[go: up one dir, main page]

CN1719673A - A Vertical External-Cavity Surface-Emitting Semiconductor Laser with Convex-Concave Mirrors - Google Patents

A Vertical External-Cavity Surface-Emitting Semiconductor Laser with Convex-Concave Mirrors Download PDF

Info

Publication number
CN1719673A
CN1719673A CN 200510016967 CN200510016967A CN1719673A CN 1719673 A CN1719673 A CN 1719673A CN 200510016967 CN200510016967 CN 200510016967 CN 200510016967 A CN200510016967 A CN 200510016967A CN 1719673 A CN1719673 A CN 1719673A
Authority
CN
China
Prior art keywords
heat sink
convex
light
semiconductor laser
concave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 200510016967
Other languages
Chinese (zh)
Other versions
CN100384039C (en
Inventor
晏长岭
秦丽
何春凤
单肖楠
路国光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changchun Institute of Optics Fine Mechanics and Physics of CAS
Original Assignee
Changchun Institute of Optics Fine Mechanics and Physics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changchun Institute of Optics Fine Mechanics and Physics of CAS filed Critical Changchun Institute of Optics Fine Mechanics and Physics of CAS
Priority to CNB200510016967XA priority Critical patent/CN100384039C/en
Publication of CN1719673A publication Critical patent/CN1719673A/en
Application granted granted Critical
Publication of CN100384039C publication Critical patent/CN100384039C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Semiconductor Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

本发明涉及垂直外腔面发射半导体激光器的结构设计,包括:泵浦光源1、凸凹反射镜2、反射介质膜3、增透膜4、窗口层5、光吸收层6、有源增益区7、布拉格反射镜8、焊料9、散热片10、热沉11、导热胶12、微通道散热片13、非线性晶体14。通过外凸凹反射镜的凸面会聚作用减小光散射,增大光反馈,进而降低器件的激射阈值,达到提高器件输出效率和输出功率的目的。与此同时采用微通道散热技术解决器件散热问题来提高输出功率。本发明采用凸凹反射镜为外腔镜,使输出光近似为平行光,发光区为均匀的圆形,从而获得圆对称光束质量,利于光束耦合。本发明可以应用于III-V族半导体材料体系,还可以应用于II-VI族半导体材料体系。

Figure 200510016967

The present invention relates to the structural design of a vertical external cavity surface-emitting semiconductor laser, including: a pumping light source 1, a convex-concave mirror 2, a reflective dielectric film 3, an anti-reflection film 4, a window layer 5, an optical absorption layer 6, and an active gain region 7 , Bragg reflector 8, solder 9, heat sink 10, heat sink 11, thermal conductive glue 12, microchannel heat sink 13, nonlinear crystal 14. Through the converging effect of the convex surface of the outer convex-concave mirror, the light scattering is reduced, the light feedback is increased, and then the lasing threshold of the device is reduced, so as to achieve the purpose of improving the output efficiency and output power of the device. At the same time, the micro-channel heat dissipation technology is used to solve the heat dissipation problem of the device to increase the output power. The present invention adopts the concave-convex reflector as the external cavity mirror, so that the output light is approximately parallel light, and the light-emitting area is uniformly circular, thereby obtaining circularly symmetrical beam quality and facilitating beam coupling. The invention can be applied to the III-V group semiconductor material system, and can also be applied to the II-VI group semiconductor material system.

Figure 200510016967

Description

A kind of emission semiconductor laser of vertical external chamber surface with convexo-concave mirror
Technical field:
The invention belongs to field of semiconductor lasers, relate to the structural design of emission semiconductor laser of vertical external chamber surface.
Background technology:
Vertical-cavity-face emitting semiconductor laser is one of most active research topic of current optoelectronic areas, compare with edge-emission semiconductor laser, vertical cavity surface emitting laser spare has less far-field divergence angle, circular light spot, be easy to single longitudinal mode swashs and penetrates, and be easy to advantages such as two-dimentional light is integrated, therefore have a wide range of applications at aspects such as optical communication, light interconnection and light are integrated, caused people's very big interest.Emission semiconductor laser of vertical external chamber surface then is the emerging representative of vertical-cavity-face emitting semiconductor laser, is with a wide range of applications in fields such as laser display, laser communication, materials processing, medical treatment and defence engineerings with its Output optical power height, good beam quality and the characteristics that are easy to two-dimensional array.Particularly it is easy to the intracavity frequency doubling aspect, in fields such as laser pumping, nonlinear crystal frequencys multiplication very large research and development prospect is arranged.The vertical external cavity emitting laser structure mainly comprises: exocoel speculum, periodically Multiple Quantum Well active gain district, semiconductor-distribution Bragg reflector, diamond heat sink and heat sink etc.Device can inject under excitation and the optical pumping excitation dual mode at electric current works.Exocoel mirror structure in the existing emission semiconductor laser of vertical external chamber surface structure is a plano-concave lens, and, realize the anti-reflection deielectric-coating of the wavelength after the frequency multiplication when perhaps evaporation is realized high the reflection to operation wavelength at the deielectric-coating of concave side evaporation to the high reflection of operation wavelength realization.The advantage of this exocoel speculum is that processing is easy, cheap.But, the light of advancing there is scattering process in formed optical resonator, so, certainly will increases the lasing threshold of device, reduce the efficient and the power output of device owing to adopted this plano-concave speculum.Therefore need a kind of better exocoel speculum, as the exocoel speculum in the high-power vertical external cavity face emitting semiconductor laser.Meanwhile, the heat radiation of high-power semiconductor laser is the key that influences device performance always, and the same problem of heat radiation that exists needs well to solve in emission semiconductor laser of vertical external chamber surface.
Summary of the invention:
Emission semiconductor laser of vertical external chamber surface structure China and foreign countries cavity reflection mirror adopts plano-concave lens in the background technology, this exocoel speculum has scattering process to the light of advancing, certainly will increase the lasing threshold of device, reduce the efficient and the power output of device, meanwhile, the heat radiation of high-power semiconductor laser is the key that influences device performance always.In order to solve the above problems, the objective of the invention is to reduce the lasing threshold of device, meanwhile improve the heat radiation of device, further improve Output optical power and the stability of device work and the life-span of device of device, the present invention will provide a kind of device architecture of the emission semiconductor laser of vertical external chamber surface with convexo-concave mirror for this reason.
To achieve these goals, a kind of emission semiconductor laser of vertical external chamber surface with convexo-concave mirror of the present invention comprises: pump light source, convexo-concave mirror, the reflecting medium film, anti-reflection film, Window layer, light absorbing zone, the active gain district, Bragg mirror, scolder, fin, heat sink, heat-conducting glue, the microchannel fin, fixedly connected with Bragg mirror with light absorbing zone respectively in the two sides in active gain district, scolder is fixedlyed connected Bragg mirror with fin, scolder is fixedlyed connected fin with heat sink, the concave surface of convexo-concave mirror is fixedlyed connected with high reflecting medium film, the convex surface of convexo-concave mirror is connected with outside output, fixedly connected with light absorbing zone with anti-reflection film respectively in the two sides of Window layer, heat-conducting glue is fixedlyed connected with the microchannel fin with heat sink respectively.Between reflecting medium film and anti-reflection film, be placed with nonlinear crystal.
When the present invention worked: device was worked in optical pumping mode (semiconductor laser or other LASER Light Source).Pump light is absorbed the generation photo-generated carrier through Window layer at absorbed layer and enters the active gain district, electronics and hole are carried out compound, produce stimulated emission, and the resonant cavity modeling vibration through constituting by outer convex-concave speculum and Bragg mirror, laser is from the outgoing of outer convex-concave speculum.
The present invention adopts the structure of the emission semiconductor laser of vertical external chamber surface of band convexo-concave mirror, convex surface converging action by outer convex-concave speculum reduces light scattering, increase the light feedback, and then reduce the lasing threshold of device, reach the purpose that improves device delivery efficiency and power output.And be coated with the deielectric-coating of operation wavelength being realized high reflection at the concave surface of convexo-concave mirror, and adopt the reflecting medium film to realize the wavelength after the frequency multiplication is strengthened transmitance, meanwhile adopt the microchannel heat dissipation technology to solve the device heat dissipation problem and wait and improve power output.Aspect the beam quality that improves vertical external cavity face emitting semiconductor laser, because it is external cavity mirror that the present invention adopts convexo-concave mirror, make output light be approximately directional light, the luminous zone that makes laser of the present invention is for circular uniformly, thereby obtain the cylindrical symmetric beam quality, be beneficial to light beam coupling.The anti-reflection film that the present invention adopts can obtain the transmitance more than 99.99%, for example: HfO 2Anti-reflection film stable performance and can be used for rigorous environment.Window layer of the present invention and anti-reflection membrane-bound structure adhesiveness is good, membrane structure is fine and close, even, free of pinholes, at effectively clear aperature theca interna flawless, scratch, idea, photographic fog and color spot, have advantages such as moisture-proof, good stability, the ability that has good resisting laser damage simultaneously, good performance such as the scattering loss that the anti-reflection film microstructure causes is low.A kind of emission semiconductor laser of vertical external chamber surface with convexo-concave mirror of the present invention can be applied to III-V family semiconductor material system, can also be applied to II-VI family semiconductor material system.
Description of drawings
Fig. 1 is a laser structure front view of the present invention.
Fig. 2 is the 980nm emission semiconductor laser of vertical external chamber surface intracavity frequency doubling front view of the embodiment of the invention 3 band convexo-concave mirrors.
Embodiment: the present invention is further described below in conjunction with drawings and Examples, but the invention is not restricted to these embodiment.Comprise among the embodiment: pump light source 1, convexo-concave mirror 2, high reflecting medium film 3, anti-reflection film 4, Window layer 5, light absorbing zone 6, active gain district 7, semiconductor-distribution Bragg reflector 8, scolder 9, fin 10, heat sink 11, heat-conducting glue 12, microchannel fin 13, nonlinear crystal 14.The concave curvature of convexo-concave mirror 2 half is through can be from 5 millimeters to 100 millimeters, and the convex curvature radius can be from 5 millimeters to 50 millimeters,
Embodiment 1:
Pump light source 1 is a high power 800-810nm wavelength semiconductor laser array, convexo-concave mirror 2 is by k9 optical glass or quartzy making, concave curvature half is through being 5 millimeters or 25 millimeters, the convex curvature radius is 5 millimeters or 9.5 millimeters, high reflecting medium film 3 adopts the Si/SiO2 deielectric-coating, and reflectivity is at 95%-99%.Anti-reflection film 4 adopts the HfO2 material to make, and the effective refractive index that anti-reflection film is selected is n eff = n 0 n 1 , Wherein the effective refractive index of HfO2 material selection is 1.85-1.90.Window layer 5 adopts the GaIn0.49P material.Light absorbing zone 6 adopts the Al0.06GaAs material.Periodically active Multiple Quantum Well gain region can be selected by active gain district 7, and its diameter can be from 50 microns to 5000 microns; Active gain district 7 can adopt GaIn0.16As quantum well and GaAs0.94P potential barrier.Bragg mirror 8 can adopt 30 pairs of Al0.12GaAs/Al0.9GaAs materials.Scolder 9 adopts indium, indium stannum alloy or gold-tin alloy.Fin 10 adopts diamond or aluminium nitride or beryllium oxide material.Heat sink 11 and microchannel fin 13 can adopt fine copper or oxygen-free copper or red copper, heat-conducting glue 12 adopts the thermal conductive silicon materials.
The present invention adopts substrate removal process that the substrate of the semiconductor chip of active quantum well of carrying and distribution Bragg reflector is removed, the method that adopts chemical corrosion and epitaxial loayer to set up etch stop layer at process aspect.Device adopts the micromechanics mounting technology that convexo-concave mirror and semiconductor chip, heat sink and microchannel heat sink etc. are assembled in assembling process.
Embodiment 2: pump light source 1, reflecting medium film 3, anti-reflection film 4 and Window layer 5, scolder 9, fin 10, heat sink 11, heat-conducting glue 12 and microchannel fin 13 are identical with embodiment 1, the concave curvature of convexo-concave mirror 2 half is through being 50 millimeters, and the convex curvature radius is 25 millimeters.Light absorbing zone 6 is Al0.2GaAs, and periodically Multiple Quantum Well active gain district 7 is GaAs quantum well and Al0.2GaAs potential barrier, and Bragg mirror 8 adopts 30 pairs of AlAs/Al0.2GaAs materials.The present invention is identical with embodiment 1 at process aspect.
Embodiment 3: the 980nm emission semiconductor laser of vertical external chamber surface intracavity frequency doubling of band convexo-concave mirror, and nonlinear crystal 14 is a lbo crystal, and the concave curvature of convexo-concave mirror 2 half is through selecting 100 millimeters, and the convex curvature radius can be selected 50 millimeters.Other assembly is with identical with embodiment 1.

Claims (2)

1、一种带凸凹反射镜的垂直外腔面发射半导体激光器,包括:泵浦光源(1)、窗口层(5)、光吸收层(6)、有源增益区(7)、布拉格反射镜(8)、焊料(9)、散热片(10)、热沉(11)、导热胶(12),有源增益区(7)的两面分别与光吸收层(6)和布拉格反射镜(8)固定连接,焊料(9)将布拉格反射镜(8)和散热片(10)固定连接,焊料(9)将散热片(10)和热沉(11)固定连接,其特征在于还包括:凸凹反射镜(2)、反射介质膜(3)、增透膜(4)、微通道散热片(13),凸凹反射镜(2)的凹面与反射介质膜(3)固定连接,窗口层(5)的两面分别与增透膜(4)和光吸收层(6)固定连接,导热胶(12)分别与热沉(11)和微通道散热片(13)固定连接。1. A vertical external-cavity surface-emitting semiconductor laser with a convex-concave mirror, comprising: a pump light source (1), a window layer (5), a light-absorbing layer (6), an active gain region (7), and a Bragg reflector (8), solder (9), heat sink (10), heat sink (11), thermally conductive glue (12), the two sides of the active gain area (7) are connected with the light absorbing layer (6) and the Bragg reflector (8) respectively ), the bragg reflector (8) is fixedly connected to the heat sink (10) by the solder (9), and the heat sink (10) and the heat sink (11) are fixedly connected by the solder (9), which is characterized in that it also includes: Reflector (2), reflective medium film (3), anti-reflection film (4), microchannel heat sink (13), concave surface of convex-concave reflector (2) is fixedly connected with reflective medium film (3), window layer (5 ) are fixedly connected to the antireflection film (4) and the light absorbing layer (6) respectively, and the thermally conductive adhesive (12) is fixedly connected to the heat sink (11) and the microchannel heat sink (13) respectively. 2、根据权利要求1所述的一种带凸凹反射镜的垂直外腔面发射半导体激光器,其特征在于还包括非线性晶体(14),在反射介质膜(3)与增透膜(4)之间放置有非线性晶体(14)。2. A vertical external-cavity surface-emitting semiconductor laser with convex-convex mirrors according to claim 1, characterized in that it also includes a nonlinear crystal (14), between the reflective medium film (3) and the anti-reflection film (4) A nonlinear crystal (14) is placed between them.
CNB200510016967XA 2005-07-14 2005-07-14 A Vertical External-Cavity Surface-Emitting Semiconductor Laser with Convex-Concave Mirrors Expired - Fee Related CN100384039C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB200510016967XA CN100384039C (en) 2005-07-14 2005-07-14 A Vertical External-Cavity Surface-Emitting Semiconductor Laser with Convex-Concave Mirrors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB200510016967XA CN100384039C (en) 2005-07-14 2005-07-14 A Vertical External-Cavity Surface-Emitting Semiconductor Laser with Convex-Concave Mirrors

Publications (2)

Publication Number Publication Date
CN1719673A true CN1719673A (en) 2006-01-11
CN100384039C CN100384039C (en) 2008-04-23

Family

ID=35931446

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200510016967XA Expired - Fee Related CN100384039C (en) 2005-07-14 2005-07-14 A Vertical External-Cavity Surface-Emitting Semiconductor Laser with Convex-Concave Mirrors

Country Status (1)

Country Link
CN (1) CN100384039C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112753145A (en) * 2018-09-19 2021-05-04 新墨西哥大学雨林创新 Broadband active mirror architecture of high-power optically pumped semiconductor disc laser

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6026111A (en) * 1997-10-28 2000-02-15 Motorola, Inc. Vertical cavity surface emitting laser device having an extended cavity
CA2298492A1 (en) * 1999-02-19 2000-08-19 Hyun-Kuk Shin Micro-lens, combination micro-lens and vertical cavity surface emitting laser, and methods for manufacturing the same
US6393038B1 (en) * 1999-10-04 2002-05-21 Sandia Corporation Frequency-doubled vertical-external-cavity surface-emitting laser
US6669367B2 (en) * 2001-10-10 2003-12-30 Applied Optoelectronics, Inc. Optical fiber with mirror for semiconductor laser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112753145A (en) * 2018-09-19 2021-05-04 新墨西哥大学雨林创新 Broadband active mirror architecture of high-power optically pumped semiconductor disc laser

Also Published As

Publication number Publication date
CN100384039C (en) 2008-04-23

Similar Documents

Publication Publication Date Title
US7526009B2 (en) End-pumped vertical external cavity surface emitting laser
JP2004503118A (en) VCSEL and VCSEL array with integrated microlenses for use in semiconductor laser pumped solid-state laser systems
CN100452577C (en) Mid-infrared solid-state lasers pumped by semiconductor lasers
EP1720225B1 (en) End-pumped vertical external cavity surface emitting laser
US20080273570A1 (en) Optically Pumped Waveguide Laser With a Tapered Waveguide Section
US20070253458A1 (en) Diode pumping of a laser gain medium
TWI244815B (en) Optically pumped semiconductor laser device
JP2017530554A (en) Laser active medium and manufacturing method thereof
CN108110608B (en) Array type laser
CN115621842B (en) An optically pumped semiconductor disk laser based on photonic crystal
KR101857751B1 (en) Slab solid laser amplifier
CN101388522A (en) Electrically Pumped Top-Emitting Vertical External-Cavity Surface-Emitting Laser
CN101710671A (en) Optical pumping vertical outer-cavity-surface transmitting laser containing bireflection-zone semiconductor-distribution Bragg reflector
CN111244734A (en) Mid-infrared single-mode laser
CN102299464A (en) Microchip solid state laser
CN1741328A (en) diode pumped laser
CN101567520A (en) Hollow beam pumping emission semiconductor laser of vertical external chamber surface
CN105633796A (en) Miniaturized high repetition frequency mode-locked semiconductor thin disk laser
CN219163901U (en) Device for generating efficient middle infrared vortex laser
CN1719673A (en) A Vertical External-Cavity Surface-Emitting Semiconductor Laser with Convex-Concave Mirrors
CN104917053A (en) V-shaped resonator and laser based on V-shaped resonator
CN101145673A (en) A Vertical External Cavity Surface Emitting Semiconductor Laser
CN101651286B (en) Optical pumping vertical external cavity emitting laser with gradient band gap barrier absorption layer
CN114597736A (en) Er-based large-energy 2940 nanometer pulse disc laser
CN1697272A (en) A high-power vertical-cavity surface-emitting laser with a light-exit window

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080423