CN1702879A - 薄膜晶体管衬底和其制造方法 - Google Patents
薄膜晶体管衬底和其制造方法 Download PDFInfo
- Publication number
- CN1702879A CN1702879A CNA2005100738168A CN200510073816A CN1702879A CN 1702879 A CN1702879 A CN 1702879A CN A2005100738168 A CNA2005100738168 A CN A2005100738168A CN 200510073816 A CN200510073816 A CN 200510073816A CN 1702879 A CN1702879 A CN 1702879A
- Authority
- CN
- China
- Prior art keywords
- active area
- source
- drain regions
- thin film
- film transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 21
- 239000010409 thin film Substances 0.000 title claims description 20
- 239000012535 impurity Substances 0.000 claims description 25
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 15
- 229920005591 polysilicon Polymers 0.000 claims description 15
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 5
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000006356 dehydrogenation reaction Methods 0.000 claims description 3
- 238000005224 laser annealing Methods 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims 3
- 239000010410 layer Substances 0.000 description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
Landscapes
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR36841/04 | 2004-05-24 | ||
KR1020040036841A KR100599595B1 (ko) | 2004-05-24 | 2004-05-24 | 발광표시 장치용 반도체 소자 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1702879A true CN1702879A (zh) | 2005-11-30 |
CN100426527C CN100426527C (zh) | 2008-10-15 |
Family
ID=35374395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100738168A Active CN100426527C (zh) | 2004-05-24 | 2005-05-24 | 薄膜晶体管衬底和其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7326959B2 (zh) |
JP (1) | JP2005340822A (zh) |
KR (1) | KR100599595B1 (zh) |
CN (1) | CN100426527C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102456743A (zh) * | 2010-10-22 | 2012-05-16 | 三星移动显示器株式会社 | 薄膜晶体管及其制造方法 |
CN104617108A (zh) * | 2015-01-27 | 2015-05-13 | 深圳市华星光电技术有限公司 | 低温多晶硅tft基板结构 |
CN112420743A (zh) * | 2020-11-06 | 2021-02-26 | 深圳市华星光电半导体显示技术有限公司 | 显示面板和显示面板的制作方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101309174B1 (ko) * | 2006-11-15 | 2013-09-23 | 삼성디스플레이 주식회사 | 표시 장치와 그 제조 방법 |
KR20080099463A (ko) * | 2007-05-09 | 2008-11-13 | 주식회사 하이닉스반도체 | 반도체 소자, 비휘발성 메모리 소자 및 그 제조방법 |
KR101015847B1 (ko) * | 2008-01-18 | 2011-02-23 | 삼성모바일디스플레이주식회사 | 박막트랜지스터와 그 제조방법 및 이를 구비한유기전계발광표시장치 |
US20120104402A1 (en) * | 2010-11-03 | 2012-05-03 | Pei-Hua Chen | Architecture of analog buffer circuit |
TWI422039B (zh) * | 2011-05-11 | 2014-01-01 | Au Optronics Corp | 薄膜電晶體元件及其製作方法 |
KR101915754B1 (ko) | 2012-05-08 | 2018-11-07 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 표시 장치 |
KR101938760B1 (ko) | 2012-07-26 | 2019-01-16 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
DE112016000170T5 (de) | 2015-06-17 | 2017-08-03 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und Verfahren zur Hestellung einer Halbleitervorrichtung |
CN105547191B (zh) * | 2015-12-15 | 2018-03-27 | 宁波频泰光电科技有限公司 | 一种彩色3d测量系统 |
KR102666532B1 (ko) | 2018-09-27 | 2024-05-14 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0626244B2 (ja) | 1985-03-04 | 1994-04-06 | 日本電気株式会社 | 半導体装置 |
JPH04359562A (ja) | 1991-06-06 | 1992-12-11 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
US6979840B1 (en) * | 1991-09-25 | 2005-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having anodized metal film between the gate wiring and drain wiring |
JP2975973B2 (ja) * | 1993-08-10 | 1999-11-10 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
JP3362467B2 (ja) | 1993-08-12 | 2003-01-07 | セイコーエプソン株式会社 | 薄膜半導体装置の製造方法 |
JPH07288287A (ja) * | 1994-04-18 | 1995-10-31 | Sony Corp | Tft負荷型sram |
US5789762A (en) * | 1994-09-14 | 1998-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor active matrix circuit |
JP2647020B2 (ja) | 1994-09-27 | 1997-08-27 | セイコーエプソン株式会社 | 相補型薄膜トランジスタ及びその製造方法 |
JP3525316B2 (ja) * | 1996-11-12 | 2004-05-10 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置 |
JP2924832B2 (ja) * | 1996-11-28 | 1999-07-26 | 日本電気株式会社 | 半導体装置の製造方法 |
US6013930A (en) * | 1997-09-24 | 2000-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having laminated source and drain regions and method for producing the same |
AU5600998A (en) | 1997-11-21 | 1999-06-15 | Btg International Inc. | Memory apparatus including programmable non-volatile multi-bit memory cell, and apparatus and method for demarcating memory states of the cell |
JPH11204657A (ja) | 1998-01-19 | 1999-07-30 | Sony Corp | Cmos集積回路 |
JP4236992B2 (ja) * | 2002-06-24 | 2009-03-11 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置の製造方法 |
KR100450683B1 (ko) * | 2002-09-04 | 2004-10-01 | 삼성전자주식회사 | Soi 기판에 형성되는 에스램 디바이스 |
KR20050028101A (ko) * | 2003-09-17 | 2005-03-22 | 주식회사 하이닉스반도체 | 인버터 및 그 제조방법 |
-
2004
- 2004-05-24 KR KR1020040036841A patent/KR100599595B1/ko active IP Right Grant
-
2005
- 2005-05-16 US US11/129,393 patent/US7326959B2/en active Active
- 2005-05-23 JP JP2005149436A patent/JP2005340822A/ja active Pending
- 2005-05-24 CN CNB2005100738168A patent/CN100426527C/zh active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102456743A (zh) * | 2010-10-22 | 2012-05-16 | 三星移动显示器株式会社 | 薄膜晶体管及其制造方法 |
CN102456743B (zh) * | 2010-10-22 | 2015-09-16 | 三星显示有限公司 | 薄膜晶体管及其制造方法 |
CN104617108A (zh) * | 2015-01-27 | 2015-05-13 | 深圳市华星光电技术有限公司 | 低温多晶硅tft基板结构 |
CN104617108B (zh) * | 2015-01-27 | 2017-06-27 | 深圳市华星光电技术有限公司 | 低温多晶硅tft基板结构 |
CN112420743A (zh) * | 2020-11-06 | 2021-02-26 | 深圳市华星光电半导体显示技术有限公司 | 显示面板和显示面板的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100599595B1 (ko) | 2006-07-13 |
KR20050111911A (ko) | 2005-11-29 |
CN100426527C (zh) | 2008-10-15 |
JP2005340822A (ja) | 2005-12-08 |
US7326959B2 (en) | 2008-02-05 |
US20050258486A1 (en) | 2005-11-24 |
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GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090109 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung SDI Co., Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090109 |
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ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121023 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121023 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Mobile Display Co., Ltd. |