particles on the platform with the cleaning device ). 16. The photoresist coating method according to claim 14, wherein, in the step (d), the cleaning device moves from the second position to the first position along a second direction, and simultaneously cleans the The plurality of particles on the platform. 17. The photoresist coating method according to claim 16, further comprising moving the photoresist coating device from the second position to the first position along the second direction after the step (c). Step (e) of the location.

Images