CN1694601A - Electronic component assembly device inside electronic equipment - Google Patents

Abstract

The present invention is an electronic component assembly device inside an electronic device, mainly comprising two parallel and spaced rows of circuit contacts preset on the surface of a main circuit board inside a body of the electronic device, an electronic component arranged on the main circuit board in the middle of the two rows of circuit contacts, and a first circuit board group arranged in addition. The first circuit board group is composed of two flexible circuit boards and a first electronic component. The first electronic component can be connected to a corresponding circuit on the main circuit board via the flexible circuit board. The welding points between the flexible circuit board and the first electronic component are mainly arranged at the two edges of the upper surface of the electronic component arranged on the main circuit board, so that the first electronic component can be arranged just above the electronic component of the main circuit board.

Description

Electronic component assembly device inside electronic equipment

technical field

The invention relates to an electronic component assembly device inside electronic equipment, especially an assembly structure for assembling electronic components by means of a flexible circuit board.

Background technique

With the continuous development of modern electronic technology, there are various electronic products on the market for individuals to carry and use, so as to provide various functions such as personal data management, mobile phone communication, two-way paging, multimedia audio-visual and wireless Internet access, etc. Especially in the industrial and commercial society that pays great attention to work efficiency and speed, this kind of portable electronic products with multi-functions has become an indispensable tool for handling trivial affairs or public works in daily life. It is easy to carry around, and at the same time, it meets the needs of consumers in terms of use functions. The appearance of the product is gradually designed to be thin, light and small, so as to meet the needs of most consumers in the society. Therefore, in the design of related products, due to the continuous reduction in the size of the product appearance, the space available for arranging electronic components inside the body of the electronic product is relatively gradually reduced.

In the interior of the body of electronic products in the past, when the space for IC chips or electronic components that can be accommodated on the original main circuit board is insufficient, other IC chips or electronic components to be installed are often placed on other circuit boards. , and the circuit board corresponds to the main circuit board, and is stacked on the main circuit board in parallel. The main circuit board and the circuit board are connected with each other by connectors, so as to complete the design of the hardware circuit layout , but because the main circuit board and the circuit board are often composed of a rigid printed circuit board (Printed Circuit Board, PCB), the printed circuit board is not only thicker, but also requires a connector to connect the two The group circuit boards are joined and fixed in one body, so that when the hardware circuit layout is carried out inside the electronic product body, it is usually forced to give up the design or assemble other IC chips due to the limited or insufficient setting space reserved inside. Or electronic components, so that after the miniaturization design of related electronic products, some of the functions that can be provided are sacrificed and simplified, which cannot meet the needs of the public.

Contents of the invention

The main purpose of the present invention is to provide an electronic component assembly device inside the electronic equipment, so as to make up for the shortcoming that the electronic components cannot be installed inside the electronic equipment due to insufficient area of the main circuit board.

Another object of the present invention is to provide an electronic component assembling device inside the electronic device, so that when the electronic component is installed inside the body, the space for installing parts can be reduced, and the product volume can be reduced at the same time.

In order to achieve the above object, the present invention is mainly provided with a circuit board group, and the circuit board group is stacked so that the electronic components on the circuit board group can be arranged on the surface above the electronic components of the main circuit board. And it is connected with the main circuit board to form a circuit conduction.

The circuit board set of the present invention is composed of an electronic component arranged on the surface of a flexible circuit board. The surface of the flexible circuit board has a plurality of circuit contacts, which can be electrically connected to other pins provided on the electronic component. superior.

The end of the flexible circuit board of the present invention has a plurality of circuit contacts, which can be connected with the corresponding circuit contacts on the main circuit board by soldering to form a circuit conduction.

In the present invention, a plurality of circuit board groups can be arranged, and the circuit board groups are arranged on the main circuit board in a stacked manner, and are respectively connected with the main circuit board to form a circuit conduction.

Description of drawings

Fig. 1 is the three-dimensional exploded schematic diagram of the first embodiment of the present invention;

Fig. 2 is the combination schematic diagram of the first embodiment of the present invention;

Figure 3 is a side view of a first embodiment of the present invention;

Figure 4 is a side sectional view of a second embodiment of the present invention;

Figure 5 is a side sectional view of a third embodiment of the present invention;

Figure 6 is a side sectional view of a fourth embodiment of the present invention;

Fig. 7 is a schematic perspective view of a fifth embodiment of the present invention;

Figure 8 is a side sectional view of a fifth embodiment of the present invention;

Fig. 9 is an exploded perspective view of a sixth embodiment of the present invention;

Fig. 10 is a perspective combination view of the sixth embodiment of the present invention;

Fig. 11 is a side sectional view of a seventh embodiment of the present invention.

Detailed ways

Please refer to FIG. 1 and FIG. 2 , which are respectively an exploded perspective view and an assembled view of the first embodiment of the present invention. As shown in the figure, the present invention mainly pre-sets two rows of parallel and spaced circuit contacts 12 on the surface of the main circuit board 10 inside the electronic equipment body (not shown), and the two rows of circuit contacts 12 are arranged on the surface of the main circuit board 10. An electronic component 14 is arranged in the center of the contact point 12, wherein the main circuit board 10 is a printed circuit board (Printed Circuit Board, PCB), and a first circuit board group 20 is provided, and the first circuit board group 20 has two flexible circuits. Board 22 (FlexiblePrinted Circuit, FPC) and a first electronic component 24, in the present embodiment, this first electronic component 24 then refers to an IC package chip, please also refer to as shown in Figure 3, flexible printed circuit board 22 two ends A plurality of soldering points 222 and 224 are respectively provided on the upper and lower surfaces, wherein a plurality of pins 242 are provided on both sides of the first electronic component 24, which can be welded and fixed with the soldering points 222 provided at one end of the flexible circuit board 22 respectively, and the flexible circuit board 22 The welding point 224 provided at the other end of the flexible circuit board 22 is welded and fixed with the corresponding circuit contact 12 on the main circuit board 10, so that the first electronic component 24 can be connected with the circuit on the main circuit board 10 through the flexible circuit board 22 The corresponding circuit (not shown) connected by the contact point 12 is connected.

The welding points 222 of the aforementioned flexible circuit board 22 are mainly arranged at both edges of the upper surface of the electronic component 14 provided on the main circuit board 10, so that the first electronic component 24 can be precisely arranged on the electronic component 14 located on the main circuit board 10 above, or attached to the upper surface of the electronic component 14 in a stacked manner; moreover, in the present invention, the first electronic component 24 provided by the first circuit board group 20 is not only suitable for a single first electronic component 24, but also Set a plurality of first electronic components 24 or other electronic components that can be used for soldering and setting, and arrange them side by side between the two flexible circuit boards 22; For signal interference, a metal isolation layer (not shown) can be provided on the surface of the flexible circuit board 22 , which is electrically connected to the conductive layer of the main circuit board 10 to achieve the effect of noise shielding.

Since the flexible circuit board 22 is flexible, it can reduce the setting of connectors, wires or other packaging parts, and can be designed in irregular shapes, or placed in a narrow space; so in the first embodiment of the present invention , mainly by relying on the properties of the flexible circuit board 22, the first electronic component 24 is pre-assembled on the two flexible circuit boards 22 to form the first circuit board group 20, and the main circuit board 10 is reserved for Provide the circuit contacts 12 welded by the flexible circuit board 22, so that the first circuit board group 20 can be electrically connected with the main circuit board 10 by soldering on the circuit contacts 12, so that the In the area, more first electronic components 24 can be accommodated and designed. Of course, the first electronic components to be accommodated in the present invention are not limited to IC packaging chips, but can be applied to other electronic components that can also be designed in the main circuit. Various electronic components on the board 10; moreover, because in the present invention, in order to assemble the first electronic component 24 on the main circuit board 10 is the flexible circuit board 22 with flexibility, and because the flexible circuit The thickness of the board 22 is thinner than the general main circuit board 10, so when the flexible circuit board 22 is arranged inside the body of the electronic device, it can be fully accommodated in the body of the electronic device by virtue of its flexibility and thinness. In a limited space, there is no need to assemble another multi-layer circuit board side by side on the main circuit board 10 as in the previous circuit design, which requires a large installation space and makes it difficult to miniaturize the appearance of electronic equipment The goal.

Please refer to FIG. 4 , which is a side sectional view of the second embodiment of the present invention. As shown in the figure, in this embodiment, two groups of first circuit board groups 20 are stacked on the main circuit board 10, wherein the two groups of first circuit board groups 20 also have two flexible circuits. Board 22 and a first electronic component 24. In this embodiment, the first electronic component 24 also refers to an IC package chip, and both ends of the flexible circuit board 22 are provided with a plurality of welding points 222, 224. The first electronic component 24 is provided with a plurality of pins 242 on both sides, which can be welded and fixed with the soldering point 222 provided at one end of the flexible circuit board 22 respectively, and the soldering point 224 provided at the other end of the flexible circuit board 22 is connected with the soldering point 224 provided at the main circuit board 10. The corresponding circuit contacts 12 are fixed by welding.

In this embodiment, the two first circuit board groups 20 are mainly welded on the surface of the main circuit board 10 in a stacked manner on the upper surface of the electronic components 14 of the main circuit board 10 to achieve the purpose of assembly. Wherein the soldering point 222 of the flexible circuit board 22 is mainly located at the two edges of the upper surface of the electronic component 14 provided on the main circuit board 10, so that the first electronic component 24 can be just arranged on the electronic component 14 of the main circuit board 10 Above, or in a superimposed manner, it is pasted on the upper surface of the electronic component 14, so it can fully use the space inside the body of the electronic device, and use it and save the effect of setting space; and the above-mentioned first in the present invention The first electronic component 24 provided in the circuit board group 20 is not only suitable for a single first electronic component 24, but also can be provided with a plurality of first electronic components 24 or other electronic components that can be used for soldering and setting, and arrange them side by side. Between two flexible printed circuit boards 22 .

Please also refer to FIG. 5 , which is a side sectional view of a third embodiment of the present invention. As shown in the figure, in the third embodiment of the present invention, a second circuit board group 30 is provided, wherein the second circuit board group 30 has two flexible circuit boards 32 and a second electronic component 34, in this embodiment The second electronic component 34 in the middle refers to an IC package chip, and the second electronic component 34 of the second circuit board group 30 is arranged on the lower surface of the two flexible circuit boards 32, wherein the lower surfaces of the two ends of the flexible circuit board 32 Both are provided with a plurality of welding points 322, 324, and the two sides of the second electronic component 34 are provided with a plurality of pins 342, which can be welded and fixed with the welding points 322 provided at one end of the flexible circuit board 32 respectively, and the flexible circuit board 32 is separately fixed. The welding point 324 provided at one end is welded and fixed with the corresponding circuit contact 12 provided on the main circuit board 10, so that the second circuit board group 30 is combined on the main circuit board 10, so that the second electronic component 34 The pins 342 and the corresponding welding points 322 of the flexible circuit board 10 can be respectively hidden on the lower surface of the flexible circuit board 32, so as to prevent the pins 342 and the welding points 322 from being damaged by collisions of other foreign objects, and at the same time The second electronic component 34 can be arranged just above the electronic component 14 of the main circuit board 10, or attached to the upper surface of the electronic component 14 in a stacked manner; The second electronic component 34 is not only suitable for a single second electronic component 34, but also can be provided with a plurality of second electronic components 34 or other electronic components that can be soldered and fixed, and arranged side by side on two flexible circuit boards Between 32.

Please refer to FIG. 6 , which is a side sectional view of a fourth embodiment of the present invention. As shown in the figure, in the fourth embodiment of the present invention, two sets of second circuit board groups 30 are respectively arranged on the main circuit board 10, wherein the second circuit board groups 30 of the two groups also have Two flexible circuit boards 32 and a second electronic component 34, in the present embodiment the second electronic component 34 also refers to an IC package chip, the second circuit board group 30 of these two groups is mainly on the main circuit board 10 The upper surface of the electronic components 14 is sequentially welded on the surface of the main circuit board 10 in a stacked manner to achieve the purpose of assembly, wherein the welding points of the flexible circuit board 32 are mainly located on the main circuit board 10. The two edges of the upper surface of the electronic component 14, and the second electronic component 34 can be arranged just above the electronic component 14 of the main circuit board 10, or be attached to the upper surface of the electronic component 14 in a stacked manner, and the second The set second electronic component 34 of the circuit board group 30 is because the second electronic component 34 is set on the lower surface of the flexible circuit board 32, so that the pins 342 of the second electronic component 34 and their corresponding The welding point 322 of the flexible circuit board 32 can be better protected; and the second electronic component 34 set in the second circuit board group 30 in the aforementioned present invention is not only suitable for a single second electronic component 34, but can also be provided with A plurality of second electronic components 34 or other electronic components that can be soldered and fixed are arranged side by side between the two flexible circuit boards 32 .

Please refer to Fig. 7 and Fig. 8 respectively, which are schematic perspective views and side sectional views of the fifth embodiment of the present invention; as shown in the figure, in the fifth embodiment of the present invention, there is mainly a third Circuit board group 40, wherein the third circuit board group 40 has a flexible circuit board 42 and a third electronic component 44, in this embodiment the third electronic component 44 refers to an IC package chip, and the flexible circuit board 42 is close to A plurality of soldering points 422, 424 are respectively provided at the center of the upper surface and at the end of the lower surface, so that the pins 442 of the third electronic component 44 can be directly arranged on the corresponding soldering points 422 on the surface of the flexible circuit board 42, and make The flexible circuit board 42 is stacked on the surface of the main circuit board 10, wherein the welding points 422 on the upper surface of the flexible circuit board 42, that is, the welding points 422 located on the inner surface of the flexible circuit board 42 are mainly corresponding to the main circuit board. The electronic component 14 of 10 is arranged so that the soldering point 422 is located at both edges of the upper surface of the electronic component 14, and the third electronic component 44 can be arranged just above the electronic component 14, and the third electronic component 44 The lower surface of the flexible circuit board 42 below is attached to the upper surface of the electronic component 14, and the welding points 424 at the two outer ends of the flexible circuit board 42 are soldered to the corresponding circuit contacts 12 on the main circuit board 10. The way of connection is a circuit conduction.

In the fifth embodiment of the present invention, it is different from the first embodiment in that the third electronic component 44 is directly fixed and electrically connected to a single flexible circuit board 42 instead of two flexible circuit boards 42 respectively. Each is connected to the pins 442 on both sides of the third electronic component 44, so that a relatively simple way of assembling the third electronic component 44 on the flexible circuit board 42 is provided; The third electronic component 44 provided in 40 is not only suitable for a single third electronic component 44, but also can be provided with a plurality of third electronic components 44 or other electronic components that can be used for soldering and setting, and arrange them side by side on a flexible at the center of the upper surface of the circuit board 42 .

The aforementioned first to fifth embodiments are mainly applied to the type of chip packaged in DIP (Dual In-line Package) with symmetrical pins. Please also refer to FIG. 9 and FIG. 10 , which are an exploded perspective view and a combined perspective view of the sixth embodiment of the present invention. As shown in the figure, in the sixth embodiment of the present invention, a plurality of circuit contacts 12 are preset on the surface of the main circuit board 10 inside the body of the electronic device, the main circuit board 10 is a printed circuit board, and a The fourth circuit board group 50, the fourth circuit board group 50 has a flexible circuit board 52 and a fourth electronic component 54, in this embodiment the fourth electronic component 54 refers to an IC package chip, and this embodiment mainly The chip type that can be implemented in a miniaturized package (TSOP, Thin Small Outline Package), its typical feature is that the pins are arranged around the chip in the chip packaging mode. In this embodiment, the upper surface of the flexible circuit board 52 The center is provided with four rows of welding points 522 that together form a square, and the lower surfaces of the two outer ends are respectively provided with a row of welding points 524, wherein a plurality of pins 542 are provided on the sides of the fourth electronic component 54, which can be connected with soft parts respectively. The corresponding welding points 522 set in the center of the upper surface of the flexible circuit board 52 are welded and fixed to each other, and the flexible circuit board 52 is stacked on the surface of the electronic components 14 of the main circuit board 10. The welding point 522 is mainly arranged corresponding to the position of the electronic component 14 of the main circuit board 10, so that the welding point 522 can correspond to and surround the periphery of the upper surface of the electronic component 14, and the fourth electronic component 54 can be properly arranged above the electronic component 14, and the lower surface of the flexible circuit board 52 located below the fourth electronic component 54 is attached to the upper surface of the electronic component 14, and the welding of the lower surfaces of the two ends of the flexible circuit board 52 The point 524 and the corresponding circuit contact 12 on the main circuit board 10 are connected with each other in a soldering manner to be a circuit conduction; A single fourth electronic component 54 can also be provided with a plurality of fourth electronic components 54 or other electronic components that can be fixed by soldering, and they are arranged side by side at the center of the upper surface of the flexible circuit board 52 .

Please refer to FIG. 11 , which is a side sectional view of a seventh embodiment of the present invention. As shown in the figure, this embodiment is provided with a fifth circuit board group 60 on the main circuit board 10, the fifth circuit board group 60 has a flexible circuit board 62 and a fifth electronic component 64, in this embodiment The fifth electronic component 64 refers to an IC package chip, which is mainly used in the chip type of flip-chip (Flip-Chip) semiconductor packaging mode, wherein the flexible circuit board 62 is respectively provided with A plurality of soldering points 622 and a row of soldering points 624 are arranged in a matrix, and the solder balls 642 on the bottom surface of the fifth electronic component 64 can be directly soldered to the corresponding soldering points 622 on the central surface of the flexible circuit board 62 , the flexible circuit board 62 is stacked on the surface of the main circuit board 10, wherein the welding point 622 located on the central surface of the flexible circuit board 62 is mainly set corresponding to the position of the electronic components 14 of the main circuit board 10 , so that the welding point 622 can correspond to and surround the periphery of the upper surface of the electronic component 14, and the fifth electronic component 64 can be arranged just above the electronic component 14, and the soft flexible part under the fifth electronic component 64 The lower surface of the circuit board 62 is attached to the upper surface of the electronic component 14, and the welding points 624 at both ends of the flexible circuit board 62 are connected with the corresponding circuit contacts 12 on the main circuit board 10 by soldering to form a circuit. conduction, so as to make the electronic components of the chips in the flip-chip (Flip-Chip) semiconductor packaging mode also provide assembly; certainly, the fifth electronic component 64 set by the fifth circuit board group 60 in the aforementioned present invention is not only applicable to A single fifth electronic component 64 can also be provided with a plurality of fifth electronic components 64 or other electronic components that can be fixed by soldering, and they are arranged side by side at the center of the upper surface of the flexible circuit board 62 .

As mentioned above, the present invention mainly aims to solve the problem that when the main circuit board inside the electronic device is performing circuit design or expanding the functions of the electronic device, when there is no space on the main circuit board for accommodating electronic components, you can use the The assembled electronic components (in the present invention, the chip is used as the description of the embodiment) are first arranged on the flexible circuit board, and the circuit contacts for the electrical connection of the flexible circuit board are arranged on the main circuit board, After the flexible circuit board with electronic components can be stacked on the surface of the main circuit board, the soldering points on the surface of the flexible circuit board for setting chips are mainly corresponding to the position of the electronic components on the main circuit board It is set so that the soldering point can be set corresponding to the upper surface of the electronic component, and the chip can be placed just above the electronic component, or the chip can be stacked and attached to the upper surface of the electronic component, and the soft The welding points on the lower surface of both ends of the flexible circuit board and the corresponding circuit contacts on the main circuit board are connected by soldering to form a circuit conduction, so as to achieve the purpose of expanding and setting the circuit, and at the same time solve the problem of hard multi-layer in the past. When the circuit board is installed, due to the need to use a large range of space inside the body of the electronic device, it is difficult to achieve the goal of thin and short in the design of the electronic device; moreover, because the flexible circuit board itself has better flexibility and its material It is also relatively light and thin, so when it is assembled and placed inside the body of the electronic device, it can be easily adjusted and placed in a better or open space inside the body of the electronic device, so that the electronic components can be optimally assembled when they are assembled. flexible space design; finally, because the present invention enables electronic components to be assembled on the main circuit board through the flexible circuit board, since the material of the flexible circuit board is relatively light and thin, the size and height of the same range inside the body of the electronic device In the installation space, the best space utilization effect can be achieved by stacking multiple circuit board groups composed of multiple electronic components and flexible circuit boards. The material of the board is thick and heavy, and the connector and the main circuit board must be electrically connected, so the number of components such as electronic components that can be placed in the same installation space is relatively lower than that of the present invention, which affects the function of the product. The scalability is also poor.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. For example, all equal changes and modifications are made according to the shape, structure, characteristics and spirit described in the patent scope of the present invention. , should be included in the protection scope of the claims of the present invention.

Claims (20)

1. An electronic component assembly device inside an electronic device, characterized in that it comprises: A main circuit board, the upper surface of which is provided with two rows of circuit contacts spaced apart; an electronic component disposed between the two rows of circuit contacts on the main circuit board; and A first circuit board set having: A first electronic component is disposed above the electronic component and has corresponding two sides, and a plurality of pins are respectively provided on the sides; and Two flexible circuit boards, the upper surface of one end of the flexible circuit board has a plurality of soldering points correspondingly connected to the pins of the first electronic component, and the lower surface of the other end of the flexible circuit board has correspondingly connected to the main pins A plurality of solder joints for circuit contacts on a circuit board. 2. The electronic component assembly device inside the electronic device as claimed in claim 1, wherein the soldering points for correspondingly connecting the pins of the first electronic component are provided on the main circuit board. the two edges of the upper surface of the electronic component, so that the first electronic component can be arranged just above the electronic component of the main circuit board. 3. The electronic component assembly device inside the electronic equipment according to claim 1, wherein at least two or more first circuit board groups are arranged on the main circuit board, and the upper surface of the main circuit board is provided with A plurality of rows of circuit contacts spaced apart are respectively arranged on both sides of the electronic component; such that the first circuit board groups are stacked on the surface of the electronic component of the main circuit board, stacked above the electronic component. 4. The electronic component assembling device inside the electronic equipment as claimed in claim 1, 2 or 3, wherein the first electronic component is an IC packaged chip. 5. An electronic component assembly device inside an electronic device, characterized in that it comprises: A main circuit board, the upper surface of which is provided with two rows of circuit contacts spaced apart; an electronic component disposed between the two rows of circuit contacts on the main circuit board; and A second circuit board set having: A second electronic component is arranged above the electronic component and has corresponding two sides, and a plurality of pins are provided on each side; and Two flexible circuit boards, the bottom surface of the end of the flexible circuit board has a plurality of soldering points corresponding to the pins of the first electronic component, and a plurality of soldering points corresponding to the circuit contacts on the main circuit board . 6. The electronic component assembly device inside the electronic device as claimed in claim 5, wherein the soldering points for correspondingly connecting the pins of the second electronic component are provided on the main circuit board. the two edges of the upper surface of the electronic component, so that the second electronic component can be arranged just above the electronic component of the main circuit board. 7. The electronic component assembly device inside the electronic equipment according to claim 5, wherein at least two or more second circuit board groups are arranged on the main circuit board, and the upper surface of the main circuit board is provided with A plurality of rows of circuit contacts spaced apart are respectively arranged on both sides of the electronic component; such that the second circuit board groups are stacked on the surface of the electronic component of the main circuit board, stacked above the electronic component. 8. The electronic component assembling device inside the electronic equipment as claimed in claim 5, 6 or 7, wherein the second electronic component is an IC packaged chip. 9. An electronic component assembly device inside an electronic device, characterized in that it comprises: A main circuit board, the upper surface of which is provided with two rows of circuit contacts spaced apart; an electronic component disposed between the two rows of circuit contacts on the main circuit board; and A third circuit board set, having: A third electronic component is disposed above the electronic component and has corresponding two sides, and a plurality of pins are respectively provided on the sides; and A flexible circuit board, the flexible circuit board is provided with a plurality of soldering points near the center of the upper surface and the end of the lower surface, respectively, for conducting the pins of the third electronic component respectively, and correspondingly conducting the connection to the pins of the third electronic component. Circuit contacts on the main circuit board. 10. The electronic component assembling device inside the electronic device as claimed in claim 9, wherein the welding points for correspondingly connecting the pins of the third electronic component are provided on the main circuit board. The two edges of the upper surface of the electronic component, so that the third electronic component can be arranged just above the electronic component of the main circuit board. 11. The electronic component assembly device inside the electronic equipment according to claim 9, wherein at least two or more third circuit board groups are arranged on the main circuit board, and the upper surface of the main circuit board is provided with A plurality of rows of circuit contacts spaced apart are respectively arranged on both sides of the electronic component; such that the third circuit board group is stacked on the surface of the electronic component of the main circuit board, stacked above the electronic component. 12. The electronic component assembling device inside the electronic equipment as claimed in claim 9, 10 or 11, wherein the third electronic component is an IC packaged chip. 13. An electronic component assembly device inside an electronic device, characterized in that it comprises: A main circuit board, the upper surface of which is provided with two rows of circuit contacts spaced apart; an electronic component disposed between the two rows of circuit contacts on the main circuit board; and A fourth circuit board set having: A fourth electronic component is arranged above the electronic component, and a plurality of pins are provided on each side of the four sides; and A flexible printed circuit board has four rows of soldering points that together form a square at the center of its upper surface, and a row of soldering points on each of the lower surfaces of the two outer ends, which are respectively used to connect the fourth electronic component. The pins are correspondingly connected to the circuit contacts on the main circuit board. 14. The electronic component assembling device inside the electronic device as claimed in claim 13, wherein the welding points for correspondingly connecting the pins of the fourth electronic component are set close to the main circuit board. The peripheral edge of the upper surface of the provided electronic component enables the fourth electronic component to be positioned just above the electronic component of the main circuit board. 15. The electronic component assembly device inside the electronic equipment according to claim 13, wherein at least two or more fourth circuit board groups are arranged on the main circuit board, and the upper surface of the main circuit board is provided with A plurality of rows of circuit contacts spaced apart are respectively arranged on both sides of the electronic component; so that the fourth circuit board group is stacked on the surface of the electronic component of the main circuit board, stacked above the electronic component. 16. The electronic component assembling device inside the electronic equipment as claimed in claim 13, 14 or 15, wherein the fourth electronic component is an IC packaged chip. 17. An electronic component assembly device inside an electronic device, characterized by comprising: A main circuit board, the upper surface of which is provided with two rows of circuit contacts spaced apart; an electronic component disposed between the two rows of circuit contacts on the main circuit board; and A fifth circuit board set, having: A fifth electronic component is arranged above the electronic component, and a plurality of pins are provided on each of its surrounding sides; and A flexible circuit board, the center of the upper surface and the two outer ends of the lower surface are respectively provided with a plurality of soldering points arranged in a matrix and a row of soldering points for connecting the pins of the fifth electronic component respectively, and the corresponding circuit contacts on the main circuit board. 18. The electronic component assembling device inside the electronic device according to claim 17, wherein the welding points for correspondingly connecting the pins of the fifth electronic component are arranged close to the main circuit board. The peripheral edge of the upper surface of the provided electronic component enables the fourth electronic component to be positioned just above the electronic component of the main circuit board. 19. The electronic component assembly device inside the electronic equipment according to claim 17, wherein at least two or more fifth circuit board groups are arranged on the main circuit board, and the upper surface of the main circuit board is provided with A plurality of rows of circuit contacts spaced apart are respectively arranged on both sides of the electronic component; so that the fifth circuit board group is stacked on the surface of the electronic component of the main circuit board, stacked above the electronic component. 20. The electronic component assembling device inside the electronic equipment as claimed in claim 17, 18 or 19, wherein the fifth electronic component is an IC packaged chip.

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